MSK111E [MSK]
HIGH SPEED POWER AMPLIFIER; 高速功率放大器型号: | MSK111E |
厂家: | M.S. KENNEDY CORPORATION |
描述: | HIGH SPEED POWER AMPLIFIER |
文件: | 总5页 (文件大小:234K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
ISO 9001 CERTIFIED BY DSCC
HIGH SPEED
POWER AMPLIFIER
111
(315) 701-6751
M.S.KENNEDY CORP.
4707 Dey Road Liverpool, N.Y. 13088
MIL-PRF-38534 CERTIFIED
FEATURES:
Replaces Apex WA-01
Internal 1.5KΩ Feedback Resistor
High Output Current: 400mA
ꢀery Fast Slew Rate: 3000ꢀ/µS
Fast Settling Time
Low Offset ꢀoltage: ± 5mꢀ
Offset Null Capability
DESCRIPTION:
The MSK 111 is a high speed operational amplifier which utilizes low impedance push-pull circuitry to achieve high
speed amplification. Laser trimmed offset voltage provides a high DC accuracy typically less than ± ±mꢀ. The
MSK 111 also offers an external offset null capability for applications in which zero offset is critical. The speed and
output current offered by the MSK 111 makes it an excellent choice for video processing circuits and high speed test
circuits. The MSK 111 is packaged in a hermetically sealed 8 pin TO-3 package.
EQUIVALENT SCHEMATIC
PIN-OUT INFORMATION
TYPICAL APPLICATIONS
Output
+ꢀCC
NC
8 Balance
7 -ꢀCC
1
±
3
4
Sample and Hold Circuits
ꢀideo Processing
Line Drivers
6 +Input
5 -Input
Balance
Function Generators
Rev. B 10/05
1
7
ABSOLUTE MAXIMUM RATINGS
TST
Storage Temperature Range
Lead Temperature Range
(10 Seconds)
Total Supply ꢀoltage
Output Current
3±ꢀ
0.4A
± 6ꢀ
ꢀCC
-65°C to +150°C
300°C
TLD
IOUT
ꢀIN
ꢀIN
Differential Input ꢀoltage
Common Mode Input ꢀoltage
TC
TJ
Case Operating Temperature
MSK111
MSK111H/E
± ꢀCC
-40°C to +85°C
-55°C to +1±5°C
175°C
Junction Temperature
ELECTRICAL SPECIFICATIONS
Group A
MSK 111H/E
MSK 111
1
Parameter
Units
Test Conditions
Subgroup Min.
Max.
Typ.
Min.
Max.
Typ.
STATIC
Supply Voltge Range
2
V
-
± 12
± 16
± 30
± ±0
± 1±
± 28
-
± 12
± 16
± 3±
-
± 1±
± 28
-
mA
mA
1
-
-
-
-
Quiescent Current
INPUT
VIN=0V
VIN=0V
2,3
mV
mV
µA
dB
1
2,3
1
-
-
± ±
± 0.±
-
-
-
± 10
± 0.±
-
Input Offset Voltage
± 30
-
30
-
2
Input Bias Current
-
±
20
-
±
Common Mode Rejection 2
Power Supply Rejection 2
VCM=± ±V
4
48
60
-
-
±4
7±
48
60
±4
7±
VCC=24V to 30V
dB
1
-
OUTPUT
Output Voltage Swing
Output Current
f=1KHz RL=1KΩ
f=1KHz RL=±0Ω
VO=20VPP
V
mA
4
4
-
± 10
-
± 11
-
± 10
-
± 11
-
400
-
400
-
2
Power Bandwidth
MHz
nS
-
40
-
-
40
-
2
Settling Time
Slew Rate
10V Step
-
-
-
20
-
-
20
VOUT=± 10V RL=1KΩ
TC=2±°C
V/µS
nS
4
-
2±00
-
3000
2.9
31
2±00
-
3000
2.9
3±
Propagation Delay 2
Thermal Resistance
-
-
-
-
-
Junction to Case @ 12±°C
Rf
2
°C/W
KΩ
-
-
-
-
Internal Feedback Resistor
-
1.497
1.±03
1.±
1.49±
1.±0±
1.±
NOTES:
1
2
Unless otherwise specified, VCC= 15V AV=10V/V and RL=∞ and Tc=25°C.
Guaranteed by design but not tested. Typical parameters are representative of actual device
performance but are for reference only.
30
3
4
5
6
Industrial grade and "E" suffix devices shall be tested to subgroups 1 and 4 unless otherwise specified.
Military grade devices ("H" suffix) shall be 100% tested to subgroups 1,2,3 and 4.
Subgroup 5 and 6 testing available upon request.
Subgroup 1,4 TA=TC=+25°C
Subgroup 2,5 TA=TC=+125°C
Subgroup 3,6 TA=TC=-55°C
Continuous operation at or above absolute maximum ratings may adversely effect the device performance and/or life cycle.
7
Rev. B 10/05
2
APPLICATION NOTES
POWER SUPPLY BYPASSING
HEAT SINKING
To select the correct heat sink for your application, refer
to the thermal model and governing equation below.
Both the negative and the positive supplies must be
effectively decoupled with a high and low frequency
bypass circuit to avoid power supply induced oscilla-
tion. An effective decoupling scheme consists of a 0.01
microfarad ceramic capacitor in parallel with a 4.7 mi-
crofarad tantalum capacitor from each power supply pin
to ground. All power supply decoupling capacitors should
be placed as close to the package power supply pins as
possible.
Thermal Model:
Output, power supply, and bypass leads should be kept
as short as possible. Long connections can add signifi-
cant inductance, raising impedance and limiting output
current slew rate. This is especially true in the video
frequency range.
The case of the MSK 111 is electrically isolated and
should be connected to a common ground plane. In ad-
dition to the case, the input signal and input resistors
should be connected to this common ground plane us-
ing a single point grounding scheme. This will help to
prevent undesired current feedback that can cause in-
stability in the circuit.
Governing Equation:
TJ = PD x (RθJC + RθCS + RθSA) + TA
Where
GAIN
The MSK 111, unlike most operational amplifiers, has
an internal feedback resistor. The value of this resistor
is 1.5KΩ. Fewer external components are required to
configure the MSK 111 in either inverting or non-invert-
ing modes. Using an internal feedback resistor shortens
the feedback path, lowering summing node capacitance
to ground and stabilizing high frequency characteristics.
TJ
PD
= Junction Temperature
= Total Power Dissipation
RθJC = Junction to Case Thermal Resistance
RθCS = Case to HeaItNSink Thermal Resistance
RθSA = Heat Sink to Ambient Thermal Resistance
TC
TA
TS
= Case Temperature
= Ambient Temperature
= Sink Temperature
OUTPUT OFFSET NULL
Typically,the MSK 111 has an input offset voltage of
less than ± ±mꢀ. The input offset voltage is laser
trimmed to less than ± 5mꢀ, but in applications where
offset is critical, the balance pins may be used to null
the offset to zero. A ±0KΩ potentiometer may be placed
between pins 4 and 8 with the wiper arm connected to
+ꢀCC. If the balance function is not used pins 4 and 8
should not be connected (floating). However, if settling
time is extremely important, pin 8 should be tied to the
AC ground with a 100-150pF capacitor.
Example:
In our example the amplifier application requires the output
to drive a 10 volt peak sine wave across a 50 ohm load for
0.± amp of output current. For a worst case analysis we will
treat the 0.± amp peak output current as a D.C. output cur-
rent. The power supplies are ± 15 ꢀDC.
1.) Find Power Dissipation
PD=[(quiescent current) x (+ꢀCC - (ꢀCC))] + [(ꢀS - ꢀO) x IOUT]
=(±8 mA) x (30ꢀ) + (5ꢀ) x (0.±A)
=0.84W + 1W
SAFE OPERATING AREA-POWER DISSIPATION
=1.84W
The safe operating area curve is a graphical represen-
tation of the power handling capability of the amplifier
under various conditions. The wire bond current carry-
ing capability, transistor junction temperature and sec-
ondary breakdown limitations are all incorporated into
the safe operating area curves. All applications should
be checked against the S.O.A. curves to ensure high
M.T.B.F.
±.) For conservative design, set TJ = +150°C.
3.) For this example, worst case TA = +±5°C.
4.) RθJC = 31°C/W
5.) Rearrange governing equation to solve for RθSA:
RθSA = (TJ - TA) / PD - (RθJC) - (RθCS)
= (150°C-±5°C)/1.84W-(31°C/W)-(0.15°C/W)
= 36°C/W
The heat sink in this example must have a thermal resis-
tance of no more than 36°C/W to maintain a junction tempera-
ture of less than +150°C. This calculation assumes a case to
sink thermal resistance of 0.15°C/W.
Rev. B 10/05
3
TYPICAL PERFORMANCE CURVES
Rev. B 10/05
4
MECHANICAL SPECIFICATIONS
CONTAINS INTERNAL BeO (BERYLLIUM OXIDE)
WEIGHT = 15 GRAMS TYPICAL
NOTE: ALL DIMENSIONS ARE ± 0.010 INCHES UNLESS OTHERWISE LABELED
ORDERING INFORMATION
Part
Screening Level
Number
Industrial
MSK111
EXTENDED RELIABILITY
MIL-PRF-38534 CLASS H
MSK111E
MSK111H
M.S. Kennedy Corp.
4707 Dey Road, Liverpool, New York 13088
Phone (315) 701-6751
FAX (315) 701-6752
www.mskennedy.com
The information contained herein is believed to be accurate at the time of printing. MSK reserves the right to make
changes to its products or specifications without notice, however, and assumes no liability for the use of its products.
Please visit our website for the most recent revision of this datasheet.
5
Rev. B 10/05
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