90136-1125 [MOLEX]
2.54mm (.100) Pitch C-Grid III™ Header, Single Row, Vertical, Shrouded, 25 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni); 2.54毫米（ .100 ）间距C-电网III ™头，单列，立式，带罩， 25电路，为4μm （ 160μ ）锡/铅（Sn ）在镍（Ni ）
| 型号： | 90136-1125 |
| 厂家： | 
Molex |
| 描述： | 2.54mm (.100) Pitch C-Grid III™ Header, Single Row, Vertical, Shrouded, 25 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni) |
| 文件： | 总4页 (文件大小：163K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
This document was generated on 05/26/2010
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
Part Number:
Status:
0901361112
Active
cgrid_iii
Overview:
Description:
2.54mm (.100") Pitch C-Grid III™ Header, Single Row, Vertical, Shrouded, 12 Circuits,
4µm (160µ") Tin/Lead (Sn) over Nickel (Ni)
Documents:
3D Model
RoHS Certificate of Compliance (PDF)
Drawing (PDF)
Series
image - Reference only
General
Product Family
Series
PCB Headers
90136
EU RoHS
China RoHS
ELV and RoHS
Compliant
Application
Overview
Wire-to-Board
cgrid_iii
REACH SVHC
Contains SVHC: No
Halogen-Free
Status
Product Name
C-Grid III™
Physical
Breakaway
No
Not Reviewed
Circuits (Loaded)
12
Circuits (maximum)
Color - Resin
12
Black
No
No
No
None
Yes
Brass
Tin
Tin
Polyester
1
Need more information on product
environmental compliance?
First Mate / Last Break
Glow-Wire Compliant
Guide to Mating Part
Keying to Mating Part
Lock to Mating Part
Material - Metal
Material - Plating Mating
Material - Plating Termination
Material - Resin
Number of Rows
Orientation
PC Tail Length (in)
PC Tail Length (mm)
PCB Locator
Email productcompliance@molex.com
For a multiple part number RoHS Certificate of
Compliance, click here
Please visit the Contact Us section for any
non-product compliance questions.
Search Parts in this Series
90136Series
Vertical
0.114 In
2.90 mm
No
Mates With
90123 C-Grid III™ Modular Crimp Housing.
90156 C-Grid III™ Crimp Housing
PCB Retention
None
0.062 In
1.60 mm
Tray
PCB Thickness Recommended (in)
PCB Thickness Recommended (mm)
Packaging Type
Pitch - Mating Interface (in)
Pitch - Mating Interface (mm)
Plating min: Mating (µin)
Plating min: Mating (µm)
Plating min: Termination (µin)
Plating min: Termination (µm)
Polarized to PCB
0.100 In
2.54 mm
120
3
120
3
No
Shrouded
Fully
Stackable
No
Temperature Range - Operating
Termination Interface: Style
-55°C to +125°C
Through Hole
Electrical
Current - Maximum per Contact
Voltage - Maximum
3A
350V
Solder Process Data
Lead-free Process Capability
Wave Capable (TH only)
Material Info
Reference - Drawing Numbers
Packaging Specification
Sales Drawing
PK-90136-001
SDA-90136
This document was generated on 05/26/2010
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
相关型号：
90136-1126
Board Connector, 26 Contact(s), 1 Row(s), Male, Straight, 0.1 inch Pitch, Solder Terminal, Locking, Black Insulator
MOLEX
90136-1127
Board Connector, 27 Contact(s), 1 Row(s), Male, Straight, 0.1 inch Pitch, Solder Terminal, Locking, Black Insulator
MOLEX
90136-1130
2.54mm (.100) Pitch C-Grid III™ Header, Single Row, Vertical, Shrouded, 30 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
MOLEX
90136-1131
Board Connector, 31 Contact(s), 1 Row(s), Male, Straight, 0.1 inch Pitch, Solder Terminal, Locking, Black Insulator
MOLEX
90136-1132
2.54mm (.100) Pitch C-Grid III™ Header, Single Row, Vertical, Shrouded, 32 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
MOLEX
90136-1202
2.54mm (.100) Pitch C-Grid III™ Header, Single Row, Vertical, Shrouded, 2 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
MOLEX
90136-1203
2.54mm (.100) Pitch C-Grid III™ Header, Single Row, Vertical, Shrouded, 3 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
MOLEX
90136-1204
2.54mm (.100) Pitch C-Grid III™ Header, Single Row, Vertical, Shrouded, 4 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
MOLEX
90136-1205
2.54mm (.100) Pitch C-Grid III™ Header, Single Row, Vertical, Shrouded, 5 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
MOLEX
90136-1206
2.54mm (.100) Pitch C-Grid III™ Header, Single Row, Vertical, Shrouded, 6 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
MOLEX
90136-1207
2.54mm (.100) Pitch C-Grid III™ Header, Single Row, Vertical, Shrouded, 7 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
MOLEX
90136-1208
2.54mm (.100) Pitch C-Grid III™ Header, Single Row, Vertical, Shrouded, 8 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
MOLEX
©2020 ICPDF网 联系我们和版权申明