MP6232DH-Z [MPS]

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MP6232DH-Z
型号: MP6232DH-Z
厂家: MONOLITHIC POWER SYSTEMS    MONOLITHIC POWER SYSTEMS
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MP6231/MP6232  
3.3V/5V, Dual-Channel 500mA  
Current-Limited Power Distribution Switches  
The Future of Analog IC Technology  
DESCRIPTION  
FEATURES  
500mA Continuous Current  
Accurate Current Limit  
2.7V to 5.5V Supply Range  
140μA Quiescent Current  
85mMOSFET  
The MP6231/MP6232 Power Distribution  
Switch features internal current limiting to  
prevent damage to host devices due to faulty  
load conditions. The MP6231/MP6232 analog  
switch has 85mon-resistance and operates  
from 2.7V to 5.5V input. It is available with  
guaranteed current limits, making it ideal for  
Thermal-Shutdown Protection  
Under-Voltage Lockout  
load  
switching  
applications.  
The  
8ms FLAG Deglitch Time  
No FLAG Glitch During Power Up  
Reverse Current Blocking  
Active High & Active Low Options  
UL File # E322138  
MP6231/MP6232 has built-in protection for both  
over current and increased thermal stress. For  
over current, the device will limit the current by  
changing to a constant current mode.  
As the temperature increases as a result of  
short circuit, then the device will shut off. The  
device will recover once the device temperature  
reduces to approx 120°C.  
APPLICATIONS  
Smartphone and PDA  
Portable GPS Device  
Notebook PC  
The MP6231/MP6232 is available in 8-pin  
MSOP, SOIC package with exposed pad and 8-  
pin SOIC w/o exposed pad.  
Set-top-box  
Telecom and Network Systems  
PC Card Hot Swap  
USB Power Distribution  
“MPS” and “The Future of Analog IC Technology” are Trademarks of Monolithic  
Power Systems, Inc.  
TYPICAL APPLICATION  
+5V  
8
7
1
To USB Controller  
Output 1  
FLAG1  
OUT1  
GND  
IN  
2
MP6232  
Output 2  
3
4
6
5
EN1  
OUT2  
EN2  
FLAG2  
DUAL-CHANNEL  
UL Recognized Component  
MP6231/MP6232 Rev. 1.2  
3/31/2010  
www.MonolithicPower.com  
MPS Proprietary Information. Unauthorized Photocopy and Duplication Prohibited.  
© 2010 MPS. All Rights Reserved.  
1
MP6231/MP6232 –CURRENT-LIMITED POWER DISTRIBUTION SWITCHES  
ORDERING INFORMATION  
Maximum  
Typical Short-  
Free Air  
Temperature  
(TA)  
Top  
Marking  
Part Number  
Enable Switch  
Continuous Circuit Current Package  
Load Current  
@ TA=25C  
MP6231DN*  
MP6231DH  
MP6231DS  
MP6232DN  
MP6232DH  
MP6232DS  
SOIC8E MP6231DN  
Active  
High  
MSOP8E  
SOIC8  
6231D  
Dual  
0.5A  
750mA  
-40°C to +85°C  
SOIC8E MP6232DN  
Active  
Low  
MSOP8E  
SOIC8  
6232D  
* For Tape & Reel, add suffix –Z (e.g. MP6231DN–Z).  
For RoHS compliant packaging, add suffix –LF (e.g. MP6231DN–LF–Z)  
PACKAGE REFERENCE  
TOP VIEW  
TOP VIEW  
TOP VIEW  
GND  
IN  
1
2
3
4
8
7
6
5
FLAG1  
OUT1  
OUT2  
FLAG2  
GND  
1
FLAG1  
OUT1  
OUT2  
FLAG2  
8
7
6
5
GND  
IN  
1
2
3
4
8
7
6
5
FLAG1  
OUT1  
OUT2  
FLAG2  
IN  
2
EN1*  
3
EN1*  
EN2*  
EN1*  
EN2*  
EN2*  
4
EXPOSED PAD  
ON BACKSIDE  
CONNECT TO GND  
EXPOSED PAD  
ON BACKSIDE  
MSOP8E  
SOIC8  
SOIC8E  
MP6231/MP6232Dual-Channel  
(* EN is active high for MP6231)  
ABSOLUTE MAXIMUM RATINGS (1)  
Thermal Resistance (3)  
SOIC8E ..................................50...... 10... °C/W  
MSOP8E.................................55...... 12... °C/W  
SOIC8.....................................90...... 42... °C/W  
θJA  
θJC  
IN .................................................-0.3V to +6.0V  
EN, FLAG, OUT to GND..............-0.3V to +6.0V  
(2)  
Continuous Power Dissipation (TA = +25°C)  
SOIC8E...................................................... 2.5W  
MSOP8E.................................................. 2.27W  
SOIC8........................................................ 1.4W  
Junction Temperature...............................150°C  
Lead Temperature ....................................260°C  
Storage Temperature............... -65°C to +150°C  
Operating Junct. Temp. ........... -40°C to +125°C  
Notes:  
1) Exceeding these ratings may damage the device.  
2) The maximum allowable power dissipation is a function of the  
maximum junction temperature TJ (MAX), the junction-to-  
ambient thermal resistance θJA, and the ambient temperature  
TA. The maximum allowable continuous power dissipation at  
any ambient temperature is calculated by PD (MAX) = (TJ  
(MAX)-TA)/θJA. Exceeding the maximum allowable power  
dissipation will cause excessive die temperature, and the  
regulator will go into thermal shutdown. Internal thermal  
shutdown circuitry protects the device from permanent  
damage.  
3) Measured on JESD51-74-layer PCB.  
MP6231/MP6232 Rev. 1.2  
3/31/2010  
www.MonolithicPower.com  
MPS Proprietary Information. Unauthorized Photocopy and Duplication Prohibited.  
© 2010 MPS. All Rights Reserved.  
2
MP6231/MP6232 –CURRENT-LIMITED POWER DISTRIBUTION SWITCHES  
ELECTRICAL CHARACTERISTICS (4)  
VIN=5V, TA=+25°C, unless otherwise noted.  
Parameter  
Condition  
Min  
Typ  
Max  
Units  
IN Voltage Range  
2.7  
5.5  
V
One Channel Enabled, IOUT=0, One  
Switch ON  
Both Channels Enabled, IOUT=0, Both  
Switches ON  
Supply Current  
Supply Current  
90  
120  
160  
μA  
μA  
140  
Shutdown Current  
Off Switch Leakage  
Current Limit  
Device Disable, VOUT=float, VIN=5.5V  
Device Disable, VIN=5.5V  
1
1
μA  
μA  
550  
1100  
1.6  
mA  
Current Ramp (slew rate100A/s) on  
Output  
Trip Current  
1.2  
A
Under-voltage Lockout  
Rising Edge  
1.95  
2.65  
V
mV  
mΩ  
V
Under-voltage Hysteresis  
FET On Resistance  
250  
85  
130  
IOUT=100mA , and -40°C<TA<85°C  
EN Input Logic High Voltage  
EN Input Logic Low Voltage  
FLAG Output Logic Low Voltage  
2
0.8  
0.4  
V
ISINK=5mA  
V
FLAG Output High Leakage  
Current  
VIN=VFLAG=5.5V  
1
μA  
Thermal Shutdown  
140  
°C  
Thermal Shutdown Hysteresis  
20  
0.9  
1.7  
°C  
ms  
ms  
ms  
ms  
VIN=5.5V, CL=1μF, RL=11ꢀ  
VIN=2.7V, CL=1μF, RL=11ꢀ  
VIN=5.5V, CL=1μF, RL=11ꢀ  
VIN=2.7V, CL=1μF, RL=11ꢀ  
VOUT Rising Time, Tr  
VOUT Falling Time, Tf  
0.5  
0.5  
3
Turn On Time, Ton  
Turn Off Time, Toff  
FLAG Deglitch Time  
ENx Input Leakage  
Reverse Leakage Current  
Notes:  
CL=100μF, RL=11ꢀ  
CL=100μF, RL=11ꢀ  
ms  
ms  
ms  
μA  
μA  
10  
15  
4
8
1
OUTX=5.5V, IN=GND  
0.2  
4) Production test at +25°C. Specifications over the temperature range are guaranteed by design and characterization.  
MP6231/MP6232 Rev. 1.2  
3/31/2010  
www.MonolithicPower.com  
MPS Proprietary Information. Unauthorized Photocopy and Duplication Prohibited.  
© 2010 MPS. All Rights Reserved.  
3
MP6231/MP6232 –CURRENT-LIMITED POWER DISTRIBUTION SWITCHES  
PIN FUNCTIONS  
MP6231/MP6232  
SOIC8  
SOIC8E  
MSOP8E  
Name Description  
GND Ground.  
1
2
IN  
Input Voltage. Accepts 2.7V to 5.5V input.  
Active Low: (MP6232), Active High: (MP6231)  
3
4
5
EN1  
Active Low: (MP6232), Active High: (MP6231)  
EN2  
IN-to-OUT2 Over-current, active-low output flag. Open-Drain.  
FLAG2  
6
7
OUT2 IN-to-OUT2 Power-Distribution Switch Output.  
OUT1 IN-to-OUT1 Power-Distribution Switch Output  
8
IN-to-OUT1 Over-current, active-low output flag. Open-Drain.  
FLAG1  
TYPICAL PERFORMANCE CHARACTERISTICS  
TA = +25ºC, unless otherwise noted.  
OUT  
X
tf  
tr  
CL  
RL  
VO  
(OUT  
X
)
90%  
10%  
90%  
10%  
TEST CIRCUIT  
50%  
90%  
50%  
50%  
50%  
VI(ENX)  
VI(ENX)  
toff  
t
on  
ton  
toff  
90%  
V
O
(OUT  
X
)
VO(OUTX)  
10%  
10%  
VOLTAGE WAVEFORMS  
Figure 1—Test Circuit and Voltage Waveforms  
MP6231/MP6232 Rev. 1.2  
3/31/2010  
www.MonolithicPower.com  
MPS Proprietary Information. Unauthorized Photocopy and Duplication Prohibited.  
© 2010 MPS. All Rights Reserved.  
4
MP6231/MP6232 –CURRENT-LIMITED POWER DISTRIBUTION SWITCHES  
TYPICAL PERFORMANCE CHARACTERISTICS  
VIN=5.5V, CL = 1µF, TA = +25ºC, unless otherwise noted.  
Supply Current, Output Enabled  
vs. Input Voltage  
VEN=5V  
1.2  
1
4
3.5  
3
120  
100  
80  
60  
40  
20  
0
0.8  
0.6  
0.4  
0.2  
0
2.5  
2
1.5  
1
0.5  
0
2.5  
3
3.5  
4
4.5  
5
5.5  
6
2.5  
3
3.5  
4
4.5  
5
5.5  
6
2.5  
3
3.5  
4
4.5  
5
5.5  
6
INPUT VOLTAGE (V)  
INPUT VOLTAGE (V)  
INPUT VOLTAGE (V)  
Static Drain-Source On-State  
Resistance Variation vs.  
Ambient Temperature  
IO=0.1A, VIN=5V  
Static Drain-Source  
On-State Resistance vs.  
Input Voltage  
Input to Output Voltage vs.  
Load Current  
VEN=5V  
VEN=5V, IOUT=0.5A  
30  
25  
20  
15  
10  
5
90  
140  
130  
120  
110  
100  
90  
Vin=2.7V  
80  
70  
60  
50  
40  
30  
20  
10  
0
Vin=3.3V  
Vin=4.5V  
0
-5  
Vin=5.5V  
Vin=5V  
-10  
-15  
-20  
-25  
-30  
80  
70  
-45 -30 -15 0 15 30 45 60 75 90  
2.5  
3
3.5  
4
4.5  
5
5.5  
6
0
0.1 0.2 0.3 0.4 0.5 0.6 0.7  
OUTPUT CURRENT (A)  
AMBIENT TEMPERATURE (0C)  
INPUT VOLTAGE (V)  
Current Limit  
vs. Input Voltage  
VEN=5V  
Threshold Trip Current vs.  
Input Voltage  
VEN=5V  
Current Limit Response Time  
vs. Peak Current  
VEN=5V  
1.5  
1.4  
1.3  
1.2  
1.1  
1
45  
0.9  
40  
35  
30  
25  
20  
15  
10  
5
0.85  
0.8  
0.75  
0.7  
0.65  
0.9  
0.6  
0.8  
0
2.5  
3
3.5  
4
4.5  
5
5.5  
6
2.5  
3
3.5  
4
4.5  
5
5.5  
6
0
2
4
6
8
10 12 14  
INPUT VOLTAGE (V)  
INPUT VOLTAGE (V)  
PEAK CURRENT (A)  
MP6231/MP6232 Rev. 1.2  
3/31/2010  
www.MonolithicPower.com  
MPS Proprietary Information. Unauthorized Photocopy and Duplication Prohibited.  
© 2010 MPS. All Rights Reserved.  
5
MP6231/MP6232 –CURRENT-LIMITED POWER DISTRIBUTION SWITCHES  
TYPICAL PERFORMANCE CHARACTERISTICS  
VIN=5.5V, CL = 1µF, TA = +25ºC, unless otherwise noted.  
Turn On Delay  
and Rise Time  
with 0.1uF Load  
VEN=5V, CL=0.1uF  
Turn Off Delay  
and Fall Time  
with 0.1uF Load  
VEN=5V, CL=0.1uF  
V
OUT  
V
V
OUT  
OUT  
2V/div  
2V/div  
2V/div  
EN  
5V/div  
EN  
5V/div  
EN  
5V/div  
1s/div  
Threshold Trip Current  
with Ramped Load  
on Enabled Device  
VEN=5V, CL=1uF  
Short Circuit Current  
Device Enabled into Short  
VEN=5V, CL=1uF  
V
OUT  
2V/div  
V
OUT  
2V/div  
I
OUT  
200mA/div  
EN  
5V/div  
EN  
5V/div  
I
OUT  
500mA/div  
4ms/div  
Ramped Load  
on Enabled Device  
VEN=5V, CL=1uF  
Flag  
5V/div  
Flag  
5V/div  
I
OUT  
200mA/div  
I
OUT  
500mA/div  
EN  
5V/div  
I
OUT  
1A/div  
2ms/div  
1ms/div  
2ms/div  
MP6231/MP6232 Rev. 1.2  
3/31/2010  
www.MonolithicPower.com  
MPS Proprietary Information. Unauthorized Photocopy and Duplication Prohibited.  
© 2010 MPS. All Rights Reserved.  
6
MP6231/MP6232 –CURRENT-LIMITED POWER DISTRIBUTION SWITCHES  
FUNCTION BLOCK DIAGRAM  
Figure 2—Functional Block Diagram  
DETAILED DESCRIPTION  
3Output current has been gradually increased  
beyond the recommended operating current.  
The load current rises until the trip current  
threshold is reached or until the thermal limit  
Over Current  
When the load exceeds trip current (minimum  
threshold current triggering constant-current  
mode) or a short is present, MP6231/MP6232  
switches into to a constant-current mode (current  
limit value). MP6231/MP6232 will be shutdown  
only if the overcurrent condition stays long  
enough to trigger thermal protection.  
of  
the  
device  
is  
exceeded.  
The  
MP6231/MP6232 is capable of delivering  
current up to the trip current threshold without  
damaging the device. Once the trip threshold  
has been reached, the device switches into its  
constant-current mode.  
Trigger overcurrent protection for different  
overload conditions occurring in applications:  
1) The output has been shorted or overloaded  
before the device is enabled or input applied.  
MP6231/MP6232 detects the short or  
overload and immediately switches into a  
constant-current mode.  
2) A short or an overload occurs after the device  
is enabled. After the current-limit circuit has  
been tripped (reached the trip current  
threshold), the device switches into constant-  
current mode. However, high current may  
flow for a short period of time before the  
current-limit circuit can react.  
Flag Response  
The FLAG pin is an open drain configuration.  
This FAULT will report a fail mode after an 8ms  
deglitch timeout. This is used to ensure that no  
false fault signals are reported. This internal  
deglitch circuit eliminates the need for extend  
components. The FLAG pin is not deglitched  
during an over temp. or a voltage lockout.  
MP6231/MP6232 Rev. 1.2  
3/31/2010  
www.MonolithicPower.com  
MPS Proprietary Information. Unauthorized Photocopy and Duplication Prohibited.  
© 2010 MPS. All Rights Reserved.  
7
MP6231/MP6232 –CURRENT-LIMITED POWER DISTRIBUTION SWITCHES  
Thermal Protection  
The purpose of thermal protection is to prevent  
damage in the IC by allowing exceptive current to  
flow and heating the junction. The die temp. is  
internally monitored until the thermal limit is  
reached. Once this temp. is reached, the switch  
will turn off and allow the chip to cool. The switch  
has a built-in hysteresis.  
Under-voltage Lockout (UVLO)  
This circuit is used to monitor the input voltage to  
ensure that the MP6231/MP6232 is operating  
correctly. This UVLO circuit also ensures that  
there is no operation until the input voltage  
reaches the minimum spec.  
Enable  
The logic pin disables the chip to reduce the  
supply current. The device will operate once the  
enable signal reaches the appropriate level. The  
input is compatible with both COMS and TTL.  
MP6231/MP6232 Rev. 1.2  
3/31/2010  
www.MonolithicPower.com  
MPS Proprietary Information. Unauthorized Photocopy and Duplication Prohibited.  
© 2010 MPS. All Rights Reserved.  
8
MP6231/MP6232 –CURRENT-LIMITED POWER DISTRIBUTION SWITCHES  
APPLICATION INFORMATION  
In order to achieve smaller output load transient,  
placing a high-value electrolytic capacitor on the  
output pin(s) is recommended when the output  
load is heavy.  
Power-Supply Considerations  
Over 10μF capacitor between IN and GND is  
recommended. This precaution reduces power-  
supply transients that may cause ringing on the  
input and improves the immunity of the device to  
short-circuit transients.  
+5V  
8
1
2
To USB Controller  
Output 1  
FLAG1  
OUT1  
GND  
IN  
7
MP6232  
Output 2  
3
4
6
5
EN1  
OUT2  
EN2  
FLAG2  
DUAL-CHANNEL  
Figure 3—Application Circuit  
MP6231/MP6232 Rev. 1.2  
3/31/2010  
www.MonolithicPower.com  
MPS Proprietary Information. Unauthorized Photocopy and Duplication Prohibited.  
© 2010 MPS. All Rights Reserved.  
9
MP6231/MP6232 –CURRENT-LIMITED POWER DISTRIBUTION SWITCHES  
PACKAGE INFORMATION  
SOIC8E  
0.189(4.80)  
0.197(5.00)  
0.124(3.15)  
0.136(3.45)  
8
5
0.150(3.80)  
0.157(4.00)  
0.228(5.80)  
0.244(6.20)  
0.089(2.26)  
0.101(2.56)  
PIN 1 ID  
1
4
TOP VIEW  
BOTTOM VIEW  
SEE DETAIL "A"  
0.051(1.30)  
0.067(1.70)  
SEATING PLANE  
0.000(0.00)  
0.006(0.15)  
0.0075(0.19)  
0.0098(0.25)  
0.013(0.33)  
0.020(0.51)  
SIDE VIEW  
0.050(1.27)  
BSC  
FRONT VIEW  
0.010(0.25)  
0.020(0.50)  
x 45o  
GAUGE PLANE  
0.010(0.25) BSC  
0.050(1.27)  
0.024(0.61)  
0.063(1.60)  
0.016(0.41)  
0.050(1.27)  
0o-8o  
DETAIL "A"  
0.103(2.62)  
0.213(5.40)  
NOTE:  
1) CONTROL DIMENSION IS IN INCHES. DIMENSION IN  
BRACKET IS IN MILLIMETERS.  
2) PACKAGE LENGTH DOES NOT INCLUDE MOLD FLASH,  
PROTRUSIONS OR GATE BURRS.  
3) PACKAGE WIDTH DOES NOT INCLUDE INTERLEAD FLASH  
OR PROTRUSIONS.  
0.138(3.51)  
4) LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING)  
SHALL BE 0.004" INCHES MAX.  
5) DRAWING CONFORMS TO JEDEC MS-012, VARIATION BA.  
6) DRAWING IS NOT TO SCALE.  
RECOMMENDED LAND PATTERN  
MP6231/MP6232 Rev. 1.2  
3/31/2010  
www.MonolithicPower.com  
MPS Proprietary Information. Unauthorized Photocopy and Duplication Prohibited.  
© 2010 MPS. All Rights Reserved.  
10  
MP6231/MP6232 –CURRENT-LIMITED POWER DISTRIBUTION SWITCHES  
MSOP8E (EXPOSED PAD)  
0.087(2.20)  
0.099(2.50)  
0.114(2.90)  
0.122(3.10)  
5
8
0.187(4.75)  
0.199(5.05)  
0.062(1.58)  
0.074(1.88)  
0.114(2.90)  
0.122(3.10)  
PIN 1 ID  
(NOTE 5)  
Exposed Pad  
4
1
0.010(0.25)  
0.014(0.35)  
0.0256(0.65)BSC  
BOTTOM VIEW  
TOP VIEW  
GAUGE PLANE  
0.010(0.25)  
0.030(0.75)  
0.037(0.95)  
0.043(1.10)MAX  
SEATING PLANE  
0.002(0.05)  
0.004(0.10)  
0.008(0.20)  
0.016(0.40)  
0.026(0.65)  
0o-6o  
0.006(0.15)  
FRONT VIEW  
SIDE VIEW  
NOTE:  
0.100(2.54)  
1) CONTROL DIMENSION IS IN INCHES. DIMENSION IN BRACKET IS  
IN MILLIMETERS.  
2) PACKAGE LENGTH DOES NOT INCLUDE MOLD FLASH,  
PROTRUSION OR GATE BURR.  
0.075(1.90)  
0.181(4.60)  
3) PACKAGE WIDTH DOES NOT INCLUDE INTERLEAD FLASH OR  
PROTRUSION.  
4) LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING)  
SHALL BE 0.004" INCHES MAX.  
5) PIN 1 IDENTIFICATION HAS HALF OR FULL CIRCLE OPTION.  
6) DRAWING MEETS JEDEC MO-187, VARIATION AA-T.  
7) DRAWING IS NOT TO SCALE.  
0.040(1.00)  
0.016(0.40)  
0.0256(0.65)BSC  
RECOMMENDED LAND PATTERN  
MP6231/MP6232 Rev. 1.2  
3/31/2010  
www.MonolithicPower.com  
MPS Proprietary Information. Unauthorized Photocopy and Duplication Prohibited.  
© 2010 MPS. All Rights Reserved.  
11  
MP6231/MP6232 –CURRENT-LIMITED POWER DISTRIBUTION SWITCHES  
SOIC8  
0.189(4.80)  
0.197(5.00)  
0.050(1.27)  
0.024(0.61)  
8
5
0.063(1.60)  
0.150(3.80)  
0.157(4.00)  
0.228(5.80)  
0.244(6.20)  
0.213(5.40)  
PIN 1 ID  
1
4
TOP VIEW  
RECOMMENDED LAND PATTERN  
0.053(1.35)  
0.069(1.75)  
SEATING PLANE  
0.004(0.10)  
0.010(0.25)  
0.0075(0.19)  
0.0098(0.25)  
0.013(0.33)  
0.020(0.51)  
SEE DETAIL "A"  
0.050(1.27)  
BSC  
SIDE VIEW  
FRONT VIEW  
0.010(0.25)  
0.020(0.50)  
x 45o  
NOTE:  
1) CONTROL DIMENSION IS IN INCHES. DIMENSION IN  
BRACKET IS IN MILLIMETERS.  
GAUGE PLANE  
0.010(0.25) BSC  
2) PACKAGE LENGTH DOES NOT INCLUDE MOLD FLASH,  
PROTRUSIONS OR GATE BURRS.  
3) PACKAGE WIDTH DOES NOT INCLUDE INTERLEAD FLASH  
OR PROTRUSIONS.  
4) LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING)  
SHALL BE 0.004" INCHES MAX.  
0.016(0.41)  
0.050(1.27)  
0o-8o  
5) DRAWING CONFORMS TO JEDEC MS-012, VARIATION AA.  
6) DRAWING IS NOT TO SCALE.  
DETAIL "A"  
NOTICE: The information in this document is subject to change without notice. Users should warrant and guarantee that third  
party Intellectual Property rights are not infringed upon when integrating MPS products into any application. MPS will not  
assume any legal responsibility for any said applications.  
MP6231/MP6232 Rev. 1.2  
3/31/2010  
www.MonolithicPower.com  
MPS Proprietary Information. Unauthorized Photocopy and Duplication Prohibited.  
© 2010 MPS. All Rights Reserved.  
12  

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