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BLM15HD182SZ1D

更新时间：2024-09-18 18:48:50

品牌：MURATA

描述：Ferrite Chip,

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BLM15HD182SZ1D 概述

Ferrite Chip, 数据线路滤波器

BLM15HD182SZ1D 规格参数

是否Rohs认证：	符合	生命周期：	Active
Reach Compliance Code：	compliant	Factory Lead Time：	7 weeks
风险等级：	1.73	Samacsys Description：	BLM15_Z1D Series EMI Suppression Filter 1800Ω±25% at 100MHz 200mA @85℃
滤波器类型：	FERRITE CHIP	JESD-609代码：	e3
端子面层：	Tin (Sn)	Base Number Matches：	1

BLM15HD182SZ1D 数据手册

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Reference Spec.No.JENF243A-9121B-01

P1/8

Reference Only

Chip Ferrite Bead BLM15H□□□□SZ1D

Murata Standard Reference Specification [AEC-Q200]

1.Scope

This reference specification applies to Chip Ferrite Bead BLM15H_SZ series based on AEC-Q200 except for

Power train and Safety.

2.Part Numbering

(ex.) BL

(1)

(2)

(3)

(4)

102

(5)

(9)

(6) (7) (8)

(1)Product ID

(2)Type

(3)Dimension (L×Ｗ) (6)Performance

(4)Characteristics

(5)Typical Impedance at 100MHz (8)Numbers of Circuit

(9)Packaging (D:Taping)

(7)Category(for Automotive Electronics)

3.Rating

DC Resistance

(Ω max.) (*1)

(refer to below

comment)

Impedance (Ω)

(at 100MHz)(*1)

(refer to below comment)

Rated

Current

(mA)

ESD Rank

2 :2kV

ustomer

Part Number

MURATA

Part Number

Initial

Values

Values After

at100MHz

at1GHz

Testing

0.8

120±25% 500±40%

220±25% 900±40%

600±25% 1400±40%

1000±25% 2000±40%

1800±25% 2700±40%

600±25% 1000±40%

1000±25% 1000±40%

BLM15HB121SZ1D

BLM15HB221SZ1D

BLM15HD601SZ1D

BLM15HD102SZ1D

BLM15HD182SZ1D

BLM15HG601SZ1D

BLM15HG102SZ1D

300

250

300

250

200

300

250

0.7

1.0

0.85

1.25

2.2

1.1

0.95

1.35

2.3

0.7

0.8

1.1

1.2

■Operating Temperature : -55°C to +125°C

■Storage Temperature : -55°C to +125°C

(*1)

Standard Testing Conditions

< Unless otherwise specified >

< In case of doubt >

Temperature : Ordinary Temp. (15 °C to 35 °C )

Humidity : Ordinary Humidity (25%(RH) to 85%(RH))

Temperature : 20°C±2 °C

Humidity : 60%(RH) to 70%(RH)

Atmospheric pressure : 86kPa to 106kPa

4.Style and Dimensions

1.0±0.05

0.5±0.05

■ Equivalent Circuit

0.25±0.1

Resistance element becomes

dominant at high frequencies.

(

)

: Electrode

(in mm)

■ Unit Weight (Typical value)

0.001g

5.Marking

No marking.

MURATA MFG.CO.,LTD.

Reference Spec.No.JENF243A-9121B-01

P2/8

Reference Only

6.Specifications

6-1.Electrical Performance

No.

Item

Specification

Meet item 3.

Test Method

6-1-1 Impedance

Measuring Frequency : 100MHz±1MHz,1GHz±1MHz

Measuring Equipment : Agilent4291A or the equivalent

Test Fixture : Agilent16192A or the equivalent

Measuring Equipment : Digital multi meter

6-1-2 DC Resistance

Meet item 3.

6-2.Mechanical Performance (based on Table 13 for FILTER EMI SUPPRESSORS/FILTERS)

AEC-Q200 Rev.D issued June. 1 2010

AEC-Q200

Murata Specification / Deviation

No.

Stress

Test Method

High

Temperature

Exposure

1000hours at 125 deg C

Set for 24hours

at room temperature,

then measured.

Meet Table A after testing.

Table A

Appearance No damage

Impedance

Change

(at 100MHz)

Within ±30%

Meet item 3.

Resistance

Temperature Cycling 1000cycles

-55 deg C to +125 deg C

Meet Table A after testing.

Set for 24hours

at room temperature,

then measured.

Destructive

Physical Analysis

Per EIA469

No electrical tests

No defects

Biased Humidity

Operational Life

1000hours at 85 deg C, 85%RH Meet Table A after testing.

Apply max rated current.

Meet Table A after testing.

If the rated current of parts exceed 1A,

the operating temperature should be 85 deg C.

Apply 125 deg C 1000hours

Set for 24hours at

room temperature,

then measured

External Visual

Visual inspection

No abnormalities

No defects

10 Physical Dimension Meet ITEM 4

（Style and Dimensions）

12 Resistance

to Solvents

Per MIL-STD-202 Method 215 Not Applicable

13 Mechanical Shock

Per MIL-STD-202 Method 213 Meet Table A after testing.

Condition F:

1500g's(14.7N)/0.5ms/Half sine

14 Vibration

5g's(0.049N) for 20 minutes Meet Table A after testing.

12cycles each of 3 oritentations

Test from 10-2000Hz.

MURATA MFG.CO.,LTD.

Reference Spec.No.JENF243A-9121B-01

AEC-Q200

P3/8

Reference Only

Murata Specification / Deviation

No.

15 Resistance

to Soldering Heat

Stress

Test Method

Solder temperature

260C+/-5 deg C

Pre-heating: 150C +/-10 deg C, 60s to 90s

Immersion time 10s

Meet Table A after testing.

17 ESD

Per AEC-Q200-002

ESD Rank: Meet Item 3 (Rating)

Meet Table A after testing.

18 Solderability

Per J-STD-002

Measured : Impedance

Per UL-94

Method b : Not Applicable

95% of the terminations is to be soldered.

19 Electrical

No defects

Characterization

20 Flammability

21 Board Flex

Not Applicable

Epoxy-PCB(1.6mm)

Deflection 2mm(min)

Murata deviation request: Epoxy-PCB(0.8mm)

Meet Table A after testing.

60s minimum holding time

22 Terminal Strength

Per AEC-Q200-006

Murata deviation request: 5N

No defects

30 Electrical

Transient

Per ISO-7637-2

Not Applicable

Conduction

7.Specification of Packaging

7-1.Appearance and Dimensions (8mm-wide paper tape)

2.0±0.05

4.0±0.1

2.0±0.05

1.5^+0.1

-0

0.8max.

0.65(Typ.)

(in mm)

Direction of Feed

(1) Taping

Products shall be packaged in the cavity of the base tape of 8mm-wide, 2mm-pitch continuously and sealed

by top tape and bottom tape.

(2) Sprocket hole:Sprocket hole shall be located on the left hand side toward the direction of feed.

(3) Spliced point:The base tape and top tape have no spliced point

(4) Cavity:There shall not be burr in the cavity.

(5) Missing components number

Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater, and are not

continuous. The specified quantity per reel is kept..

MURATA MFG.CO.,LTD.

Reference Spec.No.JENF243A-9121B-01

P4/8

Reference Only

7-2.Tape Strength

(1)Pull Strength

Top tape

Bottom tape

5N min.

Top tape

165 to 180 degree

(2)Peeling off force of Cover tape

0.1N to 0.6N (Minimum value is typical.)

*Speed of Peeling off:300mm/min

Bottom tape

Base tape

7-3.Taping Condition

(1)Standard quantity per reel

Quantity per 180mm reel

10000 pcs. / reel

(2)There shall be leader-tape(top tape and empty tape) and trailer- tape(empty tape) as follows.

(3)On paper tape, the top tape and the base tape shall not be adhered at the tip of the empty leader tape

for more than 5 pitch.

(4)Marking for reel

The following items shall be marked on a label and the label is stuck on the reel.

(Customer part number, MURATA part number, Inspection number(∗1) , RoHS marking(∗2) , Quantity, etc)

∗1) « Expression of Inspection No. »

□□ OOOO ×××

(1) (2) (3)

(1) Factory Code

(2) Date

First digit

: Year / Last digit of year

Second digit

: Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O,N,D

Third, Fourth digit : Day

(3) Serial No.

∗2) « Expression of RoHS marking »

ROHS – Y (△)

(1) (2)

(1) RoHS regulation conformity parts.

(2) MURATA classification number

(5)Outside package

These reels shall be packed in the corrugated cardboard package and the following items shall be marked

on a label and the label is stuck on the box.

(Customer name, Purchasing order number, Customer part number, MURATA part number,

RoHS marking(∗2) ,Quantity, etc)

(6)Dimensions of reel and taping(leader-tape, trailer-tape)

Trailer

160 min.

Leader

2.0±0.5

Label

190 min.

210 min.

Empty tape

Top tape

13.0±0.2

60⁺¹

Direction of feed

21.0±0.8

-0

9.0

13.0±1.4

180 ⁺⁰

-3

(in mm)

7-4. Specification of Outer Case

Outer Case Dimensions

(mm)

Label

Standard Reel Quantity in Outer Case

(Reel)

186

∗ Above Outer Case size is typical. It is depend on a quantity of an

order.

MURATA MFG.CO.,LTD.

Reference Spec.No.JENF243A-9121B-01

P5/8

Reference Only

8. ！ Caution

8-1.Rating

Do not use products beyond the Operating Temperature Range and Rated Current.

8-2.Surge current

Excessive surge current (pulse current or rush current) than specified rated current applied to the product

may cause a critical failure, such as an open circuit, burnout caused by excessive temperature rise.

Please contact us in advance in case of applying the surge current.

8-3.Fail Safe

Be sure to provide an appropriate fail-safe function on your product to prevent from a second damage

that may be caused by the abnormal function or the failure of our products.

8-4.Limitation of Applications

Please contact us before using our products for the applications listed below which require especially high

reliability for the prevention of defects which might directly cause damage to the third party's life, body or property.

(1)Aircraft equipment

(6)Disaster prevention / crime prevention equipment

(7)Traffic signal equipment

(8)Transportation equipment (trains,ships,etc.)

(9)Applications of similar complexity and /or reliability requirements

to the applications listed in the above

(2)Aerospace equipment

(3)Undersea equipment

(4)Power plant control equipment

(5)Medical equipment

9. Notice

This product is designed for solder mounting.

Please consult us in advance for applying other mounting method such as conductive adhesive.

9-1.Land pattern designing

• Standard land dimensions (Reflow soldering)

Chip Ferrite Bead

0.5

Solder Resist

0.4

Pattern

1.2 to 1.4

(in mm)

9-2.Soldering Conditions

Products can be applied to reflow soldering.

(1) Flux,Solder

Flux

Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. )

Do not use water-soluble flux.

Solder

Use Sn-3.0Ag-0.5Cu solder

Standard thickness of solder paste : 100 µm to 200 μm

(2) Soldering conditions

• Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited

to 150℃ max. Also cooling into solvent after soldering should be in such a way that the temperature difference

is limited to 100℃ max.

Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality.

• Standard soldering profile and the limit soldering profile is as follows.

The excessive limit soldering conditions may cause leaching of the electrode and / or resulting

in the deterioration of product quality.

MURATA MFG.CO.,LTD.

Reference Spec.No.JENF243A-9121B-01

(3) Soldering profile

P6/8

Reference Only

Temp.

(℃)

260℃

230℃

245℃±3℃

220℃

Limit Profile

180

150

Standard Profile

30s～60s

60s max.

90s±30s

Time.(s)

Standard Profile

150～180°C 、90s±30s

above 220°C、30s～60s

245±3°C

Limit Profile

Pre-heating

Heating

above 230°C、60s max.

260°C,10s

Peak temperature

Cycle of reflow

2 times

9-3. Soldering iron

• Pre-heating: 150°C, 1 min

• Tip temperature: 350°C max.

• Soldering time : 3(+1,-0) seconds.

• Soldering iron output: 80W max.

• Tip diameter:φ3mm max.

• Times : 2times max.

Note :Do not directly touch the products with the tip of the soldering iron in order to prevent the crack

on the ferrite material due to the thermal shock.

9-4.Solder Volume

Solder shall be used not to be exceeded as shown below.

Upper Limit

Recommendable

1/3T≦t≦T

(T:Chip thickness)

Accordingly increasing the solder volume, the mechanical stress to product is also increased.

Exceeding solder volume may cause the failure of mechanical or electrical performance.

9-5.Attention regarding P.C.B. bending

The following shall be considered when designing and laying out P.C.B.'s.

(1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage.

Products shall be located in the sideways

direction (Length:a<b) to the mechanical

stress.

Poor example

〈

〉

Good example

〈

〉

(2)Products location on P.C.B. separation.

Products (A,B,C,D) shall be located carefully

so that products are not subject to the

Seam

mechanical stress due to warping the board.

Because they may be subjected the mechanical

stress in order of A>C>B ≅ D.

Slit

Length:a b

9-6.Mounting density

Add special attention to radiating heat of products when mounting the inductor near the products with heating.

The excessive heat by other products may cause deterioration at joint of this product with substrate.

MURATA MFG.CO.,LTD.

Reference Spec.No.JENF243A-9121B-01

9-7. Operating Environment

P7/8

Reference Only

Do not use this product under the following environmental conditions, on deterioration of the Insulation

Resistance of the Ferrite material and/or corrosion of Inner Electrode may result from the use.

(1) in the corrodible atmosphere (acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.)

(2) in the atmosphere where liquid such as organic solvent, may splash on the products.

(3) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew.

9-8. Resin coating

The impedance value may change and/or it may affect on the product's performance due to high cure-stress of

resin to be used for coating / molding products. So please pay your careful attention when you select resin.

In prior to use, please make the reliability evaluation with the product mounted in your application set.

9-9.Cleaning Conditions

Products shall be cleaned on the following conditions.

(1)Cleaning temperature shall be limited to 60°C max. (40°C max. for IPA.)

(2)Ultrasonic cleaning shall comply with the following conditions, avoiding the resonance phenomenon

at the mounted products and P.C.B.

Power:20W/ max. Frequency:28kHz to 40kHz Time:5 min max.

(3)Cleaner

1.Alternative cleaner

•Isopropyl alcohol (IPA)

2.Aqueous agent

•PINE ALPHA ST-100S

(4)There shall be no residual flux and residual cleaner after cleaning.

In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water

in order to remove the cleaner.

(5)Other cleaning

Please contact us.

9-10. Handling of a substrate

After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the

substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to

the substrate.

Excessive mechanical stress may cause cracking in the product.

Bending

Twisting

9-11.Storage Conditions

(1)Storage period

Use the products within 6 months after delivered.

Solderability should be checked if this period is exceeded.

(2)Storage conditions

• Products should be stored in the warehouse on the following conditions.

Temperature : -10°C to 40°C

Humidity

: 30% to 70% relative humidity

No rapid change on temperature and humidity

• Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization

of electrode, resulting in poor solderability.

• Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.

• Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.

• Products should be stored under the airtight packaged condition.

(3)Delivery

Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.

MURATA MFG.CO.,LTD.

Reference Spec.No.JENF243A-9121B-01

P8/8

Reference Only

10 .

! Note

(1)Please make sure that your product has been evaluated in view of your specifications with our product being

mounted to your product.

(2)You are requested not to use our product deviating from the agreed specifications.

(3)Please return one duplicate of this product specification to us with your signature to acknowledge your receipt.

If the duplicate is not returned by two month after issued date, the product specification will be deemed to

have been received by you.

(4)We consider it not appropriate to include any terms and conditions with regard to the business transaction

in the product specifications, drawings or other technical documents. Therefore, if your technical documents

as above include such terms and conditions such as warranty clause, product liability clause, or intellectual

property infringement liability clause, they will be deemed to be invalid.

MURATA MFG.CO.,LTD.

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