54HC138 [MOTOROLA]

3-to-8 Line Decoder; 3至8行译码器
54HC138
型号: 54HC138
厂家: MOTOROLA    MOTOROLA
描述:

3-to-8 Line Decoder
3至8行译码器

文件: 总7页 (文件大小:168K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
SEMICONDUCTOR TECHNICAL DATA  
The MC74VHC138 is an advanced high speed CMOS 3–to–8 decoder  
fabricated with silicon gate CMOS technology. It achieves high speed  
operation similar to equivalent Bipolar Schottky TTL while maintaining  
CMOS low power dissipation.  
When the device is enabled, three Binary Select inputs (A0 – A2)  
determine which one of the outputs (Y0 – Y7) will go Low. When enable input  
E3 is held Low or either E2 or E1 is held High, decoding function is inhibited  
and all outputs go high. E3, E2, and E1 inputs are provided to ease cascade  
connection and for use as an address decoder for memory systems.  
The internal circuit is composed of three stages, including a buffer output  
which provides high noise immunity and stable output. The inputs tolerate  
voltages up to 7V, allowing the interface of 5V systems to 3V systems.  
D SUFFIX  
16–LEAD SOIC PACKAGE  
CASE 751B–05  
DT SUFFIX  
16–LEAD TSSOP PACKAGE  
CASE 948F–01  
High Speed: t  
= 5.7ns (Typ) at V  
= 5V  
PD  
Low Power Dissipation: I  
CC  
= 4µA (Max) at T = 25°C  
CC  
A
High Noise Immunity: V  
Power Down Protection Provided on Inputs  
Balanced Propagation Delays  
Designed for 2V to 5.5V Operating Range  
= V  
= 28% V  
NIH  
NIL CC  
Low Noise: V  
= 0.8 V (Max)  
M SUFFIX  
16–LEAD SOIC EIAJ PACKAGE  
CASE 966–01  
OLP  
Pin and Function Compatible with Other Standard Logic Families  
Latchup Performance Exceeds 300mA  
ESD Performance: HBM > 2000V; Machine Model > 200V  
Chip Complexity: 122 FETs or 30.5 Equivalent Gates  
ORDERING INFORMATION  
MC74VHCXXXD  
MC74VHCXXXDT  
MC74VHCXXXM  
SOIC  
TSSOP  
SOIC EIAJ  
FUNCTION TABLE  
Inputs  
Outputs  
E3 E2 E1 A2 A1 A0 Y0 Y1 Y2 Y3 Y4 Y5 Y6 Y7  
X
X
L
X
H
X
H
X
X
X
X
X
X
X
X
X
X
X
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
PIN ASSIGNMENT  
A0  
A1  
1
2
16  
15  
14  
13  
V
CC  
H
H
H
H
L
L
L
L
L
L
L
L
L
L
L
L
L
L
H
H
L
H
L
L
H
H
H
H
L
H
H
H
H
L
H
H
H
L
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
Y0  
Y1  
Y2  
Y3  
Y4  
3
4
5
6
A2  
E1  
H
H
H
H
H
H
L
L
L
L
L
L
L
L
H
H
H
H
L
L
H
H
L
H
L
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
L
H
H
H
H
L
H
H
H
H
L
H
H
H
L
E2  
E3  
12  
11  
H
H
7
8
10  
9
Y7  
Y5  
Y6  
H = high level (steady state); L = low level (steady state);  
X = don’t care  
GND  
15  
Y0  
1
14  
13  
12  
A0  
A1  
A2  
Y1  
Y2  
Y3  
SELECT  
INPUTS  
2
3
ACTIVE–LOW  
OUTPUTS  
11  
10  
Y4  
Y5  
Y6  
Y7  
9
7
6
5
E3  
E2  
E1  
ENABLE  
INPUTS  
LOGIC DIAGRAM  
4
6/97  
REV 1  
Motorola, Inc. 1997  
MC74VHC138  
EXPANDED LOGIC DIAGRAM  
15  
Y0  
14  
13  
Y1  
Y2  
1
2
3
A0  
A1  
A2  
12  
11  
Y3  
Y4  
10  
Y5  
5
4
E2  
E1  
9
7
Y6  
Y7  
6
E3  
MOTOROLA  
2
MC74VHC138  
MAXIMUM RATINGS*  
Symbol  
Parameter  
Value  
Unit  
V
This device contains protection  
circuitry to guard against damage  
due to high static voltages or electric  
fields. However, precautions must  
be taken to avoid applications of any  
voltage higher than maximum rated  
voltages to this high–impedance cir-  
V
DC Supply Voltage  
DC Input Voltage  
– 0.5 to + 7.0  
– 0.5 to + 7.0  
CC  
V
V
in  
V
DC Output Voltage  
Input Diode Current  
Output Diode Current  
– 0.5 to V  
CC  
+ 0.5  
V
out  
I
IK  
– 20  
mA  
mA  
mA  
mA  
mW  
cuit. For proper operation, V and  
in  
I
± 20  
± 25  
± 75  
OK  
V
should be constrained to the  
out  
range GND (V or V  
)
V
.
I
DC Output Current, per Pin  
DC Supply Current, V and GND Pins  
in out  
CC  
out  
CC  
Unused inputs must always be  
tied to an appropriate logic voltage  
I
CC  
level (e.g., either GND or V  
).  
P
D
Power Dissipation in Still Air,  
SOIC Packages†  
TSSOP Package†  
500  
450  
CC  
Unused outputs must be left open.  
T
stg  
Storage Temperature  
– 65 to + 150  
C
* Absolute maximum continuous ratings are those values beyond which damage to the device  
may occur. Exposure to these conditions or conditions beyond those indicated may adversely  
affect device reliability. Functional operation under absolute–maximum–rated conditions is not  
implied.  
†Derating — SOIC Packages: – 7 mW/ C from 65 to 125 C  
TSSOP Package: – 6.1 mW/ C from 65 to 125 C  
RECOMMENDED OPERATING CONDITIONS  
Symbol  
Parameter  
Min  
2.0  
0
Max  
5.5  
Unit  
V
V
CC  
DC Supply Voltage  
DC Input Voltage  
DC Output Voltage  
V
in  
5.5  
V
V
out  
0
V
CC  
V
T
Operating Temperature  
Input Rise and Fall Time  
– 40  
+ 85  
C
A
t , t  
r f  
V
CC  
V
CC  
= 3.3V ±0.3V  
=5.0V ±0.5V  
0
0
100  
20  
ns/V  
DC ELECTRICAL CHARACTERISTICS  
T
A
= 25°C  
T = – 40 to 85°C  
A
V
CC  
V
Symbol  
Parameter  
Test Conditions  
Unit  
Min  
1.50  
Typ  
Max  
Min  
Max  
V
IH  
Minimum High–Level  
Input Voltage  
2.0  
3.0 to  
5.5  
1.50  
V
V
x 0.7  
V
x 0.7  
CC  
CC  
V
Maximum Low–Level  
Input Voltage  
2.0  
3.0 to  
5.5  
0.50  
0.50  
V
V
IL  
V
x 0.3  
V
x 0.3  
CC  
CC  
V
OH  
Minimum High–Level  
Output Voltage  
V
= V or V  
IH  
2.0  
3.0  
4.5  
1.9  
2.9  
4.4  
2.0  
3.0  
4.5  
1.9  
2.9  
4.4  
in  
IL  
IL  
I
= – 50µ  
OH  
V
in  
= V or V  
IH  
I
I
= – 4mA  
3.0  
4.5  
2.58  
3.94  
2.48  
3.80  
OH  
OH  
= – 8mA  
V
OL  
Maximum Low–Level  
Output Voltage  
V
= V or V  
IH IL  
= 50µA  
2.0  
3.0  
4.5  
0.0  
0.0  
0.0  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
V
in  
I
OL  
V
in  
= V or V  
IH  
IL  
I
I
= 4mA  
= 8mA  
3.0  
4.5  
0.36  
0.36  
0.44  
0.44  
OL  
OL  
3
MOTOROLA  
MC74VHC138  
DC ELECTRICAL CHARACTERISTICS  
T
A
= 25°C  
T = – 40 to 85°C  
A
V
CC  
V
Symbol  
Parameter  
Test Conditions  
Min  
Typ  
Max  
Min  
Max  
Unit  
I
Maximum Input  
Leakage Current  
V
V
= 5.5 V or GND  
0 to 5.5  
± 0.1  
± 1.0  
µA  
in  
in  
I
Maximum Quiescent  
Supply Current  
= V  
or GND  
CC  
5.5  
4.0  
40.0  
µA  
CC  
in  
AC ELECTRICAL CHARACTERISTICS (Input t = t = 3.0ns)  
r
f
T
A
= 25°C  
T
A
= – 40 to 85°C  
Symbol  
Parameter  
Test Conditions  
Unit  
Min  
Typ  
Max  
Min  
1.0  
Max  
t
t
t
,
Maximum Propagation Delay,  
A to Y  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
= 3.3 ± 0.3V  
= 5.0 ± 0.5V  
= 3.3 ± 0.3V  
= 5.0 ± 0.5V  
= 3.3 ± 0.3V  
= 5.0 ± 0.5V  
C
C
= 15pF  
= 50pF  
8.2  
10.0  
11.4  
15.8  
13.5  
18.0  
ns  
PLH  
L
L
t
1.0  
PHL  
C
C
= 15pF  
= 50pF  
5.7  
7.2  
8.1  
10.1  
1.0  
1.0  
9.5  
11.5  
L
L
,
Maximum Propagation Delay,  
E3 to Y  
C
C
= 15pF  
= 50pF  
8.1  
10.6  
12.8  
16.3  
1.0  
1.0  
15.0  
18.5  
ns  
ns  
PLH  
t
L
L
PHL  
C
C
= 15pF  
= 50pF  
5.6  
7.1  
8.1  
10.1  
1.0  
1.0  
9.5  
11.5  
L
L
,
Maximum Propagation Delay,  
E2 or E1 to Y  
C
C
= 15pF  
= 50pF  
8.2  
10.7  
11.4  
14.9  
1.0  
1.0  
13.5  
17.0  
PLH  
L
L
t
PHL  
C
C
= 15pF  
= 50pF  
5.8  
7.3  
8.1  
10.1  
1.0  
1.0  
9.5  
11.5  
L
L
C
C
Maximum Input Capacitance  
4
10  
10  
pF  
pF  
in  
Typical @ 25°C, V  
= 5.0V  
CC  
Power Dissipation Capacitance (Note 1.)  
34  
PD  
PD  
1. C  
is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.  
Averageoperating current can be obtained by the equation: I  
power consumption; P = C  
D
= C  
V
f
+ I . C  
PD CC in CC PD  
is used to determine the no–load dynamic  
CC(OPR)  
2
V
f
+ I  
in CC  
V
.
CC  
PD  
CC  
MOTOROLA  
4
MC74VHC138  
SWITCHING WAVEFORMS  
VALID  
VALID  
V
CC  
V
E3  
Y
CC  
50%  
A
50%  
GND  
GND  
t
t
PLH  
PHL  
t
t
PHL  
PLH  
50% V  
CC  
Y
50% V  
CC  
Figure 1.  
Figure 2.  
TEST POINT  
V
CC  
OUTPUT  
E2 or E1  
50%  
DEVICE  
UNDER  
TEST  
GND  
t
t
PLH  
C *  
PHL  
L
50% V  
CC  
Y
* Includes all probe and jig capacitance  
Figure 3.  
Figure 4. Test Circuit  
INPUT  
Figure 5. Input Equivalent Circuit  
5
MOTOROLA  
MC74VHC138  
OUTLINE DIMENSIONS  
D SUFFIX  
PLASTIC SOIC PACKAGE  
CASE 751B–05  
ISSUE J  
–A  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSIONS A AND B DO NOT INCLUDE  
MOLD PROTRUSION.  
16  
1
9
8
–B  
P 8 PL  
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)  
PER SIDE.  
M
M
0.25 (0.010)  
B
5. DIMENSION D DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE DAMBAR  
PROTRUSION SHALL BE 0.127 (0.005) TOTAL  
IN EXCESS OF THE D DIMENSION AT  
MAXIMUM MATERIAL CONDITION.  
G
MILLIMETERS  
INCHES  
DIM  
A
B
C
D
F
G
J
MIN  
9.80  
3.80  
1.35  
0.35  
0.40  
MAX  
10.00  
4.00  
1.75  
0.49  
MIN  
MAX  
0.393  
0.157  
0.068  
0.019  
0.049  
0.386  
0.150  
0.054  
0.014  
0.016  
0.050 BSC  
0.008  
0.004  
F
K
R X 45°  
C
1.25  
1.27 BSC  
–T  
0.19  
0.10  
0.25  
0.25  
0.009  
0.009  
J
SEAT  
ING  
M
K
PLANE  
D 16 PL  
M
P
R
0
5.80  
0.25  
°
7
6.20  
0.50  
°
0
°
7°  
0.244  
0.019  
0.229  
0.010  
M
S
S
0.25 (0.010)  
T
B
A
DT SUFFIX  
PLASTIC TSSOP PACKAGE  
CASE 948F–01  
ISSUE O  
16X KREF  
M
S
S
0.10 (0.004)  
T
U
V
NOTES:  
S
0.15 (0.006) T  
U
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
K
K1  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.  
PROTRUSIONS OR GATE BURRS. MOLD FLASH OR  
GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER  
SIDE.  
16  
9
2X L/2  
J1  
4. DIMENSION B DOES NOT INCLUDE INTERLEAD  
FLASH OR PROTRUSION. INTERLEAD FLASH OR  
PROTRUSION SHALL NOT EXCEED  
B
–U–  
SECTION N–N  
L
0.25 (0.010) PER SIDE.  
J
5. DIMENSION K DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION  
SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K  
DIMENSION AT MAXIMUM MATERIAL CONDITION.  
6. TERMINAL NUMBERS ARE SHOWN FOR  
REFERENCE ONLY.  
PIN 1  
IDENT.  
8
1
N
0.25 (0.010)  
7. DIMENSION A AND B ARE TO BE DETERMINED AT  
DATUM PLANE –W–.  
S
0.15 (0.006) T  
U
A
M
MILLIMETERS  
INCHES  
–V–  
DIM  
A
B
C
D
MIN  
4.90  
4.30  
–––  
0.05  
0.50  
MAX  
5.10  
4.50  
1.20  
0.15  
0.75  
MIN  
MAX  
0.200  
0.177  
0.047  
0.006  
0.030  
N
0.193  
0.169  
–––  
0.002  
0.020  
F
F
DETAIL E  
G
H
J
J1  
K
K1  
L
0.65 BSC  
0.026 BSC  
0.18  
0.09  
0.09  
0.19  
0.19  
0.28  
0.20  
0.16  
0.30  
0.25  
0.007  
0.004  
0.004  
0.007  
0.007  
0.011  
0.008  
0.006  
0.012  
0.010  
–W–  
C
6.40 BSC  
0.252 BSC  
0.10 (0.004)  
M
0
8
0
8
H
DETAIL E  
SEATING  
PLANE  
–T–  
D
G
MOTOROLA  
6
MC74VHC138  
OUTLINE DIMENSIONS  
M SUFFIX  
PLASTIC SOIC EIAJ PACKAGE  
CASE 966–01  
ISSUE O  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD  
FLASH OR PROTRUSIONS AND ARE MEASURED  
AT THE PARTING LINE. MOLD FLASH OR  
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)  
PER SIDE.  
L
E
16  
9
8
Q
1
H
E
M
4. TERMINAL NUMBERS ARE SHOWN FOR  
REFERENCE ONLY.  
E
5. THE LEAD WIDTH DIMENSION (b) DOES NOT  
INCLUDE DAMBAR PROTRUSION. ALLOWABLE  
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)  
TOTAL IN EXCESS OF THE LEAD WIDTH  
DIMENSION AT MAXIMUM MATERIAL CONDITION.  
DAMBAR CANNOT BE LOCATED ON THE LOWER  
RADIUS OR THE FOOT. MINIMUM SPACE  
BETWEEN PROTRUSIONS AND ADJACENT LEAD  
TO BE 0.46 ( 0.018).  
1
L
DETAIL P  
Z
D
VIEW P  
e
MILLIMETERS  
INCHES  
A
DIM  
A
MIN  
–––  
MAX  
2.05  
0.20  
0.50  
0.27  
10.50  
5.45  
MIN  
MAX  
0.081  
0.008  
0.020  
0.011  
0.413  
0.215  
c
–––  
0.002  
0.014  
0.007  
0.390  
0.201  
A
0.05  
0.35  
0.18  
9.90  
5.10  
1
b
c
D
E
e
A
1
b
1.27 BSC  
0.050 BSC  
0.10 (0.004)  
M
H
0.13 (0.005)  
7.40  
0.50  
1.10  
0
8.20  
0.85  
1.50  
10  
0.291  
0.020  
0.043  
0
0.323  
0.033  
0.059  
10  
E
L
L
M
E
Q
Z
0.70  
–––  
0.90  
0.78  
0.028  
–––  
0.035  
0.031  
1
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding  
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and  
specificallydisclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola  
datasheetsand/orspecificationscananddovaryindifferentapplicationsandactualperformancemayvaryovertime. Alloperatingparameters,includingTypicals”  
must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of  
others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other  
applicationsintended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury  
ordeathmayoccur. ShouldBuyerpurchaseoruseMotorolaproductsforanysuchunintendedorunauthorizedapplication,BuyershallindemnifyandholdMotorola  
and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees  
arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that  
Motorola was negligent regarding the design or manufacture of the part. Motorola and  
Opportunity/Affirmative Action Employer.  
are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal  
Mfax is a trademark of Motorola, Inc.  
How to reach us:  
USA/EUROPE/Locations Not Listed: Motorola Literature Distribution;  
P.O. Box 5405, Denver, Colorado 80217. 303–675–2140 or 1–800–441–2447  
JAPAN: Nippon Motorola Ltd.: SPD, Strategic Planning Office, 4–32–1,  
Nishi–Gotanda, Shinagawa–ku, Tokyo 141, Japan. 81–3–5487–8488  
Mfax : RMFAX0@email.sps.mot.com – TOUCHTONE 602–244–6609  
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– US & Canada ONLY 1–800–774–1848 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298  
INTERNET: http://motorola.com/sps  
MC74VHC138/D  

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Decoder/Driver, CMOS, CDIP24
MOTOROLA

54HC157

HCT157 QUAD 2 CHANNEL MULTIPLEXER HCT158 QUAD 2 CHANNEL MULTIPLEXER INV.
STMICROELECTR