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A-70567-0153 [MOLEX]

2.54mm (.100) Pitch C-GridÂ® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating; 2.54毫米（ .100 ）间距C- GridÂ®头，通孔无钉，双排，垂直，罩，高温， 6电路，锡（Sn ）镀层

A-70567-0153


元器件型号：	A-70567-0153
生产厂家：	Molex Electronics Ltd.
描述和应用：	2.54mm (.100) Pitch C-GridÂ® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating 2.54毫米（ .100 ）间距C- GridÂ®头，通孔无钉，双排，垂直，罩，高温， 6电路，锡（Sn ）镀层
PDF文件：	总7页 (文件大小：1221K)
下载文档：	下载PDF数据表文档文件
型号参数：A-70567-0153参数

A-70567-0154

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 40 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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4 MOLEX

A-70567-0154

2.54mm (.100) Pitch C-GridÂ® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating

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2 MOLEX

A-70567-0155

2.54mm (.100) Pitch C-GridÂ® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating

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5 MOLEX

A-70567-0155

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 42 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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2 MOLEX

A-70567-0156

2.54mm (.100) Pitch C-GridÂ® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating

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1 MOLEX

A-70567-0157

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 46 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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1 MOLEX

A-70567-0157

2.54mm (.100) Pitch C-GridÂ® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating

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3 MOLEX

A-70567-0158

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 48 Circuits

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2 MOLEX

A-70567-0158

2.54mm (.100) Pitch C-GridÂ® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating

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2 MOLEX

A-70567-0159

2.54mm (.100) Pitch C-GridÂ® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating

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2 MOLEX

A-70567-0159

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 50 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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1 MOLEX

A-70567-0160

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 52 Circuits

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1 MOLEX

A-70567-0160

2.54mm (.100) Pitch C-GridÂ® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating

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2 MOLEX

A-70567-0161

2.54mm (.100) Pitch C-GridÂ® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating

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0 MOLEX

A-70567-0161

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 54 Circuits

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2 MOLEX

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