45830-2225 [MOLEX]
HD Mezz™ Connectors; HD ™夹层连接器
| 型号： | 45830-2225 |
| 厂家： | 
Molex |
| 描述： | HD Mezz™ Connectors |
| 文件： | 总2页 (文件大小：883K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
1.20 by 2.00mm
FEATURES AND SPECIFICATIONS
(.047 by .079”) Pitch
HD Mezz™ Connectors
Simplify PCB routing, maximize card-slot space and achieve speeds up to 12.5 Gbps with Molex’s
HD Mezz; designed for the large and growing high-density and high-performance mezzanine
connector market
45802 HD Mezz™ Receptacle
45830 HD Mezz™ Plug
The High Density Mezzanine (HD Mezz) board-to-
board connector is designed for computer, networking,
telecommunications, storage and general market
applications with high pin-count devices on mezzanine
or module printed circuit boards (PCBs). This design
provides a flexible tooling approach that allows for
multiple stack heights and circuit-size extensions.
multi-layer boards and utilize space more efficiently
within a given card slot area. Option cards may be
added or upgraded to increase flexibility in design,
production and testing.
The HD Mezz design has superior electrical and
mechanical features that are cost competitive. The
Molex patented solder-charge technology results in
better process yields and a lower applied cost versus
equivalent BGA connector products.
HD Mezz provides many benefits. It allows
customers to simplify PCB routing without sacrificing
performance, avoid the expense of large complex
Left to right: HD Mezz Receptacle (Series 45802) and
HD Mezz Plug (Series 45830)
Features and Benefits
n Molex’s patented solder attach method is more cost
effective and reliable than Ball Grid Array (BGA)
connector attach methods
n Highest contact density on the market with 14
differential pairs per cm2 is extremely useful for
space constrained designs with limited PCB real
estate
n Data rates up to 12.5 Gbps for excellent signal
clarity with ample bandwidth for customer
requirements in high-speed designs
n Reliable mating interface with 2.00mm (.079”)
wipe and two points of contact with sufficient
conductive wipe for clean signal transmission and
enhanced durability
n Stack heights ranging from 16.00 to 38.00mm
(.630 to 1.496”) and circuit sizes of 91 to
403 circuits provides ease in design based on
engineering constraints in system envelopes
SPECIFICATIONS
Reference Information
Product Specification: PS-45802-001
Packaging: Tray
UL File No.: TBD
CSA File No.: TBD
Mechanical
Mating Force: 51g nominal per contact
Unmating Force: 25g nominal per contact
Normal Force: 51g nominal per contact
Durability: 100 cycles
Designed in: Millimeters
Physical
Electrical
Voltage: 250V AC per contact
Current: 2.0A per contact
Contact Resistance: 25 milliohms nominal
Dielectric Withstanding Voltage: 500V DC
Insulation Resistance:
Housing: Glass-filled LCP, UL 94V-0
Contact: Copper (Cu) alloy
Plating: Contact Area – 0.75µm Gold (Au) min.
Solder Tail Area – 2.50µm Tin (Sn) min.*
Underplating – 1.25µm Nickel (Ni) overall
Operating Temperature: -55 to +105°C
Across Wafers – 5000 Megohms min.
Within Wafers – 1000 Megohms min.
*Please contact Molex Customer Service for lead-free solder tail plating options
1.20 by 2.00mm
APPLICATIONS
(.047 by .079”) Pitch
HD Mezz™ Connectors
n High and mid-range computers
45802 HD Mezz™ Receptacle
45830 HD Mezz™ Plug
- Servers
n Medical
- Scanning equipment
n Military
n Networking and telecommunications
- Network routers and switches
- Mobile base stations
Mezzanine card for a customer application with one
and two HD Mezz assemblies per card
ORDERINꢀ INFORMATION
Order No. (Lead-free)
45802-0311
45802-0215
45802-0223
45802-1211
45802-1223
45802-1225
45830-0215
45830-0223
45830-2211
45830-2223
45830-2225
45830-1211
Order No. (Tin-Lead)
45802-0011
45802-0015
45802-0123
45802-1011
45802-1123
45802-1025
45830-0015
45830-0023
45830-2011
45830-2023
45830-2025
45830-1111
Component
Circuits†
143
195
299
143
299
325
195
299
143
299
325
143
Height
8.00mm (.314”)
Receptacle
18.00mm (.708”)
8.00mm (.314”)
Plug
10.00mm (.393”)
18.00mm (.708”)
†Please contact Molex Customer Service for additional circuit sizes and stack heights
Americas Headquarters
Lisle, Illinois 60532 U.S.A.
1-800-78MOLEX
Asia Pacific North Headquarters
Yamato, Kanagawa, Japan
81-46-265-2325
Asia Pacific South Headquarters
Jurong, Singapore
European Headquarters
Corporate Headquarters
2222 Wellington Ct.
Lisle, IL 60532 U.S.A.
630-969-4550
Munich, Germany
49-89-413092-0
eurinfo@molex.com
65-6268-6868
amerinfo@molex.com
apninfo@molex.com
fesinfo@molex.com
Fax:630-969-1352
Visit our website at www.molex.com/product/hdmezz.html
Order No. 987650-1132
Printed in USA/JI/2007.12
©2007, Molex
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