47494-0001 [MOLEX]
SIM Card Connector Block Type; SIM卡连接器模块类型
| 型号： | 47494-0001 |
| 厂家： | 
Molex |
| 描述： | SIM Card Connector Block Type |
| 文件： | 总2页 (文件大小：117K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
2.54mm (.100") Pitch
SIM Card Connector
Block Type
FEATURES AND SPECIFICATIONS
Molex offers the SIM and Mega-SIM block type card connectors for mobile phone markets
Molex offers its range of Subscriber Identification Module Card connectors for the Mobile
Communications Industry. The GSM (Global System for Mobile Communications) standard call
for a Subscriber Identification Module or SIM card which is used for billings, security and
number storage purposes. The SIM card parameters are defined by ISO GSM SIM Card
standards.
47019
47494
6-Circuit SIM Header
8-Circuit Mega-SIM Header
While the card is standardized, the differences in phone designs do not allow standard
connectors. Molex in, close collaboration with its customer has developed a range of SIM card
connectors that feature a range of standard options plus the ability to custom design parts in
specific applications.
This release covers the block-type SIM connector. In this design, the SIM card is integrated
into the equipment. It comes in 6 and 8 circuit options. The 6 circuit version is most commonly
used. The 8 circuit version, which is also known as a Mega-SIM connector, has 2 additional
circuits more that than the 6 circuits version. These additional 2 circuits are reserved for
memory expansion in the hardware.
For more information about the SIM connector family, please visit:
http://www.molex.com/product/memory/simcard.html
Features
Benefits
High-temperature thermoplastic housing
Smooth edges around contact
Round contact design
Withstands lead-free processing
Prevent damaging of SIM card
Allows good contact between card and connector
SPECIIFICATIONS
Reference Information
Physical
Packaging: Embossed Tape on Reel
Housing: LCP. G/F, UL 94V-0, Black
Contact: Phosphor Bronze
UL File No.: TBD
Plating:
CSA File No.: TBD
Use With: SIM Cards
Designed In: mm
Contact Area — 0.8µm (30 µ”) Gold (Au)
Solder Tail Area — 0.05µm Gold (Au)
Underplating — 2.00µm (78µ”) Nickel (Ni)
Electrical
Voltage (max.): 15V
Current (max.): 0.500 Amp
Shielded: No
2.54mm (.100") Pitch
SIM Card Connector
Block Type
MARKETS AND APPLICATIONS
Mobile phones
47019
47494
6-Circuit SIM Header
8-Circuit Mega-SIM Header
ORDERING INFORMATION
Durability (mating
cycles) min
Operating
Temperature
Plant No. for
Samples
Description
Order No.
Housing Height
No. of Circuits
47019-1502
47019-1802
47019-2002
47019-2402
47494-0001
1.50mm (.059")
1.80mm (.071")
2.00mm (.079")
2.40mm (.094")
1.50mm (.059")
10, 000
3, 000
3, 000
3, 000
500
-30°C to +85°C
6
2.54mm (.100")
Pitch
2601
SIM Card
Connector
-40°C to +85°C
8
Americas Headquarters
2222 Wellington Ct.
Lisle, Illinois 60532 USA
1-800-78MOLEX
Asia Pacific North Headquarters
Yamato, Kanagawa, Japan
81-462-65-2324
Asia Pacific South Headquarters
Jurong, Singapore
65-6-268-6868
European Headquarters
Corporate Headquarters
Munich, Germany
49-89-413092-0
eurinfo@molex.com
2222 Wellington Ct.
Lisle, Illinois 60532 USA
630-969-4550
feninfo@molex.com
fesinfo@molex.com
amerinfo@molex.com
Visit our Web site at http://www.molex.com
SAP No. 9876502701
©2008, Molex
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