MRF284LSR1 [MOTOROLA]

S BAND, Si, N-CHANNEL, RF POWER, MOSFET, NI-360S, CASE 360C-05, 2 PIN;
MRF284LSR1
型号: MRF284LSR1
厂家: MOTOROLA    MOTOROLA
描述:

S BAND, Si, N-CHANNEL, RF POWER, MOSFET, NI-360S, CASE 360C-05, 2 PIN

放大器 CD 晶体管
文件: 总12页 (文件大小:395K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
MOTOROLA  
SEMICONDUCTOR TECHNICAL DATA  
Order this document  
by MRF284/D  
The RF Sub-Micron MOSFET Line  
RF Power Field Effect Transistors  
N-Channel Enhancement-Mode Lateral MOSFETs  
MRF284LR1  
MRF284LSR1  
Designed for PCN and PCS base station applications with frequencies from  
1000 to 2600 MHz. Suitable for FM, TDMA, CDMA, and multicarrier amplifier  
applications. To be used in Class A and Class AB for PCN-PCS/cellular radio  
and wireless local loop.  
2000 MHz, 30 W, 26 V  
LATERAL N-CHANNEL  
BROADBAND  
Specified Two-Tone Performance @ 2000 MHz, 26 Volts  
Output Power = 30 Watts PEP  
Power Gain = 9 dB  
RF POWER MOSFETs  
Efficiency = 30%  
Intermodulation Distortion = -29 dBc  
Typical Single-Tone Performance at 2000 MHz, 26 Volts  
Output Power = 30 Watts CW  
Power Gain = 9.5 dB  
Efficiency = 45%  
CASE 360B-05, STYLE 1  
NI-360  
Capable of Handling 10:1 VSWR, @ 26 Vdc, 2000 MHz, 30 Watts CW  
Output Power  
MRF284LR1  
Excellent Thermal Stability  
Characterized with Series Equivalent Large-Signal Impedance Parameters  
In Tape and Reel. R1 Suffix = 500 Units per 32 mm, 13 inch Reel.  
Low Gold Plating Thickness on Leads. L Suffix Indicates 40µ″ Nominal.  
CASE 360C-05, STYLE 1  
NI-360S  
MRF284LSR1  
MAXIMUM RATINGS  
Rating  
Symbol  
Value  
65  
Unit  
Drain-Source Voltage  
Gate-Source Voltage  
V
Vdc  
Vdc  
DSS  
V
20  
GS  
Total Device Dissipation @ T = 25°C  
Derate above 25°C  
P
87.5  
0.5  
Watts  
W/°C  
C
D
Storage Temperature Range  
Operating Junction Temperature  
THERMAL CHARACTERISTICS  
T
- 65 to +150  
200  
°C  
°C  
stg  
T
J
Characteristic  
Thermal Resistance, Junction to Case  
Symbol  
Max  
Unit  
R
θ
JC  
2.0  
°C/W  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
C
Characteristic  
Symbol  
Min  
Typ  
Max  
Unit  
OFF CHARACTERISTICS  
Drain-Source Breakdown Voltage  
(V = 0, I = 10 µAdc)  
V
65  
1.0  
10  
Vdc  
µAdc  
µAdc  
(BR)DSS  
GS  
D
Zero Gate Voltage Drain Current  
(V = 20 Vdc, V = 0)  
I
I
DSS  
GSS  
DS  
GS  
Gate-Source Leakage Current  
(V = 20 Vdc, V = 0)  
GS  
DS  
NOTE - CAUTION - MOS devices are susceptible to damage from electrostatic charge. Reasonable precautions in handling and  
packaging MOS devices should be observed.  
REV 14  
Motorola, Inc. 2003  
 
ELECTRICAL CHARACTERISTICS — continued (T = 25°C unless otherwise noted)  
C
Characteristic  
Symbol  
Min  
Typ  
Max  
Unit  
ON CHARACTERISTICS  
Gate Threshold Voltage  
V
2.0  
3.0  
3.0  
4.0  
0.3  
1.5  
4.0  
5.0  
0.6  
Vdc  
Vdc  
Vdc  
S
GS(th)  
(V = 10 Vdc, I = 150 µAdc)  
DS  
D
Gate Quiescent Voltage  
(V = 26 Vdc, I = 200 mAdc)  
V
GS(q)  
DS  
D
Drain-Source On-Voltage  
(V = 10 Vdc, I = 1.0 Adc)  
V
DS(on)  
GS  
D
Forward Transconductance  
(V = 10 Vdc, I = 1.0 Adc)  
g
fs  
DS  
D
DYNAMIC CHARACTERISTICS  
Input Capacitance  
(V = 26 Vdc, V = 0, f = 1.0 MHz)  
DS  
C
43  
23  
pF  
pF  
pF  
iss  
GS  
Output Capacitance  
(V = 26 Vdc, V = 0, f = 1.0 MHz)  
C
oss  
DS  
GS  
Reverse Transfer Capacitance  
(V = 26 Vdc, V = 0, f = 1.0 MHz)  
C
rss  
1.4  
DS  
GS  
FUNCTIONAL TESTS (in Motorola Test Fixture, 50 ohm system)  
Common-Source Power Gain  
G
9
30  
9
10.5  
35  
-29  
-9  
-9  
dB  
%
ps  
(V = 26 Vdc, P = 30 W, I = 200 mA,  
DD  
out  
DQ  
f1 = 2000.0 MHz, f2 = 2000.1 MHz)  
Drain Efficiency  
η
(V = 26 Vdc, P = 30 W, I = 200 mA,  
DQ  
DD  
out  
f1 = 2000.0 MHz, f2 = 2000.1 MHz)  
Intermodulation Distortion  
IMD  
IRL  
-32  
-15  
10.4  
35  
dBc  
dB  
dB  
%
(V = 26 Vdc, P = 30 W, I = 200 mA,  
DQ  
DD  
out  
f1 = 2000.0 MHz, f2 = 2000.1 MHz)  
Input Return Loss  
(V = 26 Vdc, P = 30 W, I = 200 mA,  
DQ  
DD  
out  
f1 = 2000.0 MHz, f2 = 2000.1 MHz)  
Common-Source Amplifier Power Gain  
G
ps  
(V = 26 Vdc, P = 30 W PEP, I  
= 200 mA,  
= 200 mA,  
= 200 mA,  
= 200 mA,  
= 200 mA,  
= 200 mA,  
= 200 mA,  
DD  
out  
DQ  
f1 = 1930.0 MHz, f2 = 1930.1 MHz)  
Drain Efficiency  
η
8.5  
35  
(V = 26 Vdc, P = 30 W PEP, I  
DQ  
DD  
out  
f1 = 1930.0 MHz, f2 = 1930.1 MHz)  
Intermodulation Distortion  
IMD  
IRL  
-34  
-15  
9.5  
45  
dBc  
dB  
dB  
%
(V = 26 Vdc, P = 30 W PEP, I  
DQ  
DD  
out  
f1 = 1930.0 MHz, f2 = 1930.1 MHz)  
Input Return Loss  
(V = 26 Vdc, P = 30 W PEP, I  
DQ  
DD  
out  
f1 = 1930.0 MHz, f2 = 1930.1 MHz)  
Common-Source Amplifier Power Gain  
G
ps  
(V = 26 Vdc, P = 30 W CW, I  
DD  
out  
DQ  
DQ  
DQ  
f1 = 2000.0 MHz)  
Drain Efficiency  
η
(V = 26 Vdc, P = 30 W CW, I  
DD  
out  
f1 = 2000.0 MHz)  
Output Mismatch Stress  
(V = 26 Vdc, P = 30 W CW, I  
Ψ
DD  
out  
No Degradation In Output Power  
f1 = 2000.0 MHz, VSWR = 10:1,  
at All Phase Angles)  
MRF284LR1 MRF284LSR1  
2
MOTOROLA RF DEVICE DATA  
R1  
R2  
B1  
R3  
B2  
R6  
R7  
R5  
B3  
V
V
DD  
GG  
W1  
W2  
W3  
+
+
+
C6  
R4  
C7  
C4  
C15  
C13  
C12  
C14  
C3  
C17  
C18  
L2  
L3  
L1  
RF  
OUTPUT  
C10  
Z11 Z12  
Z10  
Z13  
C11  
Z14 Z15  
Z16  
Z17  
RF  
INPUT  
C9  
Z9  
DUT  
C16  
Z1  
Z2  
Z3  
Z4  
Z5  
Z6  
Z7  
Z8  
C5  
C8  
C1  
C2  
Z1  
0.530x 0.080Microstrip  
0.255x 0.080Microstrip  
0.600x 0.080Microstrip  
0.525x 0.080Microstrip  
0.015x 0.325Microstrip  
0.085x 0.325Microstrip  
0.165x 0.325Microstrip  
0.110x 0.515Microstrip  
0.095x 0.515Microstrip  
0.050x 0.515Microstrip  
Z11  
Z12  
Z13  
Z14  
Z15  
Z16  
Z17  
PCB  
0.155x 0.515Microstrip  
0.120x 0.325Microstrip  
0.150x 0.325Microstrip  
0.010x 0.325Microstrip  
0.505x 0.080Microstrip  
0.865x 0.080Microstrip  
0.525x 0.080Microstrip  
Z2  
Z3  
Z4  
Z5  
Z6  
Z7  
Z8  
Z9  
Arlon GX0300-55-22, 0.030,  
ε = 2.55  
r
Z10  
Figure 1. 1.93-2.0 GHz Broadband Test Circuit Schematic  
Table 1. 1.93 - 2.0 GHz Broadband Test Circuit Component Designations and Values  
Designators  
Description  
Ferrite Beads, Round, Ferroxcube #56-590-65-3B  
0.8-8.0 pF Gigatrim Variable Capacitors, Johanson #27291SL  
B1 - B3  
C1, C2, C8  
C3, C17  
C4, C14  
C5  
22 mF, 35 V Tantalum Surface Mount Chip Capacitors, Kemet #T491X226K035AS4394  
0.1 mF Chip Capacitors, Kemet #CDR33BX104AKWS  
220 pF Chip Capacitor, B Case, ATC #100B221KP500X  
C6, C12  
C7, C13  
C9  
1000 pF Chip Capacitors, B Case, ATC #100B102JCA50X  
5.1 pF Chip Capacitors, B Case, ATC #100B5R1CCA500X  
1.2 pF Chip Capacitor, B Case, ATC #100B1R2CCA500X  
2.7 pF Chip Capacitor, B Case, ATC #100B2R7CCA500X  
0.6-4.5 pF Gigatrim Variable Capacitors, Johanson #27271SL  
200 pF Chip Capacitors, B Case, ATC #100B201KP500X  
10 mF, 35 V Tantalum Surface Mount Chip Capacitor, Kemet #T495X106K035AS4394  
4 Turns, #24 AWG, 0.120OD, 0.140Long, (12.5 nH), Coilcraft #A04T-5  
2 Turns, #24 AWG, 0.120OD, 0.140Long, (5.0 nH), Coilcraft #A02T-5  
12 , 1/4 W Chip Resistors, 0.08x 0.13, Garrett Instruments #RM73B2B120JT  
560 k, 1/4 W Chip Resistor, 0.08x 0.13″  
C10  
C11  
C15, C16  
C18  
L1, L2  
L3  
R1, R2, R3, R5, R6, R7  
R4  
W1, W2, W3  
WS1, WS2  
Solid Copper Buss Wire, 16 AWG  
Beryllium Copper Wear Blocks 0.005x 0.250x 0.250″  
MOTOROLA RF DEVICE DATA  
MRF284LR1 MRF284LSR1  
3
C6  
R3  
C12  
C14  
R6  
C4  
R2  
R1  
W3  
R7  
W2  
B3  
C17  
C18  
W1  
B1  
R4  
B2  
R5  
C3  
C7  
L1  
C13  
C15  
L3  
C10  
WS2  
C9  
C5  
C16  
L2  
WS1  
C11  
C2  
C1  
C8  
MRF284  
Rev-0  
Figure 2. 1.93-2.0 GHz Broadband Test Circuit Component Layout  
MRF284  
Rev-0  
(Scale 1:1)  
Figure 3. MRF284 Test Circuit Photomaster  
(Reduced 18% in printed data book, DL110/D)  
MRF284LR1 MRF284LSR1  
4
MOTOROLA RF DEVICE DATA  
V
SUPPLY  
+
R1  
P1  
C1  
R3  
V
DD  
B3  
R9  
B4  
B5  
V
DD  
B1  
R7  
B2  
R8  
+
Q1  
R4  
R10  
R1  
1
+
C11 C13  
C10  
C15 C16  
R6  
R2  
R5  
C9 C7  
C2 C4  
C8  
Q2  
L4  
RF  
OUTPUT  
L1  
L3  
Z10 Z11  
Z12  
Z13 Z14  
Z15  
Z16  
RF  
INPUT  
DUT  
C14  
Z1  
Z2  
Z3  
Z4 Z5  
Z6  
Z7  
Z8  
Z9  
C12  
C17  
C3  
L2  
C5  
C6  
Z1  
Z2  
Z3  
Z4  
Z5  
Z6  
Z7  
Z8  
Z9  
0.363x 0.080Microstrip  
0.080x 0.080Microstrip  
0.916x 0.080Microstrip  
0.517x 0.080Microstrip  
0.050x 0.325Microstrip  
0.050x 0.325Microstrip  
0.071x 0.325Microstrip  
0.125x 0.325Microstrip  
0.210x 0.515Microstrip  
Z10  
Z11  
Z12  
Z13  
Z14  
Z15  
Z16  
PCB  
0.210x 0.515Microstrip  
0.235x 0.325Microstrip  
0.02x 0.325Microstrip  
0.02x 0.325Microstrip  
0.510x 0.080Microstrip  
0.990x 0.080Microstrip  
0.390x 0.080Microstrip  
Arlon GX0300-55-22, 0.030,  
ε = 2.55  
r
Figure 4. 2.0 GHz Class A Test Circuit Schematic  
MOTOROLA RF DEVICE DATA  
MRF284LR1 MRF284LSR1  
5
Table 2. 2.0 GHz Class A Test Circuit Component Designations and Values  
Designators  
Description  
B1 - B5  
C1, C9, C16  
C2, C13  
C3, C14  
C4, C11  
C5  
Ferrite Beads, Round, Ferroxcube # 56-590-65-3B  
100 µF, 50 V Electrolytic Capacitors, Mallory #SME50VB101M12X25L  
51 pF Chip Capacitors, B Case, ATC #100B510JCA500x  
10 pF Chip Capacitors, B Case, ATC #100B100JCA500X  
12 pF Chip Capacitors, B Case, ATC #100B120JCA500X  
0.8 - 8.0 pF Variable Capacitor, Johansen Gigatrim #27291SL  
4.7 pF Chip Capacitor, B Case, ATC #100B4R7CCA500X  
C6  
C7, C15  
C8  
91 pF Chip Capacitors, B Case, ATC #100B910KP500X  
1000 pF Chip Capacitor, B Case, ATC #100B102JCA50X  
C10  
0.1 µF Chip Capacitor, Kemet #CDR33BX104AKWS  
C12, C17  
L1  
0.6 - 4.5 pF Variable Capacitors, Johansen Gigatrim #27271SL  
4 Turns, #27 AWG, 0.087OD, 0.050ID, 0.069Long, 10 nH  
5 Turns, #24 AWG, 0.083OD, 0.040ID, 0.128Long, 12.5 nH  
9 Turns, #26 AWG, 0.080OD, 0.046ID, 0.170Long, 30.8 nH  
1000 Potentiometer, 1/2 W, 10 Turns, Bourns  
L2  
L3, L4  
P1  
Q1  
Transistor, NPN, Motorola P/N: MJD31, Case 369A-10  
Q2  
Transistor, PNP, Motorola P/N: MJD32, Case 369A-10  
R1  
360 , Fixed Film Chip Resistor, 0.08x 0.13, Garrett Instruments #RM73B2B361JT  
2 x 12 k, Fixed Film Chip Resistor, 0.08x 0.13, Garrett Instruments #RM73B2B122JT  
1 , Wirewound, 5 W, 3% Resistor, Dale # RE60G1R00  
R2  
R3  
R4  
4 x 6.8 k, Fixed Film Chip Resistor, 0.08x 0.13, Garrett Instruments #RM73B2B682JT  
2 x 1500 , Fixed Film Chip Resistor, 0.08x 0.13, Garrett Instruments #RM73B2B152JT  
270 , Fixed Film Chip Resistor, 0.08x 0.13, Garrett Instruments #RM73B2B271JT  
12 , Fixed Film Chip Resistors, 0.08x 0.13, Garrett Instruments #RM73B2B120JT  
R5  
R6  
R7 - R11  
MRF284LR1 MRF284LSR1  
6
MOTOROLA RF DEVICE DATA  
TYPICAL CHARACTERISTICS  
14  
13  
12  
11  
10  
9
40  
35  
30  
25  
20  
15  
10  
5
45  
40  
35  
30  
25  
20  
15  
10  
P
4 W  
3 W  
out  
2 W  
G
ps  
P
= 1 W  
in  
8
V
I
= 26 Vdc  
= 200 mA  
V
I
= 26 Vdc  
DD  
= 200 mA  
DD  
7
DQ  
DQ  
f = 2000 MHz Single Tone  
1.5 2.0 2.5  
P , INPUT POWER (WATTS)  
Single Tone  
6
4.0  
0
0
0.5  
1.0  
3.0  
3.5  
1800 1820 1840 1860 1880 1900 1920 1940 1960 1980 2000  
f, FREQUENCY (MHz)  
in  
Figure 5. Output Power & Power Gain  
versus Input Power  
Figure 6. Output Power versus Frequency  
12  
−10  
−ꢀ20  
−ꢀ30  
−ꢀ40  
−ꢀ50  
−ꢀ60  
−ꢀ70  
−ꢀ80  
V
= 26 Vdc  
= 200 mA  
DD  
I
DQ  
f = 2000.0 MHz  
−15  
−20  
11  
10  
1
G
f = 2000.1 MHz  
2
ps  
3rd Order  
5th Order  
−25  
−30  
9
8
7
6
P
= 30 W (PEP)  
= 200 mA  
out  
7th Order  
I
DQ  
IMD −35  
f1 = 2000.0 MHz  
f2 = 2000.1 MHz  
−40  
28  
0.1  
1.0  
10  
16  
18  
20  
V , DRAIN SUPPLY VOLTAGE (Vdc)  
DD  
22  
24  
26  
P
, OUTPUT POWER (WATTS) PEP  
out  
Figure 7. Intermodulation Distortion Products  
versus Output Power  
Figure 8. Power Gain and Intermodulation  
Distortion versus Supply Voltage  
−ꢀ20  
−ꢀ30  
−ꢀ40  
−ꢀ50  
−ꢀ60  
13  
V
= 26 Vdc  
f = 2000.0 MHz  
I
= 400 mA  
DD  
DQ  
1
f = 2000.1 MHz  
300 mA  
2
12  
11  
10  
9
100 mA  
300 mA  
200 mA  
200 mA  
V
= 26 Vdc  
f = 2000.0 MHz  
100 mA  
DD  
I
= 400 mA  
DQ  
1
f = 2000.1 MHz  
2
8
0.1  
0.1  
1.0  
10  
1.0  
10  
P
, OUTPUT POWER (WATTS) PEP  
out  
P , OUTPUT POWER (WATTS) PEP  
out  
Figure 9. Intermodulation Distortion  
versus Output Power  
Figure 10. Power Gain versus Output Power  
MOTOROLA RF DEVICE DATA  
MRF284LR1 MRF284LSR1  
7
TYPICAL CHARACTERISTICS  
3
2
100  
T
= 75°C  
flange  
C
iss  
T
= 100°C  
flange  
C
oss  
10  
1
0
T = 175°C  
C
J
rss  
1
0
4
8
12  
16  
20  
24  
28  
0
4
8
12  
V , DRAIN SOURCE VOLTAGE (VOLTS)  
DS  
16  
20  
24  
28  
V
, DRAIN SUPPLY VOLTAGE (Vdc)  
DD  
Figure 11. DC Safe Operating Area  
Figure 12. Capacitance versus  
Drain Source Voltage  
60  
50  
40  
30  
20  
10  
0
11  
10  
9
45  
G
ps  
40  
FUNDAMENTAL  
35  
η
V
= 26 Vdc  
DD  
out  
8
30  
P
= 30 W (PEP), I = 200 mA  
DQ  
−10  
−ꢁ20  
−ꢁ30  
−ꢀ40  
−ꢀ50  
−ꢁ60  
−70  
−ꢁ80  
−ꢁ90  
3rd Order  
Two−Tone  
Frequency Delta = 100 kHz  
3.0  
2.0  
7
−32  
6
IMD  
V
= 26 Vdc  
= 1.8 Adc  
5
−36  
−40  
DD  
I
DQ  
f = 2000.0 MHz  
4
3
1
VSWR  
f = 2000.1 MHz  
2
1.0  
0
5
10 15 20 25 30 35 40 45 50 55 60  
P , INPUT POWER (dBm)  
1920  
1940  
1960  
1980  
2000  
f, FREQUENCY (MHz)  
in  
Figure 13. Class A Third Order Intercept Point  
Figure 14. 1.92-2.0 GHz Broadband Circuit Performance  
1.E+10  
1.E+09  
1.E+08  
1.E+07  
1.E+06  
1.E+05  
1.E+04  
0
50  
100  
150  
200  
250  
T , JUNCTION TEMPERATURE (°C)  
J
2
This graph displays calculated MTBF in hours x ampere drain current.  
Life tests at elevated temperature have correlated to better than 10%  
2
of the theoretical prediction for metal failure. Divide MTBF factor by I  
for MTBF in a particular application.  
D
Figure 15. MTBF Factor versus Junction Temperature  
MRF284LR1 MRF284LSR1  
8
MOTOROLA RF DEVICE DATA  
1800 MHz  
1800 MHz  
Z
load  
f = 2000 MHz  
Z
source  
Z = 5 Ω  
o
f = 2000 MHz  
V
= 26 V, I = 200 mA, P = 15 W Avg.  
DQ out  
CC  
f
Z
Z
load  
source  
MHz  
1800  
1860  
1900  
1960  
2000  
1.0 - j0.4  
1.0 - j0.8  
1.0 - j1.1  
1.0 - j1.4  
1.0 - j2.3  
2.1 + j0.4  
2.2 - j0.2  
2.3 - j0.5  
2.5 - j0.9  
2.6 - j0.92  
Z
Z
=
Test circuit impedance as measured from  
gate to ground.  
source  
load  
=
Test circuit impedance as measured  
from drain to ground.  
Output  
Matching  
Network  
Device  
Under  
Test  
Input  
Matching  
Network  
Z
Z
source  
load  
Figure 16. Series Equivalent Input and Output Impedence  
MOTOROLA RF DEVICE DATA  
MRF284LR1 MRF284LSR1  
9
NOTES  
MRF284LR1 MRF284LSR1  
10  
MOTOROLA RF DEVICE DATA  
PACKAGE DIMENSIONS  
2X  
Q
M
M
M
B
NOTES:  
1. INTERPRET DIMENSIONS AND TOLERANCES  
PER ASME Y14.5M−1994.  
G
1
aaa  
T A  
B
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION H IS MEASURED 0.030 (0.762) AWAY  
FROM PACKAGE BODY.  
3
INCHES  
DIM MIN MAX  
0.805 20.19  
MILLIMETERS  
B
MIN  
MAX  
20.45  
5.97  
4.45  
5.59  
1.65  
0.15  
2
(FLANGE)  
A
B
0.795  
0.225  
0.125  
0.210  
0.055  
0.004  
2X K  
0.235  
0.175  
0.220  
0.065  
0.006  
5.72  
3.18  
5.33  
1.40  
0.10  
2X D  
bbb  
C
M
M
M
T A  
B
R
D
(LID)  
E
F
M
M
M
B
ccc  
T A  
G
0.562 BSC  
14.28 BSC  
H
0.077  
0.220  
0.355  
0.357  
0.125  
0.227  
0.225  
0.087  
0.250  
0.365  
0.363  
0.135  
0.233  
0.235  
1.96  
5.59  
9.02  
9.07  
3.18  
5.77  
5.72  
2.21  
6.35  
9.27  
9.22  
3.43  
5.92  
5.97  
F
K
H
M
M
M
B
M
ccc  
T A  
N
N
(LID)  
Q
C
E
R
S
aaa  
bbb  
ccc  
0.005 REF  
0.010 REF  
0.015 REF  
0.13 REF  
0.25 REF  
0.38 REF  
S
(INSULATOR)  
M
M
M
B
aaa  
T A  
SEATING  
PLANE  
T
STYLE 1:  
PIN 1. DRAIN  
2. GATE  
3. SOURCE  
M
M
M
B
bbb  
T A  
M
(INSULATOR)  
CASE 360B-05  
ISSUE F  
A
A
NI-360  
MRF284LR1  
A
A
(FLANGE)  
B
B
1
2
NOTES:  
1. INTERPRET DIMENSIONS AND TOLERANCES  
PER ASME Y14.5M−1994.  
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION H IS MEASURED 0.030 (0.762) AWAY  
FROM PACKAGE BODY.  
2X K  
(FLANGE)  
2X D  
M
M
M
bbb  
T A  
B
INCHES  
DIM MIN MAX  
MILLIMETERS  
R
MIN  
9.53  
5.72  
2.67  
5.33  
0.89  
0.10  
1.45  
2.16  
9.02  
9.07  
5.77  
5.72  
MAX  
9.78  
5.97  
3.94  
5.59  
1.14  
0.15  
1.70  
2.92  
9.27  
9.22  
5.92  
5.97  
(LID)  
A
B
0.375  
0.225  
0.105  
0.210  
0.035  
0.004  
0.057  
0.085  
0.355  
0.357  
0.227  
0.225  
0.385  
0.235  
0.155  
0.220  
0.045  
0.006  
0.067  
0.115  
0.365  
0.363  
0.23  
M
M
M
ccc  
T A  
B
C
N
F
D
(LID)  
H
E
M
M
M
B
ccc  
T A  
F
H
K
E
M
N
C
S
R
(INSULATOR)  
S
0.235  
aaa  
bbb  
ccc  
0.005 REF  
0.010 REF  
0.015 REF  
0.13 REF  
0.25 REF  
0.38 REF  
M
M
M
B
aaa  
T A  
SEATING  
PLANE  
PIN 3  
T
M
(INSULATOR)  
STYLE 1:  
M
M
M
bbb  
T A  
B
PIN 1. DRAIN  
2. GATE  
3. SOURCE  
CASE 360C-05  
ISSUE D  
NI-360S  
MRF284LSR1  
MOTOROLA RF DEVICE DATA  
MRF284LR1 MRF284LSR1  
11  
Information in this document is provided solely to enable system and software implementers to use Motorola products. There are no express or implied copyright  
licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document.  
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding  
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and  
specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Motorola  
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including  
“Typicals”, must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the  
rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other  
applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury  
or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola  
and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees  
arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that  
Motorola was negligent regarding the design or manufacture of the part.  
MOTOROLA and the Stylized M Logo are registered in the US Patent and Trademark Office. All other product or service names are the property of their respective  
owners. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer.  
E Motorola Inc. 2003  
HOW TO REACH US:  
USA/EUROPE/LOCATIONS NOT LISTED:  
Motorola Literature Distribution  
P.O. Box 5405, Denver, Colorado 80217  
1-800-521-6274 or 480-768-2130  
JAPAN: Motorola Japan Ltd.; SPS, Technical Information Center,  
3-20-1, Minami-Azabu, Minato-ku, Tokyo 106-8573, Japan  
81-3-3440-3569  
ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; Silicon Harbour Centre,  
2 Dai King Street, Tai Po Industrial Estate, Tai Po, N.T., Hong Kong  
852-26668334  
HOME PAGE: http://motorola.com/semiconductors  
MRF284/D  

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