1PMT5927BT3 [MOTOROLA]
PLASTIC SURFACE MOUNT ZENER DIODES 2.5 WATTS 3.3.91 VOLTS; 塑料表面贴装稳压二极管2.5瓦， 91年3月3日伏
| 型号： | 1PMT5927BT3 |
| 厂家： | 
MOTOROLA |
| 描述： | PLASTIC SURFACE MOUNT ZENER DIODES 2.5 WATTS 3.3.91 VOLTS |
| 文件： | 总6页 (文件大小：141K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Order this document
by 1PMT5913BT3/D
SEMICONDUCTOR TECHNICAL DATA
This complete new line of zener/tvs diodes offers a 2.5 watt series in a micro
miniature, space saving surface mount package. The Powermite zener/tvs
diodes are designed for use as a tvs or a regulation device in automotive and
telecommunication applications where efficiency, low leakage, size/height and
profile are important.
PLASTIC SURFACE MOUNT
ZENER DIODES
2.5 WATTS
3.3–91 VOLTS
Features:
•
•
•
•
•
•
•
•
Voltage Range – 3.3 to 91 V
1
ESD Rating of Class 3 (> 16 kV) per Human Body Model
Low Profile – maximum height of 1.1mm
Integral Heat Sink/Locking Tabs
2
Full metallic bottom eliminates flux entrapment
CASE 457–01
PLASTIC
2
Small Footprint – Footprint area of 8.45mm
Supplied in 12mm tape and reel – 12,000 units per reel
Powermite is JEDEC Registered as DO–216AA
1
2
1: CATHODE
2: ANODE
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
DC Power Dissipation @ T = 75°C, Measured at Zero Lead Length
Derate above 75°C
°P
D
°
2.5
40
°Watts°
mW/°C
L
DC Power Dissipation @ T = 25°C(1)
Derate above 25°C
°P
D
°
380
2.8
°mW
mW/°C
A
Thermal Resistance from Junction to Lead
Thermal Resistance from Junction to Ambient
Operating and Storage Junction Temperature Range
R
26
324
°C/W
°C/W
°C
θJL
R
θJA
T
T
– 65 to +150
200
J, stg
(2)
Typical P Dissipation @ T < 25°C, (PW–10/1000 µs per Figure 8)
pk
P
P
Watts
Watts
L
pk
pk
(2)
Typical P Dissipation @ T < 25°C, (PW–8/20 µs per Figure 9)
pk
1000
L
(1)FR4 Board, within 1” to device, using Motorola minimum recommended footprint, as shown in case 403A outline dimensions spec.
(2)Non–repetitive current pulse.
This document contains preview information only and is subject to change without notice.
Powermite is a registered trademark of Microsemi Corporation.
Thermal Clad is a trademark of the Bergquist Company.
Motorola,Inc. 1996
ELECTRICAL CHARACTERISTICS (V = 1.5 Volts Max @ I = 200 mAdc for all types.)
F
F
Nominal
Zener Voltage
Maximum DC
Zener
Max Reverse
Leakage Current
Test
Max Zener Impedance (Note 2)
Current
V
@ I
Volts
Current
Z
ZT
@ I
Z
Z
I
I
V
R
Volts
Device
Marking
I
I
ZT
ZT
ZK
ZK
R
ZT
@
ZM
@
*
Ohms
Ohms
mA
µA
mA
Device
(Note 1)
mAdc
1PMT5913BT3
1PMT5914BT3
1PMT5915BT3
1PMT5916BT3
3.3
3.6
3.9
4.3
113.6
104.2
96.1
10
9
7.5
6
500
500
500
500
1
1
1
1
100
75
25
5
1
1
1
1
454
416
384
348
913B
914B
915B
916B
87.2
1PMT5917BT3
1PMT5918BT3
1PMT5919BT3
1PMT5920BT3
4.7
5.1
5.6
6.2
79.8
73.5
66.9
60.5
5
4
2
2
500
350
250
200
1
1
1
1
5
5
5
5
1.5
2
3
319
294
267
241
917B
918B
919B
920B
4
1PMT5921BT3
1PMT5922BT3
1PMT5923BT3
1PMT5924BT3
6.8
7.5
8.2
9.1
55.1
50
45.7
41.2
2.5
3
3.5
4
200
400
400
500
1
5
5
5
5
5.2
6.8
6.5
7
220
200
182
164
921B
922B
923B
924B
0.5
0.5
0.5
1PMT5925BT3
1PMT5926BT3
1PMT5927BT3
1PMT5928BT3
10
11
12
13
37.5
34.1
31.2
28.8
4.5
5.5
6.5
7
500
550
550
550
0.25
0.25
0.25
0.25
5
1
1
1
8
150
136
125
115
925B
926B
927B
928B
8.4
9.1
9.9
1PMT5929BT3
1PMT5930BT3
1PMT5931BT3
1PMT5932BT3
15
16
18
20
25
9
600
600
650
650
0.25
0.25
0.25
0.25
1
1
1
1
11.4
12.2
13.7
15.2
100
93
83
929B
930B
931B
932B
23.4
20.8
18.7
10
12
14
75
1PMT5933BT3
1PMT5934BT3
1PMT5935BT3
1PMT5936BT3
22
24
27
30
17
17.5
19
23
650
700
700
750
0.25
0.25
0.25
0.25
1
1
1
1
16.7
18.2
20.6
22.8
68
62
55
50
933B
934B
935B
936B
15.6
13.9
12.5
26
1PMT5937BT3
1PMT5938BT3
1PMT5939BT3
1PMT5940BT3
33
36
39
43
11.4
10.4
9.6
33
38
45
53
800
850
900
950
0.25
0.25
0.25
0.25
1
1
1
1
25.1
27.4
29.7
32.7
45
41
38
34
937B
938B
939B
940B
8.7
1PMT5941BT3
1PMT5942BT3
1PMT5943BT3
1PMT5944BT3
47
51
56
62
8
67
70
86
1000
1100
1300
1500
0.25
0.25
0.25
0.25
1
1
1
1
35.8
38.8
42.6
47.1
31
29
26
24
941B
942B
943B
944B
7.3
6.7
6
100
1PMT5945BT3
1PMT5946BT3
1PMT5947BT3
1PMT5948BT3
68
75
82
91
5.5
5
4.6
4.1
120
140
160
200
1700
2000
2500
3000
0.25
0.25
0.25
0.25
1
1
1
1
51.7
56
62.2
69.2
22
20
18
16
945B
946B
947B
948B
* TOLERANCE AND VOLTAGE DESIGNATION Tolerance designation — The type numbers listed indicate a tolerance of ±5%.
Devices listed in bold, italic are Motorola preferred devices.
MOTOROLA
2
1PMT5913BT3 through 1PMT5948BT3
TYPICAL CHARACTERISTICS
1000
6
5
RECTANGULAR
NONREPETITIVE
WAVEFORM
4
3
2
1
0
T
L
100
T
A
10
0.1
0
25
50
75
T, TEMPERATURE (
100
C)
125
150
1
10
100
°
PW, PULSE WIDTH (ms)
Figure 1. Steady State Power Derating
Figure 2. Maximum Surge Power
10
120
T
A
= 25°C
= 10
µ
s
NONREPETITIVE
EXPONENTIAL
PULSE WAVEFORM
PW (I ) IS DEFINED AS THE
D
100
80
POINT WHERE THE PEAK CURRENT
DECAYS TO 50% OF I
PEAK VALUE
I
.
pp
T
= 25°C
J
ppm
60
1
HALF VALUE – I /2
pp
40
10/1000
µs WAVEFORM
AS DEFINED BY R.E.A.
20
0
t
d
0.1
0.001
0.01
0.1
T , PULSE WIDTH (ms)
1
10
5
0
1
2
3
4
t, TIME (ms)
p
Figure 3. Maximum Surge Power
Figure 4. Pulse Waveform 10/1000
10
200
100
8
V
@ I
ZT
Z
V
@ I
ZT
Z
6
4
70
50
2
30
20
0
–2
–4
10
10
2
4
6
8
10
12
20
30
50
70
100
200
V , ZENER VOLTAGE (VOLTS)
Z
V , ZENER VOLTAGE (VOLTS)
Z
Figure 5. Zener Voltage – To 12 Volts
Figure 6. Zener Voltage – 14 To 200 Volts
NOTE 1. ZENER VOLTAGE (V ) MEASUREMENT
Z
Nominal zener voltage is measured with the device junction
in thermal equilibrium with ambient temperature at 25°C
MOTOROLA
3
1PMT5913BT3 through 1PMT5948BT3
100
50
100
50
30
20
30
20
10
10
5
3
2
5
3
2
1
1
0.5
0.5
0.3
0.2
0.3
0.2
0.1
0.1
0
10
20
30
40
50
60
70
80
90
100
0
1
2
3
4
5
6
7
8
9
10
V , ZENER VOLTAGE (VOLTS)
V , ZENER VOLTAGE (VOLTS)
Z
Z
Figure 7. V = 3.3 thru 10 Volts
Figure 8. V = 12 thru 82 Volts
Z
Z
200
1k
I
= 1mA
Z(dc)
T
i
= 25°C
J
500
= 0.1 I
100
70
Z(rms)
Z(dc)
200
100
50
V
=150V
91V
Z
50
30
20
62V
20
10
5
10mA
10
7
22V
5
2
1
20mA
10
3
2
12V
i
= 0.1 I
Z(dc)
Z(rms)
50
6.8V
100 200 500
5
7
20
30
70
100
0.5
1
2
5
10
20
50
V , ZENER VOLTAGE (VOLTS)
I , ZENER TEST CURRENT (mA)
Z
Z
Figure 9. Effect of Zener Voltage
Figure 10. Effect of Zener Current
NOTE 2. ZENER IMPEDANCE (Z ) DERIVATION
Z
Z
ZT
and Z
are measured by dividing the ac voltage drop
ZK
across the device by the ac current applied. The specified
limits are for I (ac) = 0.1 I (dc) with the ac frequency = 60 Hz.
Z
Z
MOTOROLA
4
1PMT5913BT3 through 1PMT5948BT3
INFORMATION FOR USING THE POWERMITE SURFACE MOUNT PACKAGE
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the semiconductor packages must
be the correct size to insure proper solder connection
interface between the board and the package. With the
correct pad geometry, the packages will self align when
subjected to a solder reflow process.
0.025
0.635
0.105
2.67
0.030
0.762
0.100
2.54
0.050
1.27
inches
mm
POWERMITE
POWERMITE POWER DISSIPATION
The power dissipation of the Powermite is a function of the
SOLDERING PRECAUTIONS
drain pad size. This can vary from the minimum pad size for
soldering to a pad size given for maximum power dissipation.
Power dissipation for a surface mount device is determined
The melting temperature of solder is higher than the rated
temperature of the device. When the entire device is heated
to a high temperature, failure to complete soldering within a
short time could result in device failure. Therefore, the
following items should always be observed in order to
minimize the thermal stress to which the devices are
subjected.
• Always preheat the device.
• The delta temperature between the preheat and soldering
should be 100°C or less.*
by T
, the maximum rated junction temperature of the
, the thermal resistance from the device junction to
J(max)
die, R
θJA
ambient, and the operating temperature, T . Using the
values provided on the data sheet for the Powermite
A
package, P can be calculated as follows:
D
T
– T
A
J(max)
P
=
D
R
θJA
• When preheating and soldering, the temperature of the
leads and the case must not exceed the maximum
temperature ratings as shown on the data sheet. When
using infrared heating with the reflow soldering method,
the difference shall be a maximum of 10°C.
• The soldering temperature and time shall not exceed
260°C for more than 10 seconds.
• When shifting from preheating to soldering, the maximum
temperature gradient shall be 5°C or less.
• After soldering has been completed, the device should be
allowed to cool naturally for at least three minutes.
Gradual cooling should be used as the use of forced
cooling will increase the temperature gradient and result
in latent failure due to mechanical stress.
The values for the equation are found in the maximum
ratings table on the data sheet. Substituting these values into
the equation for an ambient temperature T of 25°C, one can
A
calculate the power dissipation of the device which in this
case is 386 milliwatts.
150°C – 25°C
324°C/W
P
=
= 386 milliwatts
D
The 324°C/W for the Powermite package assumes the use
of the recommended footprint on a glass epoxy printed circuit
board to achieve a power dissipation of 386 milliwatts. There
are other alternatives to achieving higher power dissipation
from the Powermite package. Another alternative would be
to use a ceramic substrate or an aluminum core board such
as Thermal Clad . Using a board material such as Thermal
Clad, an aluminum core board, the power dissipation can be
doubled using the same footprint.
• Mechanical stress or shock should not be applied during
cooling.
* Soldering a device without preheating can cause excessive
thermal shock and stress which can result in damage to the
device.
MOTOROLA
5
1PMT5913BT3 through 1PMT5948BT3
OUTLINE DIMENSIONS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
F
C
–A–
M
S
S
0.08 (0.003)
T
B
C
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH,
PROTRUSIONS OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
J
S
MILLIMETERS
INCHES
TERM. 1 CATHODE
TERM. 2 ANODE
DIM
A
B
C
D
F
H
J
K
L
MIN
1.75
1.75
0.85
0.40
0.70
–0.05
0.10
3.60
0.50
1.20
MAX
2.15
2.15
1.15
0.65
1.00
MIN
MAX
0.081
0.086
0.045
0.026
0.039
–B–
0.069
0.069
0.033
0.016
0.028
K
+0.10 –0.002 +0.004
0.25
4.15
0.80
1.50
0.004
0.142
0.020
0.047
0.010
0.163
0.031
0.059
R
L
R
S
0.50 REF
0.020
J
D
H
M
S
S
0.08 (0.003)
T
B
C
–T–
CASE 457–01
ISSUE O
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specificallydisclaims any and all liability, includingwithoutlimitationconsequentialorincidentaldamages. “Typical” parameters which may be provided in Motorola
datasheetsand/orspecificationscananddovaryindifferentapplicationsandactualperformancemayvaryovertime. Alloperatingparameters,including“Typicals”
must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of
others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other
applicationsintended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury
ordeathmayoccur. ShouldBuyerpurchaseoruseMotorolaproductsforanysuchunintendedorunauthorizedapplication,BuyershallindemnifyandholdMotorola
and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees
arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that
Motorola was negligent regarding the design or manufacture of the part. Motorola and
Opportunity/Affirmative Action Employer.
are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal
How to reach us:
USA/EUROPE/Locations Not Listed: Motorola Literature Distribution;
P.O. Box 20912; Phoenix, Arizona 85036. 1–800–441–2447 or 602–303–5454
JAPAN: Nippon Motorola Ltd.; Tatsumi–SPD–JLDC, 6F Seibu–Butsuryu–Center,
3–14–2 Tatsumi Koto–Ku, Tokyo 135, Japan. 03–81–3521–8315
MFAX: RMFAX0@email.sps.mot.com – TOUCHTONE 602–244–6609
INTERNET: http://Design–NET.com
ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park,
51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298
1PMT5913BT3/D
◊
相关型号：
1PMT5927C/TR7
Zener Diode, 12V V(Z), 2%, 3W, Silicon, Unidirectional, DO-216AA, DO-216, 2 PIN
MICROSEMI
1PMT5927CE3
Zener Diode, 12V V(Z), 2%, 0.54W, Silicon, Unidirectional, DO-216AA, ROHS COMPLIANT, PLASTIC, DO-216, 2 PIN
MICROSEMI
1PMT5928B/TR13
Zener Diode, 13V V(Z), 5%, 3W, Silicon, Unidirectional, DO-216AA, DO-216, 2 PIN
MICROSEMI
1PMT5928BE3
Zener Diode, 13V V(Z), 5%, 0.54W, Silicon, Unidirectional, DO-216AA, ROHS COMPLIANT, PLASTIC, DO-216, 2 PIN
MICROSEMI
1PMT5928BE3/TR13
Zener Diode, 13V V(Z), 5%, 0.54W, Silicon, Unidirectional, DO-216AA, ROHS COMPLIANT, PLASTIC, DO-216, 2 PIN
MICROSEMI
©2020 ICPDF网 联系我们和版权申明