MPXH6250A6T1 [MOTOROLA]

HIGH TEMPERATURE ACCURACY INTEGRATED SILICON PRESSURE SENSOR; 高温度精度集成硅压力传感器


型号：	MPXH6250A6T1
厂家：	MOTOROLA
描述：	HIGH TEMPERATURE ACCURACY INTEGRATED SILICON PRESSURE SENSOR 高温度精度集成硅压力传感器传感器换能器压力传感器
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中文：	中文翻译
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MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Freescale Semiconductor, Inc.

Order this document

by MPXH6250A

High Temperature Accuracy

Integrated Silicon Pressure Sensor

for Measuring Absolute Pressure,

On-Chip Signal Conditioned,

Temperature Compensated

and Calibrated

MPXH6250A

SERIES

INTEGRATED

PRESSURE SENSOR

20 to 250 kPa (3.0 to 36 psi)

0.3 to 4.9 Volts Output

Motorola’s MPXH6250A series sensor integrates on–chip, bipolar op amp circuitry and

thin film resistor networks to provide a high output signal and temperature compensation.

The small form factor and high reliability of on–chip integration make the Motorola pressure

sensor a logical and economical choice for the system designer.

The MPXH6250A series piezoresistive transducer is a state–of–the–art, monolithic,

signal conditioned, silicon pressure sensor. This sensor combines advanced

micromachining techniques, thin film metallization, and bipolar semiconductor processing to

provide an accurate, high level analog output signal that is proportional to applied pressure.

Figure 1 shows a block diagram of the internal circuitry integrated on a pressure

sensor chip.

SUPER SMALL OUTLINE

PACKAGE

Features

• Improved Accuracy at High Temperature

• Available in Small and Super Small Outline Packages

• 1.5% Maximum Error over 0° to 85°C

MPXH6250A6T1

CASE 1317

• Ideally suited for Microprocessor or Microcontroller–Based Systems

• Temperature Compensated from –40° to +125°C

• Durable Thermoplastic (PPS) Surface Mount Package

Application Examples

• Industrial Controls

• Engine Control/Manifold Absolute Pressure (MAP)

MPXH6250AC6T1

CASE 1317A

PIN NUMBER

N/C

Gnd

THIN FILM

TEMPERATURE

COMPENSATION

AND

GAIN STAGE #2

AND

out

SENSING

ELEMENT

GROUND

out

NOTE: Pins 1, 5, 6, 7, and 8 are

internal device connections. Do not

connect to external circuitry or

ground. Pin 1 is denoted by the

chamfered corner of the package.

REFERENCE

SHIFT CIRCUITRY

GAIN STAGE #1

PINS 1, 5, 6, 7 AND 8 ARE NO CONNECTS

GND

Figure 1. Fully Integrated Pressure Sensor

Schematic

REV 0

MPXH6250A SERIES

Motorola Sensor Device Data

For More Information On This Product,

Go to: www.freescale.com

 Motorola, Inc. 2003

Freescale Semiconductor, Inc.

MAXIMUM RATINGS⁽¹⁾

Parametrics

Symbol

Value

1000

Units

kPa

Maximum Pressure (P1 u P2)

Storage Temperature

max

stg

–40° to +125°

0.5

°C

Operating Temperature

°C

(2)

Output Source Current @ Full Scale Output

I +

mAdc

(2)

Output Sink Current @ Minimum Pressure Offset

NOTES:

1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.

2. Maximum Output Current is controlled by effective impedance from V to Gnd or V to V in the application circuit.

I –

–0.5

out

OPERATING CHARACTERISTICS (V = 5.1 Vdc, T = 25°C unless otherwise noted, P1 u P2.)

Characteristic

Symbol

Min

Typ

—

Max

250

Unit

kPa

Vdc

Pressure Range

(1)

Supply Voltage

4.74

—

5.1

5.46

Supply Current

6.0

mAdc

Vdc

(2)

Minimum Pressure Offset

(0 to 85°C)

0.133

0.204

0.274

off

@ V = 5.1 Volts

(3)

Full Scale Output

FSO

4.826

4.552

4.896

4.692

4.966

4.833

Vdc

@ V = 5.1 Volts

(4)

Full Scale Span

FSS

@ V = 5.1 Volts

(5)

Accuracy

—

20.4

1.0

1.5

—

FSS

Sensitivity

V/P

mV/kPa

(6)

Response Time

(7)

Warm–Up Time

—

(8)

Offset Stability

ā0.25

FSS

NOTES:

1. Device is ratiometric within this specified excitation range.

2. Offset (V ) is defined as the output voltage at the minimum rated pressure.

off

3. Full Scale Output (V ) is defined as the output voltage at the maximum or full rated pressure.

FSO

4. Full Scale Span (V

) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the

FSS

minimum rated pressure.

5. Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span

at 25°C due to all sources of error including the following:

•

Linearity:

Output deviation from a straight line relationship with pressure over the specified pressure range.

Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is

cycled to and from the minimum or maximum operating temperature points, with zero differential

pressure applied.

•

Pressure Hysteresis:

Output deviation at any pressure within the specified range, when this pressure is cycled to and from

minimum or maximum rated pressure at 25°C.

•

TcSpan:

TcOffset:

Output deviation over the temperature range of 0° to 85°C, relative to 25°C.

Output deviation with minimum pressure applied, over the temperature range of 0° to 85°C, relative

to 25°C.

6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to

a specified step change in pressure.

7. Warm–up Time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized.

8. Offset Stability is the product’s output deviation when subjected to 1000 cycles of Pulsed Pressure, Temperature Cycling with Bias Test.

MPXH6250A SERIES

Motorola Sensor Device Data

For More Information On This Product,

Go to: www.freescale.com

Freescale Semiconductor, Inc.

DIE

FLUORO SILICONE

GEL DIE COAT

STAINLESS

+5.1 V

STEEL CAP

WIRE BOND

THERMOPLASTIC

CASE

Pin 2

MPXH6250A

LEAD

FRAME

100 nF

out

Pin 4

to ADC

47 pF

51 K

GND Pin 3

ABSOLUTE ELEMENT

SEALED VACUUM REFERENCE

DIE BOND

Figure 2. Cross Sectional Diagram SSOP

(not to scale)

Figure 3. Typical Application Circuit

(Output Source Current Operation)

Figure 2 illustrates the absolute sensing chip in the basic

Super Small Outline chip carrier (Case 1317).

Figure 3 shows a typical application circuit (output source

current operation).

5.0

TRANSFER FUNCTION:

4.5

4.0

V = V * (0.0040*P-0.040) Error

out s

= 5.1 Vdc

TEMP = 0 to 85°C

3.5

3.0

2.5

MAX

2.0

1.5

1.0

0.5

TYP

MIN

Pressure (ref: to sealed vacuum) in kPa

Figure 4. Output versus Absolute Pressure

Figure 4 shows the sensor output signal relative to pres-

sure input. Typical minimum and maximum output curves

are shown for operation over 0 to 85°C temperature range.

The output will saturate outside of the rated pressure range.

A fluorosilicone gel isolates the die surface and wire

bonds from the environment, while allowing the pressure

signal to be transmitted to the silicon diaphragm. The

MPXH6250A series pressure sensor operating characteris-

tics, internal reliability and qualification tests are based on

use of dry air as the pressure media. Media other than dry

air may have adverse effects on sensor performance and

long–term reliability. Contact the factory for information re-

garding media compatibility in your application.

MPXH6250A SERIES

Motorola Sensor Device Data

For More Information On This Product,

Go to: www.freescale.com

Freescale Semiconductor, Inc.

Transfer Function (MPXH6250A)

Nominal Transfer Value: V_out= V_Sx (0.004 x P – 0.040)

(Pressure Error x Temp. Factor x 0.004 x V_S)

V_S= 5.1 0.36 Vdc

Temperature Error Band

MPXH6250A Series

4.0

3.0

2.0

1.0

0.0

Break Points

Temp

Multiplier

- 40

0 to 85

125

1.75

Temperature

Error

Factor

-40

-20

100

120

140

Temperature in C°

NOTE: The Temperature Multiplier is a linear response from 0°C to –40°C and from 85°C to 125°C

Pressure Error Band

Error Limits for Pressure

4.0

3.0

2.0

1.0

0.0

Pressure (in kPa)

100

140

180

220

260

300

-1.0

-Ă2.0

-Ă3.0

-4.0

Pressure

20 to 250 (kPa)

Error (Max)

Ă3.45 (kPa)

ORDERING INFORMATION — SUPER SMALL OUTLINE PACKAGE

Device Type

Options

Case No.

1317

MPX Series Order No.

Packing Options

Rails

Marking

MPXH6250A

Basic Element

Absolute, Element Only

Absolute, Axial Port

MPXH6250A6U

MPXH6250A6T1

MPXH6250AC6U

MPXH6250AC6T1

1317

Tape and Reel

Rails

Ported Element

1317A

Tape and Reel

MPXH6250A SERIES

Motorola Sensor Device Data

For More Information On This Product,

Go to: www.freescale.com

Freescale Semiconductor, Inc.

SURFACE MOUNTING INFORMATION

MINIMUM RECOMMENDED FOOTPRINT FOR SUPER SMALL OUTLINE PACKAGES

Surface mount board layout is a critical portion of the total

design. The footprint for the semiconductor package must

be the correct size to ensure proper solder connection inter-

face between the board and the package. With the correct

pad geometry, the packages will self–align when subjected to

a solder reflow process. It is always recommended to fabri-

cate boards with a solder mask layer to avoid bridging and/or

shorting between solder pads, especially on tight tolerances

and/or tight layouts.

0.050

0.387

9.83

1.27

TYP

0.150

3.81

0.027 TYP 8X

0.69

0.053 TYP 8X

1.35

inch

Figure 5. SSOP Footprint (Case 1317 and 1317A)

MPXH6250A SERIES

Motorola Sensor Device Data

For More Information On This Product,

Go to: www.freescale.com

Freescale Semiconductor, Inc.

SUPER SMALL OUTLINE PACKAGE DIMENSIONS

0.006 C

0.420

0.400

0.050

NOTES:

1. ALL DIMENSIONS ARE IN INCHES.

2. DIMENSIONING AND TOLERANCING PER ASME

Y14.5M-1994.

0.025

3. DIMENSIONS DO NOT INCLUDE MOLD FLASH OR

PROTRUSIONS. MOLD FLASH OR PROTRUSIONS

SHALL NOT EXCEED .006 INCHES PER SIDE.

4. ALL VERTICAL SURFACES TO BE 5° MAXIMUM.

5. DIMENSION DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR PROTRUSION

SHALL BE .008 INCHES MAXIMUM.

0.300

0.280

0.019

0.014

0.004

C A B

0.300

0.280

0.298

0.278

.010

GAGE

PLANE

0.165

0.145

0.010

0.002

0.023

0.013

0.004

DETAIL E

SEATING

PLANE

CASE 1317–03

ISSUE B

MPXH6250A SERIES

Motorola Sensor Device Data

For More Information On This Product,

Go to: www.freescale.com

Freescale Semiconductor, Inc.

SUPER SMALL OUTLINE PACKAGE DIMENSIONS (CONTINUED)

0.006 C

NOTES:

1. ALL DIMENSIONS ARE IN INCHES.

2. DIMENSIONING AND TOLERANCING PER ASME

Y14.5M-1994.

0.420

0.400

3. DIMENSIONS DO NOT INCLUDE MOLD FLASH OR

PROTRUSIONS. MOLD FLASH OR PROTRUSIONS

SHALL NOT EXCEED .006 INCHES PER SIDE.

4. ALL VERTICAL SURFACES TO BE 5° MAXIMUM.

5. DIMENSION DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR PROTRUSION

SHALL BE .008 INCHES MAXIMUM.

0.050

0.025

0.345

0.325

0.018

0.014

.014

0.004

C A B

GAGE

PLANE

0.345

0.325

0.010

0.002

0.048

0.038

DETAIL E

0.130

0.110

0.200

0.180

0.300

0.280

0.390

0.370

0.004

0.300

0.280

DETAIL E

SEATING

PLANE

BOTTOM VIEW

CASE 1317A–01

ISSUE A

MPXH6250A SERIES

Motorola Sensor Device Data

For More Information On This Product,

Go to: www.freescale.com

Freescale Semiconductor, Inc.

Information in this document is provided solely to enable system and software implementers to use Motorola products. There are no express or implied copyright

licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document.

Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding

the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and

specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Motorola

data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including

“Typicals”, must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the

rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other

applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury

or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola

and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees

arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that

Motorola was negligent regarding the design or manufacture of the part.

MOTOROLA and the Stylized M Logo are registered in the US Patent and Trademark Office. All other product or service names are the property of their respective

owners. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer.

E Motorola Inc. 2003

HOW TO REACH US:

USA/EUROPE/Locations Not Listed: Motorola Literature Distribution; P.O. Box 5405, Denver, Colorado 80217. 1–800–521–6274 or 480–768–2130

JAPAN: Motorola Japan Ltd.; SPS, Technical Information Center, 3–20–1, Minami–Azabu, Minato–ku, Tokyo 106–8573, Japan. 81–3–3440–3569

ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; Silicon Harbour Centre, 2 Dai King Street, Tai Po Industrial Estate, Tai Po, N.T., Hong Kong. 852–26668334

HOME PAGE: http://motorola.com/semiconductors

MPXH6250A SERIES

Motorola Sensor Device Data

For More Information On This Product,

MPXH6250A

Go to: www.freescale.com

MPXH6250A6T1 [MOTOROLA]

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