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MC13142FTB [MOTOROLA]

TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, PQFP20, TQFP-20;
MC13142FTB
型号： MC13142FTB
厂家： MOTOROLA    MOTOROLA
描述：

TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, PQFP20, TQFP-20

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文件： 总49页 (文件大小：988K)
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LOW POWER DC – 1.8 GHz  
LNA, MIXER and VCO  
The MC13142 is intended to be used as a first amplifier, voltage controlled  
oscillator and down converter for RF applications. It features wide band  
operation, low noise, high gain and high linearity while maintaining low  
current consumption. The circuit consists of a Low Noise Amplifier (LNA), a  
Voltage Controlled Oscillator (VCO), a buffered oscillator output, a mixer, an  
SEMICONDUCTOR  
TECHNICAL DATA  
Intermediate Frequency amplifier (IF ) and a dc control section. The wide  
amp  
mixer IF bandwidth allows this part also to be used as an up converter and  
exciter amplifier.  
• Wide RF Bandwidth: DC–1.8 GHz  
• Wide LO Bandwidth: DC–1.8 GHz  
• Wide IF Bandwidth: DC–1.8 GHz  
16  
• Low Power: 13 mA @ V  
= 2.7–6.5 V  
CC  
1
• High Mixer Linearity: P  
= +3.0 dBm  
i1.0 dB  
• Linearity Adjustment Increases IP  
• Single–Ended 50 Ω Mixer Input  
• Double Balanced Mixer Operation  
• Open Collector Mixer Output  
Up to +20 dBm  
3in  
D SUFFIX  
PLASTIC PACKAGE  
CASE 751B  
(SO–16)  
• Single Transistor Oscillator with Collector, Base and Emitter Pinned Out  
• Buffered Oscillator Output  
• Mixer and Oscillator Can be Enabled Independently in TQFP–20  
Package Only  
20  
1
ORDERING INFORMATION  
Operating  
FTB SUFFIX  
PLASTIC PACKAGE  
CASE 976  
Temperature Range  
Device  
MC13142D  
MC13142FTB  
Package  
SO–16  
(Thin QFP)  
T
A
= –40° to +85°C  
TQFP–20  
PIN CONNECTIONS  
TQFP–20  
SO–16  
EN  
RF  
V
1
2
3
4
5
6
7
16  
15  
out  
5
4
3
2
1
RF  
in  
CC  
Mx Lin  
Cont  
6
7
20  
19  
18  
17  
RF  
RF  
In  
V
EE  
Mix Lin Cont  
m
14  
13  
12  
11  
10  
V
EE  
V
EE  
Osc E  
RF  
m
V
EE  
V
EE  
8
V
EE  
Osc B  
IF+  
Osc E  
Osc B  
9
Osc C, V  
IF+  
IF–  
CC  
10  
16 IF–  
Buff  
11 12 13 14 15  
V
CC  
8
9
V
EE  
This device contains 176 active transistors.  
8–235  
MOTOROLA ANALOG IC DEVICE DATA  
MC13142  
MAXIMUM RATINGS (T = 25°C, unless otherwise noted.)  
A
Rating  
Power Supply Voltage  
Symbol  
Value  
Unit  
Vdc  
Vdc  
V
7.0 (max)  
2.7–6.5  
CC  
CC  
Operating Supply Voltage Range  
V
NOTE: ESD data available upon request.  
ELECTRICAL CHARACTERISTICS (V  
= 3.0 V, T = 25°C, LO = –10 dBm @ 950 MHz, IF @ 50 MHz.)  
in  
CC  
A
Characteristic  
Symbol  
Min  
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
Typ  
100  
13.5  
12  
Max  
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
Unit  
pA  
Supply Current (Power Down)  
Supply Current (Power Up)  
I
I
CC  
mA  
dB  
CC  
Amplifier Gain (50 Ω Insertion Gain)  
Amplifier Reverse Isolation  
S
21  
12  
S
–33  
–10  
–15  
–15  
–5.0  
1.8  
dB  
Amplifier Input Match  
Γ
dB  
in amp  
Amplifier Output Match  
Γ
dB  
out amp  
Amplifier 1.0 dB Gain Compression  
Amplifier Input Third Order Intercept  
Amplifier Noise Figure (Application Circuit)  
Amplifier Gain @ N.F.  
Pin  
dBm  
dBm  
dB  
–1.0 dB  
IP3  
in  
NF  
G
17  
dB  
NF  
Mixer Voltage Conversion Gain (R = R = 800 Ω)  
VG  
PG  
9.0  
dB  
P
L
C
C
Mixer Power Conversion Gain (R = R = 800 Ω)  
–3.0  
–20  
12  
dB  
P
L
Mixer Input Match  
Γ
dB  
in M  
Mixer SSB Noise Figure  
NF  
dB  
SSBM  
Mixer 1.0 dB Gain Compression  
Mixer Input Third Order Intercept  
Oscillator Buffer Drive (50 Ω)  
Pin  
–1.0 dBM  
3.0  
dBm  
dBm  
dBm  
dBc/Hz  
dB  
IP3  
–1.0  
–16  
–90  
–35  
–35  
–35  
–35  
–35  
–25  
–25  
InM  
P
VCO  
Oscillator Phase Noise @ 25 kHz Offset  
N
Φ
RF Feedthrough to RF  
P
RFin–RFm  
in  
m
RF  
Feedthrough to RF  
P
dB  
out  
m
RFout–RFm  
LO Feedthrough to IF  
LO Feedthrough to RF  
LO Feedthrough to RF  
P
dBm  
dBm  
dBm  
dB  
LO–IF  
P
in  
LO–RFin  
LO–RFm  
P
m
Mixer RF Feedthrough to IF  
Mixer RF Feedthrough to RF  
P
RFm–IF  
P
dB  
in  
RFm–RFin  
8–236  
MOTOROLA ANALOG IC DEVICE DATA  
MC13142  
CIRCUIT DESCRIPTION  
General  
The MC13142 is a low power LNA, double–balanced  
(MSG) yields noise performance within a few tenths of a dB  
of the minimum noise figure.  
Mixer, and VCO. This device is designated for use as the  
frontend section in analog and digital FM systems such as  
Digital European Cordless Telephone (DECT), PHS, PCS,  
Cellular, UHF and 800 MHz Special Mobile Radio (SMR),  
UHF Family Radio Services and 902 to 928 MHz cordless  
telephones. It features a mixer linearity control to preset or  
auto program the mixer dynamic range, an enable function  
and a wideband IF so the IC may be used either as a down  
converter or an up converter. Further details are covered in  
the Pin by Pin Description which shows the equivalent  
internal circuit and external circuit requirements.  
Mixer  
The mixer is a double–balanced four quadrant multiplier  
biased class AB allowing for programmable linearity control  
via an external current source. An input third order intercept  
point of 20 dBm may be achieved. All 3 ports of the mixer are  
designed to work up to 1.8 GHz. The mixer has a 50 Ω  
single–ended RF input and open collector differential IF  
outputs. An on–board Local Oscillator transistor has the  
emitter, base and collector pinned out to implement a low  
phase noise VCO in various configurations. Additionally, a  
buffered LO output is provided for operation with a frequency  
synthesizer. The linear gain of the mixer is approximately  
0 dB with a SSB noise figure of 12 dB in the IF output circuit  
configuration shown in the application example.  
Current Regulation/Enable  
Temperature compensating voltage independent current  
regulators are controlled by the enable function in which  
“high” powers up the IC.  
Local Oscillator  
Low Noise Amplifier (LNA)  
The on–chip transistor operates with coaxial transmission  
line or LC resonant elements to over 2.0 GHz. Biasing is  
done with a temperature compensated current source in the  
emitter and a collector to base internal resistor of 7.6 kΩ;  
The LNA is internally biased at low supply current  
(approximately 2.0 mA emitter current) for optimal noise  
figure and gain. The LNA output is biased internally with a  
however, an RFC from V  
application circuit shows a voltage controlled Clapp oscillator  
operating at center frequency of 975 MHz.  
to base is recommended. The  
600 Ω resistor to V . Input and output matching may be  
achieved at various frequencies using few external  
components. Matching the LNA for Maximum stable gain  
CC  
CC  
8–237  
MOTOROLA ANALOG IC DEVICE DATA  
MC13142  
PIN FUNCTION DESCRIPTION  
Pin  
16 Pin  
SOIC  
20 Pin  
TQFP  
Equivalent Internal Circuit  
(20 Pin TQFP)  
Symbol  
Description  
1
4
5
EN  
E Osc  
Enable, E Osc  
V
CC  
In SO–16, both enables, (for the Oscillator/LO  
Buffer and LNA/Mixer) are bonded to Pin 1. In the  
TQFP, two pins are provided, Pin 5, E Osc enables  
the oscillator and buffer while Pin 4, EN enables  
the LNA/Mixer.  
4
40 k  
2.0 V  
EN  
BE  
Enable by pulling up to V  
CC  
or to greater than  
2.0 V  
.
BE  
V
CC  
70 k  
2.0 V  
5
E Osc  
BE  
2
3
6
RF  
in  
RF Input  
V
CC  
The input is the base of an NPN low noise  
amplifier. Minimum external matching is required to  
optimize the input return loss and gain.  
600  
3
RF  
V
ref2  
out  
7, 8  
V
EE  
V
– Negative Supply  
pin is taken to an ample dc ground plane  
EE  
V
EE  
V
EE  
through a low impedance path. The path should be  
kept as short as possible. A two sided PCB is  
implemented so that ground returns can be easily  
made through via holes.  
V
ref3  
6
RF  
in  
7
2.0 mA  
V
EE  
16  
3
RF  
out  
RF Output  
V
CC  
The output is from the collector of the LNA; it is  
internally biased with a 600 Ω resistor to V . As  
CC  
shown in the 926 MHz application receiver the  
output is conjugately matched with a shunt L, and  
series L and C network.  
8
V
EE  
4
5
6
9
10  
11  
Osc E  
Osc B  
Osc C  
On–Board VCO Transistor  
The transistor has the emitter, base and collector +  
9
V
pins available. Internal biasing which is  
CC  
Osc E  
compensated for stability over temperature is  
provided. It is recommended that the base pin is  
10  
10  
pulled up to V  
through an RFC chosen for the  
CC  
1.5  
mA  
12  
V
CC  
particular oscillator center frequency. The  
application circuit shows a modified Colpitts or  
Clapp oscillator configuration and its design is  
discussed in detail in the application section.  
Osc B  
7.6 k  
11  
V
EE  
Osc C  
6
8
12  
14  
V
CC  
V
CC  
Supply Voltage (V )  
CC  
Two V  
CC  
pins are provided for the Local Oscillator  
and LO Buffer Amplifier. The operating supply  
voltage range is from 2.7 Vdc to 6.5 Vdc. In the  
V
EE  
PCB layout, the V  
trace must be kept as wide as  
V
CC  
CC  
feasible to minimize inductive reactances along the  
trace. V should be decoupled to V at the IC  
13  
CC  
EE  
pin as shown in the component placement view.  
LOBuf  
7
13  
LO Buff  
Local Oscillator Buffer  
This is a buffered output providing –16 dBm  
(50 Ω termination) to drive the f pin of a PLL  
synthesizer. Impedance matching to the  
synthesizer may be necessary to deliver the  
optimal signal and to improve the phase noise  
performance of the VCO.  
1.0  
mA  
14  
in  
V
CC  
V
EE  
8–238  
MOTOROLA ANALOG IC DEVICE DATA  
MC13142  
PIN FUNCTION DESCRIPTION (continued)  
Pin  
16 Pin  
SOIC  
20 Pin  
TQFP  
Equivalent Internal Circuit  
(20 Pin TQFP)  
Symbol  
Description  
9, 12  
15, 18, 19  
16, 17  
V
V
, Negative Supply  
EE  
EE  
These pins are V  
V
CC  
V
CC  
supply for the mixer IF output.  
EE  
In the application PC board these pins are tied to a  
common V  
trace with other V pins.  
EE  
EE  
10, 11  
IF–, IF+  
IF Output  
The IF is a differential open collector configuration  
which designed to use over a wide frequency range  
for up conversion as well as down conversion.  
Differential to single–ended circuit configuration  
and matching options are discussed in the  
application section. 6.0 dB of additional Mixer gain  
can be achieved by conjugately matching at the  
desired IF frequency.  
16  
IF–  
15  
17  
IF+  
18, 19  
V
EE  
13  
20  
RF  
Mixer RF Input  
m
V
CC  
The mixer input impedance is broadband 50 Ω for  
applications up to 1.8 GHz. It easily interfaces with  
a RF ceramic filter as shown in the application  
schematic.  
V
ref1  
33  
V
EE  
20  
14  
1
Mix Lin  
Cont  
Mixer Linearity Control  
RF  
m
The mixer linearity control circuit accepts  
approximately 0 to 2.3 mA control current to set  
the dynamic range of the mixer. An Input Third  
Order Intercept Point, IIP3 of 20 dBm may be  
achieved at 2.3 mA of control current  
(approximately 7.0 mA of additional supply  
current).  
1
Mix Lin  
Cont  
33  
400 µA  
8–239  
MOTOROLA ANALOG IC DEVICE DATA  
MC13142  
APPLICATIONS INFORMATION  
Evaluation PC Board  
Component Selection  
The evaluation PCB is very versatile and is intended to be  
used across the entire useful frequency range of this device.  
The PC board accommodates all SMT components on the  
circuit side (see Circuit Side Component Placement View).  
This evaluation board will be discussed and referenced in  
this section.  
The evaluation PC board is designed to accommodate  
specific components, while also being versatile enough to  
use components from various manufacturers. The circuit  
side placement view is illustrated for the components  
specified in the application circuit. The application circuit  
schematic specifies particular components that were used to  
achieve the results given and specified in the tables but  
alternate components of the same Q and value should give  
equivalent results.  
Figure 1. Application Circuit  
(926.5 MHz)  
V
CC  
PC Rotary SW  
51  
47 p  
RF  
Input  
Enable  
3.0 p  
39 nH  
100 p  
*Z  
50 Ω  
=
SMA  
O
1
2
3
4
5
6
16  
15  
14  
13  
12  
11  
10  
9
DC Bias  
LNA  
6.8 nH  
18 nH  
V
Toko RF  
Filter  
CC  
Z
= 50 Ω  
O
3.9 p  
V
Control  
Mixer Linearity  
Control  
3.6 p  
2.3 mA  
Max  
120 k  
2.4 p  
100 n  
VCO  
2.4 p  
Mixer  
47 p  
1.0 µ  
2.55 nH  
MMBV809  
33 k  
5.6 p  
390 nH  
Z Transformer  
16 : 1  
L
IF  
V
CC  
Output  
IF  
Outputs  
C
7
8
SMA  
100 n  
100 p  
LO Buffer  
LO Buffer  
Output  
100 p  
SMA  
NOTE: *50 Ω Microstrip Transmission Line; length shown in Figure 2.  
8–240  
MOTOROLA ANALOG IC DEVICE DATA  
MC13142  
Figure 2. Circuit Side Component Placement View  
MC13142D  
Rev A  
Mix In  
Mix Lin Cont  
Toko  
926A10  
Dielectric  
Filter  
C
L
IF  
Out  
16:1  
Impedance  
Transformer  
LNA  
Output  
100 p  
18 nH  
PC  
Rotary  
51  
MC13142D  
Switch  
2.4 p  
2.4 p  
47 p  
6.8 nH  
100 p  
390 nH  
LNA  
Input  
LO  
Buf  
Out  
5.6 p  
33 k  
MMBV809  
120 k  
V–Cont  
V
CC  
NOTES: The PCB is laidout for the 4DFA (2 pole SMD type) and 4DFB (3 pole SMD type) filters which are available for applications in  
cellular and GSM,GPS (1.2–1.5 GHz), DECT, PHS and PCS (1.8–2.0 GHz) and ISM Bands (902–928 MHz and 2.4–2.5 GHz).  
In the component placement shown above, the 926.5 MHz dielectric type image filter is used (Toko Part # 4DFA–926A10).  
The PCB also accommodates a surface mount SAW filter in an eight or six pin ceramic package for the cellular base and  
handset frequencies. Recommended manufacturers are Siemens and Murata.  
Traces are provided on the PCB to evaluate the LNA and mixer separately. The component placement view shows external  
circuit components used for the 926.5 MHz application circuit. Note: some traces must be cut to accommodate placement of  
components; likewise some traces must be shorted. The voltage controlled oscillator is shown with the varactor referenced to  
V
ground. The PCB is modified as shown to do this.  
EE  
16:1 broadband impedance transformer is mini circuits part #TX16–R3T; it is in the leadless surface mount “TX” package.  
Components L and C comprise a low pass filter used to provide narrowband matching at a given IF frequency. For example at  
49 MHz C = 36 p and L = 330 nH.  
The microstrip trace on the ground side of the PCB is intended for a microstrip resonator; it is cut free when using a lump  
inductor as done above.  
8–241  
MOTOROLA ANALOG IC DEVICE DATA  
MC13142  
Input Matching/Components  
represents the application circuit. In the cascaded noise  
analysis the system noise equation is:  
Fsystem = F1 + [(F2 –1)/G1] + [(F3–1)]/[(G1)(G2)]  
where:  
It is desirable to use a RF ceramic or SAW filter before the  
mixer to provide image frequency rejection. The filter is  
selected based on cost, size and performance tradeoffs.  
Typical RF filters have 3.0 to 5.0 dB insertion loss. The PC  
board layout accommodates both ceramic and SAW RF  
filters which are offered by various suppliers such as  
Siemens, Toko and Murata.  
Interface matching between the LNA, RF filter and the  
mixer will be required. The interface matching networks  
shown in the application circuit are designed for 50 Ω  
interfaces.  
F1 = the Noise Factor of the MC13142 LNA  
G1 = the Gain of the LNA  
F2 = the Noise factor of the RF Ceramic Filter  
G2 = the Gain of the Ceramic Filter  
F3 = the Noise factor of the Mixer  
Note: the above terms are defined as linear relationships and  
are related to the log form for gain and noise figure by the  
following:  
In the application circuit, the LNA is conjugately matched  
–1  
–1  
F = Log  
G = Log  
[(NF in dB)/10] and similarly  
[(Gain in dB)/10].  
to 50 Ω input and output for 3.0 to 5.0 Vdc V . 17 dB gain  
CC  
and 1.8 dB noise figure is typical at 926 MHz. The mixer  
measures 0 dB gain and 12 dB noise figure as shown in the  
application circuit. Typical insertion loss of the Toko ceramic  
filter is 3.0 dB. Thus, the overall gain of the frontend receiver  
is 14 dB with a 3.3 dB noise figure.  
Calculating in terms of gain and noise factor yields the  
following:  
F1 = 1.51; G1 = 50.11  
F2 = 1.99; G2 = 0.5  
F3 = 15.85  
System Noise Considerations  
Thus, substituting in the equation for system noise factor:  
Fsystem = 2.12; NFsystem = 3.3 dB  
The block diagram shows the cascaded noise stages of  
the MC13142 in the frontend receiver subsystem; it  
Figure 3. Frontend Subsystem Block Diagram for Noise Analysis  
V
CC  
f
= 926.5 MHz  
LNA  
RF  
Z Transformer  
16:1  
330 nH  
Mixer  
NF Meter  
Toko Ceramic  
Filter  
Noise Source  
IF Output  
= 49.05 MHz  
36 p  
f
IF  
G2 = –3.0 dB  
NF2 = 3.0 dB  
G1 = 17 dB  
NF1 = 1.8 dB  
Local Oscillator  
= 975.55 MHz  
G3 = 0 dB  
NF3 = 12 dB  
f
LO  
G
= 14 dB  
sys  
sys  
NF = 3.3 dB  
8–242  
MOTOROLA ANALOG IC DEVICE DATA  
MC13142  
Figure 4. Circuit Side View  
MC13142D  
Rev A  
Mix In  
Mix Lin  
Cont  
IF  
Out  
LNA  
Output  
LNA  
Input  
V
CC  
LO Buf  
Out  
V–Cont  
V
CC  
NOTES: Critical dimensions are 50 mil centers lead to lead in SO–16 footprint.  
Also line widths to labeled ports excluding V  
FR4 PCB, 1/32 inch.  
are 50 mil (0.050 inch).  
CC  
8–243  
MOTOROLA ANALOG IC DEVICE DATA  
MC13142  
Figure 5. Ground Side View  
V–Cont  
V
CC  
LNA  
Input  
LO  
Buf Out  
LNA  
Output  
IF  
Out  
Mix Lin  
Cont  
Mix In  
MC13142D  
Rev A  
NOTES: FR4 PCB, 1/32 inch.  
8–244  
MOTOROLA ANALOG IC DEVICE DATA  
Tape and Reel Options  
In Brief . . .  
Motorola offers the convenience of Tape and Reel  
packaging for our growing family of standard integrated circuit  
products. Reels are available to support the requirements of  
both first and second generation pick–and–place equipment.  
The packaging fully conforms to the latest EIA–481A  
specification. The antistatic embossed tape provides a  
secure cavity, sealed with a peel–back cover tape.  
Page  
Tape and Reel Configurations . . . . . . . . . . . . . . . . . . . . . 12–2  
Tape and Reel Information Table . . . . . . . . . . . . . . . . . . . 12–4  
Analog MPQ Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12–5  
12–1  
MOTOROLA ANALOG IC DEVICE DATA  
Tape and Reel Configurations  
Mechanical Polarization  
SOIC and Micro–8  
DEVICES  
PLCC DEVICES  
Typical  
Typical  
PIN 1  
User Direction of Feed  
User Direction of Feed  
2
DPAK and D PAK  
DEVICES  
Typical  
User Direction of Feed  
SOT–23 (5 Pin)  
DEVICES  
Typical  
SOT–89 (3 Pin)  
DEVICES  
Typical  
SOT–89 (5 Pin)  
DEVICES  
Typical  
User Direction of Feed  
User Direction of Feed  
User Direction of Feed  
12–2  
MOTOROLA ANALOG IC DEVICE DATA  
Tape and Reel Configurations (continued)  
TO–92 Reel Styles  
STYLE A  
(Preferred)  
STYLE E  
Carrier Strip  
Carrier Strip  
Rounded  
Side  
Flat Side  
Adhesive Tape  
Adhesive Tape  
Feed  
Feed  
Rounded side of transistor and adhesive tape visible.  
Flat side of transistor and adhesive tape visible.  
TO–92 Ammo Pack Styles  
STYLE P  
(Preferred)  
STYLE M  
Adhesive Tape On  
Top Side  
Adhesive Tape On  
Top Side  
Feed  
Feed  
Rounded Side  
Flat Side  
Carrier  
Strip  
Carrier  
Strip  
Flat side of transistor and  
adhesive tape visible.  
Rounded side of transistor and  
adhesive tape visible.  
Label  
Label  
Style P ammo pack is equivalent to Styles A and B of reel pack  
dependent on feed orientation from box.  
Style M ammo pack is equivalent to Style E of reel  
pack dependent on feed orientation from box.  
TO–92 EIA Radial Tape in Fan Fold Box or On Reel  
H2A  
H2A  
H2B  
H2B  
H
W2  
H4  
H5  
T1  
L1  
H1  
W1  
W
L
T
T2  
F1  
F2  
D
P2  
P1  
P2  
P
12–3  
MOTOROLA ANALOG IC DEVICE DATA  
Tape and Reel Information Table  
(1)  
Devices  
per Reel  
Tape Width  
(mm)  
Reel Size  
(inch)  
Device  
Suffix  
Package  
SO–8, SOP–8  
SO–14  
SO–16  
12  
16  
16  
2,500  
2,500  
2,500  
13  
13  
13  
R2  
R2  
R2  
SO–16L, SO–8+8L WIDE  
SO–20L WIDE  
SO–24L WIDE  
SO–28L WIDE  
SO–28L WIDE  
16  
24  
24  
24  
32  
1,000  
1,000  
1,000  
1,000  
1,000  
13  
13  
13  
13  
13  
R2  
R2  
R2  
R2  
R3  
Micro–8  
12  
2,500  
13  
R2  
PLCC–20  
PLCC–28  
PLCC–44  
16  
24  
32  
1,000  
500  
500  
13  
13  
13  
R2  
R2  
R2  
PLCC–52  
PLCC–68  
PLCC–84  
32  
44  
44  
500  
250  
250  
13  
13  
13  
R2  
R2  
R2  
(2)  
TO–226AA (TO–92)  
18  
2,000  
13  
RA, RE, RP, or RM  
(Ammo Pack) only  
DPAK  
16  
24  
8
2,500  
800  
13  
13  
7
RK  
R4  
TR  
T1  
2
D PAK  
SOT–23 (5 Pin)  
3,000  
1,000  
SOT–89 (3/5 Pin)  
(1)  
12  
7
Minimum order quantity is 1 reel. Distributors/OEM customers may break lots or reels at their option, however broken reels may not be returned.  
Integrated circuits in TO–226AA packages are available in Styes A and E only, with optional “Ammo Pack” (Suffix RP or RM). The RA and RP configurations  
are preferred. For ordering information please contact your local Motorola Semiconductor Sales Office.  
(2)  
12–4  
MOTOROLA ANALOG IC DEVICE DATA  
Analog MPQ Table  
Tape/Reel and Ammo Pack  
Package Type  
Package Code  
MPQ  
PLCC  
Case 775  
Case 776  
Case 777  
0802  
0804  
0801  
1000/reel  
500/reel  
500/reel  
SOIC  
Case 751  
Case 751A  
Case 751B  
Case 751G  
Case 751D  
Case 751E  
Case 751F  
0095  
0096  
0097  
2003  
2005  
2008  
2009  
2500/reel  
2500/reel  
2500/reel  
1000/reel  
1000/reel  
1000/reel  
1000/reel  
Micro–8  
Case 846A  
–
2500/reel  
TO–92  
Case 29  
Case 29  
0031  
0031  
2000/reel  
2000/Ammo Pack  
DPAK  
Case 369A  
–
–
–
–
–
2500/reel  
800/reel  
2
D PAK  
Case 936  
SOT–23 (5 Pin)  
Case 1212  
3000/reel  
1000/reel  
1000/reel  
SOT–89 (3 Pin)  
Case 1213  
SOT–89 (5 Pin)  
Case 1214  
12–5  
MOTOROLA ANALOG IC DEVICE DATA  
12–6  
MOTOROLA ANALOG IC DEVICE DATA  
Packaging Information  
In Brief . . .  
The packaging availability for each device type is indicated  
on the individual data sheets and the Selector Guide. All of the  
outline dimensions for the packages are given in this section.  
The maximum power consumption an integrated circuit  
can tolerate at a given operating ambient temperature can be  
found from the equation:  
T
– T  
A
J(max)  
P
=
D(TA)  
R
θJA(Typ)  
where:  
P
= Power Dissipation allowable at a given  
operating ambient temperature. This must  
be greater than the sum of the products of  
the supply voltages and supply currents at  
the worst case operating condition.  
D(TA)  
T
= Maximum operating Junction Temperature  
as listed in the Maximum Ratings Section.  
J(max)  
See individual data sheets for T  
information.  
J(max)  
T
A
= Maximum desired operating Ambient  
Temperature  
R
= Typical Thermal Resistance Junction-to-  
Ambient  
θJA(Typ)  
13–1  
MOTOROLA ANALOG IC DEVICE DATA  
Case Outline Dimensions  
LP, P, Z SUFFIX  
CASE 29-04  
NOTES:  
Plastic Package  
(TO-226AA/TO-92)  
ISSUE AD  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
3. CONTOUR OF PACKAGE BEYOND DIMENSION R  
IS UNCONTROLLED.  
4. DIMENSION F APPLIES BETWEEN P AND L.  
DIMENSION D AND J APPLY BETWEEN L AND K  
MINIMUM. LEAD DIMENSION IS UNCONTROLLED  
IN P AND BEYOND DIMENSION K MINIMUM.  
A
B
R
P
INCHES  
DIM MIN MAX  
MILLIMETERS  
L
MIN  
4.45  
4.32  
3.18  
0.41  
0.41  
1.15  
2.42  
0.39  
MAX  
5.20  
5.33  
4.19  
0.55  
0.48  
1.39  
2.66  
0.50  
–––  
F
SEATING  
PLANE  
A
B
C
D
F
G
H
J
0.175 0.205  
0.170 0.210  
0.125 0.165  
0.016 0.022  
0.016 0.019  
0.045 0.055  
0.095 0.105  
0.015 0.020  
K
1
2
3
D
X X  
G
K
L
N
P
0.500  
0.250  
0.080 0.105  
––– 0.100  
––– 12.70  
–––  
J
H
V
6.35  
2.04  
–––  
2.93  
3.43  
–––  
2.66  
2.54  
–––  
C
SECTION X–X  
R
V
0.115  
0.135  
–––  
–––  
1
–––  
N
N
KC, T SUFFIX  
CASE 221A-06  
Plastic Package  
ISSUE Y  
SEATING  
PLANE  
–T–  
C
NOTES:  
T
F
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
–B–  
S
2. CONTROLLING DIMENSION: INCH.  
INCHES  
DIM MIN MAX  
0.560 0.625 14.23 15.87  
MILLIMETERS  
MIN MAX  
4
4
Q
A
A
B
C
D
F
U
0.380 0.420  
0.140 0.190  
0.020 0.045  
0.139 0.155  
0.100 BSC  
9.66 10.66  
1
2
3
3.56  
0.51  
3.53  
4.82  
1.14  
3.93  
H
L
–Y–  
G
H
J
2.54 BSC  
K
––– 0.280  
0.012 0.045  
–––  
0.31  
7.11  
1.14  
1
2
3
K
L
N
Q
R
S
0.500 0.580 12.70 14.73  
R
0.045 0.070  
0.200 BSC  
1.15  
5.08 BSC  
1.77  
J
0.100 0.135  
2.54  
2.04  
0.51  
5.97  
0.00  
3.42  
2.92  
1.39  
6.47  
1.27  
G
0.080  
0.115  
D 3 PL  
0.020 0.055  
0.235 0.255  
0.000 0.050  
T
U
M
M
0.25 (0.010)  
B
Y
N
13–2  
MOTOROLA ANALOG IC DEVICE DATA  
TH SUFFIX  
CASE 314A-03  
Plastic Package  
ISSUE D  
SEATING  
PLANE  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
–T–  
Y14.5M, 1982.  
B
–P–  
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION D DOES NOT INCLUDE  
INTERCONNECT BAR (DAMBAR) PROTRUSION.  
DIMENSION D INCLUDING PROTRUSION SHALL  
NOT EXCEED 0.043 (1.092) MAXIMUM.  
C
E
Q
OPTIONAL  
CHAMFER  
INCHES  
DIM MIN MAX  
MILLIMETERS  
MIN MAX  
A
U
F
A
B
C
D
E
F
0.572 0.613 14.529 15.570  
0.390 0.415 9.906 10.541  
0.170 0.180 4.318 4.572  
0.025 0.038 0.635 0.965  
0.048 0.055 1.219 1.397  
0.570 0.585 14.478 14.859  
L
K
1
5
G
J
K
L
Q
S
0.067 BSC  
1.702 BSC  
G
0.015 0.025 0.381 0.635  
0.730 0.745 18.542 18.923  
0.320 0.365 8.128 9.271  
0.140 0.153 3.556 3.886  
0.210 0.260 5.334 6.604  
0.468 0.505 11.888 12.827  
5X J  
S
5X D  
M
M
0.014 (0.356)  
T P  
U
NOTES:  
T, TV SUFFIX  
CASE 314B-05  
Plastic Package  
ISSUE J  
C
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
B
–P–  
OPTIONAL  
CHAMFER  
Q
F
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION D DOES NOT INCLUDE  
INTERCONNECT BAR (DAMBAR) PROTRUSION.  
DIMENSION D INCLUDING PROTRUSION SHALL  
NOT EXCEED 0.043 (1.092) MAXIMUM.  
E
A
INCHES  
DIM MIN MAX  
A
B
C
D
E
MILLIMETERS  
MIN MAX  
0.613 14.529 15.570  
0.415 9.906 10.541  
U
L
S
V
0.572  
0.390  
0.170  
0.025  
0.048  
0.850  
0.067 BSC  
0.166 BSC  
0.015  
0.900  
0.320  
0.320 BSC  
0.140  
–––  
0.468  
–––  
0.090  
W
K
0.180 4.318  
0.038 0.635  
0.055 1.219  
4.572  
0.965  
1.397  
F
0.935 21.590 23.749  
1
G
H
J
K
L
N
Q
S
1.702 BSC  
4.216 BSC  
5
0.025 0.381  
1.100 22.860 27.940  
0.635  
5X J  
0.365 8.128  
9.271  
G
M
0.24 (0.610)  
T
H
N
8.128 BSC  
5X D  
0.153 3.556  
0.620  
0.505 11.888 12.827  
0.735 ––– 18.669  
0.110 2.286 2.794  
3.886  
––– 15.748  
M
M
0.10 (0.254)  
T P  
U
V
W
SEATING  
PLANE  
–T–  
B
–Q–  
SEATING  
PLANE  
T SUFFIX  
–T–  
CASE 314C–01  
Plastic Package  
ISSUE A  
C
E
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
A
K
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION D DOES NOT INCLUDE  
INTERCONNECT BAR (DAMBAR) PROTRUSION.  
DIMENSION D INCLUDING PROTRUSION SHALL  
NOT EXCEED 10.92 (0.043) MAXIMUM.  
1
2 3 4 5  
INCHES  
DIM MIN MAX  
0.625 15.59  
MILLIMETERS  
L
MIN  
MAX  
15.88  
10.67  
4.83  
1
A
B
C
D
E
G
J
0.610  
0.380  
0.160  
0.020  
0.035  
5
0.420  
0.190  
0.040  
0.055  
9.65  
4.06  
0.51  
0.89  
1.02  
1.40  
0.067 BSC  
1.702 BSC  
0.015  
0.500  
0.355  
0.139  
0.025  
––– 12.70  
0.370  
0.147  
0.38  
0.64  
–––  
9.40  
3.73  
K
L
Q
9.02  
3.53  
G
D 5 PL  
M
M
0.356 (0.014)  
T Q  
J
13–3  
MOTOROLA ANALOG IC DEVICE DATA  
T, T1 SUFFIX  
CASE 314D-03  
Plastic Package  
ISSUE D  
SEATING  
PLANE  
–T–  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
C
–Q–  
B
Y14.5M, 1982.  
E
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION D DOES NOT INCLUDE  
INTERCONNECT BAR (DAMBAR) PROTRUSION.  
DIMENSION D INCLUDING PROTRUSION SHALL  
NOT EXCEED 10.92 (0.043) MAXIMUM.  
U
A
S
INCHES  
DIM MIN MAX  
MILLIMETERS  
MIN MAX  
L
A
B
C
D
E
G
H
J
0.572  
0.390  
0.170  
0.025  
0.048  
0.613 14.529 15.570  
0.415 9.906 10.541  
0.180 4.318  
0.038 0.635  
0.055 1.219  
1
2
3
4 5  
K
4.572  
0.965  
1.397  
0.067 BSC  
1.702 BSC  
0.087  
0.015  
1.020  
0.320  
0.140  
0.105  
0.543  
0.112 2.210  
0.025 0.381  
2.845  
0.635  
1
2
3
4
K
L
Q
U
S
1.065 25.908 27.051  
5
0.365 8.128  
0.153 3.556  
0.117 2.667  
9.271  
3.886  
2.972  
J
G
H
0.582 13.792 14.783  
D 5 PL  
M
M
0.356 (0.014)  
T Q  
DT-1 SUFFIX  
CASE 369-07  
Plastic Package  
(DPAK)  
C
B
R
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
V
ISSUE K  
E
INCHES  
DIM MIN MAX  
MILLIMETERS  
4
MIN  
5.97  
6.35  
2.19  
0.69  
0.84  
0.94  
MAX  
6.35  
6.73  
2.38  
0.88  
1.01  
1.19  
4
A
B
C
D
E
F
G
H
J
0.235 0.250  
0.250 0.265  
0.086 0.094  
0.027 0.035  
0.033 0.040  
0.037 0.047  
0.090 BSC  
0.034 0.040  
0.018 0.023  
0.350 0.380  
0.175 0.215  
0.050 0.090  
0.030 0.050  
A
1
2
3
S
–T–  
SEATING  
PLANE  
2.29 BSC  
1
2
3
K
0.87  
0.46  
8.89  
4.45  
1.27  
0.77  
1.01  
0.58  
9.65  
5.46  
2.28  
1.27  
K
R
S
J
F
V
H
D 3 PL  
G
M
0.13 (0.005)  
T
DT SUFFIX  
CASE 369A-13  
Plastic Package  
(DPAK)  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
SEATING  
PLANE  
–T–  
C
B
ISSUE Y  
INCHES  
DIM MIN MAX  
MILLIMETERS  
E
V
R
MIN  
5.97  
6.35  
2.19  
0.69  
0.84  
0.94  
MAX  
6.35  
6.73  
2.38  
0.88  
1.01  
1.19  
A
B
C
D
E
F
G
H
J
K
L
R
S
U
V
Z
0.235 0.250  
0.250 0.265  
0.086 0.094  
0.027 0.035  
0.033 0.040  
0.037 0.047  
0.180 BSC  
4
4
Z
1
A
K
S
1
2
3
3
4.58 BSC  
U
0.034 0.040  
0.018 0.023  
0.87  
0.46  
2.60  
1.01  
0.58  
2.89  
0.102  
0.114  
0.090 BSC  
0.175 0.215  
0.020 0.050  
2.29 BSC  
F
J
4.45  
0.51  
0.51  
0.77  
3.51  
5.46  
1.27  
–––  
1.27  
–––  
L
H
0.020  
0.030 0.050  
0.138 –––  
–––  
D 2 PL  
M
G
0.13 (0.005)  
T
13–4  
MOTOROLA ANALOG IC DEVICE DATA  
DP1, N, P, P1 SUFFIX  
CASE 626-05  
Plastic Package  
ISSUE K  
8
5
NOTES:  
1. DIMENSION L TO CENTER OF LEAD WHEN  
FORMED PARALLEL.  
2. PACKAGE CONTOUR OPTIONAL (ROUND OR  
SQUARE CORNERS).  
–B–  
1
4
3. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
MILLIMETERS  
DIM MIN MAX  
9.40 10.16 0.370 0.400  
INCHES  
MIN MAX  
F
A
B
C
D
F
–A–  
NOTE 2  
6.10  
3.94  
0.38  
1.02  
6.60 0.240 0.260  
4.45 0.155 0.175  
0.51 0.015 0.020  
1.78 0.040 0.070  
L
G
H
J
K
L
2.54 BSC  
0.100 BSC  
1.27 0.030 0.050  
0.30 0.008 0.012  
8
C
0.76  
0.20  
2.92  
1
J
3.43  
0.115  
0.135  
–T–  
SEATING  
PLANE  
7.62 BSC  
0.300 BSC  
N
M
N
–––  
10  
–––  
10  
0.76  
1.01 0.030 0.040  
M
D
K
G
H
M
M
M
0.13 (0.005)  
T A  
B
N, P, N-14, P2 SUFFIX  
CASE 646-06  
Plastic Package  
ISSUE L  
NOTES:  
1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE  
POSITION AT SEATING PLANE AT MAXIMUM  
MATERIAL CONDITION.  
2. DIMENSION L TO CENTER OF LEADS WHEN  
FORMED PARALLEL.  
3. DIMENSION B DOES NOT INCLUDE MOLD  
FLASH.  
4. ROUNDED CORNERS OPTIONAL.  
14  
1
8
B
7
INCHES  
DIM MIN MAX  
0.770 18.16  
MILLIMETERS  
A
F
MIN  
MAX  
19.56  
6.60  
4.69  
0.53  
1.78  
A
B
C
D
F
0.715  
0.240  
0.145  
0.015  
0.040  
0.260  
0.185  
0.021  
0.070  
6.10  
3.69  
0.38  
1.02  
L
14  
1
C
G
H
J
K
L
0.100 BSC  
2.54 BSC  
0.052  
0.008  
0.115  
0.095  
0.015  
0.135  
1.32  
0.20  
2.92  
2.41  
0.38  
3.43  
J
N
0.300 BSC  
7.62 BSC  
SEATING  
PLANE  
K
M
N
0
10  
0.039  
0
0.39  
10  
1.01  
0.015  
H
G
D
M
DP2, N, P, PC SUFFIX  
CASE 648-08  
Plastic Package  
ISSUE R  
NOTES:  
–A–  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION L TO CENTER OF LEADS WHEN  
FORMED PARALLEL.  
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.  
5. ROUNDED CORNERS OPTIONAL.  
16  
1
9
8
B
S
INCHES  
DIM MIN MAX  
0.770 18.80  
MILLIMETERS  
MIN  
MAX  
19.55  
6.85  
4.44  
0.53  
1.77  
F
A
B
C
D
F
0.740  
0.250  
0.145  
0.015  
0.040  
C
L
0.270  
0.175  
0.021  
0.70  
6.35  
3.69  
0.39  
1.02  
16  
1
SEATING  
PLANE  
–T–  
G
H
J
K
L
M
S
0.100 BSC  
0.050 BSC  
2.54 BSC  
1.27 BSC  
K
M
0.008  
0.015  
0.130  
0.305  
10  
0.21  
0.38  
3.30  
7.74  
10  
H
J
0.110  
0.295  
0
2.80  
7.50  
0
G
D 16 PL  
0.020  
0.040  
0.51  
1.01  
M
M
0.25 (0.010)  
T A  
13–5  
MOTOROLA ANALOG IC DEVICE DATA  
B, P, P2, V SUFFIX  
CASE 648C-03  
Plastic Package  
(DIP–16)  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION L TO CENTER OF LEADS WHEN  
FORMED PARALLEL.  
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.  
5. INTERNAL LEAD CONNECTION BETWEEN 4 AND  
5, 12 AND 13.  
–A–  
ISSUE C  
16  
1
9
8
–B–  
INCHES  
DIM MIN MAX  
0.840 18.80  
MILLIMETERS  
L
MIN  
MAX  
21.34  
6.60  
4.69  
0.53  
A
B
C
D
E
F
0.740  
0.240  
0.145  
0.015  
0.050 BSC  
0.040  
0.100 BSC  
0.008  
0.115  
0.300 BSC  
0
0.260  
0.185  
0.021  
6.10  
3.69  
0.38  
NOTE 5  
16  
1
1.27 BSC  
C
0.70  
1.02  
1.78  
G
J
K
L
M
N
2.54 BSC  
0.015  
0.135  
0.20  
2.92  
0.38  
3.43  
–T–  
SEATING  
PLANE  
M
N
7.62 BSC  
K
10  
0.040  
0
10  
E
0.015  
0.39  
1.01  
J 16 PL  
F
G
D 16 PL  
M
S
0.13 (0.005)  
T B  
M
S
0.13 (0.005)  
T A  
–A–  
P SUFFIX  
NOTES:  
CASE 648E–01  
Plastic Package  
(DIP–16)  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION L TO CENTER OF LEADS WHEN  
FORMED PARALLEL.  
4. DIMENSION A AND B DOES NOT INCLUDE MOLD  
PROTRUSION.  
5. MOLD FLASH OR PROTRUSIONS SHALL NOT  
EXCEED 0.25 (0.010).  
R
16  
1
9
8
ISSUE O  
–B–  
6. ROUNDED CORNER OPTIONAL.  
M
P
L
INCHES  
DIM MIN MAX  
0.760 18.80  
MILLIMETERS  
F
MIN  
MAX  
19.30  
6.60  
4.44  
0.53  
1.77  
A
B
C
D
F
0.740  
0.245  
0.145  
0.015  
0.050  
0.260  
0.175  
0.021  
0.070  
6.23  
3.69  
0.39  
1.27  
16  
J
1
C
G
H
J
K
L
M
P
0.100 BSC  
0.050 BSC  
2.54 BSC  
1.27 BSC  
0.21  
3.05  
7.50  
0
5.08 BSC  
7.62 BSC  
0.39 0.88  
–T–  
SEATING  
PLANE  
0.008  
0.015  
0.140  
0.305  
10  
0.38  
3.55  
7.74  
10  
S
0.120  
0.295  
0
K
H
G
0.200 BSC  
0.300 BSC  
0.015 0.035  
R
S
D 13 PL  
M
S
S
0.25 (0.010)  
T B  
A
P SUFFIX  
CASE 649-03  
Plastic Package  
ISSUE D  
P
A
NOTES:  
1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE  
POSITION AT SEATING PLANE AT MAXIMUM  
MATERIAL CONDITION.  
13  
24  
2. DIMENSION L TO CENTER OF LEADS WHEN  
FORMED PARALLEL.  
L
Q
B
MILLIMETERS  
DIM MIN MAX  
INCHES  
MIN  
MAX  
1.265  
0.540  
0.205  
0.020  
0.060  
1
A
B
C
D
F
31.50  
13.21  
4.70  
0.38  
1.02  
32.13 1.240  
13.72 0.520  
5.21 0.185  
0.51 0.015  
1.52 0.040  
12  
M
J
H
F
C
G
H
J
K
L
M
N
P
2.54 BSC  
0.100 BSC  
1.65  
0.20  
2.92  
14.99  
–––  
2.16 0.065  
0.30 0.008  
3.43  
15.49 0.590  
10 –––  
0.085  
0.012  
0.135  
0.610  
10  
24  
N
0.115  
1
K
0.51  
0.13  
0.51  
1.02 0.020  
0.38 0.005  
0.76 0.020  
0.040  
0.015  
0.030  
D
G
SEATING  
PLANE  
Q
13–6  
MOTOROLA ANALOG IC DEVICE DATA  
A, B, N, P SUFFIX  
CASE 707-02  
Plastic Package  
ISSUE C  
NOTES:  
1. POSITIONAL TOLERANCE OF LEADS (D),  
SHALL BE WITHIN 0.25 (0.010) AT MAXIMUM  
MATERIAL CONDITION, IN RELATION TO  
SEATING PLANE AND EACH OTHER.  
2. DIMENSION L TO CENTER OF LEADS WHEN  
FORMED PARALLEL.  
18  
10  
9
B
1
3. DIMENSION B DOES NOT INCLUDE MOLD  
FLASH.  
A
MILLIMETERS  
DIM MIN MAX  
INCHES  
MIN  
MAX  
0.915  
0.260  
0.180  
0.022  
0.070  
L
A
B
C
D
F
22.22  
6.10  
3.56  
0.36  
1.27  
23.24 0.875  
6.60 0.240  
4.57 0.140  
0.56 0.014  
1.78 0.050  
C
18  
1
G
H
J
K
L
2.54 BSC  
0.100 BSC  
K
N
1.02  
0.20  
2.92  
1.52 0.040  
0.30 0.008  
3.43  
0.060  
0.012  
0.135  
J
M
F
D
SEATING  
PLANE  
0.115  
H
G
7.62 BSC  
0.300 BSC  
M
N
0
0.51  
15  
0
15  
0.040  
1.02 0.020  
P SUFFIX  
CASE 710-02  
Plastic Package  
ISSUE B  
NOTES:  
1. POSITIONAL TOLERANCE OF LEADS (D), SHALL  
BE WITHIN 0.25 (0.010) AT MAXIMUM MATERIAL  
CONDITION, IN RELATION TO SEATING PLANE  
AND EACH OTHER.  
28  
2. DIMENSION L TO CENTER OF LEADS WHEN  
FORMED PARALLEL.  
3. DIMENSION B DOES NOT INCLUDE MOLD FLASH.  
1
MILLIMETERS  
DIM MIN MAX  
INCHES  
MIN MAX  
28  
1
15  
A
B
C
D
F
36.45 37.21 1.435 1.465  
13.72 14.22 0.540 0.560  
B
3.94  
0.36  
1.02  
5.08 0.155 0.200  
0.56 0.014 0.022  
1.52 0.040 0.060  
14  
G
H
J
K
L
2.54 BSC  
0.100 BSC  
2.16 0.065 0.085  
0.38 0.008 0.015  
1.65  
0.20  
2.92  
L
C
A
3.43  
0.115  
0.135  
15.24 BSC  
0.600 BSC  
N
M
N
0
0.51  
15  
0
15  
1.02 0.020 0.040  
J
M
G
H
F
K
SEATING  
PLANE  
D
P SUFFIX  
CASE 711-03  
Plastic Package  
ISSUE C  
NOTES:  
1. POSITIONAL TOLERANCE OF LEADS (D), SHALL  
BE WITHIN 0.25 (0.010) AT MAXIMUM MATERIAL  
CONDITION, IN RELATION TO SEATING PLANE  
AND EACH OTHER.  
40  
1
2. DIMENSION L TO CENTER OF LEADS WHEN  
FORMED PARALLEL.  
3. DIMENSION B DOES NOT INCLUDE MOLD FLASH.  
40  
21  
20  
MILLIMETERS  
DIM MIN MAX  
INCHES  
MIN MAX  
B
A
B
C
D
F
51.69 52.45 2.035 2.065  
13.72 14.22 0.540 0.560  
3.94  
0.36  
1.02  
5.08 0.155 0.200  
0.56 0.014 0.022  
1.52 0.040 0.060  
1
G
H
J
K
L
2.54 BSC  
0.100 BSC  
2.16 0.065 0.085  
0.38 0.008 0.015  
L
A
1.65  
0.20  
2.92  
C
3.43  
0.115  
0.135  
N
15.24 BSC  
0.600 BSC  
M
N
0
0.51  
15  
0
15  
J
1.02 0.020 0.040  
K
SEATING  
PLANE  
M
H
G
F
D
13–7  
MOTOROLA ANALOG IC DEVICE DATA  
F, P, P-3 SUFFIX  
CASE 724-03  
Plastic Package  
(NDIP–24)  
NOTES:  
1. CHAMFERED CONTOUR OPTIONAL.  
2. DIMENSION L TO CENTER OF LEADS WHEN  
FORMED PARALLEL.  
3. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
24  
ISSUE D  
1
4. CONTROLLING DIMENSION: INCH.  
–A–  
INCHES  
DIM MIN MAX  
1.265 31.25  
MILLIMETERS  
MIN  
MAX  
32.13  
6.85  
4.44  
0.51  
24  
1
13  
12  
A
B
C
D
E
F
1.230  
0.250  
0.145  
0.015  
0.050 BSC  
0.040  
–B–  
0.270  
0.175  
0.020  
6.35  
3.69  
0.38  
1.27 BSC  
1.02  
L
C
0.060  
1.52  
G
J
K
L
M
N
0.100 BSC  
2.54 BSC  
0.007  
0.110  
0.012  
0.140  
0.18  
2.80  
0.30  
3.55  
NOTE 1  
–T–  
SEATING  
PLANE  
K
0.300 BSC  
7.62 BSC  
N
M
0
15  
0
15  
E
0.020  
0.040  
0.51  
1.01  
G
J 24 PL  
F
M
M
0.25 (0.010)  
T B  
D 24 PL  
M
M
0.25 (0.010)  
T A  
H, P, DP SUFFIX  
CASE 738-03  
Plastic Package  
ISSUE E  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION L TO CENTER OF LEAD WHEN  
FORMED PARALLEL.  
–A–  
4. DIMENSION B DOES NOT INCLUDE MOLD  
FLASH.  
20  
1
11  
B
INCHES  
DIM MIN MAX  
1.010 1.070 25.66  
MILLIMETERS  
10  
MIN  
MAX  
27.17  
6.60  
A
B
C
D
E
F
0.240 0.260  
0.150 0.180  
0.015 0.022  
0.050 BSC  
6.10  
3.81  
0.39  
L
4.57  
0.55  
C
1.27 BSC  
0.050 0.070  
0.100 BSC  
1.27  
1.77  
20  
G
2.54 BSC  
1
J
0.008 0.015  
0.21  
2.80  
7.62 BSC  
0
0.51  
0.38  
3.55  
K
L
M
N
0.110  
0.140  
–T–  
SEATING  
PLANE  
K
M
0.300 BSC  
0
15  
15  
1.01  
0.020 0.040  
N
E
J 20 PL  
G
F
M
M
0.25 (0.010)  
T B  
D 20 PL  
M
M
0.25 (0.010)  
T A  
D, D1, D2 SUFFIX  
CASE 751-05  
Plastic Package  
(SO-8, SOP-8)  
ISSUE R  
NOTES:  
D
A
E
1. DIMENSIONING AND TOLERANCING PER ASME  
Y14.5M, 1994.  
2. DIMENSIONS ARE IN MILLIMETERS.  
3. DIMENSION D AND E DO NOT INCLUDE MOLD  
PROTRUSION.  
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.  
5. DIMENSION B DOES NOT INCLUDE MOLD  
PROTRUSION. ALLOWABLE DAMBAR  
PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS  
OF THE B DIMENSION AT MAXIMUM MATERIAL  
CONDITION.  
C
8
1
5
4
M
M
0.25  
B
H
MILLIMETERS  
8
h X 45  
B
C
DIM MIN  
MAX  
1.75  
0.25  
0.49  
0.25  
5.00  
4.00  
e
1
A
A1  
B
C
D
E
1.35  
0.10  
0.35  
0.18  
4.80  
3.80  
A
SEATING  
PLANE  
e
H
h
1.27 BSC  
0.10  
L
5.80  
0.25  
0.40  
0
6.20  
0.50  
1.25  
7
A1  
B
L
M
S
S
0.25  
C B  
A
13–8  
MOTOROLA ANALOG IC DEVICE DATA  
D SUFFIX  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
CASE 751A-03  
Plastic Package  
(SO-14)  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSIONS A AND B DO NOT INCLUDE  
MOLD PROTRUSION.  
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)  
PER SIDE.  
5. DIMENSION D DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE DAMBAR  
PROTRUSION SHALL BE 0.127 (0.005) TOTAL  
IN EXCESS OF THE D DIMENSION AT  
MAXIMUM MATERIAL CONDITION.  
–A–  
ISSUE F  
14  
1
8
7
–B–  
P 7 PL  
M
M
0.25 (0.010)  
B
MILLIMETERS  
DIM MIN MAX  
INCHES  
14  
1
MIN  
MAX  
0.344  
0.157  
0.068  
0.019  
0.049  
F
A
B
C
D
F
8.55  
3.80  
1.35  
0.35  
0.40  
8.75 0.337  
4.00 0.150  
1.75 0.054  
0.49 0.014  
1.25 0.016  
R X 45  
G
C
G
J
K
M
P
1.27 BSC  
0.050 BSC  
–T–  
SEATING  
PLANE  
J
M
0.19  
0.10  
0
0.25 0.008  
0.25 0.004  
0.009  
0.009  
7
K
D 14 PL  
7
0
M
S
S
0.25 (0.010)  
T B  
A
5.80  
0.25  
6.20 0.228  
0.50 0.010  
0.244  
0.019  
R
–A–  
D SUFFIX  
NOTES:  
CASE 751B-05  
Plastic Package  
(SO-16)  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSIONS A AND B DO NOT INCLUDE  
MOLD PROTRUSION.  
16  
9
ISSUE J  
–B–  
P 8 PL  
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)  
PER SIDE.  
M
S
0.25 (0.010)  
B
1
8
5. DIMENSION D DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE DAMBAR  
PROTRUSION SHALL BE 0.127 (0.005) TOTAL  
IN EXCESS OF THE D DIMENSION AT  
MAXIMUM MATERIAL CONDITION.  
G
MILLIMETERS  
DIM MIN MAX  
9.80 10.00 0.386 0.393  
INCHES  
MIN MAX  
16  
1
A
B
C
D
F
F
K
3.80  
1.35  
0.35  
0.40  
4.00 0.150 0.157  
1.75 0.054 0.068  
0.49 0.014 0.019  
1.25 0.016 0.049  
R X 45  
C
G
J
K
M
P
1.27 BSC  
0.050 BSC  
0.25 0.008 0.009  
0.25 0.004 0.009  
–T–  
SEATING  
PLANE  
0.19  
0.10  
0
J
M
D
16 PL  
7
0
7
5.80  
0.25  
6.20 0.229 0.244  
0.50 0.010 0.019  
M
S
S
0.25 (0.010)  
T B  
A
R
DW, FP SUFFIX  
–A–  
NOTES:  
CASE 751D-04  
Plastic Package  
(SO-20L, SO–20)  
ISSUE E  
1. DIMENSIONING AND TOLERANCING PER  
ANSI Y14.5M, 1982.  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSIONS A AND B DO NOT INCLUDE  
MOLD PROTRUSION.  
20  
11  
4. MAXIMUM MOLD PROTRUSION 0.150  
(0.006) PER SIDE.  
10X P  
–B–  
5. DIMENSION D DOES NOT INCLUDE  
DAMBAR PROTRUSION. ALLOWABLE  
DAMBAR PROTRUSION SHALL BE 0.13  
(0.005) TOTAL IN EXCESS OF D DIMENSION  
AT MAXIMUM MATERIAL CONDITION.  
M
M
0.010 (0.25)  
B
1
10  
J
F
20X D  
MILLIMETERS  
DIM MIN MAX  
12.65 12.95 0.499 0.510  
INCHES  
MIN MAX  
M
S
S
0.010 (0.25) T A  
B
A
B
C
D
F
20  
7.40  
2.35  
0.35  
0.50  
7.60 0.292 0.299  
2.65 0.093 0.104  
0.49 0.014 0.019  
0.90 0.020 0.035  
1
R X 45  
G
J
K
M
P
1.27 BSC  
0.050 BSC  
0.32 0.010 0.012  
0.25 0.004 0.009  
C
0.25  
0.10  
0
SEATING  
PLANE  
7
0
7
–T–  
10.05 10.55 0.395 0.415  
18X G  
R
0.25  
0.75 0.010 0.029  
K
M
13–9  
MOTOROLA ANALOG IC DEVICE DATA  
DW SUFFIX  
CASE 751E-04  
Plastic Package  
(SO-24L,  
SOP (16+4+4)L)  
ISSUE E  
–A–  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
24  
13  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSIONS A AND B DO NOT INCLUDE  
MOLD PROTRUSION.  
–B– 12X P  
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)  
PER SIDE.  
M
M
0.010 (0.25)  
B
5. DIMENSION D DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE DAMBAR  
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN  
EXCESS OF D DIMENSION AT MAXIMUM  
MATERIAL CONDITION.  
1
12  
24X D  
24  
J
MILLIMETERS  
DIM MIN MAX  
INCHES  
M
S
S
0.010 (0.25)  
T A  
B
1
MIN  
MAX  
0.612  
0.299  
0.104  
0.019  
0.035  
A
B
C
D
F
15.25  
7.40  
2.35  
0.35  
0.41  
15.54 0.601  
7.60 0.292  
2.65 0.093  
0.49 0.014  
0.90 0.016  
F
R X 45  
G
J
K
M
P
1.27 BSC  
0.050 BSC  
0.23  
0.13  
0
0.32 0.009  
0.29 0.005  
0.013  
0.011  
8
C
K
–T–  
SEATING  
8
0
M
10.05  
0.25  
10.55 0.395  
0.75 0.010  
0.415  
0.029  
PLANE  
R
22X G  
DW SUFFIX  
CASE 751F-04  
NOTES:  
Plastic Package  
(SO-28L, SOIC–28)  
ISSUE E  
28  
1. DIMENSIONING AND TOLERANCING PER  
ANSI Y14.5M, 1982.  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSION A AND B DO NOT INCLUDE  
MOLD PROTRUSION.  
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)  
PER SIDE.  
5. DIMENSION D DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE  
1
–A–  
15  
28  
14X P  
DAMBAR PROTRUSION SHALL BE 0.13  
(0.005) TOTAL IN EXCESS OF D DIMENSION  
AT MAXIMUM MATERIAL CONDITION.  
M
M
0.010 (0.25)  
B
–B–  
1
MILLIMETERS  
DIM MIN MAX  
INCHES  
14  
MIN  
MAX  
0.711  
0.299  
0.104  
0.019  
0.035  
M
A
B
C
D
F
17.80  
7.40  
2.35  
0.35  
0.41  
18.05 0.701  
7.60 0.292  
2.65 0.093  
0.49 0.014  
0.90 0.016  
28X D  
R
X 45  
M
S
S
0.010 (0.25)  
T A  
B
G
J
K
M
P
1.27 BSC  
0.050 BSC  
0.23  
0.13  
0
0.32 0.009  
0.29 0.005  
0.013  
0.011  
8
C
8
0
–T–  
SEATING  
PLANE  
10.01  
0.25  
10.55 0.395  
0.75 0.010  
0.415  
0.029  
26X G  
F
R
K
J
DW SUFFIX  
CASE 751G-02  
Plastic Package  
(SO-16L, SOP–16L,  
SOP-8+8L)  
ISSUE A  
–A–  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD  
PROTRUSION.  
16  
9
–B–  
8X P  
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER  
SIDE.  
M
M
0.010 (0.25)  
B
5. DIMENSION D DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE DAMBAR  
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN  
EXCESS OF D DIMENSION AT MAXIMUM  
MATERIAL CONDITION.  
1
8
J
16X D  
16  
MILLIMETERS  
DIM MIN MAX  
10.15 10.45 0.400  
INCHES  
M
S
S
0.010 (0.25)  
T A  
B
MIN  
MAX  
1
A
B
C
D
F
0.411  
F
7.40  
2.35  
0.35  
0.50  
7.60 0.292 0.299  
2.65 0.093 0.104  
0.49 0.014 0.019  
0.90 0.020 0.035  
R X 45  
G
J
K
M
P
1.27 BSC  
0.050 BSC  
0.32 0.010 0.012  
0.25 0.004 0.009  
0.25  
0.10  
0
C
7
0
7
–T–  
M
10.05 10.55 0.395 0.415  
0.25 0.75 0.010 0.029  
SEATING  
14X G  
K
PLANE  
R
13–10  
MOTOROLA ANALOG IC DEVICE DATA  
D SUFFIX  
16  
CASE 751K–01  
Plastic Package  
(SO–16)  
NOTES:  
1
1
DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2
3
CONTROLLING DIMENSION: MILLIMETER.  
DIMENSIONS A AND B DO NOT INCLUDE MOLD  
PROTRUSION.  
–A–  
ISSUE O  
4
5
MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER  
SIDE.  
16  
9
DIMENSION D DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE DAMBAR  
PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN  
EXCESS OF THE D DIMENSION AT MAXIMUM  
MATERIAL CONDITION.  
M
–B–  
P
MILLIMETERS  
DIM MIN MAX  
INCHES  
F
MIN  
MAX  
0.393  
0.157  
0.068  
0.019  
0.049  
A
B
C
D
F
9.80  
3.80  
1.35  
0.35  
0.40  
10.00 0.368  
4.00 0.150  
1.75 0.054  
0.49 0.014  
1.25 0.016  
1
8
G
R X 45  
G
J
K
M
P
1.27 BSC  
0.050 BSC  
0.19  
0.10  
0
0.25 0.008  
0.25 0.004  
7
0.009  
0.009  
7
C
SEATING  
PLANE  
–T–  
0
5.80  
0.25  
6.20 0.229  
0.50 0.010  
0.244  
0.019  
14 X D  
J
K
R
M
S
S
0.25 (0.010)  
T A  
B
–A–  
DW SUFFIX  
CASE 751N–01  
Plastic Package  
(SOP–16L)  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD  
PROTRUSION.  
T
16  
9
ISSUE O  
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER  
SIDE.  
M
M
–B–  
P
0.010 (0.25)  
B
5. DIMENSION D DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE DAMBAR  
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN  
EXCESS OF D DIMENSION AT MAXIMUM  
MATERIAL CONDITION.  
1
8
16  
J
F
MILLIMETERS  
DIM MIN MAX  
10.15 10.45 0.400  
INCHES  
13X D  
1
MIN  
MAX  
A
B
C
D
F
0.411  
M
S
S
0.010 (0.25)  
T A  
B
7.40  
2.35  
0.35  
0.50  
7.60 0.292 0.299  
2.65 0.093 0.104  
0.49 0.014 0.019  
0.90 0.020 0.035  
G
J
K
M
P
R
S
T
1.27 BSC  
0.050 BSC  
0.32 0.010 0.012  
0.25 0.004 0.009  
R X 45  
0.25  
0.10  
0
7
0
7
C
10.05 10.55 0.395 0.415  
0.25 0.75 0.010 0.029  
2.54 BSC  
3.81 BSC  
–T–  
SEATING  
PLANE  
M
S
0.100 BSC  
0.150 BSC  
K
9X G  
13–11  
MOTOROLA ANALOG IC DEVICE DATA  
CASE 762-01  
Plastic Medium Power Package  
(SIP-9)  
ISSUE C  
9
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5, 1982.  
2. CONTROLLING DIMENSION: MILLIMETER.  
Q
1
M
M
0.25 (0.010)  
T A  
–A–  
MILLIMETERS  
DIM MIN MAX  
22.40 23.00 0.873 0.897  
INCHES  
MIN MAX  
–C–  
U
V
A
B
C
D
E
M
X
6.40  
3.45  
0.40  
9.35  
1.40  
6.60 0.252 0.260  
3.65 0.135 1.143  
0.55 0.015 0.021  
9.60 0.368 0.377  
1.60 0.055 0.062  
S
W
E
F
Y
G
H
J
2.54 BSC  
0.100 BSC  
1.51  
1.71 0.059 0.067  
0.360 0.400 0.014 0.015  
R
B
N
K
M
N
Q
R
S
U
V
W
X
Y
3.95  
30 BSC  
2.50  
3.15  
13.60 13.90 0.535 0.547  
1.65 1.95 0.064 0.076  
22.00 22.20 0.866 0.874  
0.55  
2.89 BSC  
4.20 0.155 0.165  
30 BSC  
2.70 0.099 0.106  
3.45 0.124 0.135  
9
1
SEATING  
PLANE  
–T–  
K
M
M
0.25 (0.010)  
T C  
J
H
G
F
0.75 0.021 0.029  
0.113 BSC  
0.75 0.025 0.029  
D 9 PL  
0.65  
2.70  
M
M
0.25 (0.010)  
T A  
2.80 0.106  
0.110  
FN SUFFIX  
CASE 775-02  
Plastic Package  
(PLCC-20)  
NOTES:  
1. DATUMS –L–, –M–, AND –N– DETERMINED  
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC  
BODY AT MOLD PARTING LINE.  
2. DIMENSION G1, TRUE POSITION TO BE  
MEASURED AT DATUM –T–, SEATING PLANE.  
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD  
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)  
PER SIDE.  
1
ISSUE C  
M
S
S
0.007 (0.180) T L–M  
N
B
4. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
5. CONTROLLING DIMENSION: INCH.  
M
S
S
N
0.007 (0.180) T L–M  
Y BRK  
–N–  
U
6. THE PACKAGE TOP MAY BE SMALLER THAN THE  
PACKAGE BOTTOM BY UP TO 0.012 (0.300).  
DIMENSIONS R AND U ARE DETERMINED AT THE  
OUTERMOST EXTREMES OF THE PLASTIC BODY  
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,  
GATE BURRS AND INTERLEAD FLASH, BUT  
INCLUDING ANY MISMATCH BETWEEN THE TOP  
AND BOTTOM OF THE PLASTIC BODY.  
7. DIMENSION H DOES NOT INCLUDE DAMBAR  
PROTRUSION OR INTRUSION. THE DAMBAR  
PROTRUSION(S) SHALL NOT CAUSE THE H  
DIMENSION TO BE GREATER THAN 0.037 (0.940).  
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE  
THE H DIMENSION TO BE SMALLER THAN 0.025  
(0.635).  
D
–L–  
Z
–M–  
W
D
20  
1
S
S
S
0.010 (0.250) T L–M  
N
G1  
X
V
VIEW D–D  
INCHES  
DIM MIN MAX  
MILLIMETERS  
MIN  
9.78  
9.78  
4.20  
2.29  
0.33  
MAX  
10.03  
10.03  
4.57  
2.79  
0.48  
M
S
S
S
A
R
0.007 (0.180) T L–M  
N
A
B
C
E
0.385  
0.385  
0.165  
0.090  
0.013  
0.395  
0.395  
0.180  
0.110  
0.019  
Z
M
S
0.007 (0.180) T L–M  
N
F
M
S
S
H
0.007 (0.180) T L–M  
N
G
H
J
0.050 BSC  
1.27 BSC  
C
0.026  
0.020  
0.025  
0.350  
0.350  
0.042  
0.042  
0.042  
–––  
0.032  
–––  
–––  
0.356  
0.356  
0.048  
0.048  
0.056  
0.020  
10  
0.66  
0.51  
0.64  
8.89  
8.89  
1.07  
1.07  
1.07  
–––  
2
0.81  
–––  
–––  
9.04  
9.04  
1.21  
1.21  
1.42  
0.50  
10  
E
0.004 (0.100)  
K1  
K
K
R
U
V
W
X
Y
Z
G
–T– SEATING  
J
PLANE  
VIEW S  
M
S
S
0.007 (0.180) T L–M  
N
G1  
F
S
S
S
0.010 (0.250) T L–M  
N
VIEW S  
2
G1 0.310  
K1 0.040  
0.330  
–––  
7.88  
1.02  
8.38  
–––  
13–12  
MOTOROLA ANALOG IC DEVICE DATA  
FN SUFFIX  
CASE 776-02  
Plastic Package  
(PLCC–28)  
ISSUE D  
1
M
S
S
0.007 (0.180)  
T L–M  
N
B
Z
Y BRK  
D
–N–  
M
S
S
0.007 (0.180)  
T L–M  
N
U
–M–  
–L–  
W
D
S
S
S
0.010 (0.250)  
T L–M  
N
X
G1  
V
28  
1
VIEW D–D  
M
S
S
S
A
0.007 (0.180)  
0.007 (0.180)  
T L–M  
N
M
S
S
H
0.007 (0.180)  
T L–M  
N
Z
M
S
T L–M  
N
R
K1  
C
E
0.004 (0.100)  
SEATING  
PLANE  
G
K
–T–  
VIEW S  
J
M
S
S
0.007 (0.180)  
T L–M  
N
F
G1  
S
S
S
0.010 (0.250)  
T L–M  
N
VIEW S  
NOTES:  
INCHES  
DIM MIN MAX  
MILLIMETERS  
1. DATUMS –L–, –M–, AND –N– DETERMINED  
WHERE TOP OF LEAD SHOULDER EXITS  
PLASTIC BODY AT MOLD PARTING LINE.  
2. DIMENSION G1, TRUE POSITION TO BE  
MEASURED AT DATUM –T–, SEATING PLANE.  
3. DIMENSIONS R AND U DO NOT INCLUDE  
MOLD FLASH. ALLOWABLE MOLD FLASH IS  
0.010 (0.250) PER SIDE.  
MIN  
MAX  
12.57  
12.57  
4.57  
2.79  
0.48  
A
B
C
E
0.485  
0.485  
0.165  
0.090  
0.013  
0.495 12.32  
0.495 12.32  
0.180  
0.110  
0.019  
4.20  
2.29  
0.33  
F
G
H
J
0.050 BSC  
1.27 BSC  
4. DIMENSIONING AND TOLERANCING PER  
ANSI Y14.5M, 1982.  
0.026  
0.020  
0.025  
0.450  
0.450  
0.042  
0.042  
0.042  
–––  
0.032  
–––  
–––  
0.456  
0.456  
0.048  
0.048  
0.056  
0.020  
10  
0.66  
0.51  
0.64  
11.43  
11.43  
1.07  
1.07  
1.07  
–––  
0.81  
–––  
–––  
11.58  
11.58  
1.21  
1.21  
1.42  
0.50  
10  
5. CONTROLLING DIMENSION: INCH.  
6. THE PACKAGE TOP MAY BE SMALLER THAN  
THE PACKAGE BOTTOM BY UP TO 0.012  
(0.300). DIMENSIONS R AND U ARE  
DETERMINED AT THE OUTERMOST  
EXTREMES OF THE PLASTIC BODY  
EXCLUSIVE OF MOLD FLASH, TIE BAR  
BURRS, GATE BURRS AND INTERLEAD  
FLASH, BUT INCLUDING ANY MISMATCH  
BETWEEN THE TOP AND BOTTOM OF THE  
PLASTIC BODY.  
K
R
U
V
W
X
Y
Z
2
2
G1 0.410  
K1 0.040  
0.430 10.42  
––– 1.02  
10.92  
–––  
7. DIMENSION H DOES NOT INCLUDE DAMBAR  
PROTRUSION OR INTRUSION. THE DAMBAR  
PROTRUSION(S) SHALL NOT CAUSE THE H  
DIMENSION TO BE GREATER THAN 0.037  
(0.940). THE DAMBAR INTRUSION(S) SHALL  
NOT CAUSE THE H DIMENSION TO BE  
SMALLER THAN 0.025 (0.635).  
13–13  
MOTOROLA ANALOG IC DEVICE DATA  
FN SUFFIX  
CASE 777-02  
Plastic Package  
(PLCC)  
M
S
S
0.007(0.180)  
T
L–M  
N
B
M
S
S
0.007(0.180)  
T
L–M  
N
U
1
ISSUE C  
D
–N–  
Z
Y BRK  
–M–  
–L–  
X
G1  
S
S
S
0.010 (0.25)  
T
L–M  
N
VIEW D–D  
H
V
W
D
M
S
S
0.007(0.180)  
T
L–M  
N
44  
1
M
M
S
S
S
S
A
R
0.007(0.180)  
0.007(0.180)  
T
T
L–M  
L–M  
N
N
K1  
Z
K
J
C
F
E
M
S
S
0.007(0.180)  
VIEW S  
T
L–M  
N
0.004 (0.10)  
G
SEATING  
PLANE  
–T–  
INCHES  
DIM MIN MAX  
MILLIMETERS  
MIN MAX  
G1  
VIEW S  
A
B
C
E
0.685 0.695 17.40 17.65  
0.685 0.695 17.40 17.65  
S
S
S
0.010 (0.25)  
T
L–M  
N
0.165 0.180  
0.090 0.110  
0.013 0.019  
0.050 BSC  
4.20  
2.29  
0.33  
4.57  
2.79  
0.48  
NOTES:  
6. THE PACKAGE TOP MAY BE SMALLER THAN  
THE PACKAGE BOTTOM BY UP TO 0.012  
(0.300). DIMENSIONS R AND U ARE  
DETERMINED AT THE OUTERMOST  
EXTREMES OF THE PLASTIC BODY  
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,  
GATE BURRS AND INTERLEAD FLASH, BUT  
INCLUDING ANY MISMATCH BETWEEN THE  
TOP AND BOTTOM OF THE PLASTIC BODY.  
7. DIMENSION H DOES NOT INCLUDE DAMBAR  
PROTRUSION OR INTRUSION. THE DAMBAR  
PROTRUSION(S) SHALL NOT CAUSE THE H  
DIMENSION TO BE GREATER THAN 0.037  
(0.940). THE DAMBAR INTRUSION(S) SHALL  
NOT CAUSE THE H DIMENSION TO BE  
SMALLER THAN 0.025 (0.635).  
F
1. DATUMS –L–, –M–, AND –N– ARE DETERMINED  
WHERE TOP OF LEAD SHOULDER EXITS  
PLASTIC BODY AT MOLD PARTING LINE.  
2. DIMENSION G1, TRUE POSITION TO BE  
MEASURED AT DATUM –T–, SEATING PLANE.  
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD  
FLASH. ALLOWABLE MOLD FLASH IS 0.010  
(0.25) PER SIDE.  
G
H
J
1.27 BSC  
0.026 0.032  
0.66  
0.51  
0.64  
0.81  
–––  
–––  
0.020  
0.025  
–––  
–––  
K
R
U
V
W
X
Y
Z
0.650 0.656 16.51 16.66  
0.650 0.656 16.51 16.66  
0.042 0.048  
0.042 0.048  
0.042 0.056  
––– 0.020  
1.07  
1.07  
1.07  
–––  
2
1.21  
1.21  
1.42  
0.50  
10  
4. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
5. CONTROLLING DIMENSION: INCH.  
2
10  
G1 0.610 0.630 15.50 16.00  
K1 0.040 ––– 1.02 –––  
NOTES:  
M SUFFIX  
CASE 803C  
PRELIMINARY  
Plastic Package  
6
DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
–A–  
7
8
CONTROLLING DIMENSION: MILLIMETER.  
DIMENSIONS A AND B DO NOT INCLUDE MOLD  
PROTRUSION.  
–F–  
9
MAXIMUM MOLD PROTRUSION 0.15 (0.008) PER  
SIDE.  
20  
1
11  
10  
10 DIMENSION D DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE DAMBAR  
PROTRUSION SHALL BE 0.13 (0.006) TOTAL IN  
EXCESS OF THE D DIMENSION AT MAXIMUM  
MATERIAL CONDITION.  
K
–B–  
1
J
20  
G
MILLIMETERS  
DIM MIN MAX  
INCHES  
MIN  
MAX  
0.504  
0.215  
0.081  
0.020  
0.032  
S 10 PL  
A
B
C
D
E
F
12.35  
5.10  
1.95  
0.35  
–––  
12.80 0.486  
5.45 0.201  
2.05 0.077  
0.50 0.014  
M
M
0.13 (0.005)  
B
N
0.81  
12.40*  
–––  
0.488*  
G
H
J
K
L
M
N
S
1.15  
0.59  
0.18  
1.10  
0.05  
0
1.39 0.045  
0.81 0.023  
0.27 0.007  
1.50 0.043  
0.20 0.001  
0.055  
0.032  
0.011  
0.059  
0.008  
10  
C
0.10 (0.004)  
E
L
M
10  
0
D 20 PL  
–T–  
SEATING  
PLANE  
0.50  
7.40  
0.85 0.020  
8.20 0.291  
0.033  
0.323  
M
S
S
0.13 (0.005)  
T B  
A
*APPROXIMATE  
13–14  
MOTOROLA ANALOG IC DEVICE DATA  
TV SUFFIX  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
CASE 821C-04  
Plastic Package  
(15-Pin ZIP)  
ISSUE D  
1
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION R DOES NOT INCLUDE MOLD FLASH  
OR PROTRUSIONS.  
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH  
OR PROTRUSIONS.  
15  
5. MOLD FLASH OR PROTRUSIONS SHALL NOT  
EXCEED 0.010 (0.250).  
6. DIMENSION D DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE PROTRUSION SHALL  
BE 0.003 (0.076) TOTAL IN EXCESS OF THE D  
DIMENSION. AT MAXIMUM MATERIAL CONDITION.  
SEATING  
PLANE  
–T–  
C
E
M
B
–Q–  
INCHES  
DIM MIN MAX  
MILLIMETERS  
MIN MAX  
–P–  
U
A
B
C
D
E
0.684 0.694 17.374 17.627  
0.784 0.792 19.914 20.116  
0.173 0.181 4.395 4.597  
0.024 0.031 0.610 0.787  
0.058 0.062 1.473 1.574  
Y
K
V
A
R
G
H
J
K
L
0.050 BSC  
0.169 BSC  
0.018 0.024 0.458 0.609  
0.700 0.710 17.780 18.034  
1.270 BSC  
4.293 BSC  
S
0.200 BSC  
5.080 BSC  
PIN 15  
M
R
S
U
V
Y
0.148 0.151 3.760 3.835  
0.416 0.426 10.567 10.820  
0.157 0.167 3.988 4.242  
PIN 1  
H
L
G
0.105  
0.868 REF  
0.625 0.639 15.875 16.231  
0.115 2.667 2.921  
15X D  
15X J  
22.047 REF  
S
M
M
Q
0.010 (0.254)  
T P  
0.024 (0.610)  
T
T SUFFIX  
CASE 821D-03  
Plastic Package  
ISSUE C  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION R DOES NOT INCLUDE MOLD FLASH  
OR PROTRUSIONS.  
1
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH  
OR PROTRUSIONS.  
15  
5. MOLD FLASH OR PROTRUSIONS SHALL NOT  
EXCEED 0.010 (0.250).  
6. DELETED  
7. DIMENSION D DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE PROTRUSION SHALL  
BE 0.003 (0.076) TOTAL IN EXCESS OF THE D  
DIMENSION. AT MAXIMUM MATERIAL CONDITION.  
SEATING  
PLANE  
Q
–L–  
–T–  
C
B
E
INCHES  
DIM MIN MAX  
MILLIMETERS  
MIN MAX  
–P–  
U
A
B
C
D
E
F
0.681 0.694 17.298 17.627  
0.784 0.792 19.914 20.116  
0.173 0.181 4.395 4.597  
0.024 0.031 0.610 0.787  
0.058 0.062 1.473 1.574  
0.016 0.023 0.407 0.584  
A
R
K
G
H
J
K
Q
R
U
Y
0.050 BSC  
0.110 BSC  
0.018 0.024 0.458 0.609  
1.078 1.086 27.382 27.584  
0.148 0.151 3.760 3.835  
0.416 0.426 10.567 10.820  
1.270 BSC  
2.794 BSC  
Y
PIN 1  
PIN 15  
H
G
0.110 BSC  
0.503 REF  
2.794 BSC  
12.776 REF  
7X F  
15X D  
15X J  
S
M
L
0.010 (0.254)  
T P  
M
0.024 (0.610)  
T
13–15  
MOTOROLA ANALOG IC DEVICE DATA  
FTB SUFFIX  
CASE 824D–01  
Plastic Package  
(TQFP–44)  
1
ISSUE O  
L
–T–, –U–, –Z–  
–Z–  
44  
34  
33  
1
AE  
G
AE  
DETAIL AA  
–T–  
L
–U–  
F
PLATING  
BASE METAL  
DETAIL AA  
J
11  
23  
N
12  
22  
D
M
S
S
0.20 (0.008)  
AC T–U  
Z
A
SECTION AE–AE  
M
S
S
0.20 (0.008)  
AB T–U  
Z
Z
0.05 (0.002) T–U  
S
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
M
S
S
0.20 (0.008)  
AC T–U  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DATUM PLANE –AB– IS LOCATED AT BOTTOM OF  
LEAD AND IS COINCIDENT WITH THE LEAD WHERE  
THE LEAD EXITS THE PLASTIC BODY AT THE  
BOTTOM OF THE PARTING LINE.  
4. DATUMS –T–, –U– AND –Z– TO BE DETERMINED AT  
DATUM PLANE –AB–.  
5. DIMENSIONS S AND V TO BE DETERMINED AT  
SEATING PLANE –AC–.  
M
DETAIL AD  
–AB–  
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD  
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25  
(0.010) PER SIDE. DIMENSIONS A AND B DO  
INCLUDE MOLD MISMATCH AND ARE DETERMINED  
AT DATUM PLANE –AB–.  
E
C
7. DIMENSION D DOES NOT INCLUDE DAMBAR  
PROTRUSION. DAMBAR PROTRUSION SHALL NOT  
CAUSE THE D DIMENSION TO EXCEED 0.530  
(0.021).  
0.10 (0.004)  
–AC–  
H
Y
MILLIMETERS  
DIM MIN MAX  
INCHES  
MIN MAX  
A
B
C
D
E
9.950 10.050 0.392 0.396  
9.950 10.050 0.392 0.396  
1.400 1.600 0.055 0.063  
0.300 0.450 0.012 0.018  
1.350 1.450 0.053 0.057  
0.300 0.400 0.012 0.016  
R
F
G
H
J
K
L
M
N
Q
R
S
V
W
X
Y
0.800 BSC  
0.031 BSC  
K
0.050 0.150 0.002 0.006  
0.090 0.200 0.004 0.008  
0.450 0.550 0.018 0.022  
8.000 BSC  
12 REF  
Q
W
X
0.315 BSC  
12 REF  
VIEW AD  
0.090 0.160 0.004 0.006  
1
5
1
5
0.100 0.200 0.004 0.008  
11.900 12.100 0.469 0.476  
11.900 12.100 0.469 0.476  
0.200 REF  
1.000 REF  
12 REF  
0.008 REF  
0.039 REF  
12 REF  
13–16  
MOTOROLA ANALOG IC DEVICE DATA  
FB SUFFIX  
CASE 824E–02  
Plastic Package  
(QFP)  
44  
1
ISSUE A  
S
–L–, –M–, –N–  
M
S
S
S
S
0.20 (0.008)  
0.20 (0.008)  
T L–M  
H L–M  
N
N
A
M
0.05 (0.002) L–M  
PIN 1  
IDENT  
J1  
J1  
G
44  
34  
33  
1
VIEW Y  
3 PL  
F
PLATING  
BASE METAL  
–L–  
–M–  
J
B1  
D
M
VIEW Y  
S
S
0.20 (0.008)  
T L–M  
N
SECTION J1–J1  
11  
23  
G 40X  
44 PL  
12  
22  
–N–  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF  
LEAD AND IS COINCIDENT WITH THE LEAD  
WHERE THE LEAD EXITS THE PLASTIC BODY AT  
THE BOTTOM OF THE PARTING LINE.  
4. DATUMS –L–, –M– AND –N– TO BE DETERMINED  
AT DATUM PLANE –H–.  
5. DIMENSIONS S AND V TO BE DETERMINED AT  
SEATING PLANE –T–.  
M
VIEW P  
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD  
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25  
(0.010) PER SIDE. DIMENSIONS A AND B DO  
INCLUDE MOLD MISMATCH AND ARE  
DETERMINED AT DATUM PLANE –H–.  
7. DIMENSION D DOES NOT INCLUDE DAMBAR  
PROTRUSION. DAMBAR PROTRUSION SHALL  
NOT CAUSE THE D DIMENSION TO EXCEED  
0.530 (0.021).  
E
DATUM  
C
–H–  
PLANE  
0.01 (0.004)  
–T–  
W
Y
MILLIMETERS  
DIM MIN MAX  
INCHES  
MIN  
MAX  
0.398  
0.398  
0.087  
A
B
C
D
E
9.90  
9.90  
2.00  
0.30  
2.00  
0.30  
10.10 0.390  
10.10 0.390  
2.21 0.079  
0.45 0.0118 0.0177  
2.10 0.079  
0.40 0.012  
1
0.083  
0.016  
F
R R1  
R R2  
G
J
K
M
S
V
W
Y
A1  
0.80 BSC  
0.031 BSC  
0.13  
0.65  
5
0.23 0.005  
0.95 0.026  
10  
0.009  
0.037  
10  
DATUM  
PLANE  
–H–  
5
12.95  
12.95  
0.000  
5
13.45 0.510  
13.45 0.510  
0.210 0.000  
0.530  
0.530  
0.008  
10  
K
10  
5
2
A1  
0.450 REF  
0.170 0.005  
1.600 REF  
0.130  
0.300  
0.300 0.005  
0.018 REF  
0.007  
0.063 REF  
B1 0.130  
C1  
R1  
R2 0.130  
1
2
C1  
VIEW P  
0.005  
0.012  
0.012  
10  
5
0
10  
7
5
0
7
13–17  
MOTOROLA ANALOG IC DEVICE DATA  
FB SUFFIX  
CASE 840F–01  
Plastic Package  
ISSUE O  
64  
1
L
–Z–  
64  
49  
1
48  
–T–, –U–, –Z–  
P
AE  
AE  
L
B
V
G
–U–  
–T–  
DETAIL AA  
DETAIL AA  
16  
33  
32  
17  
BASE  
METAL  
A
N
M
S
S
S
S
0.20 (0.008)  
AB T–U  
Z
Z
0.050 (0.002) T–U  
S
D
F
M
0.20 (0.008)  
AC T–U  
M
J
C
E
SECTION AE–AE  
–AB–  
0.10 (0.004)  
–AC–  
Y
H
DETAIL AD  
MILLIMETERS  
DIM MIN MAX  
INCHES  
MIN  
MAX  
0.396  
0.396  
0.063  
0.011  
0.057  
0.009  
NOTES:  
A
B
C
D
E
F
9.950 10.050 0.392  
9.950 10.050 0.392  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
1.400  
0.170  
1.350  
0.170  
1.600 0.055  
0.270 0.007  
1.450 0.053  
0.230 0.007  
Q
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DATUM PLANE –AB– IS LOCATED AT BOTTOM OF  
LEAD AND IS COINCIDENT WITH THE LEAD  
WHERE THE LEAD EXITS THE PLASTIC BODY AT  
THE BOTTOM OF THE PARTING LINE.  
4. DATUMS –T–, –U– AND –Z– TO BE DETERMINED  
AT DATUM PLANE –AC–.  
G
H
J
K
L
M
N
P
0.500 BSC  
0.020 BSC  
R
0.050  
0.090  
0.450  
0.150 0.002  
0.200 0.004  
0.550 0.018  
0.006  
0.008  
0.022  
K
5. DIMENSIONS S AND V TO BE DETERMINED AT  
SEATING PLANE –AC–.  
7.500 BSC  
12° REF  
0.090 0.160 0.004  
0.250 BSC 0.010 BSC  
0.295 BSC  
12° REF  
0.006  
W
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD  
PROTRUSION. ALLOWABLE PROTRUSION IS  
0.25 (0.010 ) PER SIDE. DIMENSIONS A AND B DO  
INCLUDE MOLD MISMATCH AND ARE  
DETERMINED AT DATUM PLANE –AB–.  
7. DIMENSION D DOES NOT INCLUDE DAMBAR  
PROTRUSION. DAMBAR PROTRUSION SHALL  
NOT CAUSE THE D DIMENSION TO EXCEED  
0.350 (0.014).  
X
°
°
5
Q
R
S
V
W
X
Y
1°  
0.100  
5
1°  
0.200 0.004  
DETAIL AD  
0.008  
0.476  
0.476  
11.900 12.100 0.469  
11.900 12.100 0.469  
0.200 REF  
1.000 REF  
12 REF  
0.008 REF  
0.039 REF  
°
12 REF  
°
13–18  
MOTOROLA ANALOG IC DEVICE DATA  
DM SUFFIX  
CASE 846A–02  
Plastic Package  
(Micro–8)  
8
1
ISSUE C  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
–A–  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,  
PROTRUSIONS OR GATE BURRS. MOLD FLASH,  
PROTRUSIONS OR GATE BURRS SHALL NOT  
EXCEED 0.15 (0.006) PER SIDE.  
4. DIMENSION B DOES NOT INCLUDE INTERLEAD  
FLASH OR PROTRUSION. INTERLEAD FLASH OR  
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)  
PER SIDE.  
–B–  
K
MILLIMETERS  
INCHES  
PIN 1 ID  
G
DIM MIN  
MAX  
3.10  
3.10  
1.10  
MIN  
0.114  
0.114  
MAX  
0.122  
0.122  
D 8 PL  
A
B
C
D
G
H
J
2.90  
2.90  
–––  
M
S
S
0.08 (0.003)  
T B  
A
––– 0.043  
0.25  
0.40 0.010 0.016  
0.65 BSC  
0.026 BSC  
0.15 0.002 0.006  
0.23 0.005 0.009  
5.05 0.187 0.199  
0.70 0.016 0.028  
0.05  
0.13  
4.75  
0.40  
SEATING  
PLANE  
–T–  
K
L
0.038 (0.0015)  
C
L
J
H
13–19  
MOTOROLA ANALOG IC DEVICE DATA  
FB SUFFIX  
CASE 848B-04  
Plastic Package  
(TQFP–52)  
1
52  
ISSUE C  
L
39  
27  
26  
40  
B
B
DETAIL A  
–B–  
–A–  
L
–A–, –B–, –D–  
DETAIL A  
14  
52  
1
13  
–D–  
F
B
M
S
S
S
0.20 (0.008)  
H A–B  
D
D
0.05 (0.002) A–B  
J
N
V
M
S
0.20 (0.008)  
C A–B  
BASE METAL  
D
DETAIL C  
M
M
C
M
S
S
0.02 (0.008)  
C A–B  
D
E
SECTION B–B  
DATUM  
PLANE  
–H–  
0.10 (0.004)  
H
SEATING  
PLANE  
–C–  
G
MILLIMETERS  
DIM MIN MAX  
INCHES  
NOTES:  
MIN  
MAX  
0.398  
0.398  
0.096  
0.015  
0.083  
0.013  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF  
LEAD AND IS COINCIDENT WITH THE LEAD WHERE  
THE LEAD EXITS THE PLASTIC BODY AT THE  
BOTTOM OF THE PARTING LINE.  
4. DATUMS –A–, –B– AND –D– TO BE DETERMINED AT  
DATUM PLANE –H–.  
U
A
B
C
D
E
9.90  
9.90  
2.10  
0.22  
2.00  
0.22  
10.10 0.390  
10.10 0.390  
2.45 0.083  
0.38 0.009  
2.10 0.079  
0.33 0.009  
F
G
H
J
K
L
0.65 BSC  
0.026 BSC  
R
–––  
0.13  
0.65  
0.25  
0.23 0.005  
0.95 0.026  
–––  
0.010  
0.009  
0.037  
5. DIMENSIONS S AND V TO BE DETERMINED AT  
SEATING PLANE –C–.  
Q
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD  
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25  
(0.010) PER SIDE. DIMENSIONS A AND B DO  
INCLUDE MOLD MISMATCH AND ARE DETERMINED  
AT DATUM PLANE –H–.  
7. DIMENSION D DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION  
SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE D  
DIMENSION AT MAXIMUM MATERIAL CONDITION.  
DAMBAR CANNOT BE LOCATED ON THE LOWER  
RADIUS OR THE FOOT.  
7.80 REF  
0.307 REF  
M
N
Q
R
S
5
0.13  
0
0.13  
12.95  
0.13  
0
12.95  
0.35  
1.6 REF  
10  
5
10  
0.007  
7
0.17 0.005  
7
0.30 0.005  
13.45 0.510  
––– 0.005  
K
T
0
W
X
0.012  
0.530  
–––  
T
U
V
W
X
–––  
0
–––  
DETAIL C  
13.45 0.510  
0.45 0.014  
0.530  
0.018  
0.063 REF  
13–20  
MOTOROLA ANALOG IC DEVICE DATA  
FB SUFFIX  
CASE 848D–03  
Plastic Package  
ISSUE C  
1
52  
4X  
4X TIPS  
0.20 (0.008) H L–M N  
0.20 (0.008) T L–M N  
–X–  
X=L, M, N  
52  
1
40  
C
L
39  
AB  
AB  
G
3X VIEW Y  
–L–  
–M–  
B1  
VIEW Y  
B
V
V1  
BASE METAL  
F
PLATING  
13  
14  
27  
26  
J
U
–N–  
A1  
S1  
D
M
S
S
0.13 (0.005)  
T L–M  
N
A
S
SECTION AB–AB  
ROTATED 90 CLOCKWISE  
4X θ2  
4X θ3  
C
0.10 (0.004) T  
–H–  
–T–  
SEATING  
PLANE  
VIEW AA  
MILLIMETERS  
INCHES  
MIN MAX  
0.394 BSC  
0.197 BSC  
0.394 BSC  
0.197 BSC  
DIM MIN  
MAX  
10.00 BSC  
5.00 BSC  
A
A1  
B
B1  
C
C1  
C2  
D
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
S
0.05 (0.002)  
10.00 BSC  
5.00 BSC  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF  
LEAD AND IS COINCIDENT WITH THE LEAD  
WHERE THE LEAD EXITS THE PLASTIC BODY AT  
THE BOTTOM OF THE PARTING LINE.  
4. DATUMS –L–, –M– AND –N– TO BE DETERMINED  
AT DATUM PLANE –H–.  
W
–––  
0.05  
1.30  
0.20  
0.45  
0.22  
1.70  
––– 0.067  
2 X R R1  
0.20 0.002 0.008  
1.50 0.051 0.059  
0.40 0.008 0.016  
0.75 0.018 0.030  
0.35 0.009 0.014  
θ1  
E
F
0.25 (0.010)  
C2  
θ
5. DIMENSIONS S AND V TO BE DETERMINED AT  
SEATING PLANE –T–.  
G
0.65 BSC  
0.026 BSC  
GAGE PLANE  
J
K
R1  
S
S1  
U
0.07  
0.08  
12.00 BSC  
6.00 BSC  
0.09  
12.00 BSC  
6.00 BSC  
0.20 REF  
1.00 REF  
0.20 0.003 0.008  
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD  
PROTRUSION. ALLOWABLE PROTRUSION IS  
0.25 (0.010) PER SIDE. DIMENSIONS A AND B DO  
INCLUDE MOLD MISMATCH AND ARE  
DETERMINED AT DATUM PLANE -H-.  
7. DIMENSION D DOES NOT INCLUDE DAMBAR  
PROTRUSION. DAMBAR PROTRUSION SHALL  
NOT CAUSE THE LEAD WIDTH TO EXCEED 0.46  
(0.018). MINIMUM SPACE BETWEEN  
0.50 REF  
0.020 REF  
0.20 0.003 0.008  
K
E
0.472 BSC  
0.236 BSC  
0.16 0.004 0.006  
C1  
V
0.472 BSC  
0.236 BSC  
0.008 REF  
0.039 REF  
Z
V1  
W
Z
VIEW AA  
PROTRUSION AND ADJACENT LEAD OR  
PROTRUSION 0.07 (0.003).  
θ
0
0
12  
5
7
0
7
–––  
–––  
θ1  
θ2  
θ3  
0
12  
5
REF  
13  
REF  
13  
13–21  
MOTOROLA ANALOG IC DEVICE DATA  
B SUFFIX  
CASE 858–01  
Plastic Package  
ISSUE O  
42  
1
NOTES:  
–A–  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION L TO CENTER OF LEAD WHEN  
FORMED PARALLEL.  
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD  
FLASH. MAXIMUM MOLD FLASH 0.25 (0.010).  
42  
1
22  
21  
–B–  
INCHES  
DIM MIN MAX  
MILLIMETERS  
MIN MAX  
L
A
B
C
D
F
G
H
J
1.435 1.465 36.45 37.21  
0.540 0.560 13.72 14.22  
0.155 0.200  
0.014 0.022  
0.032 0.046  
0.070 BSC  
3.94  
0.36  
0.81  
1.778 BSC  
7.62 BSC  
5.08  
0.56  
1.17  
H
C
K
0.300 BSC  
0.008 0.015  
0.20  
2.92  
0.38  
3.43  
–T–  
K
L
0.115  
0.135  
SEATING  
PLANE  
0.600 BSC  
15.24 BSC  
N
G
M
N
0
15  
0
0.51  
15  
1.02  
M
F
0.020 0.040  
J 42 PL  
D 42 PL  
M
S
0.25 (0.010)  
T B  
M
S
0.25 (0.010)  
T A  
B SUFFIX  
CASE 859–01  
Plastic Package  
(SDIP)  
ISSUE O  
56  
1
–A–  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION L TO CENTER OF LEAD WHEN  
FORMED PARALLEL.  
56  
29  
28  
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD  
FLASH. MAXIMUM MOLD FLASH 0.25 (0.010)  
–B–  
INCHES  
DIM MIN MAX  
MILLIMETERS  
1
MIN  
MAX  
52.45  
14.22  
5.08  
A
B
C
D
E
2.035  
0.540  
0.155  
0.014  
2.065 51.69  
0.560 13.72  
0.200  
0.022  
L
3.94  
0.36  
0.56  
H
C
0.035 BSC  
0.89 BSC  
F
0.032  
0.046  
0.81  
1.17  
G
H
J
K
L
0.070 BSC  
0.300 BSC  
1.778 BSC  
7.62 BSC  
–T–  
K
0.008  
0.115  
0.015  
0.135  
0.20  
2.92  
0.38  
3.43  
SEATING  
PLANE  
0.600 BSC  
15.24 BSC  
N
G
M
F
M
N
0
15  
0
0.51  
15  
1.02  
0.020  
0.040  
E
J 56 PL  
D 56 PL  
M
S
0.25 (0.010)  
T A  
M
S
0.25 (0.010)  
T B  
13–22  
MOTOROLA ANALOG IC DEVICE DATA  
FB, FTB SUFFIX  
CASE 873-01  
Plastic Package  
(TQFP–32)  
1
ISSUE A  
L
17  
24  
25  
16  
B
B
P
–B–  
–A–  
L
V
B
–A–, –B–, –D–  
DETAIL A  
DETAIL A  
32  
9
1
8
F
BASE  
METAL  
–D–  
A
M
S
S
0.20 (0.008)  
C
A–B  
D
0.05 (0.002) A–B  
N
J
S
M
S
S
0.20 (0.008)  
H A–B  
D
D
M
S
S
0.20 (0.008)  
C
A–B  
D
DETAIL C  
M
SECTION B–B  
VIEW ROTATED 90 CLOCKWISE  
E
C
DATUM  
PLANE  
–H–  
–C–  
SEATING  
PLANE  
0.01 (0.004)  
M
H
G
U
MILLIMETERS  
DIM MIN MAX  
INCHES  
MIN MAX  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
A
B
C
D
E
F
G
H
J
K
L
M
N
P
Q
R
S
6.95  
6.95  
1.40  
7.10 0.274 0.280  
7.10 0.274 0.280  
1.60 0.055 0.063  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF  
LEAD AND IS COINCIDENT WITH THE LEAD WHERE  
THE LEAD EXITS THE PLASTIC BODY AT THE  
BOTTOM OF THE PARTING LINE.  
4. DATUMS –A–, –B– AND –D– TO BE DETERMINED AT  
DATUM PLANE –H–.  
T
0.273 0.373 0.010 0.015  
1.30  
0.273  
0.80 BSC  
–––  
0.119  
0.33  
5.6 REF  
6
0.119  
0.40 BSC  
5
0.15  
8.85  
0.15  
5
8.85  
1.00 REF  
1.50 0.051 0.059  
R
––– 0.010  
–––  
–H–  
0.031 BSC  
DATUM  
PLANE  
0.20  
––– 0.008  
0.197 0.005 0.008  
0.57 0.013 0.022  
5. DIMENSIONS S AND V TO BE DETERMINED AT  
SEATING PLANE –C–.  
0.220 REF  
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD  
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25  
(0.010) PER SIDE. DIMENSIONS A AND B DO  
INCLUDE MOLD MISMATCH AND ARE DETERMINED  
AT DATUM PLANE –H–.  
7. DIMENSION D DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION  
SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE D  
DIMENSION AT MAXIMUM MATERIAL CONDITION.  
DAMBAR CANNOT BE LOCATED ON THE LOWER  
RADIUS OR THE FOOT.  
K
8
6
8
Q
0.135 0.005 0.005  
0.016 BSC  
10  
X
10  
5
DETAIL C  
0.25 0.006 0.010  
9.15 0.348 0.360  
0.25 0.006 0.010  
T
U
V
X
11  
9.15 0.348 0.360  
0.039 REF  
5
11  
13–23  
MOTOROLA ANALOG IC DEVICE DATA  
T SUFFIX  
CASE 894-03  
Plastic Package  
(23-Pin SZIP)  
ISSUE B  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
1
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION R DOES NOT INCLUDE MOLD FLASH  
OR PROTRUSIONS.  
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH  
OR PROTRUSIONS.  
5. MOLD FLASH OR PROTRUSIONS SHALL NOT  
EXCEED 0.010 (0.250).  
23  
6. DIMENSION D DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE PROTRUSION  
SHALL BE 0.003 (0.076) TOTAL IN EXCESS OF  
THE D DIMENSION AT MAXIMUM MATERIAL  
CONDITION.  
C
E
INCHES  
DIM MIN MAX  
MILLIMETERS  
MIN MAX  
B
L
K
Y
A
B
C
D
E
0.684  
1.183  
0.175  
0.026  
0.058  
0.165  
0.694 17.374 17.627  
1.193 30.048 30.302  
0.179  
0.031  
0.062  
0.175  
V
–N–  
4.445  
0.660  
1.473  
4.191  
4.547  
0.787  
1.574  
4.445  
M
A
U
F
P
S
F
G
H
J
K
L
M
N
P
0.050 BSC  
0.169 BSC  
1.270 BSC  
4.293 BSC  
0.356 0.508  
0.014  
0.625  
0.770  
0.148  
0.148  
0.020  
H
0.639 15.875 16.231  
0.790 19.558 20.066  
0.152  
0.152  
R
W
3.760  
3.760  
3.861  
3.861  
–T–  
SEATING  
PLANE  
0.390 BSC  
9.906 BSC  
23X J  
R
S
U
V
W
Y
0.416  
0.157  
0.105  
0.868 REF  
0.200 BSC  
0.700  
0.424 10.566 10.770  
0.167  
0.115  
3.988  
2.667  
4.242  
2.921  
PIN 1  
M
0.024 (0.610)  
T
PIN 23  
22.047 REF  
5.080 BSC  
G
0.710 17.780 18.034  
23X D  
M
S
S
0.010 (0.254)  
T Q  
N
13–24  
MOTOROLA ANALOG IC DEVICE DATA  
FTA SUFFIX  
CASE 932–02  
Plastic Package  
(TQFP–48)  
ISSUE D  
1
48  
P
4X  
0.200 (0.008) AB T–U  
Z
DETAIL Y  
9
A
A1  
48  
37  
AE  
AE  
1
36  
–T–  
–U–  
V1  
B
V
B1  
–T–, –U–, –Z–  
12  
25  
DETAIL Y  
13  
24  
–Z–  
S1  
M
TOP & BOTTOM  
S
R
4X  
GAUGE PLANE  
0.200 (0.008) AC T–U  
Z
0.250 (0.010)  
E
C
H
0.080 (0.003) AC  
G
–AB–  
–AC–  
W
Q
K
AD  
DETAIL AD  
X
BASE METAL  
MILLIMETERS  
DIM MIN MAX  
7.000 BSC  
INCHES  
MIN  
MAX  
NOTES:  
A
A1  
B
0.276 BSC  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
3.500 BSC  
7.000 BSC  
3.500 BSC  
1.400 1.600 0.055 0.063  
0.170 0.270 0.007 0.011  
0.138 BSC  
0.276 BSC  
0.138 BSC  
N
J
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DATUM PLANE –AB– IS LOCATED AT BOTTOM OF  
LEAD AND IS COINCIDENT WITH THE LEAD  
WHERE THE LEAD EXITS THE PLASTIC BODY AT  
THE BOTTOM OF THE PARTING LINE.  
4. DATUMS –T–, –U–, AND –Z– TO BE DETERMINED  
AT DATUM PLANE –AB–.  
B1  
C
D
E
1.350 1.450 0.053 0.057  
0.170 0.230 0.007 0.009  
F
D
F
G
H
J
K
M
N
P
0.500 BASIC  
0.020 BASIC  
5. DIMENSIONS S AND V TO BE DETERMINED AT  
SEATING PLANE –AC–.  
0.050 0.150 0.002 0.006  
0.090 0.200 0.004 0.008  
0.500 0.700 0.020 0.028  
12 REF  
0.090 0.160 0.004 0.006  
0.250 BASIC 0.010 BASIC  
M
S
S
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD  
PROTRUSION. ALLOWABLE PROTRUSION IS  
0.250 (0.010) PER SIDE. DIMENSIONS A AND B DO  
INCLUDE MOLD MISMATCH AND ARE  
DETERMINED AT DATUM PLANE –AB–.  
7. DIMENSION D DOES NOT INCLUDE DAMBAR  
PROTRUSION. DAMBAR PROTRUSION SHALL  
NOT CAUSE THE D DIMENSION TO EXCEED  
0.350 (0.014).  
0.080 (0.003)  
AC T–U  
Z
12 REF  
SECTION AE–AE  
Q
R
1
5
1
5
0.150 0.250 0.006 0.010  
S
9.000 BSC  
4.500 BSC  
9.000 BSC  
4.500 BSC  
0.200 REF  
1.000 REF  
0.354 BSC  
0.177 BSC  
0.354 BSC  
0.177 BSC  
0.008 REF  
0.039 REF  
S1  
V
V1  
W
X
8. MINIMUM SOLDER PLATE THICKNESS SHALL BE  
0.0076 (0.0003).  
9. EXACT SHAPE OF EACH CORNER IS OPTIONAL.  
13–25  
MOTOROLA ANALOG IC DEVICE DATA  
D2T SUFFIX  
CASE 936–03  
Plastic Package  
ISSUE B  
1
2
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
3
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
3. TAB CONTOUR OPTIONAL WITHIN DIMENSIONS  
A AND K.  
TERMINAL 4  
4. DIMENSIONS U AND V ESTABLISH A MINIMUM  
MOUNTING SURFACE FOR TERMINAL 4.  
5. DIMENSIONS A AND B DO NOT INCLUDE MOLD  
FLASH OR GATE PROTRUSIONS. MOLD FLASH  
AND GATE PROTRUSIONS NOT TO EXCEED  
0.025 (0.635) MAXIMUM.  
K
U
A
S
V
B
H
F
1
2
3
INCHES  
DIM MIN MAX  
0.403 9.804 10.236  
MILLIMETERS  
MIN MAX  
A
B
C
D
E
F
0.386  
0.356  
0.170  
0.026  
0.045  
J
D
0.368 9.042  
0.180 4.318  
0.036 0.660  
0.055 1.143  
9.347  
4.572  
0.914  
1.397  
G
M
0.010 (0.254)  
T
0.051 REF  
0.100 BSC  
0.539 0.579 13.691 14.707  
0.125 MAX  
0.050 REF  
1.295 REF  
2.540 BSC  
–T–  
E
G
H
J
K
L
M
N
P
R
S
U
V
OPTIONAL  
CHAMFER  
3.175 MAX  
1.270 REF  
0.000  
0.088  
0.018  
0.058  
5
0.010 0.000  
0.254  
2.591  
0.660  
1.981  
0.102 2.235  
0.026 0.457  
0.078 1.473  
REF  
5 REF  
C
0.116 REF  
0.200 MIN  
0.250 MIN  
2.946 REF  
5.080 MIN  
6.350 MIN  
M
L
P
N
R
D2T SUFFIX  
CASE 936A–02  
Plastic Package  
(D PAK)  
1
NOTES:  
2
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
3. TAB CONTOUR OPTIONAL WITHIN DIMENSIONS  
A AND K.  
5
ISSUE A  
TERMINAL 6  
4. DIMENSIONS U AND V ESTABLISH A MINIMUM  
MOUNTING SURFACE FOR TERMINAL 6.  
5. DIMENSIONS A AND B DO NOT INCLUDE MOLD  
FLASH OR GATE PROTRUSIONS. MOLD FLASH  
AND GATE PROTRUSIONS NOT TO EXCEED  
0.025 (0.635) MAXIMUM.  
U
A
V
S
K
B
H
1
2
3
4
5
INCHES  
DIM MIN MAX  
0.403 9.804 10.236  
MILLIMETERS  
MIN MAX  
A
B
C
D
E
G
H
K
L
M
N
P
R
S
0.386  
0.356  
0.170  
0.026  
0.045  
0.067 BSC  
0.539  
0.050 REF  
0.000  
0.088  
0.018  
0.058  
5
0.116 REF  
0.200 MIN  
0.250 MIN  
0.368 9.042  
0.180 4.318  
0.036 0.660  
0.055 1.143  
1.702 BSC  
0.579 13.691 14.707  
1.270 REF  
9.347  
4.572  
0.914  
1.397  
D
M
0.010 (0.254)  
T
G
–T–  
E
OPTIONAL  
CHAMFER  
0.010 0.000  
0.254  
2.591  
0.660  
1.981  
0.102 2.235  
0.026 0.457  
0.078 1.473  
REF  
5 REF  
2.946 REF  
5.080 MIN  
6.350 MIN  
U
V
C
M
L
P
N
R
13–26  
MOTOROLA ANALOG IC DEVICE DATA  
20  
DT, DTB SUFFIX  
CASE 948E–02  
Plastic Package  
(TSSOP–20)  
ISSUE A  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
1
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,  
PROTRUSIONS OR GATE BURRS. MOLD FLASH  
OR GATE BURRS SHALL NOT EXCEED 0.15  
(0.006) PER SIDE.  
4. DIMENSION B DOES NOT INCLUDE INTERLEAD  
FLASH OR PROTRUSION. INTERLEAD FLASH OR  
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)  
PER SIDE.  
20X K REF  
K
M
S
S
0.10 (0.004)  
T U  
V
S
K1  
0.15 (0.006) T U  
5. DIMENSION K DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE DAMBAR  
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN  
EXCESS OF THE K DIMENSION AT MAXIMUM  
MATERIAL CONDITION.  
6. TERMINAL NUMBERS ARE SHOWN FOR  
REFERENCE ONLY.  
7. DIMENSION A AND B ARE TO BE DETERMINED  
AT DATUM PLANE –W–.  
J J1  
20  
11  
2X L/2  
B
SECTION N–N  
L
–U–  
PIN 1  
IDENT  
0.25 (0.010)  
N
10  
1
MILLIMETERS  
DIM MIN MAX  
INCHES  
MIN  
MAX  
0.260  
0.177  
0.047  
0.006  
0.030  
M
A
B
C
6.40  
4.30  
–––  
6.60 0.252  
4.50 0.169  
1.20  
S
0.15 (0.006) T U  
–––  
A
D
F
0.05  
0.50  
0.15 0.002  
0.75 0.020  
N
–V–  
G
H
J
J1  
K
K1  
L
0.65 BSC  
0.026 BSC  
F
0.27  
0.09  
0.09  
0.19  
0.19  
0.37  
0.011  
0.015  
0.008  
0.006  
0.012  
0.010  
0.20 0.004  
0.16 0.004  
0.30 0.007  
0.25 0.007  
DETAIL E  
C
6.40 BSC  
0.252 BSC  
M
0
8
0
8
–W–  
G
D
H
0.100 (0.004)  
–T– SEATING  
DETAIL E  
PLANE  
DTB SUFFIX  
CASE 948F–01  
16  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
Plastic Package  
1
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.  
PROTRUSIONS OR GATE BURRS. MOLD FLASH  
OR GATE BURRS SHALL NOT EXCEED 0.15  
(0.006) PER SIDE.  
(TSSOP–16, TSSOP–16L)  
ISSUE O  
16X KREF  
M
S
S
0.10 (0.004)  
T U  
V
4. DIMENSION B DOES NOT INCLUDE INTERLEAD  
FLASH OR PROTRUSION. INTERLEAD FLASH OR  
PROTRUSION SHALL NOT EXCEED  
0.25 (0.010) PER SIDE.  
S
0.15 (0.006) T U  
K
K1  
5. DIMENSION K DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE DAMBAR  
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN  
EXCESS OF THE K DIMENSION AT MAXIMUM  
MATERIAL CONDITION.  
6. TERMINAL NUMBERS ARE SHOWN FOR  
REFERENCE ONLY.  
7. DIMENSION A AND B ARE TO BE DETERMINED  
AT DATUM PLANE –W–.  
16  
9
2X L/2  
J1  
SECTION N–N  
B
–U–  
L
J
PIN 1  
IDENT.  
8
1
N
MILLIMETERS  
DIM MIN MAX  
INCHES  
0.25 (0.010)  
MIN  
MAX  
0.200  
0.177  
0.047  
0.006  
0.030  
A
B
C
4.90  
4.30  
–––  
5.10 0.193  
4.50 0.169  
1.20  
S
M
0.15 (0.006) T U  
A
–––  
D
F
0.05  
0.50  
0.15 0.002  
0.75 0.020  
–V–  
N
G
H
J
J1  
K
K1  
L
0.65 BSC  
0.026 BSC  
0.18  
0.09  
0.09  
0.19  
0.19  
0.28 0.007  
0.20 0.004  
0.16 0.004  
0.30 0.007  
0.25 0.007  
0.011  
0.008  
0.006  
0.012  
0.010  
F
DETAIL E  
DETAIL E  
6.40 BSC  
0.252 BSC  
0
C
M
0
8
8
0.10 (0.004)  
–W–  
H
SEATING  
PLANE  
–T–  
D
G
13–27  
MOTOROLA ANALOG IC DEVICE DATA  
DTB SUFFIX  
CASE 948G–01  
Plastic Package  
(TSSOP–14)  
ISSUE O  
14  
1
NOTES:  
14X K REF  
1
DIMENSIONING AND TOLERANCING PER ANSI  
M
S
S
Y14.5M, 1982.  
0.10 (0.004)  
T U  
V
2
3
CONTROLLING DIMENSION: MILLIMETER.  
DIMENSION A DOES NOT INCLUDE MOLD FLASH,  
PROTRUSIONS OR GATE BURRS. MOLD FLASH  
OR GATE BURRS SHALL NOT EXCEED 0.15  
(0.006) PER SIDE.  
DIMENSION B DOES NOT INCLUDE INTERLEAD  
FLASH OR PROTRUSION. INTERLEAD FLASH OR  
PROTRUSION SHALL NOT EXCEED  
0.25 (0.010) PER SIDE.  
DIMENSION K DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE DAMBAR  
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN  
EXCESS OF THE K DIMENSION AT MAXIMUM  
MATERIAL CONDITION.  
S
0.15 (0.006) T U  
N
0.25 (0.010)  
14  
4
5
8
2X L/2  
M
B
L
N
–U–  
PIN 1  
IDENT.  
F
7
1
6
7
TERMINAL NUMBERS ARE SHOWN FOR  
REFERENCE ONLY.  
DIMENSION A AND B ARE TO BE DETERMINED  
AT DATUM PLANE –W–.  
DETAIL E  
S
K
0.15 (0.006) T U  
A
MILLIMETERS  
DIM MIN MAX  
INCHES  
MIN MAX  
K1  
–V–  
A
B
C
4.90  
4.30  
–––  
5.10 0.193 0.200  
4.50 0.169 0.177  
1.20  
J J1  
––– 0.047  
D
F
0.05  
0.50  
0.15 0.002 0.006  
0.75 0.020 0.030  
SECTION N–N  
G
H
J
J1  
K
K1  
L
0.65 BSC  
0.026 BSC  
0.60 0.020 0.024  
0.20 0.004 0.008  
0.16 0.004 0.006  
0.30 0.007 0.012  
0.25 0.007 0.010  
0.50  
0.09  
0.09  
0.19  
0.19  
–W–  
C
6.40 BSC  
0.252 BSC  
0.10 (0.004)  
M
0
8
0
8
SEATING  
PLANE  
–T–  
H
G
DETAIL E  
D
13–28  
MOTOROLA ANALOG IC DEVICE DATA  
DTB SUFFIX  
CASE 948H–01  
Plastic Package  
ISSUE O  
24  
1
24X KREF  
M
S
S
0.10 (0.004)  
T U  
V
S
0.15 (0.006) T U  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
24  
13  
2X L/2  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,  
PROTRUSIONS OR GATE BURRS. MOLD FLASH  
OR GATE BURRS SHALL NOT EXCEED 0.15  
(0.006) PER SIDE.  
4. DIMENSION B DOES NOT INCLUDE INTERLEAD  
FLASH OR PROTRUSION. INTERLEAD FLASH OR  
PROTRUSION SHALL NOT EXCEED  
0.25 (0.010) PER SIDE.  
B
–U–  
L
PIN 1  
IDENT.  
12  
1
5. DIMENSION K DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE DAMBAR  
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN  
EXCESS OF THE K DIMENSION AT MAXIMUM  
MATERIAL CONDITION.  
S
0.15 (0.006) T U  
A
–V–  
6. TERMINAL NUMBERS ARE SHOWN FOR  
REFERENCE ONLY.  
7. DIMENSION A AND B ARE TO BE DETERMINED  
AT DATUM PLANE –W–.  
MILLIMETERS  
DIM MIN MAX  
7.90 0.303  
INCHES  
MIN  
MAX  
C
A
B
7.70  
4.30  
–––  
0.311  
4.50 0.169 0.177  
1.20 ––– 0.047  
C
0.10 (0.004)  
D
F
G
H
J
J1  
K
K1  
L
0.05  
0.50  
0.65 BSC  
0.27  
0.09  
0.09  
0.19  
0.19  
0.15 0.002 0.006  
0.75 0.020 0.030  
SEATING  
PLANE  
–T–  
G
H
D
0.026 BSC  
0.011 0.015  
0.37  
0.20 0.004 0.008  
0.16 0.004 0.006  
0.30 0.007 0.012  
0.25 0.007 0.010  
6.40 BSC  
0.252 BSC  
M
0
8
0
8
–W–  
DETAIL E  
N
0.25 (0.010)  
K
M
K1  
N
J1  
F
DETAIL E  
SECTION N–N  
J
13–29  
MOTOROLA ANALOG IC DEVICE DATA  
DTB SUFFIX  
CASE 948J–01  
Plastic Package  
(TSSOP–8)  
8
1
ISSUE O  
NOTES:  
8x KREF  
1
DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
M
S
S
0.10 (0.004)  
T U  
V
2
3
CONTROLLING DIMENSION: MILLIMETER.  
DIMENSION A DOES NOT INCLUDE MOLD FLASH.  
PROTRUSIONS OR GATE BURRS. MOLD FLASH  
OR GATE BURRS SHALL NOT EXCEED 0.15  
(0.006) PER SIDE.  
S
0.15 (0.006) T U  
K
K1  
8
5
2X L/2  
4
5
DIMENSION B DOES NOT INCLUDE INTERLEAD  
FLASH OR PROTRUSION. INTERLEAD FLASH OR  
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)  
PER SIDE.  
DIMENSION K DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE DAMBAR  
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN  
EXCESS OF THE K DIMENSION AT MAXIMUM  
MATERIAL CONDITION.  
TERMINAL NUMBERS ARE SHOWN FOR  
REFERENCE ONLY.  
DIMENSION A AND B ARE TO BE DETERMINED  
AT DATUM PLANE –W–.  
J J1  
B
–U–  
L
PIN 1  
IDENT.  
SECTION N–N  
4
1
N
6
7
0.25 (0.010)  
S
0.15 (0.006) T U  
A
M
–V–  
MILLIMETERS  
INCHES  
DIM MIN  
MAX  
3.10  
4.50 0.169  
1.20 –––  
0.15 0.002  
0.75 0.020  
MIN  
0.114  
MAX  
0.122  
0.177  
0.047  
0.006  
0.030  
N
A
B
C
2.90  
4.30  
–––  
F
D
F
0.05  
0.50  
DETAIL E  
G
H
J
J1  
K
K1  
L
0.65 BSC  
0.026 BSC  
0.50  
0.09  
0.09  
0.19  
0.19  
0.60 0.020  
0.20 0.004  
0.16 0.004  
0.30 0.007  
0.25 0.007  
0.024  
0.008  
0.006  
0.012  
0.010  
–W–  
C
0.10 (0.004)  
G
SEE DETAIL E  
SEATING  
PLANE  
–T–  
D
6.40 BSC  
0.252 BSC  
M
0
8
0
8
H
M SUFFIX  
CASE 967–01  
Plastic Package  
(EIAJ–20)  
20  
1
ISSUE O  
NOTES:  
1
DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2
3
CONTROLLING DIMENSION: MILLIMETER.  
DIMENSIONS D AND E DO NOT INCLUDE MOLD  
FLASH OR PROTRUSIONS AND ARE MEASURED  
AT THE PARTING LINE. MOLD FLASH OR  
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)  
PER SIDE.  
L
E
20  
11  
Q
1
4
5
TERMINAL NUMBERS ARE SHOWN FOR  
REFERENCE ONLY.  
H
E
E
M
THE LEAD WIDTH DIMENSION (b) DOES NOT  
INCLUDE DAMBAR PROTRUSION. ALLOWABLE  
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)  
TOTAL IN EXCESS OF THE LEAD WIDTH  
DIMENSION AT MAXIMUM MATERIAL CONDITION.  
DAMBAR CANNOT BE LOCATED ON THE LOWER  
RADIUS OR THE FOOT. MINIMUM SPACE  
BETWEEN PROTRUSIONS AND ADJACENT LEAD  
TO BE 0.46 ( 0.018).  
L
1
10  
DETAIL P  
Z
D
VIEW P  
MILLIMETERS  
INCHES  
MIN MAX  
––– 0.081  
e
A
DIM MIN  
MAX  
c
A
A
–––  
0.05  
0.35  
0.18  
2.05  
0.20 0.002 0.008  
0.50 0.014 0.020  
0.27 0.007  
1
b
c
0.011  
D
E
e
12.35 12.80 0.486 0.504  
A
b
1
5.10  
5.45 0.201 0.215  
1.27 BSC  
0.050 BSC  
8.20 0.291 0.323  
0.85 0.020 0.033  
1.50 0.043 0.059  
M
0.10 (0.004)  
0.13 (0.005)  
H
7.40  
0.50  
1.10  
0
0.70  
–––  
E
L
L
E
M
Q
10  
0.90 0.028 0.035  
0.81 ––– 0.032  
10  
0
1
Z
13–30  
MOTOROLA ANALOG IC DEVICE DATA  
FTB SUFFIX  
CASE 976–01  
Plastic Package  
(TQFP–20)  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DATUM PLANE –AB– IS LOCATED AT BOTTOM OF  
LEAD AND IS COINCIDENT WITH THE LEAD  
WHERE THE LEAD EXITS THE PLASTIC BODY AT  
THE BOTTOM OF THE PARTING LINE.  
4. DATUMS –T–, –U–, AND –Z– TO BE DETERMINED  
AT DATUM PLANE –AB–.  
20  
1
ISSUE O  
4X  
9
0.200 (0.008) AB T–U Z  
5. DIMENSIONS S AND V TO BE DETERMINED AT  
DATUM PLANE –AC–.  
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD  
PROTRUSION. ALLOWABLE PROTRUSION IS  
0.250 (0.010) PER SIDE. DIMENSIONS A AND B  
DO INCLUDE MOLD MISMATCH AND ARE  
DETERMINED AT DATUM PLANE –AB–.  
7. DIMENSION D DOES NOT INCLUDE DAMBAR  
PROTRUSION. DAMBAR PROTRUSION SHALL  
NOT CAUSE THE D DIMENSION TO EXCEED  
0.350 (0.014).  
A
A1  
DETAIL Y  
20  
16  
8. MINIMUM SOLDER PLATE THICKNESS SHALL BE  
0.0076 (0.0003).  
9. EXACT SHAPE OF EACH CORNER IS OPTIONAL.  
15  
1
–T–  
–U–  
MILLIMETERS  
DIM MIN MAX  
4.000 BSC  
INCHES  
MIN MAX  
0.157 BSC  
0.079 BSC  
0.157 BSC  
0.079 BSC  
V
B
A
A1  
B
2.000 BSC  
4.000 BSC  
2.000 BSC  
1.400 1.600 0.055 0.063  
0.170 0.270 0.007 0.011  
B1  
B1  
C
D
E
11  
5
V1  
1.350 1.450 0.053 0.057  
0.170 0.230 0.007 0.009  
F
G
H
J
K
M
N
P
0.650 BSC  
0.026 BSC  
0.050 0.150 0.002 0.006  
0.090 0.200 0.004 0.008  
0.500 0.700 0.020 0.028  
12 REF  
0.090 0.160 0.004 0.006  
0.250 BSC 0.010 BSC  
6
10  
12 REF  
–Z–  
S1  
Q
R
S
S1  
V
V1  
W
X
1
5
1
5
S
0.150 0.250 0.006 0.010  
6.000 BSC  
3.000 BSC  
6.000 BSC  
3.000 BSC  
0.200 REF  
1.000 REF  
0.236 BSC  
0.118 BSC  
0.236 BSC  
0.118 BSC  
0.008 REF  
0.039 REF  
4X  
0.200 (0.008) AB T–U Z  
DETAIL AD  
J
N
–AB–  
–AC–  
F
D
0.080 (0.003) AC  
S
S
S
0.080 (0.003)  
AC T–U  
Z
M
SECTION AE–AE  
TOP & BOTTOM  
R
–T–, –U–, –Z–  
C
H
E
AE  
G
AE  
W
K
X
GAUGE  
PLANE  
Q
0.250 (0.010)  
DETAIL AD  
DETAIL Y  
13–31  
MOTOROLA ANALOG IC DEVICE DATA  
FTA SUFFIX  
CASE 977–01  
Plastic Package  
ISSUE O  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
24  
1
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DATUM PLANE –AB– IS LOCATED AT BOTTOM OF  
LEAD AND IS COINCIDENT WITH THE LEAD  
WHERE THE LEAD EXITS THE PLASTIC BODY AT  
THE BOTTOM OF THE PARTING LINE.  
4. DATUMS –T–, –U–, AND –Z– TO BE DETERMINED  
AT DATUM PLANE –AB–.  
4X  
5. DIMENSIONS S AND V TO BE DETERMINED AT  
DATUM PLANE –AC–.  
9
0.200 (0.008) AB T–U Z  
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD  
PROTRUSION. ALLOWABLE PROTRUSION IS  
0.250 (0.010) PER SIDE. DIMENSIONS A AND B  
DO INCLUDE MOLD MISMATCH AND ARE  
DETERMINED AT DATUM PLANE –AB–.  
7. DIMENSION D DOES NOT INCLUDE DAMBAR  
PROTRUSION. DAMBAR PROTRUSION SHALL  
NOT CAUSE THE D DIMENSION TO EXCEED  
0.350 (0.014).  
A
A1  
24  
DETAIL Y  
19  
8. MINIMUM SOLDER PLATE THICKNESS SHALL BE  
0.0076 (0.0003).  
9. EXACT SHAPE OF EACH CORNER IS OPTIONAL.  
1
18  
–T–  
–U–  
MILLIMETERS  
DIM MIN MAX  
4.000 BSC  
INCHES  
MIN MAX  
0.157 BSC  
0.079 BSC  
0.157 BSC  
0.079 BSC  
A
A1  
B
2.000 BSC  
4.000 BSC  
2.000 BSC  
1.400 1.600 0.055 0.063  
0.170 0.270 0.007 0.011  
V
B
B1  
C
D
E
B1  
13  
6
1.350 1.450 0.053 0.057  
0.170 0.230 0.007 0.009  
V1  
F
G
H
J
K
M
N
P
0.500 BSC  
0.020 BSC  
0.050 0.150 0.002 0.006  
0.090 0.200 0.004 0.008  
0.500 0.700 0.020 0.028  
12 REF  
0.090 0.160 0.004 0.006  
0.250 BSC 0.010 BSC  
12 REF  
7
12  
Q
R
S
S1  
V
V1  
W
X
1
5
1
5
–Z–  
S1  
0.150 0.250 0.006 0.010  
6.000 BSC  
3.000 BSC  
6.000 BSC  
3.000 BSC  
0.200 REF  
1.000 REF  
0.236 BSC  
0.118 BSC  
0.236 BSC  
0.118 BSC  
0.008 REF  
0.039 REF  
S
4X  
0.200 (0.008) AB T–U Z  
DETAIL AD  
–T–, –U–, –Z–  
–AB–  
–AC–  
AE  
AE  
0.080 (0.003) AC  
M
TOP & BOTTOM  
P
R
G
DETAIL Y  
C
E
J
N
F
W
GAUGE  
Q
D
PLANE  
H
K
0.250 (0.010)  
X
S
S
S
0.080 (0.003)  
AC T–U  
Z
DETAIL AD  
SECTION AE–AE  
13–32  
MOTOROLA ANALOG IC DEVICE DATA  
N SUFFIX  
CASE 1212–01  
Plastic Package  
(SOT–23)  
1
ISSUE O  
NOTES:  
1. DIMENSIONS ARE IN MILLIMETERS.  
2. INTERPRET DIMENSIONS AND TOLERANCES  
PER ASME Y14.5M, 1994.  
A2  
B
A
E
D
S
0.05  
3. DATUM C IS A SEATING PLANE.  
A1  
MILLIMETERS  
5
1
4
3
DIM MIN  
MAX  
0.10  
1.30  
0.50  
0.25  
3.00  
3.10  
1.80  
L
A1  
A2  
B
C
D
E
E1  
e
e1  
L
0.00  
1.00  
0.30  
0.10  
2.80  
2.50  
1.50  
0.95 BSC  
1.90 BSC  
0.20  
0.45  
2
E1  
C
L1  
B
5X  
C
M
S
S
0.10  
C B  
A
e
e1  
–––  
0.75  
L1  
H SUFFIX  
1
CASE 1213–01  
Plastic Package  
(SOT–89)  
ISSUE O  
NOTES:  
A
D
A2  
1. DIMENSIONS ARE IN MILLIMETERS.  
2. INTERPRET DIMENSIONS AND TOLERANCING  
PER ASME Y14.5M, 1994.  
C
B
D1  
3. DATUM C IS A SEATING PLANE.  
MILLIMETERS  
DIM MIN  
MAX  
1.60  
0.57  
0.52  
0.50  
4.60  
1.70  
4.25  
2.60  
E1  
E
A2  
B
B1  
C
D
D1  
E
1.40  
0.37  
0.32  
0.30  
4.40  
1.50  
–––  
L1  
B
C
M
S
S
0.10  
C B  
A
E1  
e
e1  
L1  
2.40  
1.50 BSC  
3.00 BSC  
0.80 –––  
B1 2X  
e
M
S
S
0.10  
C B  
A
e1  
13–33  
MOTOROLA ANALOG IC DEVICE DATA  

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