5054330881 [MOLEX]
Micro-Lock Plus Wire-to-Board Connector System;
| 型号： | 5054330881 |
| 厂家： | 
Molex |
| 描述： | Micro-Lock Plus Wire-to-Board Connector System |
| 文件： | 总2页 (文件大小：38K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
This document was generated on 06/06/2017
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
Part Number:
Status:
5054330881
Active
Overview:
Description:
Micro-Lock Plus Wire-to-Board Connector System
Micro-Lock™ PLUS Vertical Header, 1.25mm Pitch, Dual Row, Tin-Bismuth Plating,
with Pick-and-Place Polyimide Tape, 8 Circuits, Black
Documents:
Drawing (PDF)
RoHS Certificate of Compliance (PDF)
Product Specification 5054320000-002 (PDF)
Packaging Specification 5054339200-200 (PDF)
Product Literature (PDF)
E29179
Series image - Reference only
EU ELV
Agency Certification
UL
Not Relevant
General
Product Family
Series
PCB Headers
505433
EU RoHS
Compliant
China RoHS
Application
Overview
Product Literature Order No
Product Name
UPC
Signal, Wire-to-Board
Micro-Lock Plus Wire-to-Board Connector System
987651-4888
Micro-Lock™ PLUS
889056765268
REACH SVHC
Not Contained Per
-ED/01/2017 (12
January 2017)
Halogen-Free
Status
Not Low-Halogen
Need more information on product
environmental compliance?
Physical
Breakaway
Circuits (Loaded)
Circuits (maximum)
Color - Resin
Durability (mating cycles max)
First Mate / Last Break
Glow-Wire Compliant
Guide to Mating Part
Keying to Mating Part
Lock to Mating Part
Material - Metal
No
8
8
Black
30
No
No
Yes
None
Yes
Brass
Email productcompliance@molex.com
Please visit the Contact Us section for any
non-product compliance questions.
China ROHS
ELV
RoHS Phthalates
Green Image
Not Relevant
Not Contained
Material - Plating Mating
Material - Plating Termination
Material - Resin
Tin-Bismuth
Tin-Bismuth
Polyamide
584.490/mg
Search Parts in this Series
505433 Series
Net Weight
Number of Rows
Orientation
PCB Locator
PCB Retention
2
Mates With
Micro-Lock™ PLUS Receptacle Housing
505432
Vertical
No
Yes
Packaging Type
Embossed Tape on Reel
Pitch - Mating Interface
Pitch - Termination Interface
Plating min - Mating
Polarized to Mating Part
Polarized to PCB
1.25mm
1.25mm
1.000µm
Yes
Yes
Stackable
No
Surface Mount Compatible (SMC)
Temperature Range - Operating
Termination Interface: Style
Yes
-40°C to +105°C
Surface Mount
Electrical
Current - Maximum per Contact
Voltage - Maximum
1.5A
50V AC (RMS)/DC
Material Info
Reference - Drawing Numbers
Packaging Specification
Product Specification
Sales Drawing
5054339200-200
5054320000-002
5054330000-000, 5054331000-000
This document was generated on 06/06/2017
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
相关型号：
5054331471
Micro-Lock PLUS Vertical Header, 1.25mm Pitch, Dual Row, Tin-Bismuth Plating, 14Circuits, Black
MOLEX
5054331671
Micro-Lock PLUS Vertical Header, 1.25mm Pitch, Dual Row, Tin-Bismuth Plating, 16Circuits, Black
MOLEX
5054331871
Micro-Lock PLUS Vertical Header, 1.25mm Pitch, Dual Row, Tin-Bismuth Plating, 18Circuits
MOLEX
©2020 ICPDF网 联系我们和版权申明