15-80-0665 [MOLEX]

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 66 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating; 2.54毫米( .100 )间距C- Grid®头,通孔无钉,双排,垂直,罩,高温, 66电路, 0.76μm ( 30μ ),金(Au )选择性电镀
15-80-0665
型号: 15-80-0665
厂家: Molex Electronics Ltd.    Molex Electronics Ltd.
描述:

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 66 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
2.54毫米( .100 )间距C- Grid®头,通孔无钉,双排,垂直,罩,高温, 66电路, 0.76μm ( 30μ ),金(Au )选择性电镀

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15-80-0667

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating

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2 MOLEX

15-80-0681

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 68 Circuits, Tin (Sn) Plating

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4 MOLEX

15-80-0681

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating

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1 MOLEX

15-80-0683

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 68 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

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3 MOLEX

15-80-0683

Board Connector, 68 Contact(s), 2 Row(s), Male, Straight, 0.1 inch Pitch, Solder Terminal, Receptacle,

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0 MOLEX

15-80-0685

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 68 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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2 MOLEX

15-80-0687

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating

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6 MOLEX

15-80-0701

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 70 Circuits, Tin (Sn) Plating

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2 MOLEX

15-80-0701

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating

Warning: Undefined variable $rtag in /www/wwwroot/www.icpdf.com/pdf/pdf/index.php on line 154
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1 MOLEX

15-80-0703

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 70 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating,

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5 MOLEX

15-80-0705

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 70 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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6 MOLEX

15-80-0707

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating

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2 MOLEX

15-80-0721

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating

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1 MOLEX

15-80-0721

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 72 Circuits, Tin (Sn) Plating

Warning: Undefined variable $rtag in /www/wwwroot/www.icpdf.com/pdf/pdf/index.php on line 154
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3 MOLEX

15-80-0721

Board Connector, 72 Contact(s), 2 Row(s), Male, Straight, 0.1 inch Pitch, Solder Terminal, Receptacle,

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0 MOLEX