90151-2212 [MOLEX]
2.54mm (.100) Pitch C-Grid III™ PC Board Connector, Dual Row, Vertical, 12 Circuits; 2.54毫米（ .100 ）间距C-电网III ™PC板连接器，双排，垂直， 12电路
| 型号： | 90151-2212 |
| 厂家： | 
Molex |
| 描述： | 2.54mm (.100) Pitch C-Grid III™ PC Board Connector, Dual Row, Vertical, 12 Circuits |
| 文件： | 总4页 (文件大小：209K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
This document was generated on 05/24/2010
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
Part Number:
Status:
0901512140
Active
cgrid__sl_products
Overview:
Description:
2.54mm (.100") Pitch C-Grid III™ PC Board Connector, Dual Row, Vertical, 40 Circuits
Documents:
3D Model
RoHS Certificate of Compliance (PDF)
Drawing (PDF)
Series
image - Reference only
General
Product Family
Series
Application
Overview
PCB Receptacles
90151
Board-to-Board
cgrid__sl_products
C-Grid III™
EU RoHS
ELV and RoHS
Compliant
China RoHS
Product Name
REACH SVHC
Contains SVHC: No
Halogen-Free
Status
Physical
Circuits (Loaded)
40
Black
Color - Resin
Not Halogen-Free
Need more information on product
environmental compliance?
Glow-Wire Compliant
Guide to Mating Part
Keying to Mating Part
Lock to Mating Part
No
No
None
No
Phosphor Bronze
Tin
Tin
Polyester
2
Vertical
0.114 In
2.90 mm
No
Email productcompliance@molex.com
For a multiple part number RoHS Certificate of
Compliance, click here
Material - Metal
Material - Plating Mating
Material - Plating Termination
Material - Resin
Number of Rows
Orientation
PC Tail Length (in)
PC Tail Length (mm)
PCB Locator
Please visit the Contact Us section for any
non-product compliance questions.
Search Parts in this Series
90151Series
PCB Retention
None
PCB Thickness Recommended (in)
PCB Thickness Recommended (mm)
Packaging Type
0.062 In
1.60 mm
Tube
Mates With
0.64mm (.025") square pins
Pitch - Mating Interface (in)
Pitch - Mating Interface (mm)
Plating min: Mating (µin)
Plating min: Mating (µm)
Plating min: Termination (µin)
Plating min: Termination (µm)
Polarized to PCB
0.100 In
2.54 mm
40
1.00
40
1.00
No
Temperature Range - Operating
Termination Interface: Style
-55°C to +125°C
Through Hole
Electrical
Current - Maximum per Contact
Grounding to PCB
3A
No
Voltage - Maximum
350V
Solder Process Data
Duration at Max. Process Temperature (seconds)
Lead-free Process Capability
5
Wave Capable (TH only)
Max. Cycles at Max. Process Temperature
Process Temperature max. C
1
230
Material Info
Reference - Drawing Numbers
Sales Drawing
SDA-90151
This document was generated on 05/24/2010
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
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