78079-0101 [MOLEX]
1.00mm (.039) Pitch DDR3 DIMM Socket, Vertical, Through Hole, with Beveled Metal Pins, Off-White Housing and Latches, 0.38μm (15μ) Gold (Au) Plating; 1.00毫米（ .039 ）间距DDR3 DIMM插槽，垂直，通孔，与斜面金属针，白色房屋和锁存器， 0.38μm （ 15μ ），金（Au ）镀层
| 型号： | 78079-0101 |
| 厂家： | 
Molex |
| 描述： | 1.00mm (.039) Pitch DDR3 DIMM Socket, Vertical, Through Hole, with Beveled Metal Pins, Off-White Housing and Latches, 0.38μm (15μ) Gold (Au) Plating |
| 文件： | 总18页 (文件大小：1592K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
This document was generated on 05/10/2010
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
Part Number:
Status:
0780790101
Active
Description:
1.00mm (.039") Pitch DDR3 DIMM Socket, Vertical, Through Hole, with Beveled Metal
Pins, Off-White Housing and Latches, 0.38µm (15µ") Gold (Au) Plating, 2.67mm(.105")
Soldertail, 240 Circuits, Lead free
Documents:
3D Model
Drawing (PDF)
Product Specification PS-78079-001 (PDF)
RoHS Certificate of Compliance (PDF)
Series
image - Reference only
China RoHS
Agency Certification
CSA
UL
LR19980
E29179
EU RoHS
ELV and RoHS
Compliant
General
REACH SVHC
Contains SVHC: No
Halogen-Free
Status
Product Family
Series
Component Type
JEDEC Outline
Product Name
Memory Module Sockets
78079
Socket
MO-269
DDR3 DIMM
Not Halogen-Free
Need more information on product
environmental compliance?
Physical
Circuits (Loaded)
240
240
Email productcompliance@molex.com
Circuits (maximum)
For a multiple part number RoHS Certificate of
Compliance, click here
Color - Resin
Durability (mating cycles max)
Entry Angle
Flammability
Keying to Mating Part
Material - Metal
Natural
25
Vertical
94V-0
Yes
Copper Alloy
Please visit the Contact Us section for any
non-product compliance questions.
Material - Plating Mating
Material - Plating Termination
Material - Resin
PC Tail Length (in)
PC Tail Length (mm)
PCB Locator
Gold
Tin
Search Parts in this Series
78079Series
High Temperature Thermoplastic
0.105 In
2.67 mm
Yes
Mates With
PCB Retention
Yes
JEDEC standard 1.27mm modules
PCB Thickness Recommended (in)
PCB Thickness Recommended (mm)
Packaging Type
0.062 In
1.57 mm
Tray
Pitch - Mating Interface (in)
Pitch - Mating Interface (mm)
Pitch - Term. Interface (in)
Pitch - Term. Interface (mm)
Plating min: Mating (µin)
Plating min: Mating (µm)
Plating min: Termination (µin)
Plating min: Termination (µm)
Temperature Range - Operating
Termination Interface: Style
0.039 In
1.00 mm
0.039 In
1.00 mm
15
0.38
100
2.54
-55°C to +85°C
Through Hole
Electrical
Current - Maximum per Contact
Voltage - Maximum
Voltage Key
1A
30V AC (RMS)/DC
Center
Solder Process Data
Duration at Max. Process Temperature (seconds)
Lead-free Process Capability
10
SMC & Wave Capable (TH only)
Max. Cycles at Max. Process Temperature
Process Temperature max. C
2
260
Material Info
Reference - Drawing Numbers
Packaging Specification
Product Specification
PK-78079-001
PS-78079-001
SD-78079-001
Sales Drawing
This document was generated on 05/10/2010
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
相关型号：
78079-0113
Card Edge Connector, 240 Contact(s), 2 Row(s), Female, Straight, 0.039 inch Pitch, Solder Terminal, Latch & Eject, Natural Insulator, Socket, ROHS COMPLIANT
MOLEX
78079-0201
1.00mm (.039") Pitch DDR3 DIMM Socket, Vertical, Through Hole, with Beveled Metal Pins
MOLEX
78079-0211
1.00mm (.039") Pitch DDR3 DIMM Socket, Vertical, Through Hole, with Beveled Metal Pins, Blue Housing and Off-White Latches, 0.76μm (30μ") Gold (Au) Plating2.67mm(.105") Soldertail, 240 Circuits, Lead free
MOLEX
78079-0351
1.00mm (.039") Pitch DDR3 DIMM Socket, Vertical, Through Hole, with BeveledMetal Pins, Green Housing and Off-White Latches, 0.38μm (15μ") Gold (Au) Plating2.67mm(.105") Soldertail, 240 Circuits, Lead free
MOLEX
7807A0101000
RG-58 type, 17 AWG solid .044 bare copper conductor, gas-injected foam HDPE insulation
ETC
7807A010500
RG-58 type, 17 AWG solid .044 bare copper conductor, gas-injected foam HDPE insulation
ETC
©2020 ICPDF网 联系我们和版权申明