BLM02BX241SN1D [MURATA]
FERRITE BEAD 240 OHM 01005 1LN;
| 型号： | BLM02BX241SN1D |
| 厂家： | 
muRata |
| 描述： | FERRITE BEAD 240 OHM 01005 1LN |
| 文件： | 总9页 (文件大小：235K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Spec.No.JENF243A-0038G-01
P1/9
Reference Only
Chip Ferrite Bead BLM02□X□□□SN1□ Reference Specification
1.Scope
This reference specification applies to Chip Ferrite Bead BLM02□X_SN Series.
2.Part Numbering
(ex.) BL
(1)
M
(2)
02
(3)
AX
(4)
121
(5) (6) (7)
S
N
1
D
(8) (9)
(1)Product ID (2)Type (3)Dimension(L×Ｗ) (4)Characteristics (5)Typical Impedance at 100MHz
(6)Performance (7)Category (8)Numbers of Circuit (9)Packaging
D:Paper Tape
E: Plastic tape
*B:Bulk
*Bulk packing also available. (A product is put in the plastic bag under the taping conditions.)
3.Rating
Impedance ()
(at 100MHz,
Under Standard
Rated
Current(mA)
Initial
at 85℃ at 125℃ Values
DC Resistance
Remark
( max.)
Customer
Part Number
MURATA
Part Number
Values
After
Testing Condition)
Testing
BLM02AX100SN1D
BLM02AX700SN1D
BLM02AX121SN1D
BLM02AX241SN1D
BLM02AX331SN1D
BLM02BX121SN1D
BLM02BX151SN1D
BLM02BX241SN1D
BLM02PX100SN1D
BLM02PX220SN1D
BLM02PX330SN1D
BLM02PX600SN1D
BLM02KX100SN1E
BLM02KX180SN1E
10±5Ω
70±25%
120±25%
240±25％
330±25％
120±25%
150±25％
240±25%
5 to15
750
300
250
200
150
0.07
0.36
0.5
0.12
0.46
0.6
For general
use
0.9
1.0
1.4
0.5
1.5
0.6
350*1
280*1
240*1
1100*1
750*1
550*1
500*1
1500*1
1200*1
240*1
200*1
160*1
850*1
550*1
400*1
350*1
1250*1
950*1
For high speed
signal line
0.7
0.8
1.1
1.2
0.05
0.11
0.20
0.25
0.03
0.045
0.10
0.16
0.25
0.30
0.08
0.095
22±25%
33±25%
60±25%
10±5Ω
For DC
power line
18±25%
■Operating Temperature : -55°C to +125°C
■Storage Temperature : -55°C to +125°C
Rated current
at 85°C
(Note) As for the Rated current marked with *1,
Rated Current is derated as right figure
depending on the operating temperature.
Rated current
at 125°C
0
85
125
Operating Temperature (°C)
MURATA MFG.CO.,LTD.
Spec.No.JENF243A-0038G-01
P2/9
Reference Only
■ Equivalent Circuit
4.Style and Dimensions
Except for BLM02KX
BLM02KX
Resistance element becomes
dominant at high frequencies.
(
)
■ Unit Mass (Typical value)
BLM02KX
：0.095mg
Except for BLM02KX ：0.08mg
(in mm)
5.Marking
No marking.
6.Standard Testing Conditions
Unless otherwise specified
Temperature : Ordinary Temp. (15 °C to 35 °C )
In case of doubt
Temperature : 20°C±2 °C
Humidity : Ordinary Humidity (25%(RH) to 85%(RH))
Humidity : 60%(RH) to 70%(RH)
Atmospheric pressure : 86kPa to 106kPa
7.Specifications
7-1.Electrical Performance
No. Item
Specification
Meet item 3.
Test Method
Measuring Frequency : 100MHz±1MHz
7-1-1 Impedance
Measuring Equipment : KEYSIGHT4291A or the equivalent
Test Fixture : KEYSIGHT16197A or the equivalent
Measuring Equipment : Digital multi meter
7-1-2 DC Resistance
Meet item 3.
* Except resistance of the Substrate and Wire
7-2.Mechanical Performance
No. Item
Specification
Test Method
7-2-1 Appearance and Meet item 4.
Dimensions
Visual Inspection and measured with Measuring
Microscope.
7-2-2 Bending
Strength
Meet Table 1.
It shall be soldered on the Glass-epoxy substrate.
Substrate : 100mm40mm0.8mm
Deflection : 1.0mm
Table 1
Speed of Applying Force : 0.5mm/s
Appearance No damage
Impedance
Keeping Time : 30s
Pressure jig
Change
(at 100MHz)
DC
Within ±30%
R340
F
Deflection
Product
Meet item 3.
Resistance
45mm
45mm
MURATA MFG.CO.,LTD.
Spec.No.JENF243A-0038G-01
P3/9
Reference Only
No. Item
Specification
Test Method
It shall be soldered on the substrate.
7-2-3 Vibration
Meet Table 1.
Oscillation Frequency : 10Hz to 2000Hz to 10Hz for 20 min
Amplitude : Total Amplitude 1.5mm or
Acceleration amplitude 196m/s2
whichever is smaller.
Testing Time : A period of 2 hours in each of 3 mutually
perpendicular directions. (Total 6 h)
Pre-Heating : 150°C~180°C, 90s±30s
Solder : Sn-3.0Ag-0.5Cu
7-2-4 Resistance
to Soldering
Heat
Heating:above 230°C,60s
(Reflow)
Peak temperture:260°C,10s
Cycle of reflow:2 times
Then measured after exposure in the room condition
for 48h±4h.
7-2-5 Solderability
The electrodes shall be at
least 95% covered with new
solder coating.
Flux : Ethanol solution of rosin,25(wt)%
Pre-Heating : 150°C±10°C, 60s～90s
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 240°C±5°C
Immersion Time : 3s±1s
Immersion and emersion rates : 25mm/s
7-3.Environmental Performance
It shall be soldered on the substrate.
No.
Item
Specification
Meet Table 1.
Test Method
7-3-1 Temperature
Cycle
1 cycle :
1 step : -55 °C(+0 °C,-3 °C) / 30min±3min
2 step : Ordinary temp. / 10min to 15min
3 step : +125 °C(+3 °C,-0 °C) / 30min±3min
4 step : Ordinary temp. / 10min to 15min
Total of 100 cycles
Then measured after exposure in the room condition for 48h±4h.
Temperature : 70°C±2°C
7-3-2 Humidity
Humidity : 90%(RH) to 95%(RH)
Time : 1000h(+48h,-0h)
Then measured after exposure in the room condition for 48h±4h.
Temperature : 125°C±3°C
7-3-3 Heat Life
Applying Current : Rated Current
Time : 1000h(+48h,-0h)
Then measured after exposure in the room condition for 48h±4h.
Temperature : -55±2°C
7-3-4 Cold Resistance
Time : 1000h(+48h,-0h)
Then measured after exposure in the room condition for 48h±4h.
8.Specification of Packaging
8-1.Appearance and Dimensions
【8mm-wide paper tape：Except for BLM02KX】
2.0±0.05
2.0±0.05
1.5+0.1
4.0±0.1
-0
0.40max.
(0.25)
(in mm)
Direction of Feed
MURATA MFG.CO.,LTD.
Spec.No.JENF243A-0038G-01
P4/9
Reference Only
【8mm-wide plastic tape：BLM02KX】
4.0±0.1
0.20±0.05
2.0±0.05
φ1.5±0.1
(0.46)
(in mm)
(0.34)
(0.225)
2.0±0.1
Paper tape
Plastic tape
Taping
Products shall be packaged in the cavity of the base Products shall be packaged in the each embossed
tape of 8mm-wide, 2mm-pitch continuously and
sealed by top tape and bottom tape.
cavity of 8mm-wide, 2mm-pitch plastic tape
continuously and sealed by cover tape.
Sprocket hole The sprocket holes are to the right as the tape is pulled toward the user.
Spliced point The base tape and top tape have no spliced point. The cover tape has no spliced point.
－
Cavity
There shall not be burr in the cavity.
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater,
Missing
components and are not continuous. The specified quantity per reel is kept.
number
8-2.Tape Strength
(1)Pull Strength
Cover tape
5N min.
(2)Peeling off force of Cover tape
0.1N to 0.7N (Minimum value is typical.)
*Speed of Peeling off:300mm/min
Case of Paper tape
Case of Plastic tape
Top tape
165 to 180 degree
F
165 to 180 degree
F
Cover tape
Plastic tape
Bottom tape
Base tape
8-3.Taping Condition
(1)Standard quantity per reel
Type
Quantity per 180mm reel
20000 pcs. / reel
BLM02AX/BLM02BX/BLM02PX
BLM02KX
15000 pcs. / reel
(2)There shall be leader-tape(top tape and empty tape) and trailer- tape(empty tape) as follows.
(3)On paper tape, the top tape and the base tape shall not be adhered at the tip of the empty leader tape
for more than 5 pitch.
MURATA MFG.CO.,LTD.
Spec.No.JENF243A-0038G-01
(4) Marking for reel
P5/9
Reference Only
The following items shall be marked on a label and the label is stuck on the reel.
(Customer part number, MURATA part number, Inspection number(1), RoHS marking(2), Quantity, etc)
1) « Expression of Inspection No. »
□□ OOOO
(1)
(2)
(3)
(1) Factory Code
(2) Date
First digit
: Year / Last digit of year
Second digit
Third, Fourth digit : Day
: Month / Jan. to Sep. 1 to 9, Oct. to Dec. O,N,D
(3) Serial No.
2) « Expression of RoHS marking »
ROHS – Y (△)
(1) (2)
(1) RoHS regulation conformity parts.
(2) MURATA classification number
(5) Outside package
These reels shall be packed in the corrugated cardboard package and the following items shall be marked on
a label and the label is stuck on the box.
(Customer name, Purchasing Order Number, Customer Part Number, MURATA part number,
RoHS marking(2) , Quantity , etc)
(6)Dimensions of reel and taping(leader-tape, trailer-tape)
Leader
Trailer
160 min.
2.0±0.5
190 min.
210 min.
Label
Empty tape Cover tape
13.0±0.2
60± 1
0
21.0±0.8
Direction of feed
9± 10
13±1.4
(in mm)
180±0
3
8-4. Specification of Outer Case
Outer Case Dimensions
(mm)
Label
Standard Reel Quantity in Outer Case
(Reel)
H
W
D
H
186
186
93
5
D
Above Outer Case size is typical. It depends on a quantity of an order.
W
9. ！ Caution
9-1.Surge current
Excessive surge current (pulse current or rush current) than specified rated current applied to the product may cause a
critical failure, such as an open circuit, burnout caused by excessive temperature rise.
Please contact us in advance in case of applying the surge current.
9-2.Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high
reliability for the prevention of defects which might directly cause damage to the third party's life, body or property.
(1)Aircraft equipment
(6)Disaster prevention / crime prevention equipment
(7)Traffic signal equipment
(8)Transportation equipment (vehicles,trains,ships,etc.)
(9) Data-processing equipment
(2)Aerospace equipment
(3)Undersea equipment
(4)Power plant control equipment
(5)Medical equipment
(10)Applications of similar complexity and /or reliability
requirements to the applications listed in the above
MURATA MFG.CO.,LTD.
Spec.No.JENF243A-0038G-01
P6/9
Reference Only
10. Notice
Products can only be soldered with reflow.
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
10-1.Land pattern designing
Standard land dimensions (Reflow soldering)
<For BLM02 series (except BLM02PX type)>
Chip Ferrite Bead
Type
a
b
c
c
0.40 to 0.56
BLM02
0.16 to 0.20
0.20 to 0.23
(in mm)
Solder Resist
Pattern
a
b
<For BLM02PX type>
Land pad thickness
and dimension d
Rated
Current
a
b
c
（A）
18μm 35μm 70μm
max.1.1 0.20 0.56 0.23
0.23
0.23
0.23
(in mm)
*The excessive heat by land pads may cause
deterioration at joint of products with substrate
10-2.Soldering Conditions
(1) Flux,Solder
Flux
Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. )
Do not use water-soluble flux.
Solder
Use Sn-3.0Ag-0.5Cu solder
Standard thickness of solder paste : 50 µm to 80 m
MURATA MFG.CO.,LTD.
Spec.No.JENF243A-0038G-01
(2) Soldering conditions
P7/9
Reference Only
Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited
to 150℃ max. Also cooling into solvent after soldering should be in such a way that the temperature difference
is limited to 100℃ max.
Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality.
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting
in the deterioration of product quality.
Temp.
(℃)
260℃
230℃
Limit Profile
245℃±3℃
220℃
180
150
Standard Profile
30s～60s
60s max.
90s±30s
Time.(s)
Standard Profile
Limit Profile
Pre-heating
150～180°C 、90s±30s
above 220°C、30s～60s
245±3°C
Heating
above 230°C、60s max.
260°C,10s
Peak temperature
Cycle of reflow
2 times
2 times
10-3.Solder Volume
Solder shall be used not to be exceed as shown below.
Upper Limit
Recommendable
1/3T≦t≦T
t
(T:Chip thickness)
Accordingly increasing the solder volume, the mechanical stress to product is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
10-4.Attention regarding P.C.B. bending
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage.
<Products direction>
a
Products shall be located in the sideways
direction (Length:ab) to the mechanical
stress.
b
Poor example
〈
〉
Good example
〈
〉
MURATA MFG.CO.,LTD.
Spec.No.JENF243A-0038G-01
(2)Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
P8/9
Reference Only
It is best to implement all of the following three measures; however, implement as many measures as possible
to reduce stress.
Contents of Measures
Stress Level
(1) Turn the mounting direction of the component parallel to the board separation surface.
(2) Add slits in the board separation part.
(3) Keep the mounting position of the component away from the board separation surface.
A
A
A
>
D *1
B
C
>
>
C
Perforation
B
D
A
Slit
*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
(3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during
the tightening of the screw. Mount the component in a position as far away from the screw holes as possible.
Recommended
Screw Hole
10-5.Mounting density
Add special attention to radiating heat of products when mounting the inductor near the products with heating.
The excessive heat by other products may cause deterioration at joint of this product with substrate.
10-6.Cleaning Conditions
Products shall be cleaned on the following conditions.
(1)Cleaning temperature shall be limited to 60°C max. (40°C max. for IPA.)
(2)Ultrasonic cleaning shall comply with the following conditions, avoiding the resonance phenomenon
at the mounted products and P.C.B.
Power:20W/ max. Frequency:28kHz to 40kHz Time:5 min max.
(3)Cleaner
1.Alternative cleaner
· Isopropyl alcohol (IPA)
2.Aqueous agent
· PINE ALPHA ST-100S
(4)There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water
in order to remove the cleaner.
(5)Other cleaning
Please contact us.
MURATA MFG.CO.,LTD.
Spec.No.JENF243A-0038G-01
P9/9
Reference Only
10-7. Operating Environment
Do not use this product under the following environmental conditions, on deterioration of the Insulation Resistance of
the Ferrite material and/or corrosion of Inner Electrode may result from the use.
(1) in the corrodible atmosphere (acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.)
(2) in the atmosphere where liquid such as organic solvent, may splash on the products.
(3) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew.
10-8. Resin coating
When products are coated with resin, please contact us in advance.
10-9. Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the
substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to
the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
10-10.Storage Conditions
(1)Storage period
Use the products within 6 months after delivered.
Solderability should be checked if this period is exceeded.
(2)Storage conditions
Products should be stored in the warehouse on the following conditions.
Temperature : -10°C to 40°C
Humidity
: 15% to 85% relative humidity
No rapid change on temperature and humidity
Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization
of electrode, resulting in poor solderability.
Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
Products should be stored under the airtight packaged condition.
(3)Delivery
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
11.
!
Note
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2)You are requested not to use our product deviating from the reference specifications.
(3)The contents of this reference specification are subject to change without advance notice. Please approve our
product specifications or transact the approval sheet for product specifications before ordering.
MURATA MFG.CO.,LTD.
相关型号：
©2020 ICPDF网 联系我们和版权申明