44914-1602 [MOLEX]
3.00mm (.118”) Pitch Micro-Fit 3.0, CPI™ Micro-Fit 3.0, BMI™ CPI Vertical Headers; 3.00毫米（ 0.118 “ ）间距微飞度3.0 ， CPI ™微飞度3.0 ， BMI ™ CPI垂直接头
| 型号： | 44914-1602 |
| 厂家： | 
Molex |
| 描述： | 3.00mm (.118”) Pitch Micro-Fit 3.0, CPI™ Micro-Fit 3.0, BMI™ CPI Vertical Headers |
| 文件： | 总2页 (文件大小：252K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
3.00mm (.118”) Pitch
Micro-Fit 3.0, CPI™
Micro-Fit 3.0, BMI™ CPI
Vertical Headers
FEATURES AND SPECIFICATIONS
Micro-Fit 3.0 Family Offers Press-Fit Headers For High-Density
Power and Signal Applications
The Micro-Fit 3.0, CPI (Compliant Pin Interface) and Micro-Fit 3.0, BMI CPI
(Blind-Mate version with Compliant Pin Interface) are vertical header product
extensions featuring press-fit PC tails. These headers are designed for high-
density applications where press-fit terminations are required. The CPI products
are appropriate for both power and signal uses as they can carry up to 5.0A of
current per circuit.
The standard Micro-Fit 3.0, CPI headers incorporate a compact housing that
mates with standard wire-mount housings and crimp terminals for wire-to-board
applications.
The Micro-Fit 3.0, BMI CPI headers feature a funnel entry to guide the mating
receptacle into place. Micro-Fit 3.0, BMI headers mate exclusively with BMI
components, which include panel-mount receptacles with crimp terminals and
PCB receptacles for wire-to-board and board-to-board applications.
Features and Benefits
■ CPI style (press-fit) pins require no soldering to the PCB
■ Designed for multiple board thicknesses of 2.36mm (.093”) or greater
■ Dual-row vertical headers available in 2-24 circuits for the standard version
and 4-24 circuits for the BMI (blind-mate) version
■ Rated up to 5.0A of current for both power and signal applications in wire-to-
board and board-to-board configurations
■ Fully polarized with positive locks for proper mating
■ Fully isolated contacts for electrical and mechanical integrity
Reference Information
Packaging:Tray
UL File No.: E29179
CSA File No.: LR19980
TUV No.: R95107
Mechanical
Insertion Force to PCB: 35.6N (8.0lb) per circuit max.
Retention Force to PCB: 106.8N (24.0lb) per circuit min.
Mating Force: 8.0N (1.8lb) per circuit max.
Unmating Force: 3.6N (0.8lb) per circuit min.
Durability: 30 cycles
Designed In: Millimeters
Electrical
Physical
Voltage: 250V
Housing: High-temperature polymer, UL 94V-0
Contact: Brass alloy
Current: 5.0A
Contact Resistance: 10 milliohms max.
Dielectric Withstanding Voltage: 1500 VAC
Insulation Resistance: 1000 Megohms min.
Plating:
Contact area – 5.1µm (200µ") min. Tin, 0.38µm (15µ”)
min. select Gold or 0.76µm (30µ”) min. select Gold
PC tails – Tin/Lead
Underplating: Nickel
PCB Thickness: 2.36mm (.093”) min.
Operating Temperature: -40 to +105° C
3.00mm (.118”) Pitch
Micro-Fit 3.0, CPI™
Micro-Fit 3.0, BMI™ CPI
Vertical Headers
Applications
■ Servers
■ Workstations
■ Personal Computers
■ Mainframe Computers
■ Notebook PCs
■ Fan Tray Assemblies
■ Power Supplies
■ Office Equipment
■ Vending and Gaming Machines
ORDERING INFORMATION
Contact Plating
Header Style
Circuit Size
5.1µm (200µ") min. Tin
44914-0201
44914-0401
44914-0601
44914-0801
44914-1001
44914-1201
44914-1401
44914-1601
44914-1801
44914-2001
44914-2201
44914-2401
45280-0401
45280-0601
45280-0801
45280-1001
45280-1201
45280-1401
45280-1601
45280-1801
45280-2001
45280-2201
45280-2401
0.38µm (15µ") min. Gold
44914-0202
44914-0402
44914-0602
44914-0802
44914-1002
44914-1202
44914-1402
44914-1602
44914-1802
44914-2002
44914-2202
44914-2402
45280-0402
45280-0602
45280-0802
45280-1002
45280-1202
45280-1402
45280-1602
45280-1802
45280-2002
45280-2202
45280-2402
0.76µm (30µ") min. Gold
44914-0203
44914-0403
44914-0603
44914-0803
44914-1003
44914-1203
44914-1403
44914-1603
44914-1803
44914-2003
44914-2203
44914-2403
45280-0403
45280-0603
45280-0803
45280-1003
45280-1203
45280-1403
45280-1603
45280-1803
45280-2003
45280-2203
45280-2403
Micro-Fit 3.0, CPI
2
4
6
8
10
12
14
16
18
20
22
24
4
Micro-Fit 3.0, BMI CPI
6
8
10
12
14
16
18
20
22
24
Americas Headquarters
Lisle, Illinois 60532 U.S.A.
1-800-78MOLEX
Far East North Headquarters
Yamato, Kanagawa, Japan
81-462-65-2324
Far East South Headquarters
Jurong, Singapore
65-6-268-6868
European Headquarters
Munich, Germany
49-89-413092-0
Corporate Headquarters
2222 Wellington Ct.
Lisle, IL 60532 U.S.A.
630-969-4550
amerinfo@molex.com
feninfo@molex.com
fesinfo@molex.com
eurinfo@molex.com
Fax:630-969-1352
Visit our Web site at http://www.molex.com/product/pcb/microfit/microfit.html
Printed in USA/5K/JI/JI/2006.01
Order No. USA-193
©2006, Molex
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