78028-1126 [MOLEX]
PCI Express* Connectors; 的PCI Express *连接器
| 型号： | 78028-1126 |
| 厂家： | 
Molex |
| 描述： | PCI Express* Connectors |
| 文件： | 总2页 (文件大小：259K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PCI Express* Connectors
FEATURES AND SPECIFICATIONS
Molex’s PCI Express* connector offers greater signaling bandwidths for
today’s workstation and server applications
78028
Vertical Press fit
PCI Express is a third generation I/O architecture. PCI-SIG* recently
updated PCI Express specifications to greater signaling bandwidth. Unlike
the previous version in which the PCI bus is implemented via a multi-drop
parallel architecture, PCI Express now incorporates a point-to-point
signaling using differential pairs operating at 2.5 Gbps. PCI Express
provides adequate bandwidth to support developing I/O such as
Infiniband and 10G fiber channel.
Molex’s press fit version of PCI Express provides an alternative for
customers who require solderless termination on PCBs which have a high
layer count.
All Molex PCI Express connectors are compliant with PCI-SIG*
specifications. For more information on these specifications please see
www.pcisig.com
Features and Benefits
High-temperature thermoplastic housing for lead-free processing Complies with PCI-SIG industry specifications ensure connectors
support all PCI Express module cards available in the market
Ridge design will be compatible with module cards that require a
retention clip for secure retention
Keying design ensures correct mating of card module to edge card
connector
Press fit termination allows solderless termination on high layer
count PCBs
SPECIFICATIONS
Reference Information
Packaging: Tray
Mechanical
Max Terminal Retention Force: 2.94 N min/Terminal
Mating Force: 1.15 N max/contact pair
Un-Mating Force: 0.15 N min/contact pair
Durability: 50 Cycles
UL File No.: Pending
CSA File No.: Pending
Mates With : PCI Express®* module card
Designed In: mm
Physical
Electrical
Voltage: 50 Volts AC (RMS)/DC
Current: 1.1 Amps/pin
Contact Resistance: 30 milliohms max
Dielectric Withstanding Voltage: 500V AC
Insulation Resistance: 1000 Megohms min
Housing: High Temperature Nylon, Black, UL 94V-0
Contact: Copper Alloy
Plating:
Contact Area —0.76 µm Gold or 0.38 µm Gold
Solder Tail Area — Tin
Underplating — Nickel
PCB Thickness: See Ordering Tables
Operating Temperature: - 55 ºC to +85 ºC
*PCI Express, ExpressModule, and PCI-SIG are trademarks of PIC-SIG
PCI Express
Markets and Applications
EdgeCard Connector
Servers
Desktop
Mobile
78028
Vertical Press fit
Networking and
Communications
Ordering Information
Lead Free Order
Number
Recommended PCB
Circuits
98
Plating Thickness
0.76µm (30µ")
PC Tail Length
Thickness
78028-0008
78028-0108
78028-1108
78028-0018
78028-0118
78028-1118
78028-0016
78028-0116
78028-1116
78028-0026
78028-0126
78028-1126
2.54mm (.100”)
2.79mm (.110”)
3.43mm (135”)
2.54mm (.100”)
2.79mm (.110”)
3.43mm (135”)
2.54mm (.100”)
2.79mm (.110”)
3.43mm (135”)
2.54mm (.100”)
2.79mm (.110”)
3.43mm (135”)
2.3mm (.090”)
2.6mm (.100”)
3.2mm (.125”)
2.3mm (.090”)
2.6mm (.100”)
3.2mm (.125”)
2.3mm (.090”)
2.6mm (.100”)
3.2mm (.125”)
2.3mm (.090”)
2.6mm (.100”)
3.2mm (.125”)
0.38µm (15µ")
0.76µm (30µ")
0.38µm (15µ")
164
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81-462-65-2324
feninfo@molex.com
amerinfo@molex.com
Visit our Web site at http://molex.com
Order No. SNG-041
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