MP3360DG [MPS]
Interface Circuit, 2 X 2 MM, MO-220VCCD, QFN-10;
| 型号： | MP3360DG |
| 厂家： | 
MONOLITHIC POWER SYSTEMS |
| 描述： | Interface Circuit, 2 X 2 MM, MO-220VCCD, QFN-10 CD 接口集成电路 |
| 文件： | 总8页 (文件大小：319K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MP3360
Highly Integrated Photo Flash Charger
and IGBT Driver
The Future of Analog IC Technology
DESCRIPTION
FEATURES
The MP3360 is a fast, highly efficient and
precision high voltage photo-flash charger for
camera phone xenon flash.
•
•
Integrated 60V, 0.5Ω Power Switch
Single wire digital interface for current limit
programming.
•
•
•
2.5% Charge Accuracy
<1uA Shutdown Current
Integrated IGBT Driver with Regulated Gate
Voltage
The MP3360 has programmable peak currents
of
1.5A/1.4A/1.3A/1.2A/1.1A/1.0A/0.9A/0.8A
/0.75A/0.7A/0.65A/0.6A/0.55A/0.5A/0.45A/0.4A.
A 60V, 0.5Ω internal power switch lowers
transformer turns ratio and switching losses
associated with the primary leakage inductance
and winding capacitance. Integrated secondary
feedback resistors provide +/-2.5% output
voltage charge accuracy. MP3360 also has an
integrated IGBT driver with a regulated 2.7V
gate voltage.
APPLICATIONS
•
Mobile Phones with Xeon Flash
•
•
•
Digital Still Cameras
Optical Film Cameras
PDAs with Xeon Flash
“MPS” and “The Future of Analog IC Technology” are Registered Trademarks of
Monolithic Power Systems, Inc.
MP3360 is available in the 10-pin, 2X2 flip chip
package.
TYPICAL APPLICATION
T1
1
6
4
TP7
VIN
3
TP6
R2
R1
10
U1
499k
1206
9
8
3
VIN
SW
FB
GND
MP3360
5
T2
AGND
TP8
1
2
3
6
4
CHAG
RDYB
CHG
2
Xenon Flash
IGBTOUT
VIGBT
RDYB
10
1
IGBTIN
IGBTIN
PGND
7
TP9
600V/1A
R3
1M
1206
5, 6, 7, 8
1, 2, 3
4
MP3360 Rev. 0.9
1/29/2010
www.MonolithicPower.com
MPS Proprietary Information. Unauthorized Photocopy and Duplication Prohibited.
© 2010 MPS. All Rights Reserved.
1
MP3360 – HIGHLY INTEGRATED PHOTO FLASH CHARGER AND IGBT DRIVER
ORDERING INFORMATION
Part Number*
Package
Top Marking
Free Air Temperature (TA)
MP3360
10-pin, 2x2 Flip QFN
4KY
-40°C to +85°C
For Tape & Reel, add suffix –Z (e.g. MP3360DG–Z);
For RoHS Compliant Packaging, add suffix –LF(e.g. MP3360DG–LF–Z)
PACKAGE REFERENCE
TOP VIEW
VIGBT
10
1
2
3
4
9
8
7
6
VIN
IGBTIN
IGBTOUT
SW
AGND
PGND
CHG
RDYB
5
FB
ABSOLUTE MAXIMUM RATINGS (1)
VIN to GND .........................................-0.3Vto 6V
CHG, IGBTIN, IGBTOUT, VIGBT,
Recommended Operating Conditions (3)
Supply Voltage VIN .............................2.5V to 6V
Operating Junct. Temp (TJ)...... -40°C to +125°C
Thermal Resistance (4)
θJA
θJC
RDYB to AGND .................................-0.3Vto 6V
FB to AGND...................................-60V to 350V
SW to AGND...................................-0.3V to 60V
PGND to AGND ...........................-0.3V to +0.3V
2X2, 10 pin Flip Chip Thermal Resistance
Operating Temperature Ranges .........................
............................................. -20°C to +85°C
Storage Temperature............... -55°C to +150°C
Junction Temperature............................ +150°C
2x2 Flip Chip...........................80 ...... 16...°C/W
Notes:
1) Exceeding these ratings may damage the device.
2) The maximum allowable power dissipation is a function of the
maximum junction temperature TJ (MAX), the junction-to-
ambient thermal resistance θJA, and the ambient temperature
TA. The maximum allowable continuous power dissipation at
any ambient temperature is calculated by PD (MAX) = (TJ
(MAX)-TA)/θJA. Exceeding the maximum allowable power
dissipation will cause excessive die temperature, and the
regulator will go into thermal shutdown. Internal thermal
shutdown circuitry protects the device from permanent
damage.
(2)
Continuous Power Dissipation (TA = +25°C)
………………………………………………....1.6W
Lead Temperature (Solder).....................+260°C
3) The device is not guaranteed to function outside of its operating
conditions.
4) Measured on JESD51-7, 4-layer PCB.
MP3360 Rev. 0.9
1/29/2010
www.MonolithicPower.com
MPS Proprietary Information. Unauthorized Photocopy and Duplication Prohibited.
© 2010 MPS. All Rights Reserved.
2
MP3360 – HIGHLY INTEGRATED PHOTO FLASH CHARGER AND IGBT DRIVER
ELECTRICAL CHARACTERISTICS
VIN = V (CHG) = 3.6V, TA = +25°C, unless otherwise noted.
Parameter
Conditions
Min
Typ
Max
Unit
Photoflash Capacitor Charger
VIN Voltage Range
2.5
6
V
V
Rising edge, hysteresis = 200mV
typical
VIN UVLO
2.5
VIN Quiescent Current
VIN Quiescent Current
Shutdown Current from VIN
VSW Leakage Current
SW ON Resistance between SW
and GND
V(CHG)=High, V(SW) = 0
V(CHG)=High, V(FB) = 325V
V(CHG)=Low, VIN =3.6V
VIN=3.6V, VSW=60V, in Shutdown
1
2
150
1
mA
µA
µA
µA
1
Switch turn-on
0.5
Ω
Pull-down Resistance of CHG pin
IPEAK1
IPEAK2
V(CHG)=3.6V
Program for Highest Current Limit
Program for Lowest Current Limit
100
1.5
0.4
kΩ
A
A
1.3
1.7
0.6
Charge completion detect voltage
at FB
290
298
308
V
FB Resistance
V(FB)=30V
303
5
kΩ
V
µA
V
µS
°C
V
DCM Comparator threshold
RDYB Leakage Current
RDYB Output Low Voltage
MAX TON
Thermal Shutdown
Charge Input High Voltage
Charge Input Low Voltage
tHI
V(RDYB)=3.6V
ISINK= 2mA
Maximum TON time
Rising edge, hysteresis = 15°C
0.1
0.2
70
150
120
2.4
0.6
60
V
0.1
0.1
30
µS
µS
µS
µS
tLO
tEN_delay
tPW
Vin=2.7V-5.5V
MP3360 Rev. 0.9
1/29/2010
www.MonolithicPower.com
MPS Proprietary Information. Unauthorized Photocopy and Duplication Prohibited.
© 2010 MPS. All Rights Reserved.
3
MP3360 – HIGHLY INTEGRATED PHOTO FLASH CHARGER AND IGBT DRIVER
PIN FUNCTIONS
Pin
Name
Function
1
IGBTIN
Logic Input Pin for IGBT Drive.
2
IGBTOUT Output Drive for IGBT Gate. Connect this pin to the gate of the IGBT.
3
4
5
SW
RDYB
FB
Switch Pin. This is the drain of the internal power switch.
Open-Drain Power-Ready Output. RDYB becomes low when the output voltage is reached.
Feedback Pin. Its trip voltage is 298V
Charge Enable Pin. A low to high transition on this pin puts the part into power delivery
mode. Once the target voltage is reached, the part will stop charging the output. Toggle
this pin will start charging again. Bring this pin low will terminate the power delivery and put
the part in shutdown. This pin can be also used to program the peak current regulation. See
the description for current programming.
6
CHG
7
8
PGND
AGND
Power Ground
Analog ground. Tie it directly to local ground plane.
Input Supply Pin. Connect it to system supply voltage. Bypass VIN to GND with a 0.1uF or
greater ceramic capacitor.
9
VIN
2.7V LDO output. VIGBT is the supply voltage for IGBT gate driver. Bypass VIGBT with
0.1uF cap to GND.
10
VIGBT
MP3360 Rev. 0.9
1/29/2010
www.MonolithicPower.com
MPS Proprietary Information. Unauthorized Photocopy and Duplication Prohibited.
© 2010 MPS. All Rights Reserved.
4
MP3360 – HIGHLY INTEGRATED PHOTO FLASH CHARGER AND IGBT DRIVER
TYPICAL PERFORMANCE CURVES
Line Regulation
Charge Time vs.
Input Voltage
Efficiency vs V
OUT
I
=1.5A
SET
80
77
74
71
68
65
62
59
56
53
50
3900
3600
3300
3000
2700
2400
2100
1800
1500
1200
900
1.001
1
V
=6V
IN
I
C
V
=1.5V
SET
V
=4.5V
IN
=100uF
=300V
OUT
OUT
0.999
0.998
0.997
0.996
0.995
V
=3V
IN
I
C
V
=1.5V
SET
=47uF
=300V
OUT
OUT
I
C
V
=1.5V
SET
=47uF
=300V
OUT
OUT
600
70 110 150 190 230 270 310
(V)
2.5
3
3.5
4
4.5
5
5.5
6 6.5
2.5 3 3.5
4
4.5
5
5.5
6 6.5
INPUT VOLTAGE (V)
V
INPUT VOLTAGE (V)
OUT
Switching Waveform
Switching Waveform
Charging Waveform
V
= 3.3V, V
OUT
= 300V,
= 47uF
V
= 5.0V, V
OUT
= 300V,
= 47uF
V
= 3.3V, V
= 300V,
IN
IN
IN
OUT
= 1.5A, C = 47uF
OUT
I
= 1.5A, C
I
= 1.5A, C
I
SET
OUT
SET
OUT
SET
V
CHG
2V/div.
V
SW
V
V
SW
RDYB
20V/div.
20V/div.
2V/div.
V
OUT
V
OUT
V
OUT
100V/div.
100V/div.
100V/div.
I
SW
I
I
SW
SW
1A/div.
1A/div.
500mA/div.
2us/div.
2us/div.
400µ s/div.
Charging Waveform
Charging Waveform
Charging Waveform
V
= 5.0V, V
OUT
= 300V,
= 47uF
V
= 3.3V, V
OUT
= 300V,
= 100uF
V
= 5.0V, V
OUT
= 300V,
= 100uF
IN
IN
IN
I
= 1.5A, C
I
= 1.5A, C
I
= 1.5A, C
SET
OUT
SET
OUT
SET
OUT
V
CHG
2V/div.
V
V
CHG
CHG
2V/div.
RDYB
2V/div.
2V/div.
RDYB
2V/div.
V
V
V
RDYB
2V/div.
V
V
V
OUT
OUT
OUT
100V/div.
100V/div.
100V/div.
I
I
I
SW
SW
SW
500mA/div.
500mA/div.
500mA/div.
200µ s/div.
1s/div.
400µ s/div.
MP3360 Rev. 0.9
1/29/2010
www.MonolithicPower.com
MPS Proprietary Information. Unauthorized Photocopy and Duplication Prohibited.
© 2010 MPS. All Rights Reserved.
5
MP3360 – HIGHLY INTEGRATED PHOTO FLASH CHARGER AND IGBT DRIVER
BLOCK DIAGRAM
Figure 1—Functional Block Diagram
MP3360 Rev. 0.9
1/29/2010
www.MonolithicPower.com
MPS Proprietary Information. Unauthorized Photocopy and Duplication Prohibited.
© 2010 MPS. All Rights Reserved.
6
MP3360 – HIGHLY INTEGRATED PHOTO FLASH CHARGER AND IGBT DRIVER
OPERATION
The MP3360 controlled flyback charger
operates in critical conduction mode with peak
current set by the CHG pin. The output voltage
is divided down through internal 300: 1 resistive
divider from the positive terminal of the
transformer secondary (FB pin) and compares it
with the internal 1.2V reference. The low to
high transition of the CHG pin will enable the
flyback converter to switch.
CURRENT LIMIT PROGRAMMING
The current limit can be programmed using the
CHG pin. After asserting the CHG, it should be
held high for at least 30us. After that, it takes
two pulses to enter the programming mode. In
the programming mode, each pulse advances
the internal counter to the next higher current
limit by 50mA until 750mA is reached and by
100mA increments beyond 750mA. The first
pulse is for 400mA current limit. The next pulse
will set the current limit to 450mA, etc. This
programming should be done within 60us.
Otherwise, the programming pulses will be
ignored after the programming window expires.
When you have advanced to the desired
current limit setting, the high state should be
held to make the part switch with the set current
limit. To set the current limit to 1.5A (highest
possible), the previous procedure is not
necessary. Asserting and holding high the CHG
pin will make the part switches with a 1.5A
current limit. See the following timing diagram
for detailed timing information.
A constant TOFF of 20µs is used when the
output voltage is below 20V to avoid inrush
current. The boundary mode operation will
follow to minimize charge time when the output
voltage is above 20V. A minimum TOFF of 200ns
serves as blanking for turn off transition. The
circuit will stop switching and RDYB will be
pulled low once the flash capacitor is charged
to 300V, a value set by the internal 300:1 R
divider and 1.2V reference. VIGBT will be
regulated to 2.7V.
When the charge is full,
then part will shut down its internal circuitry with
less than 1uA drawn from VIN. Toggling the
CHG pin will restart charge cycle. Bringing the
CHG pin low terminates the power delivery and
put the part in shutdown. A maximum TON timer
prevents pulling current from a depleted battery.
If the ON time exceeds maximum TON, the
switch is forced OFF regardless of the IPEAK
detection.
Falling edge of the following
LO pulses advance the internal
counter
First Two required to initiate
programming
tHI t
CHG
400mA
600mA
t
EN-delay
ON
(Internal)
ENPRG
(Internal)
t
PW
During this time, the low state of CHG can not
shut-down the part.
Switching starts.
ILIM Programming Timing Diagram
(600mA Current Limit)
MP3360 Rev. 0.9
1/29/2010
www.MonolithicPower.com
MPS Proprietary Information. Unauthorized Photocopy and Duplication Prohibited.
© 2010 MPS. All Rights Reserved.
7
MP3360 – HIGHLY INTEGRATED PHOTO FLASH CHARGER AND IGBT DRIVER
PACKAGE INFORMATION
QFN10 (2mm x 2mm)
NOTICE: The information in this document is subject to change without notice. Users should warrant and guarantee that third
party Intellectual Property rights are not infringed upon when integrating MPS products into any application. MPS will not
assume any legal responsibility for any said applications.
MP3360 Rev. 0.9
1/29/2010
www.MonolithicPower.com
MPS Proprietary Information. Unauthorized Photocopy and Duplication Prohibited.
© 2010 MPS. All Rights Reserved.
8
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