90059-0007 [MOLEX]

2.54mm (.100) Pitch C-Grid® Micro Shunt, Low Profile, 200mm Tin (Sn) Plating; 2.54毫米( .100 )间距C- Grid®微分流,低调, 200毫米锡(Sn )镀层
90059-0007
型号: 90059-0007
厂家: Molex Electronics Ltd.    Molex Electronics Ltd.
描述:

2.54mm (.100) Pitch C-Grid® Micro Shunt, Low Profile, 200mm Tin (Sn) Plating
2.54毫米( .100 )间距C- Grid®微分流,低调, 200毫米锡(Sn )镀层

互连器件 连接器
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90059-0009

2.54mm (.100) Pitch C-Grid® Micro Shunt, Low Profile, 15mm" Select Gold (Au) with Gold (Au) Flash Plating

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14 MOLEX

90059-0011

2.54mm (.100) Pitch C-Grid® Micro Shunt, Low Profile, 15mm Select Gold (Au) with Gold (Au) Flash Plating

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8 MOLEX

90059-0012

Interconnection Device,

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-
0 MOLEX

90059-0013

2.54mm (.100) Pitch C-Grid® Micro Shunt, Low Profile, 35mm Pretinned Plating

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-
18 MOLEX

90059-0013

Interconnection Device,

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-
0 MOLEX

90059-0014

2.54mm (.100) Pitch C-Grid® Micro Shunt, Low Profile, 4mm Gold Plating

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19 MOLEX

90059-0015

2.54mm (.100) Pitch C-Grid® Micro Shunt, Low Profile, Natural Housing

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-
11 MOLEX

90059-0015

Interconnection Device,

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-
0 MOLEX

90059-0016

2.54mm (.100) Pitch C-Grid® Micro Shunt, Low Profile, Red Housing

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6 MOLEX

90059-0017

2.54mm (.100) Pitch C-Grid® Micro Shunt, Low Profile, White Housing

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13 MOLEX

90059-0020

2.54mm (.100) Pitch C-Grid® Micro Shunt, Low Profile, Black Housing

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-
23 MOLEX

90059-1007

2.54mm (.100) Pitch C-Grid® Micro Shunt, Low Profile, 200mm Tin (Sn) Plating

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10 MOLEX

90059-1009

2.54mm (.100) Pitch C-Grid® Micro Shunt, Low Profile, 15mm Select Gold (Au) with Gold (Au) Flash Plating

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-
11 MOLEX

90059-1020

Interconnection Device,

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-
0 MOLEX

9005D0

1000V CERAMIC DISC

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24 NTE