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15-80-0581 [MOLEX]

2.54mm (.100) Pitch C-GridÂ® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating; 2.54毫米（ .100 ）间距C- GridÂ®头，通孔无钉，双排，垂直，罩，高温， 6电路，锡（Sn ）镀层

15-80-0581


元器件型号：	15-80-0581
生产厂家：	Molex Electronics Ltd.
描述和应用：	2.54mm (.100) Pitch C-GridÂ® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating 2.54毫米（ .100 ）间距C- GridÂ®头，通孔无钉，双排，垂直，罩，高温， 6电路，锡（Sn ）镀层连接器集管和边缘连接器 PC
PDF文件：	总7页 (文件大小：1221K)
下载文档：	下载PDF数据表文档文件
型号参数：15-80-0581参数

15-80-0583

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 58 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

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2 MOLEX

15-80-0585

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 58 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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3 MOLEX

15-80-0587

2.54mm (.100) Pitch C-GridÂ® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating

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2 MOLEX

15-80-0601

2.54mm (.100) Pitch C-GridÂ® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating

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1 MOLEX

15-80-0601

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 60 Circuits, Tin (Sn) Plating

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5 MOLEX

15-80-0603

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 60 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

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5 MOLEX

15-80-0605

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 60 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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2 MOLEX

15-80-0607

2.54mm (.100) Pitch C-GridÂ® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating

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2 MOLEX

15-80-0621

2.54mm (.100) Pitch C-GridÂ® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating

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1 MOLEX

15-80-0621

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 62 Circuits, Tin (Sn) Plating

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1 MOLEX

15-80-0623

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 62 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

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3 MOLEX

15-80-0625

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 62 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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3 MOLEX

15-80-0627

2.54mm (.100) Pitch C-GridÂ® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating

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4 MOLEX

15-80-0641

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 64 Circuits, Tin (Sn) Plating

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2 MOLEX

15-80-0641

2.54mm (.100) Pitch C-GridÂ® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating

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1 MOLEX

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