V62C18164096L-100B [MOSEL]

256K x 16, CMOS STATIC RAM; 256K ×16 , CMOS静态RAM
V62C18164096L-100B
型号: V62C18164096L-100B
厂家: MOSEL VITELIC, CORP    MOSEL VITELIC, CORP
描述:

256K x 16, CMOS STATIC RAM
256K ×16 , CMOS静态RAM

内存集成电路 静态存储器
文件: 总10页 (文件大小:54K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
                
PRELIMINARY  
V62C18164096  
MO SEL VITELIC  
256K x 16, CMOS STATIC RAM  
Features  
Description  
  High-speed: 85, 100 ns  
  Ultra low CMOS standby current of 2µA (max.)  
  Fully static operation  
  All inputs and outputs directly TTL compatible  
  Three state outputs  
The V62C18164096 is a 4,194,304-bit static  
random-access memory organized as 262,144  
words by 16 bits. Inputs and three-state outputs are  
TTL compatible and allow for direct interfacing with  
common system bus structures.  
  Ultra low data retention current (V = 1.0V)  
CC  
  Operating voltage: 1.8V – 2.3V  
  Packages  
– 48-Ball CSP BGA (8mm x 10mm)  
Functional Block Diagram  
A0  
VCC  
GND  
A6  
A7  
A8  
A9  
Row  
Decoder  
1024 x 4096  
Memory Array  
I/O1  
Column I/O  
Input  
Data  
Circuit  
Column Decoder  
I/O16  
A10  
A17  
UBE  
LBE  
OE  
Control  
WE  
CE1  
CE2  
Circuit  
Device Usage Chart  
Package Outline  
Access Time (ns)  
Power  
Operating Temperature  
Range  
Temperature  
Mark  
B
85  
100  
L
LL  
0°C to 70°C  
Blank  
I
–40°C to +85°C  
V62C18164096 Rev. 1.2 June 2000  
1
MO SEL VITELIC  
V62C18164096  
UBE, LBE Byte Enable  
Pin Descriptions  
Active low inputs. These inputs are used to enable  
the upper or lower data byte.  
A –A  
Address Inputs  
0
17  
These 18 address inputs select one of the 256K x  
16 bit segments in the RAM.  
WE  
Write Enable Input  
The write enable input is active LOW and controls  
read and write operations. With the chip enabled,  
when WE is HIGH and OE is LOW, output data will  
be present at the I/O pins; when WE is LOW and  
OE is HIGH, the data present on the I/O pins will be  
written into the selected memory locations.  
CE , CE Chip Enable Inputs  
1
2
CE is active LOW and CE is active HIGH. Both  
1
2
chip enables must be active to read from or write to  
the device. If either chip enable is not active, the  
device is deselected and is in a standby power  
mode. The I/O pins will be in the high-impedance  
state when deselected.  
I/O –I/O  
Data Input and Data Output Ports  
1
16  
These 16 bidirectional ports are used to read data  
from and write data into the RAM.  
OE  
Output Enable Input  
The output enable input is active LOW. With the  
chip enabled, when OE is Low and WE High, data  
will be presented on the I/O pins. The I/O pins will  
be in the high impedance state when OE is High.  
V
Power Supply  
Ground  
CC  
GND  
Pin Configurations (Top View)  
48 BGA  
1
2
3
4
5
6
1
2
3
4
5
6
BLE OE A0 A1 A2 CE2  
I/O9 BHE A3 A4 CE1 I/O1  
I/O10 I/O11 A5 A6 I/O2 I/O3  
VSS I/O12 A17 A7 I/O4 VCC  
A
B
C
A
B
C
D
E
F
D
VCC I/O13 NC A16 I/O5 VSS  
I/O15 I/O14 A14 A15 I/O6 I/O7  
I/O16 NC A12 A13 WE I/O8  
E
F
G
G
NC  
A8 A9 A10 A11 NC  
H
H
Note: NC means no connect.  
TOP VIEW  
TOP VIEW  
V62C18164096 Rev. 1.2 June 2000  
2
MO SEL VITELIC  
V62C18164096  
Part Number Information  
V
62  
C
18  
16 4096  
MOSEL-VITELIC  
MANUFACTURED  
TEMP.  
SRAM  
FAMILY  
OPERATING  
VOLTAGE  
DENSITY  
4096K  
SPEED  
PKG  
BLANK = 0°C to 70°C  
I = -40°C to +85°C  
PWR.  
62 = STANDARD  
85 ns  
100 ns  
C = CMOS PROCESS  
B = BGA  
18 = 1.8V 2.3V  
ORGANIZATION  
L = LOW POWER  
LL = DOUBLE LOW POWER  
16 = 16-bit  
Absolute Maximum Ratings (1)  
Symbol  
Parameter  
Commercial  
Industrial  
Units  
V
V
Supply Voltage  
-0.5 to V  
-0.5 to V  
+ 0.5  
+ 0.5  
-0.5 to V  
-0.5 to V  
+ 0.5  
+ 0.5  
CC  
CC  
CC  
CC  
CC  
V
N
Input Voltage  
V
V
Input/Output Voltage Applied  
Temperature Under Bias  
Storage Temperature  
V
+ 0.3  
V
+ 0.3  
V
DQ  
CC  
CC  
T
-10 to +125  
-55 to +125  
-65 to +135  
-65 to +150  
°C  
°C  
BIAS  
T
STG  
NOTE:  
1. Stresses greater than those listed under Absolute Maximum Ratingsmay cause permanent damage to the device. This is a stress  
rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of  
this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.  
Capacitance* T = 25°C, f = 1.0MHz  
A
Symbol Parameter  
Conditions Max. Unit  
C
C
Input Capacitance  
Output Capacitance  
V
= 0V  
= 0V  
6
8
pF  
pF  
IN  
IN  
V
OUT  
I/O  
NOTE:  
1. This parameter is guaranteed and not tested.  
Truth Table  
I/O9-16  
I/O1-8  
Mode  
CE  
H
X
L
CE  
X
OE  
X
X
X
H
L
WE UBE LBE Operation Operation  
1
2
Standby  
Standby  
Output Disable  
Output Disable  
Read  
X
X
X
H
H
H
H
L
X
X
H
X
L
X
X
H
X
L
High Z  
High Z  
High Z  
High Z  
High Z  
High Z  
High Z  
High Z  
L
H
H
H
H
H
H
H
H
L
L
D
D
OUT  
OUT  
Read  
L
L
L
H
L
D
High Z  
OUT  
Read  
L
L
H
L
High Z  
D
OUT  
Write  
L
X
X
X
L
D
D
IN  
IN  
Write  
L
L
L
H
L
D
High Z  
IN  
Write  
L
L
H
High Z  
D
IN  
NOTE:  
X = Dont Care, L = LOW, H = HIGH  
V62C18164096 Rev. 1.2 June 2000  
3
MO SEL VITELIC  
V62C18164096  
DC Electrical Characteristics (over all temperature ranges, V = 1.8V 2.3V)  
CC  
Symbol Parameter  
Test Conditions  
Min.  
-0.3  
1.6  
-1  
Typ.  
Max.  
Units  
V
(1,2)  
(1)  
V
Input LOW Voltage  
0.4  
IL  
IH  
IL  
V
Input HIGH Voltage  
V
+ 0.3  
V
CC  
I
Input Leakage Current  
Output Leakage Current  
Output LOW Voltage  
Output HIGH Voltage  
V
V
V
V
= Max, V = 0V to V  
1
µA  
µA  
V
CC  
CC  
CC  
CC  
IN  
CC  
I
= Max, CE = V , V  
= 0V to V  
CC  
-1  
1
OL  
IH  
OUT  
V
= Min, I = 2.1mA  
0.4  
OL  
OL  
V
= Min, I = -0. 1mA  
V
0.4  
V
OH  
OH  
CC  
Symbol Parameter  
Power Com.(3) Ind.(3)  
Units  
I
Average Operating Current, CE = V , CE = VCC 0.2V, Output Open,  
f = fmax  
25  
2
30  
3
mA  
CC1  
1
IL  
2
V
= Max.  
CC  
f = 1 MHz  
I
TTL Standby Current  
CE V , V = Max., f = 0  
L
LL  
L
0.4  
0.3  
5
0.5  
0.3  
7
mA  
SB  
IH  
CC  
I
CMOS Standby Current, CE V 0.2V, CE < 0.2V  
µA  
SB1  
1
CC  
2
V
V 0.2V or V 0.2V, V = Max., f = 0  
CC IN CC  
IN  
LL  
2
3
NOTES:  
1. These are absolute values with respect to device ground and all overshoots due to system or tester noise are included.  
2. (Min.) = -3.0V for pulse width < 20ns.  
V
IL  
3. Maximum values.  
AC Test Conditions  
Key to Switching Waveforms  
Input Pulse Levels  
0 to 1.6V  
5 ns  
WAVEFORM  
INPUTS  
OUTPUTS  
Input Rise and Fall Times  
Timing Reference Levels  
Output Load  
MUST BE  
STEADY  
WILL BE  
STEADY  
0.9V  
see below  
MAY CHANGE  
FROM H TO L  
WILL BE  
CHANGING  
FROM H TO L  
AC Test Loads and Waveforms  
MAY CHANGE  
FROM L TO H  
WILL BE  
CHANGING  
FROM L TO H  
TTL  
CL*  
DON'T CARE:  
ANY CHANGE  
PERMITTED  
CHANGING:  
STATE  
UNKNOWN  
CENTER  
* Includes scope and jig capacitance  
CL = 30 pF + 1 TTL Load  
DOES NOT  
APPLY  
LINE IS HIGH  
IMPEDANCE  
OFFSTATE  
V62C18164096 Rev. 1.2 June 2000  
4
MO SEL VITELIC  
V62C18164096  
Data Retention Characteristics  
Symbol  
Parameter  
Power  
Min.  
Typ.(2)  
Max.  
Units  
V
V
for Data Retention  
CC  
1.0  
2.3  
V
DR  
CE V 0.2V, CE < 0.2V, V V 0.2V,  
1
CC  
2
IN  
CC  
or V 0.2V  
IN  
I
Data Retention Current  
CE V 0.2V, CE < 0.2V, V V 0.2V,  
Coml  
L
LL  
L
1
0.5  
3
1.5  
5
µA  
CCDR  
1
DR  
2
IN  
CC  
or V 0.2V, V = 1.0V  
IN  
DR  
Ind.  
LL  
2
t
Chip Deselect to Data Retention Time  
Operation Recovery Time (see Retention Waveform)  
0
ns  
ns  
CDR  
(1)  
t
t
RC  
R
NOTES:  
1.  
2.  
t
T
= Read Cycle Time  
= +25°C.  
RC  
A
Low V Data Retention Waveform (CE Controlled)  
CC  
Data Retention Mode  
DR 1V  
VCC  
CE1  
1.8V  
tCDR  
1.8V  
V
tR  
CE1 VCC 0.2V  
1.6V  
1.6V  
V62C18164096 Rev. 1.2 June 2000  
5
MO SEL VITELIC  
V62C18164096  
AC Electrical Characteristics  
(over all temperature ranges)  
Read Cycle  
85  
100  
Parameter  
Name  
Parameter  
Min.  
85  
10  
10  
10  
0
Max.  
Min.  
70  
15  
15  
10  
0
Max.  
Unit  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
t
t
t
t
t
t
t
t
t
t
t
t
Read Cycle Time  
RC  
Address Access Time  
85  
85  
85  
35  
100  
100  
100  
40  
AA  
Chip Enable Access Time  
UBE, LBE Access Time  
ACS  
BA  
Output Enable to Output Valid  
Chip Enable to Output in Low Z  
UBE, LBE to Output in Low Z  
Output Enable to Output in Low Z  
Chip Disable to Output in High Z  
Output Disable to Output in High Z  
UBE, LBE to Output in High Z  
Output Hold from Address Change  
OE  
CLZ  
BLZ  
OLZ  
CHZ  
OHZ  
BHZ  
OH  
30  
30  
30  
35  
0
0
35  
0
0
35  
10  
10  
Write Cycle  
85  
100  
Parameter  
Name  
Parameter  
Min.  
85  
70  
0
Max.  
Min.  
100  
80  
0
Max.  
Unit  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
t
Write Cycle Time  
WC  
t
Chip Enable to End of Write  
Address Setup Time  
CW  
t
AS  
t
Address Valid to End of Write  
Write Pulse Width  
70  
60  
0
80  
70  
0
AW  
t
WP  
t
Write Recovery Time  
Write to Output High-Z  
Data Setup to End of Write  
Data Hold from End of Write  
UBE, LBE to End of Write  
WR  
t
0
25  
0
35  
WHZ  
t
40  
0
45  
0
DW  
t
DH  
t
70  
80  
BW  
V62C18164096 Rev. 1.2 June 2000  
6
MO SEL VITELIC  
V62C18164096  
Switching Waveforms (Read Cycle)  
(1, 2)  
Read Cycle 1  
tRC  
ADDRESS  
OE  
tAA  
tOE  
(5)  
tOHZ  
tOLZ  
tBLZ  
tBHZ  
UBE, LBE  
I/O  
tBA  
(1, 2, 4, 6)  
Read Cycle 2  
tRC  
ADDRESS  
tAA  
tOH  
tOH  
I/O  
(1, 3, 4, 6)  
Read Cycle 3  
ADDRESS  
tACS  
CE1  
CE2  
I/O  
(5)  
tCHZ  
(5)  
tCLZ  
NOTES:  
1. WE = V  
.
IH  
2. CE = V . CE = V .  
1
IL  
2
IH  
3. Address valid prior to or coincident with CE transition LOW.  
4. OE = V .  
IL  
5. Transition is measured ±500mV from steady state with C = 5pF. This parameter is guaranteed and not 100% tested.  
L
6. UBE = V , LBE = V .  
IL  
IL  
V62C18164096 Rev. 1.2 June 2000  
7
MO SEL VITELIC  
V62C18164096  
Switching Waveforms (Write Cycle)  
(4)  
Write Cycle 1 (WE Controlled)  
tWC  
ADDRESS  
(2)  
tWR  
(6)  
tCW  
CE1  
CE2  
tAW  
(6)  
tCW  
tAS  
WE  
(1)  
tWP  
OUTPUT  
tDW  
tDH  
tWHZ  
INPUT  
Write Cycle 2 (CE Controlled)  
ADDRESS  
(4)  
tWC  
(2)  
tWR  
(6)  
tCW  
(4)  
CE1  
CE2  
WE  
tAW  
(6)  
tCW  
tAS  
High-Z  
OUTPUT  
INPUT  
tDW  
tDH  
(5)  
NOTES:  
1. The internal write time of the memory is defined by the overlap of CE and CE active and WE low. All signals must be active to  
1
2
initiate and any one signal can terminate a write by going inactive. The data input setup and hold timing should be referenced to  
the second transition edge of the signal that terminates the write.  
2.  
3. During this period, I/O pins are in the output state so that the input signals of opposite phase to the outputs must not be applied.  
4. OE = V or V . However it is recommended to keep OE at V during write cycle to avoid bus contention.  
t
is measured from the earlier of CE or WE going high, or CE going LOW at the end of the write cycle.  
WR 1 2  
IL  
IH  
IH  
5. If CE is LOW and CE is HIGH during this period, I/O pins are in the output state. Then the data input signals of opposite phase  
1
2
to the outputs must not be applied to them.  
is measured from CE going low or CE going HIGH to the end of write.  
6.  
t
CW  
1
2
V62C18164096 Rev. 1.2 June 2000  
8
MO SEL VITELIC  
V62C18164096  
Package Diagrams  
48 Ball8x10 BGA  
D
SYMBOL  
UNIT.MM  
1.05+0.15  
0.25±0.05  
0.35±.0.05  
0.30(TYP)  
10.00±0.10  
5.25  
D1  
A
A1  
b
6
5
4
3
c
D
D1  
E
8.00±0.10  
3.75  
E1  
e
0.75TYP  
0.10  
aaa  
2
1
A
B
C
D
E
F
G
H
b
SOLDER BALL  
BOTTOM VIEW  
aaa  
SIDE VIEW  
V62C18164096 Rev. 1.2 June 2000  
9
MO SEL VITELIC WORLDWIDE OFFICES  
V62C18164096  
U.S.A.  
TAIWAN  
SINGAPORE  
UK & IRELAND  
3910 NORTH FIRST STREET  
SAN JOSE, CA 95134  
PHONE: 408-433-6000  
FAX: 408-433-0952  
7F, NO. 102  
10 ANSON ROAD #23-13  
INTERNATIONAL PLAZA  
SINGAPORE 079903  
PHONE: 65-3231801  
FAX: 65-3237013  
SUITE 50, GROVEWOOD  
BUSINESS CENTRE  
STRATHCLYDE BUSINESS  
PARK  
MIN-CHUAN E. ROAD, SEC. 3  
TAIPEI  
PHONE: 886-2-2545-1213  
FAX: 886-2-2545-1209  
BELLSHILL, LANARKSHIRE,  
SCOTLAND, ML4 3NQ  
PHONE: 01698-748515  
FAX: 01698-748516  
HONG KONG  
19 DAI FU STREET  
TAIPO INDUSTRIAL ESTATE  
TAIPO, NT, HONG KONG  
PHONE: 852-2666-3307  
FAX: 852-2770-8011  
NO 19 LI HSIN RD.  
JAPAN  
SCIENCE BASED IND. PARK  
HSIN CHU, TAIWAN, R.O.C.  
PHONE: 886-3-579-5888  
FAX: 886-3-566-5888  
WBG MARIVE WEST 25F  
6, NAKASE 2-CHOME  
MIHAMA-KU, CHIBA-SHI  
CHIBA 261-7125  
GERMANY  
(CONTINENTAL  
EUROPE & ISRAEL)  
71083 HERRENBERG  
BENZSTR. 32  
PHONE: 81-43-299-6000  
FAX: 81-43-299-6555  
GERMANY  
PHONE: +49 7032 2796-0  
FAX: +49 7032 2796 22  
U.S. SALES OFFICES  
NORTHWESTERN  
3910 NORTH FIRST STREET  
SAN JOSE, CA 95134  
PHONE: 408-433-6000  
FAX: 408-433-0952  
SOUTHWESTERN  
302 N. EL CAMINO REAL #200  
SAN CLEMENTE, CA 92672  
PHONE: 949-361-7873  
FAX: 949-361-7807  
CENTRAL,  
NORTHEASTERN &  
SOUTHEASTERN  
604 FIELDWOOD CIRCLE  
RICHARDSON, TX 75081  
PHONE: 972-690-1402  
FAX: 972-690-0341  
6/00  
Printed in U.S.A.  
© Copyright 2000, MOSEL VITELIC Inc.  
The information in this document is subject to change without  
notice.  
MOSEL VITELIC subjects its products to normal quality control  
sampling techniques which are intended to provide an assurance  
of high quality products suitable for usual commercial applica-  
tions. MOSEL VITELIC does not do testing appropriate to provide  
100% product quality assurance and does not assume any liabil-  
ity for consequential or incidental arising from any use of its prod-  
ucts. If such products are to be used in applications in which  
personal injury might occur from failure, purchaser must do its  
own quality assurance testing appropriate to such applications.  
MOSEL VITELIC makes no commitment to update or keep cur-  
rent the information contained in this document. No part of this  
document may be copied or reproduced in any form or by any  
means without the prior written consent of MOSEL-VITELIC.  
MO SEL VITELIC 3910 N. First Street, San Jose, CA 95134-1501 Ph: (408) 433-6000 Fax: (408) 433-0952 Tlx: 371-9461  

相关型号:

V62C21164096

256K x 16, 0.20 um CMOS STATIC RAM
MOSEL

V62C21164096L-70B

256K x 16, 0.20 um CMOS STATIC RAM
MOSEL

V62C21164096L-70BI

256K x 16, 0.20 um CMOS STATIC RAM
MOSEL

V62C21164096L-70T

256K x 16, 0.20 um CMOS STATIC RAM
MOSEL

V62C21164096L-70TI

256K x 16, 0.20 um CMOS STATIC RAM
MOSEL

V62C21164096L-85B

256K x 16, 0.20 um CMOS STATIC RAM
MOSEL

V62C21164096L-85BI

256K x 16, 0.20 um CMOS STATIC RAM
MOSEL

V62C21164096L-85T

256K x 16, 0.20 um CMOS STATIC RAM
MOSEL

V62C21164096L-85TI

256K x 16, 0.20 um CMOS STATIC RAM
MOSEL

V62C21164096LL-70B

256K x 16, 0.20 um CMOS STATIC RAM
MOSEL

V62C21164096LL-70BI

256K x 16, 0.20 um CMOS STATIC RAM
MOSEL

V62C21164096LL-70T

256K x 16, 0.20 um CMOS STATIC RAM
MOSEL