MP8007GV-P [MPS]

FULLY-INTEGRATED 802.3AF-COMPATI;
MP8007GV-P
型号: MP8007GV-P
厂家: MONOLITHIC POWER SYSTEMS    MONOLITHIC POWER SYSTEMS
描述:

FULLY-INTEGRATED 802.3AF-COMPATI

文件: 总27页 (文件大小:1181K)
中文:  中文翻译
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MP8007  
Fully-Integrated 802.3af-Compatible PoE  
PD Interface with 13W Primary-side  
Regulated Flyback or Buck Converter  
The Future of Analog IC Technology  
DESCRIPTION  
FEATURES  
The MP8007 is an integrated IEEE 802.3af  
compatible PoE Powered Device with PD  
interface and power converter. It is targeted for  
isolated or non-isolated 13W PoE application.  
Compatible with 802.3af Specifications  
Support 13W PoE Power Application  
100V 0.48PD Integrated Pass Switch  
120mA PD Inrush Current  
840mA PD Operation Current Limit  
Auxiliary Adaptor ORing Power Supply  
Integrated 180V Switching Power MOSFET  
Supports Primary-Side Regulated Flyback  
without Opto-Coupler Feedback  
Supports Low-side Switch Buck Converter  
Up to 3A Programmable Switching Current  
Limit  
The PD interface has all the functions of IEEE  
802.3af, including detection, classification,  
120mA inrush current, 840mA operation current  
limit as well as 100V Hot-swap MOSFET.  
The DCDC converter uses fixed peak current  
and  
variable  
frequency  
discontinuous  
conduction mode (DCM) to regulate constant  
output voltage. The primary-side regulation  
without opto-coupler feedback in flyback mode  
simplifies the design while buck mode  
continues minimizes the solution size for non-  
isolated applications. A 180V integrated power  
MOSFET optimizes the device for various wide  
voltage applications.  
OLP, OVP, Open-Circuit, and Thermal  
Protection  
Minimal External Components  
Available in QFN-28 (4mmx5mm) Package  
APPLICATIONS  
IEEE 802.3af-Compliant Devices  
Security Camera  
VoIP Phones  
WLAN Access Points  
IoT Devices  
The MP8007 features protection including over  
current protection, over voltage protection, open  
circuit protection and thermal shutdown.  
The MP8007 can support a front-end solution  
for PoE-PD application with minimum external  
component, it is available in QFN-28  
(4mmX5mm) package.  
All MPS parts are lead-free, halogen free, and adhere to the RoHS directive. For  
MPS green status, please visit MPS website under Quality Assurance.  
“MPS” and “The Future of Analog IC Technology” are Registered Trademarks  
of Monolithic Power Systems, Inc.  
TYPICAL APPLICATION  
90  
85  
80  
75  
70  
65  
60  
55  
50  
45  
40  
10  
100  
1000  
MP8007 Rev.1.0  
6/27/2016  
www.MonolithicPower.com  
MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.  
© 2016 MPS. All Rights Reserved.  
1
MP8007 IEEE 802.3AF PD WITH 13W FLYBACK / BUCK CONVERTER  
ORDERING INFORMATION  
Part Number*  
Package  
Top Marking  
MP8007GV  
QFN-28 (4mm X 5mm)  
See blew  
* For Tape & Reel, add suffix –Z (e.g. MP8007GV–Z)  
TOP MARKING  
MPS: MPS prefix:  
Y: year code;  
WW: week code:  
MP8007: part number;  
LLLLLL: lot number;  
PACKAGE REFERENCE  
TOP VIEW  
MP8007 Rev.1.0  
6/27/2016  
www.MonolithicPower.com  
MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.  
© 2016 MPS. All Rights Reserved.  
2
MP8007 IEEE 802.3AF PD WITH 13W FLYBACK / BUCK CONVERTER  
Thermal Resistance (8)  
QFN-28 (4mmx5mm) ……. .40  
θJA  
θJC  
9 °C/W  
ABSOLUTE MAXIMUM RATINGS (1)  
Pins Voltage Respects to VSS: (2)  
VDD, RTN, DET, T2P, AUX, GND, AGND  
..............................................-0.3V to +100V  
CLASS, FTY ................................-0.3V to +6.5V  
Pins Voltage Respects to GND(2):  
VDD ............................................-0.3V to +100V  
SW..............................................-0.7V to +180V  
FB1 ...........................................-0.7V to +6.5V(3)  
VCC(4), MODE, ILIM, PG..............-0.3V to +6.5V  
Pins Voltage Respects to VDD:  
Notes:  
1) Exceeding these ratings may damage the device.  
2) GND and AGND must be connected to RTN  
3) Refer to the “Converter Output Voltage Setting” section.  
4) VCC voltage can be pulled higher than this rating, but the  
external pull-up current should be limited. Refer to “VCC  
sinking current” rating and “VCC Power Supply Setting”  
section.  
5) When VDD to Adapter-ground voltage is high, AUX-VDD  
voltage may exceed -6.5V if the divider resistor is not  
appropriate, in this condition VDD will clamp the -6.5V voltage  
on AUX pin, but the current should be limited by external  
resistor.  
6) The maximum allowable power dissipation is a function of the  
maximum junction temperature TJ (MAX), the junction-to-  
ambient thermal resistance θJA, and the ambient temperature  
TA. The maximum allowable continuous power dissipation at  
any ambient temperature is calculated by PD (MAX) = (TJ  
(MAX)-TA)/θJA. Exceeding the maximum allowable power  
dissipation produces an excessive die temperature, causing  
the regulator to go into thermal shutdown. Internal thermal  
shutdown circuitry protects the device from permanent  
damage.  
AUX, FB2.....................................-6.5V to +0.3V  
Pins Current:  
T2P ........................................................... 10mA  
VCC Sinking Current............................ 1.5 mA(4)  
AUX Sinking Current.............................. -5 mA(5)  
FB1 Sinking Current.............................. ±1 mA(3)  
(6)  
Continuous Power Dissipation (TA=+25)  
QFN28 4X5……………………….…..……3.12W  
Junction Temperature...............................150C  
Lead Temperature ....................................260C  
Storage Temperature............... -65C to +150C  
7) The device is not guaranteed to function outside of its  
operating conditions.  
8) Measured on JESD51-7, 4-layer PCB.  
Recommended Operating Conditions (7)  
Supply Voltage VDD .............................0V to 57V  
Switching Voltage VSW ................-0.5V to +150V  
Maximum T2P Current................................ 5mA  
Maximum VCC Sinking Current............ 1.2mA(4)  
Maximum AUX Sinking Current ............. -3 mA(5)  
Maximum FB1 Sinking Current.......... ±0.5 mA(3)  
Maximum Switching Frequency............ 200 kHz  
Maximum Switching Current Limit ................. 3A  
Operating Junction Temp. (TJ). -40°C to +125°C  
MP8007 Rev.1.0  
6/27/2016  
www.MonolithicPower.com  
MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.  
© 2016 MPS. All Rights Reserved.  
3
MP8007 IEEE 802.3AF PD WITH 13W FLYBACK / BUCK CONVERTER  
ELECTRICAL CHARACTERISTICS  
VDD, CLASS, DET, T2P and RTN voltages are referred to VSS, and all other pin voltages are  
referred to GND, GND and RTN are shorted together. VDD – VSS = 48V, VSS = 0V; RDET = 24.9k,  
RCLASS =41.2. TJ = -40°C to +125°C, typical values are tested at TJ = 25C, unless otherwise  
noted.  
PD Interface Section  
Parameter  
Symbol Condition  
Min  
Typ  
Max  
Units  
Detection  
Detection on  
Detection off  
DET Leakage Current  
VDET-ON VDD Rising  
1.9  
11  
V
V
VDET-OFF VDD Rising  
VDET-LK VDET=VDD=57V, Measure IDET  
0.1  
5
μA  
V
DD=10.1V, float DET pin, not in  
Bias Current  
12  
μA  
Mark event, Measure ISUPPLY  
VDD=2.5V, Measure ISUPPLY  
VDD=10.1V, Measure ISUPPLY  
96  
99  
102  
425  
μA  
μA  
Detection Current  
IDET  
395  
410  
Classification  
Classification Stability Time  
90  
μs  
13V<VDD< 21V  
1mA<ICLASS< 42mA  
VCLASS Output Voltage  
VCLASS  
1.1  
1.16  
1.21  
V
13VVDD21V, Guaranteed by VCLASS  
RCLASS=578, 13VVDD21V  
RCLASS=110, 13VVDD21V  
1.8  
9.9  
2
2.4  
10.55  
18.7  
28.15  
40.4  
11.3  
19.8  
29.7  
42.6  
Classification Current  
ICLASS  
mA  
RCLASS=62, 13VVDD21V  
RCLASS=41.2, 13VVDD21V  
RCLASS=28.7, 13VVDD21V  
17.7  
26.6  
38.2  
Classification Lower  
Threshold  
Class Regulator Turns on, VDD  
Rising  
VCL-ON  
VCL-OFF  
VCL-HYS  
11.8  
21  
12.5  
22  
13  
23  
V
V
V
Classification Upper  
Threshold  
Class Regulator Turns off, VDD  
Rising  
Low side Hysteresis  
High side Hysteresis  
0.8  
0.5  
5
Classification Hysteresis  
Mark Event Reset Threshold VMARK-L  
4.5  
11  
5.5  
12  
2
V
V
Max Mark Event Voltage  
Mark Event Current  
VMARK-H  
IMARK  
11.5  
1.5  
0.5  
mA  
kΩ  
Mark Event Resistance  
RMARK 2-point Measure at 7V and 10V  
IIN-CLASS VDD = 17.5V, CLASS Floating  
ILEAKAGE VCLASS = 0 V, VDD = 57V  
12  
IC Supply Current during  
Classification  
220  
300  
1
μA  
μA  
Class Leakage Current  
PD UVLO  
VDD Turn on Threshold  
VDD Turn off Threshold  
VDD-VSS-R VDD Rising  
VDD-VSS-F VDD Falling  
35  
29  
37.5  
31  
40  
33  
V
V
VDD-VSS-  
VDD UVLO Hysteresis  
4.9  
V
HYS  
IC Supply Current during  
Operation  
IIN  
450  
μA  
MP8007 Rev.1.0  
www.MonolithicPower.com  
4
6/27/2016  
MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.  
© 2016 MPS. All Rights Reserved.  
MP8007 IEEE 802.3AF PD WITH 13W FLYBACK / BUCK CONVERTER  
ELECTRICAL CHARACTERISTICS (continued)  
VDD, CLASS, DET, T2P and RTN voltages are referred to VSS, and all other pin voltages are  
referred to GND, GND and RTN are shorted together. VDD – VSS = 48V, VSS = 0V; RDET = 24.9k,  
RCLASS =41.2. TJ = -40°C to +125°C, typical values are tested at TJ = 25C, unless otherwise  
noted.  
PD Interface Section  
Parameter  
Symbol Condition  
Min  
Typ  
Max  
Units  
Pass Device and Current Limit  
On Resistance  
RON-RTN IRTN=600mA  
0.48  
1
Leakage Current  
V
DD=VRTN=57V  
15  
μA  
IRTN-LK  
ILIMIT  
IINRUSH VRTN=2V  
VRTN Falling  
Current Limit  
VRTN=1V  
720  
80  
840  
120  
1.2  
920  
mA  
mA  
V
Inrush Current Limit  
Inrush Current Termination  
Inrush to Operation Mode  
Delay  
TDELAY  
100  
10  
1
ms  
V
Current Fold-back Threshold  
VRTN Rising  
RTN Rising to Inrush Current  
V
Fold-back Deglitch Time  
ms  
Fold-back  
T2P  
T2P Output Low Voltage  
IT2P=2mA, respect to VSS  
VT2P=48V  
0.1  
0.3  
1
V
T2P Output High Leakage  
Current  
μA  
AUX  
AUX High Threshold  
Voltage(9)  
Respect to VDD  
-2.3  
2
V
AUX Low Threshold  
Voltage(9)  
Respect to VDD  
VDD -VAUX=6V  
-0.6  
V
AUX Leakage Current  
PG  
μA  
PG Output High Voltage  
PG pin floating  
5.5  
30  
V
PG is logic high, pull down PG  
pin to 0V  
Source Current Capability  
PG Pull Down Resistance  
μA  
PG is logic low, pull up PG pin  
to 1V  
460  
kΩ  
V
PG High-Level Voltage to  
Enable DCDC Converter  
VPG-EN-H  
VPG-EN-L  
3.9  
PG Low-Level Voltage to  
Disable DCDC Converter  
1.3  
V
PD Thermal Shutdown  
Thermal Shut down  
Temperature(10)  
TPD-SD  
150  
20  
ºC  
ºC  
Thermal Shut down  
Hysteresis(10)  
TPD-HYS  
MP8007 Rev.1.0  
www.MonolithicPower.com  
5
6/27/2016  
MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.  
© 2016 MPS. All Rights Reserved.  
MP8007 IEEE 802.3AF PD WITH 13W FLYBACK / BUCK CONVERTER  
ELECTRICAL CHARACTERISTICS (continued)  
VDD, CLASS, DET, T2P and RTN voltages are referred to VSS, and all other pin voltages are  
referred to GND, GND and RTN are shorted together. VDD – VSS = 48V, VSS = 0V; RDET = 24.9k,  
RCLASS =41.2. TJ = -40°C to +125°C, typical values are tested at TJ = 25C, unless otherwise  
noted.  
DCDC Converter Section  
Parameter  
Symbol Condition  
Min  
Typ  
Max  
Units  
Converter Power Supply and UVLO  
Converter VDD UVLO  
Rising Threshold  
VDD-RTN-R PG-RTN=5V, Test VDD-RTN  
VDD-RTN-F PG-RTN=5V, Test VDD-RTN  
10.5  
11.6  
12.8  
V
Converter VDD UVLO  
Falling Threshold  
VCC Regulation(11)  
7.4  
4.8  
4.3  
8.2  
5.4  
4.7  
9
V
V
V
VCC  
Load = 0mA to 10mA  
5.9  
5.1  
VCC UVLO Rising  
Threshold(11)  
VDD is higher than UVLO, VCC  
rising  
VCC-R  
VCC UVLO Falling  
Threshold(11)  
VDD is higher than UVLO, VCC  
falling  
VCC-F  
IQ  
4
4.5  
4.8  
V
VFB1 = 2.2 V, VFB2 = VDD, Test  
Quiescent Current  
0.87  
mA  
supply from VDD to VSS  
Voltage Feedback  
Respect to GND, TJ = 25°C  
1.94  
1.93  
1.99  
1.99  
10  
2.04  
2.05  
50  
V
V
FB1 Reference Voltage  
VREF1  
IFB1  
Respect to GND, TJ = -40°C to  
+125°C  
FB1 Leakage Current  
Respect to GND, VFB1 = 2V  
nA  
mV  
Flyback Mode DCM Detect  
Threshold on FB1  
VDCM1 Respect to GND  
25  
50  
75  
FB1 Open-circuit Threshold VFB1OPEN  
-90  
-60  
-20  
mV  
FB1 OVP Threshold  
VFB1OVP  
120%  
125%  
130%  
VREF1  
Minimum Diode Conduction  
Time for FB1 Sample  
TSAMPLE  
1.4  
2.2  
-1.88  
-1.88  
10  
3
-1.805  
-1.8  
50  
μs  
V
Respect to VDD, TJ = 25°C  
-1.955  
-1.96  
FB2 Reference Voltage  
VREF2  
IFB2  
Respect to VDD, TJ = -40°C to  
+125°C  
V
FB2 Leakage Current  
Respect to VDD, VFB2 = -2V  
nA  
V
Buck Mode DCM Detect  
Threshold on SW  
VDCM2 Respect to VDD  
RON-SW VCC = 5.4V  
0
0.14  
Switching Power Device  
On Resistance  
0.8  
Current Sense  
Switching Current Limit  
ILIMIT  
TLEB  
RILIM = 53.6k, L = 47μH  
1.85  
2.05  
450  
2.25  
A
Switching Current Leading-  
edge Blanking Time  
ns  
MP8007 Rev.1.0  
www.MonolithicPower.com  
6
6/27/2016  
MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.  
© 2016 MPS. All Rights Reserved.  
MP8007 IEEE 802.3AF PD WITH 13W FLYBACK / BUCK CONVERTER  
ELECTRICAL CHARACTERISTICS (continued)  
VDD, CLASS, DET, T2P and RTN voltages are referred to VSS, and all other pin voltages are  
referred to GND, GND and RTN are shorted together. VDD – VSS = 48V, VSS = 0V; RDET = 24.9k,  
RCLASS =41.2. TJ = -40°C to +125°C, typical values are tested at TJ = 25C, unless otherwise  
noted.  
DCDC Converter Thermal Shutdown  
Thermal Shutdown  
TSD  
150  
20  
ºC  
ºC  
Temperature(10)  
Thermal Shutdown  
Hysteresis(10)  
THYS  
9) If VDD-AUX>2.3V, IC enable adapter input, if VDD-AUX<0.6V, IC enable PSE input. Refer to "Wall adaptor detection and operation"  
section for AUX setting.  
10) Guaranteed by characterization, not tested in production.  
11) The maximum VCC UVLO rising threshold is higher than the minimum VCC regulation in the EC table due to production distribution.  
However, for one unit, VCC regulation is higher than the VCC UVLO rising threshold. The VCC UVLO rising threshold is about 87 percent  
of the VCC regulation voltage, and the VCC UVLO falling threshold is about 83 percent of the VCC regulation voltage in one unit.  
MP8007 Rev.1.0  
6/27/2016  
www.MonolithicPower.com  
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© 2016 MPS. All Rights Reserved.  
7
MP8007 IEEE 802.3AF PD WITH 13W FLYBACK / BUCK CONVERTER  
TYPICAL CHARACTERISTICS  
VIN = 48V, VOUT = 12V, IOUT = 1A, TA = 25°C, unless otherwise noted.  
MP8007 Rev.1.0  
6/27/2016  
www.MonolithicPower.com  
MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.  
© 2016 MPS. All Rights Reserved.  
8
MP8007 IEEE 802.3AF PD WITH 13W FLYBACK / BUCK CONVERTER  
TYPICAL CHARACTERISTICS (continued)  
VIN = 48V, VOUT = 12V, IOUT = 1A, TA = 25°C, unless otherwise noted.  
MP8007 Rev.1.0  
6/27/2016  
www.MonolithicPower.com  
MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.  
© 2016 MPS. All Rights Reserved.  
9
MP8007 IEEE 802.3AF PD WITH 13W FLYBACK / BUCK CONVERTER  
TYPICAL PERFORMANCE CHARACTERISTICS  
VIN = 48V, VOUT = 12V, IOUT = 1A, TA = 25°C, unless otherwise noted.  
MP8007 Rev.1.0  
6/27/2016  
www.MonolithicPower.com  
MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.  
© 2016 MPS. All Rights Reserved.  
10  
MP8007 IEEE 802.3AF PD WITH 13W FLYBACK / BUCK CONVERTER  
TYPICAL PERFORMANCE CHARACTERISTICS (continued)  
VIN = 48V, VOUT = 12V, IOUT = 1A, TA = 25°C, unless otherwise noted.  
I
= 10mA  
I
= 1A  
OUT  
OUT  
V
/AC  
OUT  
1V/div.  
V
V
OUT  
OUT  
5V/div.  
5V/div.  
V
V
IN  
IN  
50V/div.  
50V/div.  
V
V
SW  
SW  
50V/div.  
50V/div.  
I
OUT  
500mA/div.  
I
I
PRI  
PRI  
2A/div.  
2A/div.  
V
/AC  
OUT  
V
OUT  
200mV/div.  
V
OUT  
5V/div.  
V
2V/div.  
5V/div.  
FB1  
V
IN  
50V/div.  
V
SW  
V
SW  
50V/div.  
50V/div.  
I
OUT  
500mA/div.  
I
I
PRI  
PRI  
2A/div.  
2A/div.  
V
OUT  
5V/div.  
V
FB1  
2V/div.  
V
SW  
50V/div.  
I
PRI  
2A/div.  
MP8007 Rev.1.0  
6/27/2016  
www.MonolithicPower.com  
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© 2016 MPS. All Rights Reserved.  
11  
MP8007 IEEE 802.3AF PD WITH 13W FLYBACK / BUCK CONVERTER  
PIN FUNCTIONS  
PIN#  
Name  
AUX  
DET  
N/C  
Description  
Auxiliary power input detector. Use this pin for adaptor power supply application.  
Drive VDD-AUX higher than 2.3V to disable hot-swap MOSFET and CLASS pin  
function, and force T2P and PG active.  
1
2
Connect 24.9kresistor between VDD and DET for PoE detection.  
3, 11, 14,  
15, 19, 22,  
28  
Not connected internally, can be connected to GND pin and exposed thermal pad in  
layout.  
4
VDD  
FB2  
Positive power supply terminal from PoE input power rail.  
Feedback pin for non-isolated buck solution. Connect FB2 to VDD in flyback  
application  
5
Buck mode or flyback mode select pin. MODE is pulled up internally to VCC through  
6
MODE a 1.5µA current source. Float MODE for buck application mode; connect MODE to  
GND for flyback application mode.  
7
8
FB1  
Feedback for fly-back solution. Connect FB1 to GND in buck application  
DCDC converter switching current limit program pin. Connect ILIM to GND through a  
resistor to program the peak current limit.  
ILIM  
Analog power return for DCDC converter control circuit. Connect to GND through  
single point.  
9
AGND  
Supply bias voltage pin, powered through internal LDO from VIN. It is recommended  
to connect a capacitor (no less than 1µF) between VCC and GND.  
10  
VCC  
SW  
12,13  
16,17  
Drain of converter switching MOSFET.  
Switching converter power return. Connect to RTN for PoE power supply. Exposed  
thermal pad can be connected to GND plane for heat sink.  
GND  
PD supply power good indicator. This signal will enable the DCDC converter  
internally. It is pulled up by internal current source in output high condition, suggest  
float it in application.  
18  
PG  
20,21  
23,24  
25  
RTN  
VSS  
FTY  
Drain of PD Hot-swap MOSFET, connect GND and AGND to this pin.  
Negative power supply terminal from PoE input power rail.  
Factory use only, must be connected to VSS in application.  
26  
CLASS Connect resistor from CLASS to VSS to program classification current.  
Type 2 PSE indicator, open-drain output. Pulled low to VSS indicates the presence of  
a Type-2 PSE or AUX is enabled.  
27  
T2P  
MP8007 Rev.1.0  
6/27/2016  
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12  
MP8007 IEEE 802.3AF PD WITH 13W FLYBACK / BUCK CONVERTER  
FUNCTION DIAGRAM  
VDD  
AUX  
Detection  
2.7V - 10.1V  
Inrush and  
Current Limit  
DET  
T2P  
Startup Delay  
Control  
VSS  
Classification  
14.5V – 20.5V  
CLASS  
Control Logic  
and  
0/30μA  
Gate Driver  
PG  
Mark Event  
6.9V – 10.1V  
5.5V  
Current /  
Voltage Sense  
VSS  
VCC  
RTN  
Power Supply  
Management  
DCDC Enable  
FB1  
DCM Detection  
SW  
Feedback  
Sampling  
Driver  
Management  
Protection  
FB2  
Current Sense  
ILIMT Program  
GND  
AGND  
MODE  
ILIM  
Figure 1: Functional Block Diagram  
MP8007 Rev.1.0  
6/27/2016  
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13  
MP8007 IEEE 802.3AF PD WITH 13W FLYBACK / BUCK CONVERTER  
OPERATION  
Compared with IEEE802.3af, the IEE802.3at  
standard establishes a higher power allocation  
for Power-over-Ethernet while maintaining  
backwards compatibility with the existing  
converter. The PD interface also has 802.3at  
function, but DCDC converter only support 13  
W output, so MP8007 is only used for 802.3af  
power design. Along with the PSE it operates  
as a safety device to supply voltage only when  
the power sourcing equipment recognizes a  
unique, tightly specified resistance at the end of  
an unknown length of Ethernet cable. After  
powered from PSE, the MP8007 will regulate  
the output voltage based on application with  
isolated or non-isolated topology. Figure 1  
shows the function diagram of this device, and  
Figure 2 shows typical PD interface power  
operation sequence.  
IEEE802.3af  
systems.  
Power  
Sourcing  
Equipments (PSE) and Powered Devices (PD)  
are distinguished as Type-1 complying with the  
IEEE 802.3af power levels, or Type-2  
complying with the IEEE 802.3at power levels.  
IEEE802.3af/at standard establishes a method  
of communication between PD and PSE with  
detection, classification and mark event.  
The MP8007 is one integrated PoE solution  
with IEEE 802.3af PD interface and 13W DCDC  
Figure 2: PD Interface Operation Description  
Detection  
The detection resistance seen from PI is the  
result of the input bridge resistance in series  
with the VDD loading. The input bridge  
resistance is partially cancelled by MP8007  
effective leakage resistance during detection.  
The RDET connected between DET and VDD pin  
is presented as a load to the PSE in the  
Detection Mode, when the PSE applies two  
“safe” voltages between 2.7V to 10.1V while  
measuring the change in current drawn in order  
to determine the load resistance. 24.9k(1%)  
resistor between VDD and DET pins is  
recommended to present one correct signature,  
and the valid signature resistance seen from  
power interface (PI) is between 23.7kand  
26.3k.  
Classification  
The classification mode can specify to the PSE  
the expected load range of the device under  
power, so that the PSE can intelligently  
distribute power to as many loads as it can  
within its maximum current capability. The  
classification mode is active between 14.5V and  
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14  
MP8007 IEEE 802.3AF PD WITH 13W FLYBACK / BUCK CONVERTER  
20.5V. MP8007 presents  
classification mode as showing in Table 1.  
a
current in  
input capacitor CBULK. The startup charging  
current is around 120mA.  
Table 1– CLASS Resistor Selection  
If RTN drops to lower than 1.2V, the hot-swap  
current limit will change to 840mA. After the  
TDELAY from UVLO starting, MP8007 will assert  
PG signal and go from the startup mode to the  
running mode if inrush period elapse, the PG  
signal can enable down-stream DCDC  
converter internally.  
Max. Input  
Classification RCLASS  
Current (mA)  
Class  
Power to  
PD (W)  
12.95  
3.84  
()  
0
1
2
3
4
2
578  
110  
62  
41.2  
28.7  
10.55  
18.7  
28.15  
40.4  
6.49  
12.95  
25.5  
If VDD-VSS drops below falling UVLO, the Hot-  
swap MOSFET and DCDC converter both are  
disabled.  
2-Event Classification  
If output current overloads on the internal pass  
MOSFET, current limit works and VRTN-VSS rises.  
If VRTN rises above 10V for longer than 1ms, or  
rises above 20V, the current limit reverts to the  
inrush value, and PG is pulled down internally  
to disable DCDC regulator at the same time.  
MP8007 can be used as a Type-1 PD as class  
0–3 in Table 1, it also distinguishes class 4 with  
2-event  
classification.  
Generally  
it  
is  
recommended to set MP8007 in class 0-3  
because the DCDC converter can only deal  
with 13W power.  
Figure 3 shows the current limit, PG and T2P  
work logic during startup from PSE power  
supply.  
In 2-event classification, the Type-2 PSE reads  
the power classification twice. Figure 2 presents  
an example of a 2-event classification. The first  
classification event occurs when the PSE  
presents a voltage between 14.5V-to-20.5V to  
MP8007 and the MP8007 presents a class 4  
loads current. The PSE then drops the input  
voltage into the mark voltage range of 6.9V to  
10.1V, signaling the first mark event. MP8007  
presents a load current between 0.5mA to 2mA  
in the mark event voltage range  
The PSE repeats this sequence, signaling the  
second classification and second mark event.  
The PSE then applies power to MP8007 and  
MP8007 charges up the DCDC input capacitor  
CBULK (C1 of schematic on page 1) with a  
controlled inrush current. When CBULK is fully  
charged, the T2P pin presents an active low  
signal with respect to VSS after TDELAY. The T2P  
output becomes inactive when the MP8007  
input voltage VDD falls below UVLO as figure 3  
work flow shows. With class 0-3 setting in  
MP8007, 2-event classification and T2P can be  
ignored.  
PD Interface UVLO and Current Limit  
When PD is powered by PSE and VDD is  
higher than turn on threshold, the Hot-swap  
switch will start pass a limited current IINRUSH to  
charge the down stream DC-to-DC converter’s  
Figure 3: Startup Sequence  
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15  
MP8007 IEEE 802.3AF PD WITH 13W FLYBACK / BUCK CONVERTER  
Wall  
Power  
Adaptor  
Detection  
and  
Operation  
For applications where an auxiliary power  
source such as a wall adapter is used to power  
the device, the MP8007 features wall power  
adapter detection as showing in figure 4. Once  
the input voltage (VDD - VSS) exceeds about  
11.5V, the MP8007 enable wall adapter  
detection. The wall power adapter detection  
resistor divider is connected from VDD to  
negative terminal of adaptor, and DADP3 is  
added for more accurate hysteresis. There is a  
-2.3V reference voltage from AUX to VDD for  
adaptor detection. The adaptor is detected  
when AUX voltage triggers:  
Figure 4: Adaptor Power Detection  
Power Good Indicator (PG)  
The PG signal is driven by internal current  
source. After TDELAY from UVLO starting and  
RTN drops to 1.2V, or a wall power adapter is  
detected, the PG signal will be pulled high to  
indicate power condition and enable the  
downstream DCDC converter. Figure 3 shows  
the PG logic when powering from PSE, PG will  
be high if adaptor is detected.  
RADPUP  
(1)  
2.3V  
VDD VAUX (VADP VDADP3 )  
RADPUP RADPDOWN  
Where, VADP is adaptor voltage, VDADP3 is the  
zener voltage, RADPUP and RADPDOWN are the  
AUX divider resistors from adaptor power.  
If applied adapter voltage is much higher than  
the design adapter voltage, VDD-VAUX voltage  
will be high, if it is higher than 6.5V, the  
MP8007 inner circuit will clamp the VDD-VAUX  
voltage at 6.5V, then a current will flow out  
through the AUX pin, the current should be  
limited lower than 3mA by external resistor  
(RADPUP/RADPDOWN or RT resistor from the resistor  
divider to AUX PIN.)  
To make MP8007 work stable with adaptor  
power, one Schottky diode DAPD1 (D4 in  
schematic on page 1) is required between  
negative terminal of adaptor and VSS. DAPD2  
(D5 in schematic on page 1) is used to block  
reverse current between adaptor and PSE  
power source. When a wall adapter is detected,  
the internal MOSFET between RTN and VSS  
turns off, classification current is disabled and  
T2P becomes active. The PG signal is active  
when adaptor power is detected, so that it can  
enable the downstream DCDC converter even  
input hot-swap MOSFET is disabled.  
DCDC Converter Startup and Power Supply  
Once PD input overrides its UVLO, it will charge  
DCDC converter’s input capacitor (between  
VDD and RTN) with PD inrush current limit.  
DCDC converter has an internal start-up circuit.  
When voltage between VDD and GND is higher  
than 4.3 V, the capacitor at VCC is charged  
through the internal LDO. Normally VCC is  
regulated at 5.4 V (if VDD is high enough). With  
the exception of PD interface UVLO, the DCDC  
converter has an additional VIN UVLO (11.6V)  
and VCC UVLO (4.7V). When VDD-GND is  
higher than the 11.6V UVLO, VCC is charged  
higher than the 4.7V UVLO, and PG pin is  
pulled high by PD interface, DCDC converter  
starts switching.  
VCC can be powered from the transformer  
auxiliary winding to save IC power loss. Refer  
to the “Vcc Power Supply Setting” section for  
more details.  
Flyback and Buck Mode Converter  
The DCDC converter supports both flyback and  
buck topology applications. Connect MODE to  
GND to set the DCDC converter in flyback  
mode, and float MODE to set the DCDC  
converter in buck mode. MODE is pulled up  
internally to VCC through a 1.5µA current source.  
Do not connect MODE to VDD externally in  
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MP8007 IEEE 802.3AF PD WITH 13W FLYBACK / BUCK CONVERTER  
1
2
buck mode, and do not place a resistor  
between MODE and GND in flyback mode.  
(6)  
IOUT  
DIPK  
Converter Switching Work Principle  
Where, D is the inductor current conducting  
duty cycle.  
After startup, DCDC converter works in  
discontinuous conduction mode (DCM). The  
second switching cycle will not start until the  
inductor current drops to 0A. In each cycle, the  
internal MOSFET is turned on, and the current-  
sense circuit senses the current IP(t) internally.  
Use Equation (2) to calculate the rate at which  
the current rises linearly in flyback mode:  
dIp(t)  
dt  
V
IN  
(2)  
Figure 6—Inductor current waveform  
Converter Light-Load Control  
LM  
In flyback mode (if the load decreases), DCDC  
converter stretches down the frequency  
automatically to reduce the power transferring  
while keeping the same IPK in each cycle. An  
approximate 10 kHz minimum frequency is  
applied to detect the output voltage even at a  
very light load. During this condition, the  
switching IPK jumps between 20 percent of the  
normal IPK and 100 percent of the normal IPK to  
reduce the power transferring. The DCDC  
converter still transfers some energy to the  
output even if there is no load on the output due  
to the 10 kHz minimum frequency. This means  
that some load is required to keep the output  
voltage in regulation, or else VOUT will rise and  
trigger OVP.  
When IP(t) rises up to IPK, the internal MOSFET  
turns off (see Figure 5). The energy stored in  
the primary-side inductance transfers to the  
secondary-side through the transformer.  
Figure 5—Primary-side current waveform  
The primary-side inductance (LM) stores energy  
in each cycle as a function of Equation (3):  
1
E LMIP2K  
(3)  
2
In buck mode, the DCDC converter has no  
minimum frequency limit, so it stretches down  
to a very low frequency and regulates the  
output automatically even there is no load on  
the output.  
Calculate the power transferred from the input  
to the output with Equation (4):  
1
P LMIP2KF  
(4)  
S
2
Frequency Control  
Where FS is the switching frequency. When IPK  
is constant, the output power depends on FS  
and LM.  
By monitoring the auxiliary winding voltage in  
flyback mode or monitoring the SW voltage in  
buck mode, the DCDC converter detects and  
regulates the inductor current in DCM. The  
frequency is controlled by the peak current, the  
current ramp slew rate, and the load current.  
The maximum frequency occurs when the  
DCDC converter runs in critical conduction  
mode, providing the maximum load power. The  
DCDC converter switching frequency should be  
lower than 200 kHz in the design.  
Use Equation (5) to calculate the rate at which  
the current rises linearly in buck mode:  
dIp(t)  
dt  
V VOUT  
IN  
(5)  
LM  
The internal MOSFET turns off when IP(t) rises  
to IPK (see Figure 6). The output current is  
calculated with Equation (6):  
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MP8007 IEEE 802.3AF PD WITH 13W FLYBACK / BUCK CONVERTER  
Output Voltage Control  
Where ILIM is the current limit in A, VL is the  
voltage applied on the inductor when the  
MOSFET turns on, R3 is the setting resistor in  
In flyback application, the DCDC converter  
detects the auxiliary winding voltage from FB1  
during the secondary-side diode conduction  
period.  
k, and L is the inductor in μH.  
The current limit cannot be programmed higher  
than 3A.  
Assume the secondary winding is the master,  
and the auxiliary winding is the slave. When the  
secondary-side diode conducts, the FB1  
voltage is calculated with Equation (7):  
If Input voltage is very low, the inductor current  
may increase slowly, it will take a long time to  
meet the setting current limit. MP8007  
integrates a ~7us max on time. After the max  
on time, MOSFET will turn off, even the  
inductor current doesn`t meet the setting  
current limit.  
NA  
NS  
R2  
(7)  
VFB1  
(VOUT VD1F )  
R1 R2  
Where:  
Converter Leading-Edge Blanking  
VD1F is the output diode forward-drop voltage.  
VOUT is the output voltage.  
Transformer parasitic capacitance induces a  
current spike on the switching power FET when  
the power switch turns on. The DCDC converter  
includes a 450 ns leading-edge blanking period  
to avoid falsely terminating the switching pulse.  
During this blanking period, the current sense  
comparator is disabled, and the gate driver  
cannot switch off.  
NA and NS are the turns of the auxiliary winding  
and the secondary-side winding, respectively.  
R1 and R2 are the resistor dividers for sampling.  
The output voltage differs from the secondary-  
winding voltage due to the current-dependant  
diode forward voltage drop. If the secondary-  
winding voltage is always detected at a fixed  
secondary current, the difference between the  
output voltage and the secondary-winding  
voltage is a fixed VD1F. DCDC converter starts  
sampling the auxiliary-winding voltage after the  
internal power MOSFET turns off for 0.7 μs and  
finishes the sampling after the secondary-side  
diode conducts for 3μs. This provides good  
regulation when the load changes. However,  
the secondary diode conducting period must be  
longer than 3μs in each cycle, and the FB1  
signal must be smooth in 0.7μs after the switch  
turns off.  
DCDC Converter DCM Detection  
The DCDC switching regulator operates in  
discontinuous conduction mode in both flyback  
and buck modes.  
In flyback mode, the DCDC converter detects  
the falling edge of the FB1 voltage in each cycle.  
The second cycle switching will not start unless  
the chip detects a 50 mV falling edge on FB1.  
In buck mode, the DCDC converter detects the  
falling edge of the SW voltage in each cycle.  
The second cycle switching will not start unless  
the chip detects 0.14 V falling edge between  
VSW-VDD.  
With a buck solution, there is one FB2 pin  
referred to VDD. It can be used as the  
reference voltage for the buck application. The  
output voltage is referred to VDD and does not  
have the same GND as the input power.  
Over-Voltage & Open-Circuit Protection  
In flyback mode, the DCDC converter includes  
over-voltage protection (OVP) and open-circuit  
protection. If the voltage at FB1 exceeds 125  
percent of VREF1, or FB1’s -60 mV falling edge  
cannot be detected because the feedback  
resistor is removed, immediately the DCDC  
converter shuts off the driving signal and enters  
hiccup mode by re-charging the internal  
capacitor. The DCDC converter resumes  
normal operation when the fault is removed.  
Programming the Switching Current Limit  
The switching converter current limit is set by  
an external resistor (R3 in schematic on page 1)  
from ILIM to ground. The value of R3 can be  
estimated with Equation (8):  
100 VL 0.18  
(8)  
ILIM  
R3  
L
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MP8007 IEEE 802.3AF PD WITH 13W FLYBACK / BUCK CONVERTER  
In buck mode, if the voltage at FB2 is higher  
than the reference voltage, the DCDC converter  
stops switching immediately.  
Thermal Shutdown  
Thermal shutdown is implemented to prevent  
the chip from thermally running away. MP8007  
has separated temperature monitor circuit for  
PD and switching devices, DC converter  
thermal protection won't affect PD interface but  
PD temperature protection will turn off both PD  
and DC converter. When the temperature is  
lower than its recovery threshold, thermal  
shutdown is gone and the chip is enabled.  
MP8007 Rev.1.0  
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MP8007 IEEE 802.3AF PD WITH 13W FLYBACK / BUCK CONVERTER  
VADP  
VDD  
APPLICATION INFORMATION  
RADPUP  
Detection Resistor  
PG  
AUX  
VSS  
In the Detection Mode, a resistor connected  
between DET and VDD pin is needed as a load  
to the PSE. The resistance is calculated as a  
ΔV/ΔI, with an acceptable range of 23.7kto  
26.3k. Use a typical value of 24.9kas  
detection resistor.  
RADPDOWN  
RTN  
DADP3  
DADP1  
DADP2  
Adaptor GND  
Classification Resistor  
Figure 7: Wall Adaptor Detection Circuit  
In order to distribute power to as many loads as  
possible from PSE, a resistor between CLASS  
and VSS pins is used to classify the PD power  
level, which draws a fixed current set by  
classification resistor. The power supplied to  
PD set by classification resistor is shown in  
Table 1. Typical voltage on CLASS pin is 1.16V  
in classification range, and it produces about  
33mW power loss on class resistor in Class 3  
condition.  
To prevent the converter from operating at an  
excessively low adapter voltage, choose a  
startup voltage, VSTART approximately 80% of  
nominal. Assuming that the adapter voltage is  
48V, Let RADPUP=3k, RADPDOWN=8.06kand  
DADP3=30V as Equation (1). Re-check the  
adapter turn-on and turn-off voltage:  
RADPUP RADPDOWN  
VADPON 30 2.3  
RADPUP  
(9)  
38.5V  
RADPUP RADPDOWN  
(10)  
32.2V  
Protection TVS  
VADPOFF 30 0.6  
RADPUP  
To limit input transient voltage within the  
absolute maximum rating, a TVS across the  
rectified voltage (VDD-VSS) must be used. A  
SMAJ58A, or equivalent, is recommended for  
general indoor applications. Outdoor transient  
levels or special applications require additional  
protection.  
The VDD-AUX voltage differential voltage is  
4.88V when adapter input is 48V. If much  
higher adapter voltage is applied and divided  
voltage on AUX pin is higher than 6.5V,  
RADPDOWN and DADP3 must be able to limit the  
current from AUX to adapter-GND less than  
3mA, or else additional resistor from tap of  
resistor divider to AUX pin is needed to limit the  
current.  
PD Input Capacitor  
An input bypass capacitor (from VDD to VSS)  
of 0.05μF to 0.12μF is needed for IEEE  
802.3af/at standard specification. Typically a  
0.1μF, 100V ceramic capacitor is used.  
One small package Schottky diode with 100V  
voltage rating (such as BAT46W) is usually  
suggested for DADP1. The voltage rating of DADP2  
must also be 100V or higher while current rating  
must be higher than load current. Low voltage  
drop Schottky diode (such as SS1H10) is  
recommended to reduce conduction power-loss.  
Wall Power Adaptor Detection Circuit  
When an auxiliary power source such as a wall  
power adapter is used to power the device, the  
divider resistors RADPUP, RADPDOWN and DADP3  
must be chosen as shown in figure 7 to satisfy  
the Equation (1) for correct wall power adaptor  
detection.  
Power Good (PG) Indicator Signal  
MP8007 integrates one PG indicator. PG pin is  
used to indicate the PD inrush period finishes  
and enable the DCDC converter internally. The  
PG pin is an active-high output with internal  
driven, consequently it can be floated to enable  
DCDC converter. Pull PG pin low externally can  
disable the DCDC regulator of MP8007.  
RADPUP with typical 3kvalue is suggested to  
balance the power loss and DADP1&DADP2  
leakage current discharge.  
MP8007 Rev.1.0  
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MP8007 IEEE 802.3AF PD WITH 13W FLYBACK / BUCK CONVERTER  
In PG high condition, PG pin is pulled up by  
internal 30μA current source while clamped by  
one 5.5V zener between PG and RTN. In PG  
low condition, internal 30μA current source is  
disabled and PG pin is pulled low by about  
460k Ω pull-down resistor between PG and  
RTN(GND). Generally, float PG for automatic  
startup after power is connected. PG pin can be  
pulled low externally but the signal sink current  
capability must be higher than the internal  
current source. The zener on PG pin is used to  
clamp internal 30μA current, do not connect  
external signal with higher than 5.5V voltage to  
PG pin.  
VCC Power Supply Setting  
The VCC voltage is charged through the internal  
LDO by VDD. Normally, VCC is regulated at  
5.4V, typically. A capacitor no less than 1µF is  
recommended for decoupling between VCC and  
GND.  
In flyback mode, VCC can be powered from the  
transformer auxiliary winding to save the high-  
voltage LDO power loss.  
T2P Indicator Connection  
The T2P pin is an active-low, open-drain output  
which indicates the presence of a Type-2 PSE  
or AUX is enabled. An opto-coupler is usually  
used as the interface from the T2P pin to  
circuitry on output of the converter as figure 8  
shown. A high-gain opto-coupler and a high-  
impedance (for example, CMOS) receiver are  
recommended.  
Figure 9: Supply VCC from auxiliary winding  
The auxiliary winding supply voltage can be  
calculated with Equation (11):  
NA  
(11)  
VCC  
(VOUT VD1F )VDAUXF  
NS  
Where NA and NS are the turns of the auxiliary  
winding and the output winding, VD1F is the  
output rectifier diode voltage drop, and VDAUXF is  
the DAUX voltage drop in Figure 9.  
VCC voltage is clamped at about 6.2V by one  
internal Zener diode. The clamp current  
capability is about 1.2mA. If the auxiliary  
winding power voltage is higher than 6.2V  
(especially in a heavy-load condition), a series  
resistor (RAUX) is necessary to limit the current  
to VCC. For simple application, supply the VCC  
power through the internal LDO directly.  
Figure 8: T2P Indicator Circuit  
Converter Output Voltage Setting  
Considering T2P sinking current (2mA typical),  
T2P output low voltage 0.1V and diode forward  
voltage drop, choose RT2P=23.7kto match the  
typical 48V VDD input. Suppose VOUT of DCDC  
converter is 12V, usually choose RT2P-O=20kꢀ  
based on the CRT even it may vary with  
temperature, LED bias current and aging.  
In DCDC converter, there are two feedback  
pins for different application modes.  
In flyback mode, the converter detects the  
auxiliary winding voltage from FB1. R1 and R2  
are the resistor dividers for the feedback  
sampling  
(see  
Figure  
10).  
If lighten a LED from VDD to T2P to indicate the  
T2P`s activity, the RT2P’s resistance can be  
higher to match the LED`s max current and  
reduce the power-loss.  
MP8007 Rev.1.0  
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MP8007 IEEE 802.3AF PD WITH 13W FLYBACK / BUCK CONVERTER  
full-load condition. The maximum frequency is  
affected by the peak current limit, the  
inductance, and the input/output voltage.  
Generally, design the maximum frequency must  
be lower than 200kHz.  
GND  
R2  
Na  
FB1  
R1  
In buck mode, the maximum frequency occurs  
when the buck runs in critical continuous  
conduction mode. The frequency can be  
calculated:  
Figure 10: Feedback in isolation application  
(V VOUT )VOUT  
When the primary-side power MOSFET turns  
off, the auxiliary-winding voltage is sampled.  
IN  
(14)  
F
SW _MAX  
ILIM LV  
IN  
The output voltage is estimated:  
Where, ILIM is the IPK set by the current limit  
resistor.  
VREF1 (R1 R2 ) NS  
(12)  
VOUT  
VD1F  
R2  
NA  
With a lighter load, the frequency is lower than  
the maximum frequency above.  
Where,  
In flyback mode, design the maximum  
frequency with the minimum input voltage and  
the maximum load condition. Calculate the  
frequency with Equation:  
NS is the transformer secondary-side winding  
turns.  
NA is the transformer auxiliary winding turns.  
VD1F is the rectifier diode forward drop.  
VREF1 is the reference voltage of FB1 (1.99V,  
typically).  
1
(15)  
F
SW  
TON TCON TDELAY  
When the primary-side power MOSFET turns  
on, the auxiliary winding forces a negative  
voltage to FB1. The FB1 voltage is clamped to  
less than -0.7V internally, but the clamp current  
should be limited to less than -0.5mA by R1.  
For example, if the auxiliary winding forces  
-11V to R1, to make the current flowing from  
FB1 to R1 lower than -0.5mA, R1 resistance  
must be higher than 22k(if ignoring R2  
current).  
Where:  
TON is the MOSFET one pulse turn-on time  
determined with Equation:  
ILIM LM  
(16)  
TON  
V
IN  
LM is the transformer primary-winding  
inductance.  
TCON is the rectifier diode current conducting  
time and can be calculated:  
Generally, select R2 with a 10kto 50kꢀ  
resistor to limit noise and provide an  
appropriate R1 for the -0.5mA negative current  
limit.  
NS ILIM LM  
NP (VOUT VD1F  
(17)  
TCON  
)
In buck application, the feedback pin is FB2.  
The output voltage can be estimated:  
Where, NS is the transformer secondary-side  
winding turns. NP is the transformer primary-  
side winding turns.  
R1 R2  
(13)  
VOUT    
VREF2  
R2  
TDELAY is the resonant delay time from the  
rectifier diode current drop to 0A to the  
auxiliary-winding voltage drop to 0V. The  
resonant time can be tested on the board  
(estimate around 0.5μs).  
Where, VREF2 is the reference voltage of FB2  
-1.88V, typically.  
Maximum Switching Frequency  
In flyback mode, the DCDC converter samples  
the feedback signal within 3μs after the primary-  
When DCDC converter works in DCM, the  
frequency reaches its maximum value during a  
MP8007 Rev.1.0  
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MP8007 IEEE 802.3AF PD WITH 13W FLYBACK / BUCK CONVERTER  
side MOSFET turns off. The secondary-side  
In buck application, the worst Vout ripple can be  
estimated with Equation (22):  
diode conduction time in Equation (17) should  
be higher than 3μs. This time period, combined  
with the duty cycle, determines the maximum  
frequency.  
0.5ILIM2 L(V VD1F  
)
IN  
(22)  
VOUTP _P  
C2(V VOUT )(VOUT VD1F  
)
IN  
Leakage Inductance  
The transformer’s  
decreases system efficiency and affects the  
output current and voltage precision. Optimize  
the transformer structure to minimize the  
leakage inductance. Aim for  
inductance less than 3 percent of the primary-  
winding inductance.  
Converter Input Capacitor Selection  
An input capacitor is required to supply the AC  
ripple current to the inductor while limiting noise  
at the input source. A low ESR capacitor is  
required to keep the noise to the IC at a  
minimum. Ceramic capacitors are preferred, but  
tantalum or low ESR electrolytic capacitors will  
suffice. For ceramic capacitors, the capacitance  
dominates the impedance at the switching  
frequency. The ripple will be the worst at light  
load. The required input capacitance can be  
estimated:  
leakage  
inductance  
a
leakage  
RCD Snubber for Flyback  
The transformer leakage inductance causes  
spikes and excessive ringing on the MOSFET  
drain voltage waveform, affecting the output  
voltage sampling 0.7µs after the MOSFET turns  
off. The RCD snubber circuit limits the SW  
voltage spike (see Figure 11).  
0.5ILIM TON  
(18)  
C1   
V
INP _P  
Where C1 is the DCDC converter input bulk  
capacitor value, VINP-P is the expected input  
ripple, and TON is the MOSFET turn-on time.  
In an isolated application, TON is calculated:  
ILIM LM  
(19)  
TON  
V
IN  
In a non-isolation application, TON is calculated:  
ILIM L  
(20)  
TON  
V VOUT  
IN  
Where L is the buck`s inductor value.  
Figure 11: RCD snubber  
Converter Output Capacitor Selection  
The power dissipation in the snubber circuit is  
estimated with Equation (23):  
The output capacitor maintains the DC output  
voltage. For best results, use ceramic  
capacitors or low ESR capacitors to minimize  
the output voltage ripple. For ceramic  
capacitors, the capacitance dominates the  
impedance at the switching frequency.  
1
P
LK ILIM2 F  
(23)  
SN  
S
2
Where, LK is the leakage inductance.  
Since R4 consumes the majority of the power,  
R4 is estimated with Equation (24):  
In flyback application, the worst output ripple  
occurs under a light-load condition; the worst  
output ripple can be estimated:  
2
VSN  
(24)  
R4   
P
SN  
Where, VSN is the expected snubber voltage on  
C4.  
0.5NP ILIM TCON  
VOUTP_P  
(21)  
NS C2  
Where,  
C2 is the output capacitor value.  
OUTP-P is the output ripple.  
The snubber capacitor C4 can be designed to  
get appropriate voltage ripple on the snubber  
using Equation (25):  
V
Normally, a 44μF or higher ceramic capacitor is  
recommended as the output capacitor. This  
allows a small Vo ripple and stable operation.  
VSN  
(25)  
VSN  
R4C4F  
S
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MP8007 IEEE 802.3AF PD WITH 13W FLYBACK / BUCK CONVERTER  
dummy load is a tradeoff between efficiency  
Generally, a 15 percent ripple is acceptable.  
and load regulation. For applications using  
Figure 14, a minimum load of around 10mA is  
recommended.  
Buck Inductor Selection  
The inductor is required to transfer the energy  
between the input source and the output  
capacitors. Unlike normal application where  
inductors determine the inductor ripple, the  
DCDC converter always works in DCM while  
VIN, VOUT, and ILIM are constant. The inductor  
only determines the speed of the current rising  
and falling, which determines the switching  
period. The expected maximum frequency can  
determine the inductor value using Equation  
(26):  
PCB Layout Guide  
A good layout of the PoE front-end and high-  
frequency switching power supply is critical.  
Poor layout may result in reduced performance,  
excessive EMI, resistive loss, and system  
instability. For best results, refer to Figure 12  
and Figure 13 and follow the guidelines in  
below:  
For PD interface circuit:  
(V V OUT )(VOUT VD1F  
)
1
IN  
(26)  
1. All components place must follow power  
flow, from RJ-45, Ethernet transformer,  
diode bridges, TVS, to 0.1-μF capacitor and  
DCDC converter input bulk capacitor.  
L   
(V VD1F )IPEAK  
FSW  
IN  
FSW is the expected maximum switching  
frequency, which should be lower than 200kHz  
in general setting.  
2. Make all leads as short as possible with  
wide power traces.  
Converter Output Diode Selection  
3. The spacing between VDD (48V) and VSS  
must comply with safety standards like  
IEC60950.  
The output rectifier diode supplies current to the  
output capacitor when the internal MOSFET is  
off. Use a Schottky diode to reduce loss due to  
the diode forward voltage and recovery time.  
4. Place the PD interface circuit ground planes  
referenced to VSS, while place the  
In isolation application, the diode should be  
rated for a reverse voltage greater than  
Equation (27):  
switching  
converter  
ground  
planes  
referenced to RTN/GND.  
5. The exposed PAD must be connected to  
GND, it can not be connected to VSS.  
V NS  
IN  
(27)  
VD1 VOUT  
VPD1  
NP  
6. If adaptor power detection is enabled, the  
AUX divider resistor should be close to AUX  
pin. And diode D5 (between VSS and RTN)  
should be placed close to VSS and RTN.  
VPD1 can be selected at 40 percent to 100  
percent of VOUT + VIN x NS/NP. An RC or RCD  
snubber circuit for the output diode D1 is  
recommended.  
For flyback circuit:  
In buck mode, the diode reverse voltage  
equates to the input voltage. A 20 percent ~ 40  
percent margin is recommended.  
1. Keep the input loop as short as possible  
between the input capacitor, transformer,  
SW, and GND plane for minimal noise and  
ringing.  
In both applications, the current rating should  
be higher than the maximum output current.  
2. Keep the output loop between the rectifier  
diode, the output capacitor, and the  
transformer as short as possible.  
Converter Dummy Load  
When the system operates without a load in  
flyback mode, the output voltage rises above  
the normal operation voltage because of the  
minimum switching frequency limitation. Use a  
dummy load for good load regulation. A large  
dummy load decreases efficiency, so the  
3. Keep the clamp loop circuit between D2, C4,  
and the transformer as small as possible.  
4. Place the VCC capacitor close to VCC for  
the best decoupling. The current setting  
resistor R3 should be placed as close to  
ILIM  
and  
AGND  
as  
possible.  
MP8007 Rev.1.0  
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MP8007 IEEE 802.3AF PD WITH 13W FLYBACK / BUCK CONVERTER  
5. Keep the feedback trace far away from  
Via  
noise sources (such as SW). The trace  
connecting FB1 should be short.  
C1  
C2  
Top Layer  
Bottom Layer  
D1  
6. Use a single point connection between  
power GND and signal GND. Vias around  
D3  
U1  
C5  
GND  
and  
the  
thermal  
pad  
are  
recommended to lower the die temperature.  
R6  
L1  
C3  
R3  
Refer to Figure 12 for flyback circuit layout,  
D4  
which is referred to schematic  
on page 1.  
R8 R7 R5  
D5  
R2 R1  
Figure 13: Recommended buck layout  
Design Example  
Below is a design example following the  
application guidelines for the following  
specifications:  
Table 2 – Flyback Design Example  
Figure 12: Recommended flyback layout  
VDD-VSS  
RDET  
RCLASS  
VADAPTER  
VOUT  
37V–57V (PoE Supply)  
For buck circuit:  
24.9k  
41.2ꢀ  
48V  
1. Keep the input loop as short as possible  
between the input capacitor, rectifier diode,  
SW, and GND plane for minimal noise and  
ringing.  
12V  
IOUT  
1A  
2. Keep the output loop between the rectifier  
diode, the output capacitor, and the inductor  
as short as possible.  
The typical application circuit in Figure 14  
shows the detailed application schematic, and  
is the basis for the typical performance  
waveforms. Typically, the device is powered by  
PSE (VDD-VSS=48V). When an adapter voltage  
above than 38.5V presents, the internal  
MOSFET between RTN and VSS turns off,  
instead the device is powered by the adapter  
whatever the PSE voltage is. For more detailed  
device applications, please refer to the related  
Evaluation Board Datasheets.  
3. Place the VCC capacitor close to VCC for  
the best decoupling. The current setting  
resistor R3 should be placed as close to  
ILIM and AGND as possible.  
4. Connect the output voltage sense and VDD  
power supply from the output capacitor with  
parallel traces. The feedback trace should  
be far away from noise sources (such as  
SW). The trace connected to FB2 should be  
short. The trace for VDD power should be  
wider.  
5. Use a single point connection between  
power GND and signal GND. Vias around  
GND  
and  
the  
thermal  
pad  
are  
recommended to lower the die temperature  
Refer to Figure 13 for buck circuit layout.  
MP8007 Rev.1.0  
6/27/2016  
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25  
MP8007 IEEE 802.3AF PD WITH 13W FLYBACK / BUCK CONVERTER  
TYPICAL APPLICATION CIRCUIT  
Figure 14: Flyback Application Circuit, VIN=37-57V PoE oring 48V Adaptor Input, VOUT=12V@1A.  
Figure 15: Flyback Application Circuit, VIN=37-57V, No adaptor input, VOUT=5V@2.5A.  
Figure 16: Buck Application Circuit, VIN=37-57V PoE Input, No adapter input, VOUT=12V@1A  
MP8007 Rev.1.0  
6/27/2016  
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© 2016 MPS. All Rights Reserved.  
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MP8007 IEEE 802.3AF PD WITH 13W FLYBACK / BUCK CONVERTER  
PACKAGE INFORMATION  
QFN28 (4mmX5mm)  
NOTICE: The information in this document is subject to change without notice. Users should warrant and guarantee that third  
party Intellectual Property rights are not infringed upon when integrating MPS products into any application. MPS will not  
assume any legal responsibility for any said applications.  
MP8007 Rev.1.0  
6/27/2016  
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27  

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