47213-0015 [MOLEX]

LGA Socket 771; LGA 771插座


型号：	47213-0015
厂家：	Molex
描述：	LGA Socket 771 LGA 771插座插座
文件：	总2页 (文件大小：98K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

1.09mm (.043") by

1.17mm (.046") Pitch

LGA Socket 771

FEATURES AND SPECIFICATIONS

Molex offers the 771-pin LGA CPU Socket for the Intel Dempsey

Platform Processor

47213

Vertical

Surface Mount

Socket 771 is the first Computer Processing Unit (CPU) socket to be used on the

server/workstation industry featuring the Land Grid Array (LGA) contact design.

This socket is commonly known as Socket J, Socket 771 and LGA 771. This socket

mates with the 771 LGA CPU package (gold pads) to form the processing unit of the

application. Previous design uses the Pin Grid Array (PGA) socket or Micro-PGA

socket (such as socket 604) mated with PGA CPU package. The 771-pin LGA CPU

and Socket will replace the Socket 604 in Intel®Xeon® processor line.

Molex’s high density LGA sockets features our low profile design, the shepard hook

actuation lever and a flat or raised pick and place cover for the assembly process.

All Molex’s LGA sockets comes with lead or lead-free BGA solder balls.

Features

Benefits

• High-temperature thermoplastic

housing

• Withstands lead-free processing

• Pick-&-place cover and Jedec hard

packaging tray

• Facilitates automation socket

placement

• LGA contact/BGA solder

• Prevents CPU misalignment

• Compliant with environmental needs

• For easy actuation

• Lead free BGA solder balls

• Shepard hook actuation lever

• Flat or raised pick & place cover

• Raised cover facilitates easy removal

• Visible triangle pin 1 identification on

housing, pick & place cover, stiffener

plate.

• Ensure correct CPU loading

• Prevent Socket 775 CPU from mating

to socket 771.

• West alignment key.

• 2 finger cutouts on north and south

side

• For easy CPU removal

SPECIFICATIONS

Reference Information

Mechanical

Packaging: JEDEC Thick Handling Hard Tray

UL File No.: E29179

Mates With: Intel®Xeon® Processor family(771-pin Package)

Designed In: Millimeters

Insertion Force to Socket: Zero Insertion Force

Durability: 20 cycles

Physical

Housing: LCP, UL 94V-0

Contact: Copper Alloy

Plating:

Electrical

Voltage: 30V

Current: 0.8A

Contact Area — 0.38 um (15u”) Gold

Solder Tail Area —

Underplating — Nickel

Operating Temperature: -40 to +90°C

Contact Resistance: 15.2 milliohms max. average,

28.0 milliohms max. chain

Dielectric Withstanding Voltage: 360V AC

Insulation Resistance: 500 Megohms min.

1.09mm (.043") by

1.17mm (.046") Pitch

LGA Socket 771

MARKETS AND APPLICATIONS

•

Workstation/Low End Server

47213

Vertical

Surface Mount

ORDERING INFORMATION

Lead-Free

Order No.

Tin-Lead

Order No.

Description

1.09mm (.043") by 1.17mm (.046") Pitch LGA Socket, 771 Circuits,

15u” Gold Plating, Shepherd Hook Lever, Flat Pick & Place Cover

47213-0015

47213-1015

47213-0005

47213-0010

47213-1010

47213-0000

1.09mm (.043") by 1.17mm (.046") Pitch LGA Socket, 771 Circuits,

15u” Gold Plating, Shepherd Hook Lever, Raised Pick & Place Cover

1.09mm (.043") by 1.17mm (.046") Pitch LGA Socket, 771 Circuits,

30u” Gold Plating, Shepherd Hook Lever, Raised Pick & Place Cover

Intel®Xeon® is a registered trademark of Intel.

Bringing People & Technology Together, Worldwide^SM

Americas Headquarters

2222 Wellington Ct.

Lisle, Illinois 60532 USA

1-800-78MOLEX

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81-462-65-2324

Far East South Headquarters

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65-6-268-6868

European Headquarters

Corporate Headquarters

2222 Wellington Ct.

Lisle, Illinois 60532 USA

630-969-4550

Munich, Germany

49-89-413092-0

eurinfo@molex.com

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amerinfo@molex.com

Visit our Web site at http://www.molex.com

Order No. SNG-035

47213-0015 [MOLEX]

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