44067-0802 [MOLEX]
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick; 3.00毫米( 0.118 “ )间距微飞度3.0线对板头,双排,垂直长达3.56毫米( 0.140 ”)厚型号: | 44067-0802 |
厂家: | Molex |
描述: | 3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick |
文件: | 总3页 (文件大小:208K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
This document was generated on 05/24/2010
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
Part Number:
Status:
0440670403
Active
microfit_30
Overview:
Description:
3.00mm (.118") Pitch Micro-Fit 3.0™ Wire-to-Board Header, Dual Row, Vertical for up
to 3.56mm (.140") Thick PCB, 4 Circuits, 0.76µm (30µ") Gold (Au) Selective Plating
Documents:
3D Model
Drawing (PDF)
Product Specification PS-43045 (PDF)
RoHS Certificate of Compliance (PDF)
Series
image - Reference only
China RoHS
General
Product Family
Series
PCB Headers
44067
EU RoHS
ELV and RoHS
Compliant
REACH SVHC
Contains SVHC: No
Halogen-Free
Status
Application
Comments
Overview
Wire-to-Board
High Temperature, Polarization Key to PCB
microfit_30
Product Name
Micro-Fit 3.0™
Physical
Breakaway
Not Reviewed
No
Circuits (Loaded)
Circuits (maximum)
4
4
Need more information on product
environmental compliance?
Color - Resin
Black
30
No
No
No
None
Yes
Email productcompliance@molex.com
For a multiple part number RoHS Certificate of
Compliance, click here
Durability (mating cycles max)
First Mate / Last Break
Glow-Wire Compliant
Guide to Mating Part
Keying to Mating Part
Lock to Mating Part
Please visit the Contact Us section for any
non-product compliance questions.
Material - Plating Mating
Material - Plating Termination
Material - Resin
Number of Rows
Orientation
Gold
Tin
High Temperature Thermoplastic
2
Vertical
Search Parts in this Series
44067Series
PC Tail Length (in)
PC Tail Length (mm)
PCB Locator
0.158 In
4.01 mm
Yes
Mates With
43025 Micro-Fit™ Header
PCB Retention
Yes
PCB Thickness Recommended (in)
PCB Thickness Recommended (mm)
Packaging Type
0.140 In
3.60 mm
Tray
Pitch - Mating Interface (in)
Pitch - Mating Interface (mm)
Pitch - Term. Interface (in)
Pitch - Term. Interface (mm)
Plating min: Mating (µin)
Plating min: Mating (µm)
Plating min: Termination (µin)
Plating min: Termination (µm)
Polarized to PCB
0.118 In
3.00 mm
0.118 In
3.00 mm
30
0.75
100
2.5
Yes
Shrouded
Fully
Stackable
No
Surface Mount Compatible (SMC)
Temperature Range - Operating
Termination Interface: Style
Yes
-40°C to +105°C
Through Hole - Kinked Pin
Electrical
Current - Maximum per Contact
Voltage - Maximum
5A
250V
Solder Process Data
Duration at Max. Process Temperature (seconds)
Lead-free Process Capability
30
SMC & Wave Capable (TH only)
Max. Cycles at Max. Process Temperature
Process Temperature max. C
3
260
Material Info
Reference - Drawing Numbers
Packaging Specification
Product Specification
Sales Drawing
PK-70873-0314
PS-43045
SD-44067-001
TS-43045-002
Test Summary
This document was generated on 05/24/2010
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
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