MP2632 [MPS]
All-in-One, 3A Battery Charger with 3A Boost Current;
| 型号： | MP2632 |
| 厂家： | 
MONOLITHIC POWER SYSTEMS |
| 描述： | All-in-One, 3A Battery Charger with 3A Boost Current 电池 |
| 文件： | 总37页 (文件大小：2693K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MP2632
All-in-One, 3A Battery Charger
with 3A Boost Current
DESCRIPTION
FEATURES
The MP2632 is a highly integrated, flexible,
switch-mode battery charger with system power-
path management and is designed for single-cell
Li-ion or Li-polymer battery use in a wide range
of applications.
Up to 14V Sustainable Input Voltage
4.65V to 6V Operating Input Voltage Range
Power Management Function, Integrated
Input Current Limit, Input Voltage Regulation
Up to 3A Programmable Charge Current
Trickle-Charge Function
The IC can operate in both charge mode and
boost mode to allow for full system and battery
power management.
Selectable 4.2V/4.35V/4.45V Charge Voltage
with 0.5% Accuracy
4-LED Driver for Battery Fuel Gauge
Indication
Automatic Turn-Off at Light Load
Input Source Detection
Output Source Signaling
Torch-Light Control
Negative Temperature Coefficient Pin for
Battery Temperature Monitoring
Programmable Timer Back-Up Protection
Thermal Regulation and Thermal Shutdown
Internal Battery Reverse Leakage Blocking
Integrated Over-Voltage Protection (OVP)
and Over-Current Protection (OCP) for Pass-
Through Path
Reverse Boost Operation Mode for System
Power
Up to 3.0A Programmable Output Current
Limit for Boost Mode
The IC has an integrated IN-to-SYS pass-through
path to pass the input voltage to the system. The
pass-through path has built-in over-voltage and
over-current protection and has a higher priority
over the charging path.
When the input power is present, the device
operates in charge mode. The MP2632 detects
the battery voltage automatically and charges the
battery in three phases: trickle current, constant
current and constant voltage. Other features
include charge termination and auto-recharge.
The MP2632 also integrates both input current
limit and input voltage regulation to manage input
power and meet the priority of the system power
demand.
In the absence of an input source, the IC
switches to boost mode through PB to power
SYS from the battery. In boost mode, OLIM
programs the output current limit, and the IC
turns off at light load automatically. The IC also
uses output short-circuit protection to disconnect
the battery from the load completely in the event
of a short-circuit fault. The MP2632 resumes
normal operation once the short-circuit fault is
removed.
Integrated Short-Circuit Protection (SCP) and
Output Over-Voltage Protection for Boost
Mode
APPLICATIONS
Sub-Battery Applications
Power-Bank Applications for Smart Phones
Tablets and Other Portable Devices
The 4-LED driver is integrated for voltage-based
fuel gauge indication. Together with torch-light
control, the MP2632 provides an all-in-one
solution for power banks and similar applications
without an external micro-controller.
All MPS parts are lead-free, halogen-free, and adhere to the RoHS
directive. For MPS green status, please visit the MPS website under
Quality Assurance. “MPS” and “The Future of Analog IC Technology” are
registered trademarks of Monolithic Power Systems, Inc.
Analog Digital Adaptive Modulation (ADAM) is a trademark of Monolithic
Power Systems, Inc.
The MP2632 is available in a 26-pin QFN
(4mmx4mm) package.
MP2632 Rev.1.0
6/24/2016
www.MonolithicPower.com
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© 2016 MPS. All Rights Reserved.
1
MP2632 – ALL-IN-ONE, 3A SW CHARGER, 3A BOOST
TYPICAL APPLICATION
USB OUTPUT
CSYS
C2
USB INPUT
PB
SYS
DM2 DP2
RS1
L1
5V Input
ICHG
SW
VBATT
IBATT
VIN
CIN
Q1
Q2
Q3
CBATT
CSP
Battery
Q4
DM1
BATT
VNTC
DP1
NTC
TC
VNTC
MP2632
VBATT
VCC
LED1
LED2
C4
VB
ILIM
LED3
LED4
TMR
VCC
OLIM
ISET
AGND
PGND
RILIM ROLIM RISET
CTMR
Table 1: Operation Mode Control
VIN (V)
PB
Operation Mode
Q1, Q2
Q3
Q4
VBATT + 300mV < VIN < 6V
X
Charging
Discharging
(boost)
On
SW
SW
SW
From H to L
for >1.5ms
VIN < VBATT + 300mV
Off
SW
VIN > 6V
VIN < 2V
X
OVP
Off
Off
Off
Off
Off
Off
H or L
Sleep
MP2632 Rev.1.0
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6/24/2016
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© 2016 MPS. All Rights Reserved.
MP2632 – ALL-IN-ONE, 3A SW CHARGER, 3A BOOST
ORDERING INFORMATION
Part Number*
Package
Top Marking
MP2632GR
QFN-26 (4mmx4mm)
See Below
* For Tape & Reel, add suffix –Z (e.g. MP2632GR–Z)
TOP MARKING
MPS: MPS prefix
Y: Year code
WW: Week code
MP2632: Product code of MP2632GR
LLLLLL: Lot number
PACKAGE REFERENCE
TOP VIEW
LED1 LED2 LED3 LED4 CSP BATT
VB
26
25
24
23
22
21
20
19
18
17
16
15
14
13
NTC
VNTC
AGND
VCC
PGND
SW
1
2
3
4
5
SYS
SYS
VIN
OLIM
ISET
TMR
6
7
8
9
10
11
12
DM1
DP1 TC ILIM DM2 DP2
PB
QFN-26 (4mmx4mm)
MP2632 Rev.1.0
6/24/2016
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3
MP2632 – ALL-IN-ONE, 3A SW CHARGER, 3A BOOST
Thermal Resistance (4) θJA
θJC
ABSOLUTE MAXIMUM
QFN-26 (4mmx4mm)..............44........9 ....°C/W
RATINGS (1)
VIN to PGND ............................... -0.3V to +14V
SYS to PGND............................. -0.3V to +6.5V
SW to PGND ........-0.3V (-2V for 20ns) to +6.5V
BATT to PGND………………...... -0.3V to +6.5V
All other pins to AGND................ -0.3V to +6.5V
NOTES:
1) Exceeding these ratings may damage the device.
2) The maximum allowable power dissipation is a function of the
maximum junction temperature TJ (MAX), the junction-to-
ambient thermal resistance θJA, and the ambient temperature
TA. The maximum allowable continuous power dissipation at
any ambient temperature is calculated by PD (MAX) = (TJ
(MAX)-TA)/θJA. Exceeding the maximum allowable power
dissipation produces an excessive die temperature, causing
the regulator to go into thermal shutdown. Internal thermal
shutdown circuitry protects the device from permanent
damage.
(2)
Continuous power dissipation (TA = +25°C) ...
................................................................2.84W
Junction temperature ...........................150°C
Lead temperature (solder) .......................260°C
Storage temperature….. ..........-65°C to +150°C
Recommended Operating Conditions (3)
Supply voltage (VIN) ...................... 4.65V to +6V
IIN ......................................................... Up to 3A
ISYS....................................................... Up to 3A
ICHG ...................................................... Up to 3A
VBATT ............................................... Up to 4.45V
Operating junction temp. (TJ) ...-40°C to +125°C
3) The device is not guaranteed to function outside of its
operating conditions.
4) Measured on JESD51-7, 4-layer PCB.
MP2632 Rev.1.0
6/24/2016
www.MonolithicPower.com
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4
MP2632 – ALL-IN-ONE, 3A SW CHARGER, 3A BOOST
ELECTRICAL CHARACTERISTICS
VIN = 5.0V, RS1 = 10mΩ, TA = +25°C, unless otherwise noted.
Parameter
Symbol Condition
Min
49
Typ
55
26
26
7
Max Units
IN-to-SYS NMOS on resistance
High-side PMOS on resistance
Low-side NMOS on resistance
RIN to SYS VCC = 5V
62
31
mΩ
mΩ
mΩ
A
RH_DS
RL_DS
VCC = 5V
20
VCC = 5V
20
31
CC charge mode/boost mode
TC charge mode
5.7
1.9
8.4
2.8
High-side PMOS peak current
limit
IPEAK_HS
IPEAK_LS
2.3
A
Low-side NMOS peak current
limit
6.4
8
9.6
A
Switching frequency
VCC UVLO
Fsw
500
600
2.16
100
800
kHz
V
VCC_UVLO
1.96
2.36
VCC UVLO hysteresis
Charge Mode
mV
Charge mode, ISYS = 0,
battery float
Input quiescent current
Input current limit for DCP
Input current limit for SDP
IQ_IN
1.8
2.5
mA
mA
mA
RlLIM = 88.7k
380
740
435
820
490
900
IIN_LIMIT RlLIM = 49.9k
RlLIM = 14.7k
2580
2840
3100
SDP is detected using DP1/DM1
detection
IUSB
400
5.8
450
500
6.2
Input over-voltage protection
VIN_OVP hysteresis
VIN_OVP VIN rising
VIN falling
6.0
250
3.45
155
5
V
mV
V
Input under-voltage lockout
VUVLO hysteresis
VIN_UVLO VIN rising
VIN falling
3.3
3.6
mV
A
Input over-current threshold
IIN_OCP
Input over-current blanking
τINOCBLK
200
µs
time(5)
Input over-current recover time(5) τINRECVR
150
4.35
4.2
ms
Connect VB to GND
4.328
4.179
4.428
4.1
4.372
4.221
4.472
4.22
4.08
4.32
3.13
3.02
3.2
Terminal battery voltage
Recharge threshold
VBATT_FULL Leave VB floating
Connect VB to VCC
V
V
V
4.45
4.16
4.02
4.26
3.07
2.96
3.14
Connect to VB to GND
VRECH
Leave VB floating
Connect VB to VCC
Connect VB to GND
3.95
4.19
3
Trickle charge voltage threshold
VBATT_TC Leave VB floating
Connect VB to VCC
2.9
3.07
MP2632 Rev.1.0
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MP2632 – ALL-IN-ONE, 3A SW CHARGER, 3A BOOST
ELECTRICAL CHARACTERISTICS (continued)
VIN = 5.0V, RS1 = 10mΩ, TA = +25°C, unless otherwise noted.
Parameter
Symbol Condition
Min
Typ
Max
Units
Trickle charge hysteresis
220
mV
As a percentage of
VBATT_FULL
VBATT_
FULL
Battery over-voltage threshold
VBOVP
101.5% 103.5% 105.5%
RS1 = 10mΩ,
RISET = 150k
900
1800
2700
1000
2000
3000
1100
2200
3300
Constant charge (CC) current
ICC
RS1 = 10mΩ, RISET = 75k
mA
RS1 = 10mΩ,
RISET = 49.9k
Trickle charge current
Termination charge current
Input voltage regulation reference
Boost Mode
ITC
IBF
90
90
280
200
4.65
400
300
4.75
mA
mA
V
RS1 = 10mΩ
VREG
4.55
SYS voltage range
ISYS = 100mA
5
5.1
5.8
5.2
6
V
V
Threshold over VSYS to
VSYS(OVP) turn off the converter
during boost mode
Boost SYS over-voltage protection
threshold
5.6
SYS over-voltage protection
threshold hysteresis
VSYS falling from VSYS(OVP)
330
mV
mA
ISYS = 0, boost mode,
IQ_BOOST in test mode with auto-off
disabled
Boost quiescent current
1.65
RS1 = 10mΩ,
ROLIM = 150k
0.9
2.34
2.8
1
2.5
3
1.1
2.66
3.2
Programmable boost output current-
limit accuracy
RS1 = 10mΩ,
IOLIM
A
ROLIM = 60.4k
RS1 = 10mΩ,
ROLIM = 49.9k
SYS over-current blanking time(5)
SYS over-current recover time(5)
τSYSOCBLK
τSYSRECVR
150
1.5
µs
ms
Battery current in boost
System load to turn off boost
Light-load blanking time(5)
INOLOAD
mode
50
85
120
mA
16
2.5
2.9
s
V
V
During boost
VBAT_UVLO
2.6
Weak battery threshold
Before boost starts
3.05
Sleep Mode
VBATT = 4.2V, SYS float,
ILEAKAGE VIN = 0V,
Battery leakage current
13
16
μA
not in boost mode
MP2632 Rev.1.0
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6/24/2016
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MP2632 – ALL-IN-ONE, 3A SW CHARGER, 3A BOOST
ELECTRICAL CHARACTERISTICS (continued)
VIN = 5.0V, RS1 = 10mΩ, TA = +25°C, unless otherwise noted.
Parameter
Symbol Condition
Min
Typ
Max Units
Indication and Logic
LED1, LED2, LED3, and LED4
output low voltage
Sinking 5mA
200
550
0.2
mV
mV
µA
TC output low voltage
Sinking 100mA
Connected to 5V
LED1, LED2, LED3, LED4, TC
leakage current
INOVP, BOVP and NTC, fault
blinking frequency(5)
1
Hz
PB input logic low voltage
PB input logic high voltage
Protection
0.4
V
V
1.4
CTMR = 0.1µF, remains in
TC mode, ITC = 250mA
Trickle charge time
16
Min
Min
Total charge time
CTMR = 0.1µF, ICHG = 1A
390
NTC low temp, rising threshold
65.2% 66.2% 67.2%
RNTC = NCP18XH103(0°C)
NTC low temp, rising threshold
hysteresis
2.4%
34.7% 35.7% 36.7%
2%
VSYS
NTC high temp, rising threshold
RNTC = NCP18XH103(50°C)
Charge mode
NTC high temp, rising threshold
hysteresis
Charging
current
foldback
120
150
°C
°C
threshold(5)
Thermal shutdown threshold(5)
Input DP1/DM1 USB Detection
DP1 voltage source
VDP_SRC
IDP_SRC
IDM_SINK
IDP_LKG
0.5
7
0.6
0.7
13
150
1
V
μA
μA
ΜA
ΜA
V
Data connect detect current source
DM1 sink current
50
-1
100
Leakage current input DP1/DM1
IDM_LKG
-1
1
Data detect voltage
VDAT_REF
VLGC_LOW
0.25
0.4
0.8
Logic low (logic threshold)
DM pull-down resistor
V
19
KΩ
Logic I/O Characteristics
Low-logic voltage threshold
High-logic voltage threshold
VL
0.4
V
V
VH
1.3
MP2632 Rev.1.0
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MP2632 – ALL-IN-ONE, 3A SW CHARGER, 3A BOOST
ELECTRICAL CHARACTERISTICS (continued)
VIN = 5.0V, RS1 = 10mΩ, TA = +25°C, unless otherwise noted.
Parameter
Symbol Condition
Min
Typ
Max Units
Output DP2/DM2 USB Signaling
BC1.2 DCP Mode
DP2 and DM2 short resistance
BC1.2 SDP Mode
VDP = 0.8V, IDM = 1mA
158
200
Ω
DP2 pull-down resistance
DM2 pull-down resistance
Divider Mode
11
11
15
15
19
19
kΩ
kΩ
DP2 output voltage
VOUT = 5V
VOUT = 5V
2.6
2.6
26
2.7
2.7
31
2.8
2.8
36
V
V
DM2 output voltage
DP2/DM2 output impedance
1.2V/1.2V Mode
kΩ
DP2/DM2 output voltage
DP2/DM2 output impedance
VOUT = 5V
1.21
60
1.26
78
1.31
90
V
kΩ
Voltage-Based Fuel Gauge (VOREG = 4.2V, Charge Mode)
First level of battery voltage
threshold
3.52
3.7
3.6
500
3.8
3.69
3.91
4.11
V
mV
V
Hysteresis
Second level of battery voltage
threshold
Hysteresis
500
4.0
mV
V
Third level of battery voltage
threshold
3.92
Hysteresis
500
mV
Voltage-Based Fuel Gauge (VOREG = 4.2V, Discharge Mode)
First level of battery voltage
threshold
3.4
3.55
3.7
3.47
500
3.62
500
3.77
500
3.92
500
3.54
3.69
3.84
3.99
V
mV
V
Hysteresis
Second level of battery voltage
threshold
Hysteresis
mV
V
Third level of battery voltage
threshold
Hysteresis
mV
V
Fourth level of battery voltage
threshold
3.85
Hysteresis
mV
NOTE:
5) Guaranteed by design.
MP2632 Rev.1.0
6/24/2016
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MP2632 – ALL-IN-ONE, 3A SW CHARGER, 3A BOOST
TYPICAL PERFORMANCE CHARACTERISTICS
VIN = 5V, CIN = CBATT = CSYS = C2 = 22µF, L1 = 2.2µH, RS1 = 10mΩ, C4 = CTMR = 0.1µF, battery
simulator, unless otherwise noted.
MP2632 Rev.1.0
6/24/2016
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MP2632 – ALL-IN-ONE, 3A SW CHARGER, 3A BOOST
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
VIN = 5V, CIN = CBATT = CSYS = C2 = 22µF, L1 = 2.2µH, RS1 = 10mΩ, C4 = CTMR = 0.1µF, battery
simulator, unless otherwise noted.
MP2632 Rev.1.0
6/24/2016
www.MonolithicPower.com
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MP2632 – ALL-IN-ONE, 3A SW CHARGER, 3A BOOST
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
VIN = 5V, CIN = CBATT = CSYS = C2 = 22µF, L1 = 2.2µH, RS1 = 10mΩ, C4 = CTMR = 0.1µF, battery
simulator, unless otherwise noted.
MP2632 Rev.1.0
6/24/2016
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MP2632 – ALL-IN-ONE, 3A SW CHARGER, 3A BOOST
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
VIN = 5V, CIN = CBATT = CSYS = C2 = 22µF, L1 = 2.2µH, RS1 = 10mΩ, C4 = CTMR = 0.1µF, battery
simulator, unless otherwise noted.
MP2632 Rev.1.0
6/24/2016
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MP2632 – ALL-IN-ONE, 3A SW CHARGER, 3A BOOST
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
VIN = 5V, CIN = CBATT = CSYS = C2 = 22µF, L1 = 2.2µH, RS1 = 10mΩ, C4 = CTMR = 0.1µF, battery
simulator, unless otherwise noted.
MP2632 Rev.1.0
6/24/2016
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MP2632 – ALL-IN-ONE, 3A SW CHARGER, 3A BOOST
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
VIN = 5V, CIN = CBATT = CSYS = C2 = 22µF, L1 = 2.2µH, RS1 = 10mΩ, C4 = CTMR = 0.1µF, battery
simulator, unless otherwise noted.
MP2632 Rev.1.0
6/24/2016
www.MonolithicPower.com
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14
MP2632 – ALL-IN-ONE, 3A SW CHARGER, 3A BOOST
PIN FUNCTIONS
P/N Name
I/O
Description
1
2
PGND
SW
Power
Power ground.
Switch output node. It is not recommended to place vias on the SW plane during
PCB layout.
Power
Power
Power
System output. Place a ceramic capacitor of at least 22µF as close to SYS and
PGND as possible. The total capacitance should not be lower than 44µF.
3, 4
5
SYS
VIN
Adapter input. Place a bypass capacitor close to VIN to prevent large input voltage
spikes.
Negative line of the input USB data line pair. DM1 together with DP1 achieves
the USB host. DM1 has automatic charging port detection.
6
7
DM1
DP1
I
I
Positive line of the input USB data line pair. DP1 together with DM1 achieves
the USB host. DP1 has automatic charging port detection.
Torch control output. TC is the open-drain structure. The internal driver MOSFET
is on when PB is pulled low for more than 1.5ms twice within one second.
8
9
TC
O
I
Input current setting. Connect ILIM to GND with an external resistor to program
an input current limit in charge mode when a dedicated charger is detected.
ILIM
Negative line of the output USB data line pair. DM2 together with DP2
automatically provides the correct voltage signal for attached portable equipment to
perform DCP detection.
10
11
DM2
DP2
O
O
Positive line of the output USB data line pair. DP2 together with DM2
automatically provides the correct voltage signal for attached portable equipment to
perform DCP detection.
Push button input. Connect a push button from PB to AGND. PB is pulled up by a
resistor internally. When PB is set from high to low for more than 1.5ms, the boost
is enabled and latched if VIN is not available.
LED1-4 are on for five seconds whenever PB is set from high to low for more than
1.5ms.
12
PB
I
If PB is set from high to low for more than 1.5ms twice within one second and the
torch light is off, the torch light drive MOSFET is on and latched. However, if PB is
set from high to low for more than 1.5ms twice within one second and the torch
drive MOSFET is on, the torch light drive MOSFET is off.
If PB is set from high to low for more than 2.5 seconds, this is defined as a long
push, and boost is shut down manually.
Oscillator period timer. Connect a timing capacitor between TMR and GND to set
the oscillator period. Short TMR to GND to disable the timer function.
13
14
15
TMR
ISET
OLIM
I
I
I
Programmable charge current. Connect an external resistor to GND to program
the charge current.
Programmable output current limit for boost mode. Connect an external resistor
to GND to program the system current in boost mode.
MP2632 Rev.1.0
6/24/2016
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MP2632 – ALL-IN-ONE, 3A SW CHARGER, 3A BOOST
PIN FUNCTIONS (continued)
P/N Name
I/O
Description
Internal circuit power supply. Bypass VCC to GND with a ceramic capacitor no
higher than 100nF.
16
17
VCC
I
AGND
I/O
Analog ground.
Pull-up voltage source for the NTC function. VNTC is connected to VCC through
an internal MOSFET. VNTC is disconnected from VCC during sleep mode. VNTC
should be the pull-up voltage of the external NTC resistive divider.
18
VNTC
O
19
20
NTC
VB
I
I
Negative temperature coefficient (NTC) thermistor.
Programmable battery full voltage. Leave VB floating for 4.2V. Connect VB to
logic high for 4.45V. Connect VB to GND for 4.35V.
21
22
BATT
CSP
I
I
Positive battery terminal/battery charge current sense negative input.
Battery charge current sense positive input.
LED4 together with LED1, LED2, and LED3 achieves the voltage-based fuel
gauge indication.
23
24
25
26
LED4
LED3
LED2
LED1
O
O
O
O
LED3 together with LED1, LED2, and LED4 achieves the voltage-based fuel
gauge indication.
LED2 together with LED1, LED3, and LED4 achieves the voltage-based fuel
gauge indication.
LED1 together with LED2, LED3, and LED4 achieves the voltage-based fuel
gauge indication.
MP2632 Rev.1.0
6/24/2016
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16
MP2632 – ALL-IN-ONE, 3A SW CHARGER, 3A BOOST
BLOCK DIAGRAM
SYS
DM2
DP2
Output
Signaling
SW
VIN
Q1
Q2
Q3
DM1
VCC
A1
DP/DM
Detection
LSMOS
Driver
DP1
IIN_FB
VCC
LSMOS
Driver
Charge
Pump
Q4
IIN_LMT
ILIM
Input Current
Limit Setting
PWM
Controller
VNTC
Sleep Mode
CSP
VC
C
VCC
Current Sense
K1*ICHG
VIN
Buffer
VBATT_FULL
VBATT_FB
BATT
GMV
GMI
VBATT
ICC
VSYS
K1*ICHG
VBATT_FB
PGND
Control Logic
&
Mode Selection
VIN
IIN_LMT
UV
OV
GMINI
GMINV
IIN_FB
AGND
LED1
VIN_FB
VIN_LMT
VSYS
VBATT
300mV
+
TRef
LED2
LED3
LED4
GMT
TJ
Boost Enable
Junction
Temp Sense
Torch Control
PB
Thermal
Protection
FG
Indication
VCC
H/L/Floating
VB
VBATT_FULL
VNTC
Charge
Parameter
Setting
ISET
ICC
Battery Temp
Protection
Boost Output
Current Limit
Setting
OLIM
Timer Fault
VBATT
TMR
TIMER
Function
NTC
VTNC
Figure 1: Functional Block Diagram in Charge Mode
MP2632 Rev.1.0
6/24/2016
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17
MP2632 – ALL-IN-ONE, 3A SW CHARGER, 3A BOOST
BLOCK DIAGRAM (continued)
SYS
DM2
DP2
Output
Signaling
IOUT_FB
SW
VIN
Q1
Q2
Q3
DM1
VCC
A1
DP/DM
Detection
LSMOS
Driver
DP1
VCC
LSMOS
Driver
Charge
Pump
Q4
IIN_LMT
ILIM
Input Current
Limit Setting
PWM
Controller
VNTC
Sleep Mode
CSP
VC
C
VCC
Current Sense
K1*ICHG
VSYS_FB
VSYS_REG
IOLIM
VIN
Buffer
BATT
GMV
GMI
VBATT
VSYS
IOUT_FB
VBATT_FB
PGND
Control Logic
&
Mode Selection
VIN
UV
OV
AGND
LED1
VSYS
VBATT
300mV
+
TRef
LED2
LED3
LED4
GMT
TJ
Boost Enable
Junction
Temp Sense
Torch Control
PB
Thermal
Protection
FG
Indication
VCC
H/L/Floating
VB
VBATT_FULL
VNTC
Charge
Parameter
Setting
ISET
ICC
Battery Temp
Protection
Boost Output
Current Limit
Setting
OLIM
Timer Fault
VBATT
TMR
TIMER
Function
NTC
VTNC
Figure 2: Functional Block Diagram in Boost Mode
MP2632 Rev.1.0
6/24/2016
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18
MP2632 – ALL-IN-ONE, 3A SW CHARGER, 3A BOOST
OPERATION FLOW CHART
POR
No
VCC >VCC_ UVLO
?
Yes
4.65V <VIN <5.8 V?
No
Input OVP
Fault
Yes
V
IN
>5.8 V?
No
Yes
SYS is Powered by VIN
No
No
No
Short Low Pulse at PB ?
USB Detection
Done?
Yes
VBATT>2.9V ?
Yes
Yes
Input Current
Limit is Configured
Yes
Boost Mode
No
Any Charge Fault?
No Load is
Detected?
No
Yes
No
Charge Mode
No Load Timer
Expires?
Yes
Sleep Mode
Figure 3: Mode Selection Flow Chart
MP2632 Rev.1.0
6/24/2016
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19
MP2632 – ALL-IN-ONE, 3A SW CHARGER, 3A BOOST
OPERATION FLOW CHART (continued)
Normal Operation
Charge Mode
Charge Mode?
VBATT = VBATT_FULL
VBATT < VBATT_TC
VBATT_TC < VBATT < VBATT_FULL
C.V.C
C.C.C
T.C.C
No
No
No
ICHG<IBF
Battery Full
VBATT = VBATT_FULL
?
VBATT > VBATT_TC
Yes
?
Yes
Yes
Charger “Off”
Yes
No
VBATT < VRECH
?
No
No
No
Timer Out ?
Yes
NTC Fault?
Yes
TJ ≥120oC?
Yes
Charge
Termination
Decrease ICHG to
Charge Suspend
Maintain TJ at 120oC
No
No
No
Reset
Timer?
NTC OK?
Yes
TJ ≥150oC?
Yes
Yes
Charge Recovery,
Return to Normal
Operation
Thermal Shutdown
No
TJ ≤120oC?
Yes
Fault Protection
Figure 4: Normal Operation and Fault Protection in Charge Mode
MP2632 Rev.1.0
6/24/2016
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20
MP2632 – ALL-IN-ONE, 3A SW CHARGER, 3A BOOST
OPERATION FLOW CHART (continued)
Power Path Management
SYS Output
Current Increase
VIN touch the VIN_R
Yes
?
IIN > IIN_LIMIT?
No
No
Yes
Reduce the ICHG
ICHG ≤0?
No
Yes
IIN > 7A?
No
YES
Normal Operation
No
IIN > IIN_OCP
?
Yes
Fast Turn Off the
IN-to-SYS MOSFET
Regulate IIN at IIN_OCP
NO
TINOCBLK , 200μs
reaches?
YES
After One-Shot Delay
Turn Off IN-to-SYS
MOSFET
No
150ms Timer
Expires?
Yes
Softly Turn On the
IN-to-SYS MOSFET
Figure 5: Power-Path Management in Charge Mode
MP2632 Rev.1.0
6/24/2016
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21
MP2632 – ALL-IN-ONE, 3A SW CHARGER, 3A BOOST
OPERATION FLOW CHART (continued)
BATT POR
Normal Boost
Operation
No
VBATT >2.9V?
Yes
No
No
No
VSYS<4V?
Yes
Yes
Yes
No
Yes
IL>3.5A?
Boost Enabled?
Yes
VSYS<VBATT+100mV?
Yes
Normal Boost
Operation
No
ISYS >IOLIM
Yes
No
No
120μs
Blanking
Time Pass?
Boost Shutdown
Start 1ms Timer
?
Yes
VBATT<2.5V?
Yes
No
Output Current Loop
Keeps SIYS=IOLMT
VSYS Decreases
1ms Timer
Expires?
,
Boost Turns Off
Figure 6: Operation Flow Chart in Boost Mode
MP2632 Rev.1.0
6/24/2016
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22
MP2632 – ALL-IN-ONE, 3A SW CHARGER, 3A BOOST
START-UP TIME FLOW IN CHARGE MODE
Condition: VIN = 5V, VBATT = 3.8V
VIN
VCC
VIN > VBATT+ 300mV
Auto-recharge threshold
VBATT
2V
VSYS
0V
Band Gap
VINOK
CHG EN
REF SS
200μs
ICC
ICHG
IBF
1ms
Charge Full
Figure 7: Input Power Start-Up Time Flow in Charge Mode
MP2632 Rev.1.0
6/24/2016
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23
MP2632 – ALL-IN-ONE, 3A SW CHARGER, 3A BOOST
START-UP TIME FLOW IN BOOST MODE
Condition: VIN = 0V, VBATT = 3.8V
VSYS
VSYS >VCC + 150 mV
VCC
VBATT
0V
1.5ms
Band Gap
Boost EN
1.2ms
REF SS
IBATT
75mA
75mA
No Load Off
Control
16s
Figure 8: Boost Start-Up Time Flow in Boost Mode
MP2632 Rev.1.0
6/24/2016
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24
MP2632 – ALL-IN-ONE, 3A SW CHARGER, 3A BOOST
OPERATION
The MP2632 is a highly integrated, flexible,
switch-mode battery charger with system power-
path management designed for single-cell Li-ion
or Li-polymer battery use in a wide range of
applications. Depending on the status of the
input, the IC can operate in three different
modes: charge mode, boost mode, and sleep
mode.
In charge mode, the IC can work with a single-cell Li-
ion or Li-polymer battery. In boost mode, the IC boosts
the battery voltage to VSYS to power higher voltage
system rails. In sleep mode, both charging and boost
operations are disabled, and the device enters a
power saving mode to help reduce overall power
consumption. The IC monitors VIN to allow smooth
transitions between different modes of operation.
VCC Power Supply
The MP2632 has an external VCC power supply. VCC
is powered by the highest voltage level out of VSYS
,
VBATT, and VIN - 0.7V. An external capacitor is required
to bypass VCC to GND. When VCC is higher than
2.2V, the internal control circuit is activated.
Figure 9: Typical Battery Charge Profile
Charge Mode Operation
Charge Cycle
(Trickle Charge CC Charge CV
Charge)
In charge mode, the IC uses five control loops to
regulate the input current, input voltage, charge
current, charge voltage, and device junction
temperature. The IC charges the battery in three
phases: trickle current (TC), constant current
(CC), and constant voltage (CV).
Auto-Recharge
Once the battery charge cycle is completed, the
charger remains off. During this time, the system
load may consume battery power, or the battery
may self-discharge. To ensure that the battery
does not go into depletion, a new charge cycle
begins automatically when the battery voltage
falls below the auto-recharge threshold and the
input power is present. The timer resets when the
auto-recharge cycle begins.
If the input power restarts during the off-state
after the battery is fully charged, the charge cycle
starts and the timer resets regardless of what the
battery voltage is.
When charge operation is enabled, all five loops
are active, but only one dictates the IC behavior.
A typical battery charge profile is shown in Figure
9a. The charger stays in TC charge mode until
the battery voltage reaches a TC-to-CC threshold.
Otherwise, the charger enters CC charge mode.
Charge Current Setting
The external sense resistors (RS1 and RISET
)
When the battery voltage rises to the CV mode
threshold, the charger operates in constant
voltage mode. Figure 9b shows a typical charge
profile when the input current limit loop
dominates during the CC charge mode. In this
case, the charger maximizes the charging current
due to the switching-mode charging solution,
resulting in charging that is faster than a
traditional linear charging solution.
program the battery charge current (ICHG). Select
RISET based on RS1.
To optimize the transfer efficiency, RS1 is
recommended to be 10mΩ. The relationship
between the RISET and ICHG is shown in Equation
(1):
1500
ICHG(A)
(1)
RISET (k)RS1(m)
MP2632 Rev.1.0
6/24/2016
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25
MP2632 – ALL-IN-ONE, 3A SW CHARGER, 3A BOOST
Battery Over-Voltage Protection (OVP)
VNTC Power Supply
The IC has battery over-voltage protection
(OVP). If the battery voltage exceeds the battery
over-voltage threshold (103.5% of the battery’s
full voltage), charging is disabled. Under this
condition, an internal 5kΩ dummy load draws a
small current from BATT to reduce the battery
voltage and protect the battery.
The MP2632 has NTC protection in both boost
mode and charge mode. To allow NTC protection
in both boost mode and charge mode and to
minimize the battery leakage current in sleep
mode, the MP2632 uses a dedicated power
supply pin for the pull-up voltage for the NTC
protection function block. In boost mode and
charge mode, VNTC is connected to VCC
internally by a switch. In sleep mode, VNTC is
disconnected from VCC to minimize the battery
leakage current (see Figure 10).
Timer Operation in Charge Mode
The IC uses an internal timer to terminate the
charging. The timer remains active during the
charging process. An external capacitor between
TMR and GND programs the charge cycle
duration.
VNTC
NTC
VCC
If charging remains in TC mode beyond the
trickle-charge time (τTRICKLE_TMR), charging is
terminated. For the MP2632, the charge current
in TC mode is fixed at 265mA, and the sense
resistor (RS1) is set to 10mΩ. The length of the
trickle-charge period can be determined with
Equation (2):
Sleep mode
Charge
Control
CTMR(F)
0.1F
TRICKLE_TMR 17mins
(2)
The maximum total charge time can be
calculated with Equation (3):
Figure 10: NTC Protection Block
CTMR(F)
0.1F
1A
TOTAL_TMR 7.55Hours
(3)
ICHG(A) 0.1
Input DP1/DM1 USB Detection and Input
Current Limit
Negative Temperature Coefficient
(NTC) Input for Battery Temperature
Monitoring
Power devices (PDs) are able to draw current
from the USB ports in personal computers to
charge their batteries. If the portable device is
attached to a USB host of the hub, then the USB
specification requires the portable device to draw
a limited current (usually 500mA). When the
device is attached to a charging port, it is allowed
to draw more than 1.5A.
The IC has a built-in NTC resistance window
comparator, which allows the IC to monitor the
battery temperature via the battery-integrated
thermistor during both charge and boost modes.
Connect an appropriate resistor from VNTC to
NTC and connect the thermistor from NTC to
GND. The resistor divider determines the NTC
voltage depending on the battery temperature. If
the NTC voltage falls outside of the NTC window,
the IC stops charging. The operation then
restarts if the temperature goes back into the
NTC window range. Please refer to the
Application Information section on page 33 for
the appropriate resistor selection.
The IC features input source detection to
determine the input current limit according to the
input source (USB or adapter) (see Figure 11).
MP2632 Rev.1.0
6/24/2016
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MP2632 – ALL-IN-ONE, 3A SW CHARGER, 3A BOOST
During primary detection, the PD turns on VDP_SRC
on DP1 and IDM_SINK on DM1. If the portable
device is attached to a USB host, DM1 is low. If
the power device is attached to CDP, DCP, or
another dedicated charging port, DM1 remains
high.
DP
VDP_SRC
VLGC_HI
IDP_SRC
CHG_DET
VDAT_REF
To be compatible with different capacities of the
input source, the input current limit is
recommended to be set using Table 2 if a 5V
input is requested.
IDM_SINK
Table 2: Input Current Limit Setting
DM
DP1/DM1 Detection
IIN_LMT
Floating
SDP
500mA
500mA
RDM_DWN
CDP or DCP
Set through RILIM
The USB detection runs once VIN is detected and
is independent of the charge enable status. After
the DP1/DM1 detection is done, the IC sets the
input current limit as shown in Table 2.
Figure 11: USB Port Detection
When the input source plugs in, the IC starts
DP1/DM1 detection. DP1/DM1 detection has two
steps: data contact detection (DCD) and primary
detection. DCD uses a current source to detect
when the data pins have made contact during an
attach event. The protocol for data contact
detection is as follows:
When the detection algorithm is completed, the
DP1 and DM1 signal lines enter a high-Z state
with approximately 4pF of capacitive load.
External Input Current Limit Setting
The IC has a dedicated pin used to program the
input current limit when CDP or DCP is detected.
The current at ILIM is a fraction of the input
current. The ILIM voltage indicates the average
input current of the switching regulator as
determined by the resistor value between ILIM
and GND. As the input current approaches the
programmed input current limit, the charge
current is reduced to give priority to the system
power.
The power device (PD) detects if VBUS is
asserted.
The PD turns on DP IDP_SRC and the DM pull-
down resistor for 40ms.
The PD waits for the DP line to be low.
The PD turns off IDP_SRC and the DM pull-
down resistor when the DP line is detected to
be low, or when the 40ms timer expires.
DCD allows the PD to start primary detection
once the data pins have made contact. Once the
data contact is detected, the IC jumps to the
primary detection immediately. If the data contact
is not detected, the IC jumps to the primary
detection automatically after 300ms from the
beginning of the DCD.
The input current limit threshold can be
determined with Equation (4):
40(k)
RILIM(k)
I
(A)
(4)
ILIM
Input Voltage Regulation in Charge
Mode
Primary detection is used to distinguish between
the USB host (or SDP) and different types of
charging ports.
In charge mode, if the input power source is not
sufficient for supporting both the charge current
and the system load current, the input voltage
decreases. As the input voltage internally
approaches the 4.65V input voltage regulation
threshold preset, the charge current is reduced to
MP2632 Rev.1.0
6/24/2016
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MP2632 – ALL-IN-ONE, 3A SW CHARGER, 3A BOOST
give priority to the system power and maintain
proper regulation of the input voltage.
battery voltage drops below the TC threshold.
The switching frequency also decreases when
the BATT voltage drops to 40% of the charge-full
voltage.
Integrated Over-Current Protection
and Over-Voltage Protection for Pass-
Through Path
Thermal Foldback Function
The IC implements thermal protection to prevent
thermal damage to the IC and the surrounding
components. An internal thermal sense and
feedback loop decreases the programmed
charge current automatically when the die
temperature reaches 120°C. This function is
called the charge-current-thermal foldback. This
function protects against thermal damage and
sets the charge current based on requirements,
rather than worst-case conditions while ensuring
safe operation. The part also includes thermal
shutdown protection, where the charging process
is stopped if the junction temperature rises to
150°C.
The IC has an integrated IN-to-SYS pass-through
path to allow direct connection of the input
voltage to the system. Therefore, the IC monitors
both the input current and voltage continuously.
In the event of an overload, the charge current is
reduced to ensure priority of the system power
requirements.
The IC also features input over-current and over-
voltage protection for the IN-to-SYS pass-through
path.
Input Over-Current Protection (OCP)
When the total input current exceeds 5A, Q2 is
controlled linearly to regulate the current (see
Figure 12). If the current continues to exceed 5A
after 200μs of blanking time, Q2 is turned off. In
the event of the input current exceeding 7A, Q2
is turned off almost instantaneously and without
any blanking time. This is done to protect both
Q1 and Q2.
Non-Sync Operation Mode
During charging mode, the IC monitors the total
input current flowing from IN to SYS continuously.
When the input current is lower than 170mA, the
low-side switch operates as a non-synchronous
MOSFET.
Input Over-Voltage Protection (OVP)
Constant Off-Time Control for Large
Duty Charging Operation
The IC has a built-in over-voltage threshold
(VIN_OVP). When the input voltage is higher than
VIN_OVP, an invalid input power source is detected
by the IC. At this time, the IN-to-SYS pass-
through path is turned off to prevent connecting
to the wrong adapter.
The IC has a built-in 600kHz frequency oscillator
for the switching frequency. Unlike a traditional
fixed-frequency peak-current control, the IC
features a constant-off time control to support a
constant current charge, even when the input
voltage is very close to the battery voltage. The
IC compares the high-side MOSFET sense
current with the comp level continuously (see
Figure 13). If the sense current does not reach
the comp level within the original switching period,
the next clock is delayed until the sense current
reaches the comp level. As a result, the duty
cycle is able to be extended as long as possible.
SYS
Q1
Q2
IN
Charge
Pump
Figure 12: Integrated Pass-Through Path
Indication for Fault Flag in Charge
Mode
Battery Short Protection
In charge mode, the MP2632 uses two inherent
current-limit thresholds due to a peak-current-
control strategy. CC and CV modes have a peak-
current-limit threshold of 7A, while TC mode has
a current-limit threshold of 4A. Therefore, the
current limit threshold decreases to 4A when the
The MP2632 is designed with distinct indication
separating the charging fault from the normal
operation. At the charging fault, including INOVP,
BOVP, and NTC fault, the four LED pins blink
with a 1Hz frequency simultaneously (see Table
3).
MP2632 Rev.1.0
6/24/2016
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MP2632 – ALL-IN-ONE, 3A SW CHARGER, 3A BOOST
Table 3: Indication at Charge Mode
Operation Status
LED1 to LED4 State
Depending on the battery
voltage, LEDx blinks at
1Hz, (refer to Fuel Gauge
Indication section)
LED1 to LED4 are all
turned on
Normal charging
Charge full
VIN UVLO
LED1 to LED4 are all
turned off
VIN OVP, NTC fault, LED1 to LED4 are all
battery OVP
blinking at 1Hz
Comp
Slope Compensation
HS Sense Current
HS Signal
Constant Off Time
600kHz
Lower the Fsw to support larger Duty
Figure 13: Constant-Off Time Operation Profile
Board layout is extremely critical for minimizing
Boost Mode Operation
Low-Voltage Start-Up
voltage overshoot at SW due to stray inductance.
Keep the output filter capacitor as close to SYS
as possible, and use very low ESR/ESL ceramic
capacitors tied to a good ground plane.
The minimum battery voltage required to start up
the circuit in boost mode is 2.9V. Initially, when
VSYS is less than VBATT, the IC works in down
mode. In this mode, the synchronous P-FET
stops switching and its gate connects to VBATT
statically. The P-FET stays off for as long as the
voltage across the parasitic CDS (VSW) is lower
than VBATT. When the voltage across CDS
exceeds VBATT, the synchronous P-FET enters
linear mode, allowing the inductor current to
decrease and flow into SYS. Once VSYS exceeds
VBATT, the P-FET gate is released, and normal
closed-loop PWM operation is initiated. In boost
mode, the battery voltage can drop as low as
2.5V without affecting circuit operation.
Boost Output Voltage Setting
In boost mode, the IC programs the output
voltage internally according to the load
connected to SYS (5.1V or 5.2V) and provides
built-in output over-voltage protection (OVP) to
protect the device and other components against
damage when VSYS goes beyond 6V. Once
output over-voltage occurs, the IC turns off the
boost converter. When the voltage on VSYS drops
to a normal level, the boost converter restarts
again when PB is set from high to low for more
than 1.5ms.
SYS Disconnect and Inrush Limiting
Boost Output Current Limiting
The IC can achieve true output disconnect by
eliminating body diode conduction of the internal
P-FET rectifier. VSYS can go to 0V during
shutdown, drawing no current from the input
source. It also allows for inrush current limiting at
start-up, minimizing surge currents from the input
supply. To optimize the benefits of the output
disconnect, avoid connecting an external
Schottky diode between SW and SYS.
The IC integrates a programmable output current
limit function in boost mode. If the boost output
current exceeds this programmable limit, the
output current is limited at this level and the SYS
voltage begins to drop down. OLIM programs the
current limit threshold up to 3.0A, per Equation
(5):
1500
IOLIM(A)
(5)
ROLIM(k)RS1(m)
MP2632 Rev.1.0
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MP2632 – ALL-IN-ONE, 3A SW CHARGER, 3A BOOST
The MP2632 can operate in CC mode when the
Thermal Shutdown Protection
current limit is reached, and VIN does not drop to
the down mode threshold (VBATT + 100mV) (see
Figure 14).
The thermal shutdown protection is also active in
boost mode. Once the junction temperature rises
higher than 150°C, the IC enters thermal
shutdown and does not resume normal operation
until the junction temperature drops below 120°C.
VSYS
VSYS_REG
Automatic Off at Light Load
The boost turns off automatically if the load
current at BATT is below the typical 75mA value
for 16 seconds.
VBATT+100mV
SCP
The MP2632 also features a long-push action on
PB to shut down the boost manually. A low push
on PB longer than 2.5 seconds is defined as a
long push (see Figure 14 for PB action).
ISYS
IOLIM
Figure 14: Boost Output U-I Curve
Automatic Output DP2/DM2 Signaling
The MP2632 not only has CC mode during the
charging process, but also has CC mode
operation in boost mode for various applications.
In boost mode, the IC sets the DP2/DM2 signal
based on the load applied on USB2. In pass-
through mode, DP2 and DM2 are set according
to DP1/DM1 detection results.
SYS to BATT Block Protection
When there is no VIN and the boost mode is not
on, the part is in sleep mode. The HS switch
implements the body switch function, which
connects the body diode of the switch to the
high-voltage side of SW and SYS, which blocks
the external voltage on SYS from flooding into
the battery.
In boost mode, DM2/DP2 are set based on three
types of signals: DM2/DP2 separately biased
with a 2.7V voltage signal (default), DM2/DP2
shorted, and DM2/DP2 shorted with a 1.2V bias.
In pass-through mode, DM2/DP2 are connected
together if the dedicated charger ports are
detected, and pulled down to ground separately
with a 15kΩ resistor if SDP is identified.
SYS Output Over-Current Protection (OCP)
The IC integrates a three-phase output over-
current protection.
Torch Control
1. Phase one (boost mode output current limit):
When the output current exceeds the
programmed output current limit, the output
constant current loop controls the output
current, the output current remains at its limit
(IOLIM), and VSYS decreases.
If the internal torch drive FET is off when PB is
pulled from high to low for more than 1.5ms twice
within one second, the drive FET is turned on.
Conversely, if the torch drive FET is on, the drive
FET is turned off.
Once the torch light is turned on, the automatic
off function is blocked.
2. Phase two (down mode): When VSYS drops
below VBATT + 100mV and the output current
loop remains in control, the boost converter
enters down mode and shuts down after
120μs of blanking time.
PB Control
PB is used to control the enable of boost mode.
Pull PB from high to low for more than 1.5ms to
enable boost mode; pull PB from high to low for
2.5s to disable boost mode.
3. Phase three (short-circuit mode): When VSYS
drops below 4.0V (2V during boost soft start),
the boost converter shuts down immediately
once the inductor current hits the foldback
peak-current limit of the low-side N-FET. The
boost
converter
can
also
recover
automatically after a 1ms deglitch period.
MP2632 Rev.1.0
6/24/2016
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MP2632 – ALL-IN-ONE, 3A SW CHARGER, 3A BOOST
Automatic On when Load is Applied
4-LED Driver for Voltage-Based Fuel
Gauge
The boost turns on automatically when PB is
pulled from high to low for more than 1.5ms, or
when the load is plugged in to USB2 using the
PB control.
The IC provides 4-LED drivers for a voltage-
based fuel gauge. The driver is connected to an
internal open-drain FET. The 4-LED indication
values are shown in Table 4.
To detect the USB load plug-in, the RC network
is connected to the USB port shield floating in the
PCB. Once the USB load is inserted, the USB
connector shield is grounded through the USB
load. A short pulse (high to low for more than
1.5ms) is generated in PB, resulting in the start of
boost.
The LED threshold can be programmed using a
fuse. Each threshold can be adjusted from
150mV to 200mV with 50mV steps from their
default value.
The LED threshold is also adjusted automatically
based on the VBAT_REG setting. The VOREG
difference is considered to be offset for LED
thresholds.
An RC network can also be connected in VBUS of
the USB output port. During load insertion, the
load input cap generates a high-to-low pulse for
more than 1.5ms to start the boost (see Figure
15). The circuit in the dash frame is the automatic
load detection circuit. M2 is used to decouple the
USB port from the VSYS cap (C2, CSYS), and M1 is
used to drive M2.
During the voltage measurement, the battery
impedance (50mΩ) should be compensated
based on the battery current to get a precise
battery voltage for fuel gauge indication.
Indication for Fault Flag in Boost Mode
Once a phone is plugged in, the voltage at CUSB is
pulled down because the input cap inside the
phone is far larger than CUSB, so the falling edge
is delivered to PB to enable boost automatically.
To minimize the power consumption of the
battery, the indication is active once PB is short-
pushed in normal discharge operation, and turns
off after five seconds automatically.
M3 is used to cut off PB to and from the USB port
when boost is turned on. The PB state is not
affected by the spec of the inserted load of the
USB port. Choose M3 with a low turn-on
threshold (-0.7V is recommended) which can
ensure that it is fully on when the load is inserted
and that its on resistance does not cause too
much of a voltage drop.
Table 4: Indication at Discharge Mode
Operation status
LED1 to LED4 state
Depending on the battery
voltage, LEDx is turned off.
(refer to Fuel Gauge
Normal discharging
Indication section)
LED1 to LED4 are all blinking
at 1Hz
NTC fault
1.5ms
1.5ms
PB
2.5s
2.5s
TMR
2.5s
2.5s
2.5s
2.5s
Boost EN
Off
On
Off
On
t0
(1st Push)
t1
t2
t3
(4th Push)
(2nd Push)
(3rd Push)
Figure 15: PB Action Profile
MP2632 Rev.1.0
6/24/2016
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MP2632 – ALL-IN-ONE, 3A SW CHARGER, 3A BOOST
Table 5: Indication during Normal Operation
VBATT SOC LED1 LED2
VBATT < 3.6V <25% Flash
Mode
LED3
Off
Off
LED4
Off
Off
Off
Flash
On
[3.6V, 3.8V)
[3.8V, 4.0V)
[25%, 50%)
[50%, 75%)
On
On
Flash
Off
Charging
CV mode, [4.0V, 4.2V),
not terminated
[75%, 100%)
100%
On
On
On
On
On
On
Flash
On
VBATT ≥ 4.0, terminated
VBATT ≥ 3.92V
>75%
[50%, 75%)
[25%, 50%)
[5%, 25%)
[1%, 5%)
<1%
On
On
On
On
Flash
Off
On
On
On
Off
Off
Off
On
On
Off
Off
Off
Off
On
Off
Off
Off
Off
Off
[3.77V, 3.92V)
[3.62V, 3.77V)
[3.47V, 3.62V)
[VBAT_ULVO, 3.47V)
VBATT < VBAT_UVLO
Discharging
(All off after 5s)
MP2632 Rev.1.0
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MP2632 – ALL-IN-ONE, 3A SW CHARGER, 3A BOOST
RT2//RNTC_Hot
VTH
APPLICATION INFORMATION
TH 35%
(9)
VSYS RT1 RT2//RNTC_Hot
Setting the Charge Current in Charge
Mode
Where RNTC_Hot is the value of the NTC resistor at
the upper bound of its operating temperature
range, and RNTC_Cold is its lower bound.
In charge mode, both the external sense resistor
(RS1) and the resistor (RISET) connect to ISET to
set the charge current (ICHG) of the MP2632 (see
the Typical Application circuit on page 2). Given
the expected ICHG and RS1 values, RISET can be
calculated with Equation (6):
The two resistors RT1 and RT2 determine the
upper and lower temperature limits independently.
This flexibility allows the IC to operate with most
NTC resistors for different temperature range
requirements. Calculate RT1 and RT2 with
Equation (10) and Equation (11):
1500
ICHG(A)
(6)
RISET (k)RS1(m)
For example, if ICHG = 3.0A and RS1 = 10mΩ,
then RISET = 49.9kΩ.
RNTC_Hot RNTC_Cold (TL TH)
RT1
(10)
(11)
THTL(RNTC_Cold RNTC_Hot
)
Given a 10mΩ RS1, Table 6 lists the expected
RISET values for the typical charge current.
(TL TH)RNTC_Cold RNTC_Hot
RT2
Table 6: Charging Current vs. RISET
(1 TL)THRNTC_Cold -(1-TH)TLRNTC_Hot
RISET (kΩ)
150
Charge Current (A)
For example, the NCP18XH103 thermistor has
the following electrical characteristics:
1.0
1.5
2.0
2.5
3.0
100
75
60
49.9
At 0°C, RNTC_Cold = 27.445kΩ
At 50°C, RNTC_Hot = 4.1601kΩ
Based on Equation (17) and Equation (18), an
RT1 value of 6.65kΩ and an RT2 value of 25.63kΩ
are suitable for an NTC window between 0°C and
50°C. Approximate values are RT1 = 6.65kΩ and
RT2 = 25.5kΩ.
Setting the Input Current Limit in
Charge Mode
In charge mode, connect a resistor from ILIM to
AGND to program the input current limit if a
dedicated charger (CDP or DCP) is detected.
The relationship between the input current limit
and setting resistor is shown in Equation (7):
If no external NTC is available, connect RT1 and
RT2 to keep the voltage on NTC within the valid
NTC window (e.g.: RT1 = RT2 = 10kΩ).
40(k)
RILIM(k)
I
(A)
(7)
ILIM
VNTC
RILIM must exceed 14.7kΩ so that IIN_LIM is in the
Low Temp Threshold
range of 0A to 2.7A.
RT1
VTL
NTC
NTC Function in Charge Mode
An internal resistor divider sets the low
temperature threshold (VTL) and high temperature
threshold (VTH) at 66.6% of VSYS and 35% of VSYS
respectively (see Figure 16). For a given NTC
RNTC
RT2
,
High Temp Threshold
VTH
thermistor, select an appropriate RT1 and RT2 to
set the NTC window with Equation (8) and
Equation (9):
Figure 16: NTC Function Block
For convenience, an NTC thermistor design
spreadsheet has also been provided.
RT2//RNTC_Cold
VTL
TL 66.6%
(8)
VSYS RT1 RT2//RNTC_Cold
MP2632 Rev.1.0
6/24/2016
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MP2632 – ALL-IN-ONE, 3A SW CHARGER, 3A BOOST
In boost mode, the MP2637 works as a boost
Setting the Output Current Limit in
Boost Mode
In boost mode, connect a resistor from OLIM to
AGND to program the output current limit. The
relationship between the output current limit and
the setting resistor is shown in Equation (12):
converter. The required inductance value can be
calculated with Equation (14), Equation (15), and
Equation (16):
VBATT (VSYS VBATT
VSYS fS IL_MAX
)
L
(14)
(15)
(16)
1500
IL_MAX (30% 40%)IBATT(MAX)
VSYS ISYS(MAX)
IOLIM(A)
(12)
ROLIM(k)RS1(m)
The output current limit of the boost can be
programmed up to 3.0A.
IBATT(MAX)
VBATT
Given a 10mΩ RS1, Table 7 lists the expected
ROLIM values for the typical output current limit.
Where VBATT is the minimum battery voltage, fSW
is the switching frequency, and ∆IL_MAX is the
peak-to-peak
inductor
ripple
current
Table 7: Output Current vs. ROLIM
(approximately 30% of the maximum battery
current (IBATT(MAX))), ISYS(MAX) is the system current,
and η is the efficiency.
ROLIM (kΩ)
150
Output Current (A)
1.0
1.5
2.0
2.5
3.0
100
75
60
49.9
The worst case occurs if the battery voltage is 3V,
there is a 30% inductor current ripple, and the
typical system voltage is VSYS = 5V. Then, the
inductance is 1.5µH when the efficiency is 90%.
Selecting the Inductor
The inductor selection trades off between cost,
size, and efficiency. A lower inductance value
corresponds with a smaller size, but results in
higher current ripples, higher magnetic hysteretic
losses, and higher output capacitances. However,
a higher inductance value benefits from lower
ripple currents and smaller output filter capacitors,
but results in a higher inductor DC resistance
(DCR) loss. Choose an inductor that does not
saturate under the worst-case load condition.
For best results, use an inductor with an
inductance of 2.2µH with a DC current rating no
lower than the peak current of the MOSFET. For
higher efficiency, minimize the inductor’s DC
resistance.
Selecting the Input Capacitor (CIN)
The input capacitor (CIN) reduces both the surge
current drawn from the input and the switching
noise from the device. The input capacitor
impedance at the switching frequency should be
less than the input source impedance to prevent
the high-frequency switching current from
passing to the input. Ceramic capacitors with
X7R dielectrics are recommended because of
their low ESR and small temperature coefficients.
For most applications, a 22µF capacitor is
sufficient.
In charge mode, the MP2632 works as a buck
converter. The required inductance can be
estimated with Equation (13):
V VBATT VBATT
IN
L
(13)
IL_MAX
V fS
IN
Where VIN is the typical input voltage, VBATT is the
CC charge threshold, fS is the switching
frequency, and ∆IL_MAX is the maximum peak-to-
peak inductor current, which is usually designed
at 30% - 40% of the CC charge current.
Selecting the System Capacitor (CSYS
)
Select the system capacitor (CSYS) based on the
demand of the system current ripple. In charge
mode, CSYS acts as the input capacitor of the
buck converter. The input current ripple can be
calculated with Equation (17):
With a typical 5V input voltage, if there is a 35%
inductor current ripple at the corner point
between the trickle charge and the CC charge
(VBATT = 3V, ICHG = 2.5A), then the inductance is
2.2μH.
VTC (VIN_MAX VTC )
(17)
IRMS _MAX ISYS _MAX
V
IN_MAX
MP2632 Rev.1.0
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MP2632 – ALL-IN-ONE, 3A SW CHARGER, 3A BOOST
In boost mode, CSYS is the output capacitor of the
PCB Layout Guidelines
boost converter. CSYS keeps the system voltage
ripple small and ensures feedback loop stability.
The system current ripple can be calculated with
Equation (18):
Efficient PCB layout is critical for meeting
specified noise, efficiency, and stability
requirements.
The
following
design
considerations can improve circuit performance:
VTC (VSYS _MAX VTC )
1. Route the power stage adjacent to their
grounds.
(18)
IRMS _MAX ISYS _MAX
VSYS _MAX
2. Minimize the high-side switching node (SW,
inductor) trace lengths in the high-current
paths.
Since the input voltage is passed to the system
directly, VIN_MAX is equal to VSYS_MAX, and both
charge mode and boost mode have the same
system current ripple.
3. Keep the switching node short and away from
all small control signals, especially the
feedback network.
When ICC_MAX equals 2A, VTC equals 3V, VIN_MAX
equals 6V, and the maximum ripple current is 1A.
Select the system capacitors based on the ripple-
current temperature rise, not exceeding 10°C.
For best results, use low ESR ceramic capacitors
with X7R dielectrics and small temperature
coefficients. For most applications, use three
22µF capacitors.
4. Place the input capacitor as close to VIN and
PGND as possible.
5. Place the local power input capacitors
connected from SYS to PGND as close to the
IC as possible.
6. Place the output inductor close to the IC.
Selecting the Battery Capacitor (CBATT
)
7. Connect the output capacitor between the
inductor and PGND of the IC.
CBATT is in parallel with the battery to absorb the
high-frequency switching ripple current. In charge
mode, the capacitor (CBATT) is the output
capacitor of the buck converter. The output
voltage ripple is then calculated with Equation
(19):
8. Connect the power pads for VIN, SYS, SW,
BATT, and PGND to as many coppers planes
on the board as possible for high-current
applications.
VBATT
VBATT
1 VBATT / VSYS
This improves thermal performance
because the board conducts heat away
from the IC.
(19)
rBATT
8CBATT fSW2 L
In boost mode, CBATT is the input capacitor of the
boost converter. The input voltage ripple is the
same as the output voltage ripple from Equation
(19).
9. Connect a ground plane directly to the return
of all components through vias (e.g.: two vias
per capacitor for power-stage capacitors, and
one via per capacitor for small-signal
components).
Both charge mode and boost mode have the
same battery voltage ripple. CBATT can be
calculated with Equation (20):
A star ground design approach is typically
used to keep circuit block currents
isolated
(power-signal/control-signal),
1 VTC / VSYS _MAX
(20)
CBATT
which reduces noise-coupling and
ground-bounce issues. A single ground
plane for this design provides good
results.
8 rBATT _MAX fSW2 L
To guarantee ±0.5% BATT voltage accuracy, the
maximum BATT voltage ripple must not exceed
0.5% (e.g.: 0.1%). The worst case occurs at the
minimum battery voltage of the CC charge with
the maximum input voltage. For example,
VSYS_MAX = 6V, VCC_MIN = VTC = 3V, L = 2.2µH, fS =
600kHz, ∆rBATT_MAX = 0.1%, and CBATT is 22µF.
10. Place the ISET, OLIM, and ILIM resistors
very close to their respective IC pins.
A 22µF ceramic capacitor with X7R dielectrics is
sufficient.
MP2632 Rev.1.0
6/24/2016
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35
MP2632 – ALL-IN-ONE, 3A SW CHARGER, 3A BOOST
TYPICAL APPLICATION CIRCUITS
Vpull-up
VNTC
M3
Load in detect
USB OUTPUT
VBUS
M2
CUSB
CSYS
C2
CIN in PD
VNTC
M1
PB
SYS
DM2 DP2
RS1
L1
SW
VBATT
VIN
Q1
Q2
Q3
CBATT
CSP
Battery
Q4
MP2632
BATT
VNTC
AGND
PGND
a) High-Side MOSFET Solution
Vpull-up
M3
VNTC
USB OUTPUT
VBUS
Load in detect
M2
CSYS
C2
CIN in PD
CUSB
M1
Load in detect
PB
SYS
Q3
DM2 DP2
VNTC
RS1
L1
SW
VBATT
Battery
VIN
Q1
Q2
CBATT
CSP
Q4
MP2632
BATT
VNTC
AGND
PGND
b) Low-Side MOSFET Solution
Figure 17: Load Detection Circuit
MP2632 Rev.1.0
6/24/2016
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MP2632 – ALL-IN-ONE, 3A SW CHARGER, 3A BOOST
PACKAGE INFORMATION
QFN-26 (4mmx4mm)
PIN 1 ID
0.15x45° TYP.
PIN 1 ID
MARKING
PIN 1 ID
INDEX AREA
TOP VIEW
BOTTOM VIEW
SIDE VIEW
NOTE:
0.15x45°
1) ALL DIMENSIONS ARE IN MILLIMETERS.
2) LEAD COPLANARITY SHALL BE 0.10
MILLIMETERS MAX.
3) DRAWING CONFORMS TO JEDEC MO-220.
4) DRAWING IS NOT TO SCALE.
RECOMMENDED LAND PATTERN
NOTICE: The information in this document is subject to change without notice. Please contact MPS for current specifications.
Users should warrant and guarantee that third party Intellectual Property rights are not infringed upon when integrating MPS
products into any application. MPS will not assume any legal responsibility for any said applications.
MP2632 Rev.1.0
6/24/2016
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