BLM03PX330SN1D [MURATA]
Ferrite Chip, 1 Function(s), 1.5A, EIA STD PACKAGE SIZE 0201, 2 PIN;
| 型号： | BLM03PX330SN1D |
| 厂家： | 
muRata |
| 描述： | Ferrite Chip, 1 Function(s), 1.5A, EIA STD PACKAGE SIZE 0201, 2 PIN |
| 文件： | 总9页 (文件大小：166K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Reference Only
Spec.No.JENF243A-0020AC-01
P1/9
Chip Ferrite Bead BLM03□□□□□SN1□ Reference Specification
1.Scope
This reference specification applies to Chip Ferrite Bead BLM03_SN Series.
2.Part Numbering
(ex.) BL
M
03
(3)
AG
(4)
121
(5) (6)
S
N
(7)
1
D
(1)
(2)
(8) (9)
(1)Product ID (2)Type (3)Dimension(L×Ｗ) (4)Characteristics (5)Typical Impedance at 100MHz
(6)Performance (7)Category (8)Numbers of Circuit (9)Packaging(D:Taping / B:Bulk)
3.Rating
Impedance ()
(at 100MHz,Under Standard
Testing Condition)
DC Resistance
( max.)
Initial Values
Values After
Testing
Rated
Current
(mA)
Customer
Part Number
MURATA
Part Number
Remark
Typical
at 85℃ at 125℃
BLM03AG100SN1D
BLM03AG100SN1B
BLM03AG700SN1D
BLM03AG700SN1B
BLM03AG800SN1D
BLM03AG800SN1B
BLM03AG121SN1D
BLM03AG121SN1B
BLM03AG241SN1D
BLM03AG241SN1B
BLM03AG601SN1D
BLM03AG601SN1B
BLM03AG102SN1D
BLM03AG102SN1B
BLM03AX100SN1D
BLM03AX100SN1B
BLM03AX800SN1D
BLM03AX800SN1B
BLM03AX121SN1D
BLM03AX121SN1B
BLM03AX241SN1D
BLM03AX241SN1B
BLM03AX601SN1D
BLM03AX601SN1B
BLM03AX102SN1D
BLM03AX102SN1B
BLM03PG220SN1D
BLM03PG220SN1B
BLM03PG330SN1D
BLM03PG330SN1B
BLM03PX220SN1D
BLM03PX220SN1B
BLM03PX330SN1D
BLM03PX330SN1B
BLM03PX800SN1D
BLM03PX800SN1B
BLM03PX121SN1D
BLM03PX121SN1B
5 to 15
40 to 100
80±25％
10
70
500
200
200
200
200
100
100
0.1
0.15
0.5
0.4
80
0.4
0.5
120±25%
240±25%
600±25%
1000±25%
5～15
120
240
600
1000
10
0.5
0.6
0.8
0.9
1.5
1.6
For general
use
2.5
2.6
1000
500
450
350
250
200
900
750
0.05
0.18
0.23
0.38
0.85
1.25
0.10
0.23
0.28
0.43
0.90
1.30
80±25％
120±25％
240±25％
600±25％
1000±25％
80
120
240
600
1000
22
22±25%
33±25%
0.065 0.115
0.090 0.140
33
22±25％
33±25％
80±25％
120±25％
22
1800*1 1450*1 0.040 0.045
1500*1 1200*1 0.055 0.060
For DC
power Line
33
80
1000*1 800*1
900*1 700*1
0.130 0.135
0.160 0.210
120
MURATA MFG.CO.,LTD.
Reference Only
Spec.No.JENF243A-0020AC-01
P2/9
Impedance ()
(at 100MHz,Under Standard
Testing Condition)
DC Resistance
( max.)
Initial Values
Values After
Testing
Rated
Current
(mA)
Customer
Part Number
MURATA
Part Number
Remark
Typical
at 85℃ at 125℃
BLM03BB100SN1D
BLM03BB100SN1B
BLM03BB220SN1D
BLM03BB220SN1B
BLM03BB470SN1D
BLM03BB470SN1B
BLM03BB750SN1D
BLM03BB750SN1B
BLM03BB121SN1D
BLM03BB121SN1B
BLM03BC330SN1D
BLM03BC330SN1B
BLM03BC470SN1D
BLM03BC470SN1B
BLM03BC560SN1D
BLM03BC560SN1B
BLM03BC800SN1D
10±25%
22±25%
10
22
300
200
200
200
100
150
125
100
0.4
0.5
0.5
0.6
47±25%
47
0.7
0.8
75±25%
75
1.0
1.1
120±25%
33±25％
47±25％
56±25％
80±25％
75±25%
120
33
1.5
1.6
0.85
0.95
1.05
1.40
0.4
0.90
1.00
1.10
1.45
0.5
47
56
For high
speed
signal Line
80
100
300
250
200
215
200
170
140
BLM03BC800SN1B
BLM03BD750SN1D
BLM03BD750SN1B
BLM03BD121SN1D
BLM03BD121SN1B
BLM03BD241SN1D
BLM03BD241SN1B
BLM03BD471SN1D
BLM03BD471SN1B
BLM03BD601SN1D
BLM03BD601SN1B
BLM03BX102SN1D
BLM03BX102SN1B
BLM03BX182SN1D
BLM03BX182SN1B
75
120±25%
240±25%
470±25％
600±25％
1000±25%
1800±25%
120
240
470
600
1000
1800
0.5
0.6
0.8
0.9
1.5
1.6
1.7
1.8
1.70
2.50
1.75
2.55
■Operating Temperature : -55°C to +125°C
■Storage Temperature : -55°C to +125°C
Rated current
at 85°C
(Note) As for the Rated current marked with *1,
Rated Current is derated as right figure
depending on the operating temperature.
Rated current
at 125°C
0
85
125
Operating Temperature (°C)
MURATA MFG.CO.,LTD.
Reference Only
Spec.No.JENF243A-0020AC-01
P3/9
4.Style and Dimensions
0.6±0.03
0.3±0.03
■ Equivalent Circuit
0.15±0.05
Resistance element becomes
dominant at high frequencies.
(
)
: Electrode
■ Unit Mass(Typical value)
(in mm)
0.0003g
5.Marking
No marking.
6.Standard Testing Conditions
Unless otherwise specified
Temperature : Ordinary Temp. (15 °C to 35 °C )
In case of doubt
Temperature : 20°C±2 °C
Humidity : Ordinary Humidity (25%(RH) to 85%(RH))
Humidity : 60%(RH) to 70%(RH)
Atmospheric pressure : 86kPa to 106kPa
7.Specifications
7-1.Electrical Performance
No.
Item
Specification
Meet item 3.
Test Method
Measuring Frequency : 100MHz±1MHz
7-1-1 Impedance
Measuring Equipment : Agilent4291A or the equivalent
Test Fixture : Agilent16192A or the equivalent
Measuring Equipment : Digital multi meter
7-1-2 DC Resistance
Meet item 3.
* Except resistance of the Substrate and Wire
7-2.Mechanical Performance
No.
Item
Specification
Test Method
7-2-1 Appearance and Meet item 4.
Dimensions
Visual Inspection and measured with Measuring
Microscope.
7-2-2 Bending
Strength
Meet Table 1.
It shall be soldered on the Glass-epoxy substrate.
Substrate : 100mm40mm0.8mm
Deflection : 1.0mm
Table 1
Speed of Applying Force : 0.5mm/s
Keeping Time : 30s
Appearance No damage
Impedance
Pressure jig
Change
Within ±30%
(at 100MHz)
DC
Resistance
R340
F
Meet item 3.
Deflection
Product
45mm
45mm
7-2-3 Vibration
It shall be soldered on the substrate.
Oscillation Frequency : 10Hz to 55Hz to 10Hz for 1 min
Total Amplitude : 1.5mm
Testing Time : A period of 2 hours in each of 3 mutually
perpendicular directions. (Total 6 h)
Pre-Heating : 150°C±10°C, 60s～90s
Solder : Sn-3.0Ag-0.5Cu
7-2-4 Resistance
to Soldering
Heat
Solder Temperature : 270°C±5°C
Immersion Time : 10s±0.5s
Immersion and emersion rates : 25mm/s
Then measured after exposure in the room condition
for 48h±4h.
7-2-5 Solderability
The electrodes shall be at
least 95% covered with new
solder coating.
Flux : Ethanol solution of rosin,25(wt)%
Pre-Heating : 150°C±10°C, 60s～90s
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 240°C±5°C
Immersion Time : 3s±1s
Immersion and emersion rates : 25mm/s
MURATA MFG.CO.,LTD.
Reference Only
Spec.No.JENF243A-0020AC-01
P4/9
7-3.Environmental Performance
It shall be soldered on the substrate.
No.
Item
Specification
Meet Table 1.
Test Method
7-3-1 Temperature
Cycle
1 cycle :
1 step : -55 °C(+0 °C,-3 °C) / 30min±3min
2 step : Ordinary temp. / 10min to 15min
3 step : +125 °C(+3 °C,-0 °C) / 30min±3min
4 step : Ordinary temp. / 10min to 15min
Total of 100 cycles
Then measured after exposure in the room condition for 48h±4h.
Temperature : 40°C±2°C
7-3-2 Humidity
Humidity : 90%(RH) to 95%(RH)
Time : 1000h(+48h,-0h)
Then measured after exposure in the room condition for 48h±4h.
Temperature : 125°C±3°C
7-3-3 Heat Life
Applying Current : Rated Current (at 125℃)
Time : 1000h(+48h,-0h)
Then measured after exposure in the room condition for 48h±4h.
Temperature : -55±2°C
7-3-4 Cold Resistance
Time : 1000h(+48h,-0h)
Then measured after exposure in the room condition for 48h±4h.
8.Specification of Packaging
8-1.Appearance and Dimensions (8mm-wide paper tape)
2.0±0.05
+0.1
2.0±0.05
4.0±0.1
1.5
-0
0.55max.
0.36(Typ.)
Direction of Feed
(in mm)
(1)Taping
Products shall be packaged in the cavity of the base tape of 8mm-wide, 2mm-pitch continuously
and sealed by cover tape .
(2)Sprocket hole: The sprocket holes are to the right as the tape is pulled toward the user.
(3)Spliced point:The base tape and cover tape have no spliced point
(4)Cavity:There shall not be burr in the cavity.
(5)Missing components number
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater,
and are not continuous. The specified quantity per reel is kept.
8-2.Tape Strength
(1)Pull Strength
Cover tape
5N min.
Cover tape
Base tape
165 to 180 degree
F
(2)Peeling off force of Cover tape
0.1N to 0.6N (Minimum value is typical.)
*Speed of Peeling off:300mm/min
MURATA MFG.CO.,LTD.
Reference Only
Spec.No.JENF243A-0020AC-01
P5/9
8-3.Taping Condition
(1)Standard quantity per reel
Quantity per 180mm reel
15000 pcs. / reel
(2)There shall be leader-tape(top tape and empty tape) and trailer- tape(empty tape) as follows.
(3)On paper tape, the top tape and the base tape shall not be adhered at the tip of the empty leader tape
for more than 5 pitch.
(4) Marking for reel
The following items shall be marked on a label and the label is stuck on the reel.
(Customer part number, MURATA part number, Inspection number(1), RoHS marking(2), Quantity, etc)
1) « Expression of Inspection No. »
□□ OOOO
(1)
(2)
(3)
(1) Factory Code
(2) Date
First digit
: Year / Last digit of year
Second digit
Third, Fourth digit : Day
: Month / Jan. to Sep. 1 to 9, Oct. to Dec. O,N,D
(3) Serial No.
2) « Expression of RoHS marking »
ROHS – Y (△)
(1) (2)
(1) RoHS regulation conformity parts.
(2) MURATA classification number
(5) Outside package
These reels shall be packed in the corrugated cardboard package and the following items shall be marked on
a label and the label is stuck on the box.
(Customer name, Purchasing Order Number, Customer Part Number, MURATA part number,
RoHS marking(2) , Quantity , etc)
(6)Dimensions of reel and taping(leader-tape, trailer-tape)
Leader
Trailer
160 min.
2.0±0.5
190 min.
210 min.
Label
Empty tape Cover tape
13.0±0.2
60± 10
9± 10
13±1.4
21.0±0.8
Direction of feed
(in mm)
180±03
8-4. Specification of Outer Case
Outer Case Dimensions
(mm)
Label
Standard Reel Quantity in Outer Case
(Reel)
H
W
D
H
186
186
93
5
D
Above Outer Case size is typical. It depends on a quantity of an
order.
W
9. ！ Caution
9-1.Surge current
Excessive surge current (pulse current or rush current) than specified rated current applied to the product may
cause a critical failure, such as an open circuit, burnout caused by excessive temperature rise.
Please contact us in advance in case of applying the surge current.
MURATA MFG.CO.,LTD.
Reference Only
Spec.No.JENF243A-0020AC-01
P6/9
9-2.Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high
reliability for the prevention of defects which might directly cause damage to the third party's life, body or property.
(1)Aircraft equipment
(6)Disaster prevention / crime prevention equipment
(7)Traffic signal equipment
(8)Transportation equipment (vehicles, trains, ships, etc.)
(9) Data-processing equipment
(10)Applications of similar complexity and /or reliability
requirements to the applications listed in the above
(2)Aerospace equipment
(3)Undersea equipment
(4)Power plant control equipment
(5)Medical equipment
10. Notice
Products can only be soldered with reflow.
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
10-1.Land pattern designing
Standard land dimensions (Reflow soldering)
< For BLM03 series (except BLM03PG, BLM03PX, BLM03AX type) >
Chip Ferrite Bead
Type
a
b
c
BLM03
0.2 to 0.3 0.6 to 0.9
0.3
(except 03PG, PX, AX Type)
c
Solder Resist
Pattern
a
b
(in mm)
< For BLM03PG, BLM03PX, BLM03AX type >
Chip Ferrite Bead
Land pad thickness and
dimension d
18µm 35µm 70µm
Rated
Current
(A)
a
b
c
max.0.9
max.1.8
0.3
1.2
0.3
0.7
0.3
0.3
d
c
0.6 to 0.9
0.2 to 0.3
0.3
(in mm)
The excessive heat by land pads may cause deterioration
at joint of products with substrate.
a
b
Solder Resist
Pattern
10-2.Soldering Conditions
(1) Flux,Solder
Flux
Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. )
Do not use water-soluble flux.
Solder
Use Sn-3.0Ag-0.5Cu solder
Standard thickness of solder paste : 100 µm to 150 m
MURATA MFG.CO.,LTD.
Reference Only
Spec.No.JENF243A-0020AC-01
(2) Soldering conditions
P7/9
Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited
to 150℃ max. Also cooling into solvent after soldering should be in such a way that the temperature difference
is limited to 100℃ max.
Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality.
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting
in the deterioration of product quality.
Temp.
(℃)
260℃
230℃
Limit Profile
245℃±3℃
220℃
180
150
Standard Profile
30s～60s
60s max.
90s±30s
Time.(s)
Standard Profile
Limit Profile
Pre-heating
150～180°C 、90s±30s
above 220°C、30s～60s
245±3°C
Heating
above 230°C、60s max.
260°C,10s
Peak temperature
Cycle of reflow
2 times
2 times
10-3. Reworking with soldering iron
Pre-heating: 150°C, 1 min
Soldering iron output: 80W max.
Tip diameter:φ3mm max.
Tip temperature: 350°C max.
Soldering time : 3(+1,-0) seconds. Times : 2times max.
Note :Do not directly touch the products with the tip of the soldering iron in order to prevent the crack
on the ferrite material due to the thermal shock.
10-4.Solder Volume
Solder shall be used not to be exceeded as shown below.
Upper Limit
Recommendable
1/3T≦t≦T
t
(T:Chip thickness)
Accordingly increasing the solder volume, the mechanical stress to product is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
MURATA MFG.CO.,LTD.
Reference Only
Spec.No.JENF243A-0020AC-01
P8/9
10-5.Attention regarding P.C.B. bending
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage.
<Products direction>
a
Products shall be located in the sideways
direction (Length:ab) to the mechanical
stress.
b
Poor example
〈
〉
Good example
〈
〉
(2)Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible
to reduce stress.
Contents of Measures
Stress Level
(1) Turn the mounting direction of the component parallel to the board separation surface.
(2) Add slits in the board separation part.
(3) Keep the mounting position of the component away from the board separation surface.
A
A
A
>
D *1
B
C
>
>
C
Perforation
B
D
A
Slit
*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
(3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during
the tightening of the screw. Mount the component in a position as far away from the screw holes as possible.
Recommended
Screw Hole
10-6.Mounting density
Add special attention to radiating heat of products when mounting the inductor near the products with heating.
The excessive heat by other products may cause deterioration at joint of this product with substrate.
MURATA MFG.CO.,LTD.
Reference Only
Spec.No.JENF243A-0020AC-01
P9/9
10-7.Cleaning Conditions
Products shall be cleaned on the following conditions.
(1)Cleaning temperature shall be limited to 60°C max. (40°C max. for IPA.)
(2)Ultrasonic cleaning shall comply with the following conditions, avoiding the resonance phenomenon
at the mounted products and P.C.B.
Power:20W/ max. Frequency:28kHz to 40kHz Time:5 min max.
(3)Cleaner
1.Alternative cleaner
· Isopropyl alcohol (IPA)
2.Aqueous agent
· PINE ALPHA ST-100S
(4)There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water
in order to remove the cleaner.
(5)Other cleaning
Please contact us.
10-8. Operating Environment
Do not use this product under the following environmental conditions, on deterioration of the Insulation
Resistance of the Ferrite material and/or corrosion of Inner Electrode may result from the use.
(1) in the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.
(the sea breeze, Cl2, H2S, NH3, SO2, NO2,etc)
(2) in the atmosphere where liquid such as organic solvent, may splash on the products.
(3) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew.
10-9. Resin coating
The impedance value may change and/or it may affect on the product's performance due to high cure-stress of
resin to be used for coating / molding products. So please pay your careful attention when you select resin. In
prior to use, please make the reliability evaluation with the product mounted in your application set.
10-10. Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to
the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening
screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
10-11.Storage Conditions
(1)Storage period
Use the products within 6 months after delivered.
Solderability should be checked if this period is exceeded.
(2)Storage conditions
Products should be stored in the warehouse on the following conditions.
Temperature : -10°C to 40°C
Humidity
: 15% to 85% relative humidity
No rapid change on temperature and humidity
Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization
of electrode, resulting in poor solderability.
Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
Products should be stored under the airtight packaged condition.
(3)Delivery
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
11 .
!
Note
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2) You are requested not to use our product deviating from the reference specifications.
(3) The contents of this reference specification are subject to change without advance notice. Please approve our
product specifications or transact the approval sheet for product specifications before ordering.
MURATA MFG.CO.,LTD.
相关型号：
©2020 ICPDF网 联系我们和版权申明