select brandShort,logo,brand from pdf_brand where id=752 limit 1 15-47-7750_技术文档

15-47-7750 [MOLEX]

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 50 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating; 2.54毫米( .100 )间距C- Grid®头,通孔,双排,垂直,高温,罩,用PEG , 50电路, 0.76μm ( 30μ ),金(Au )选择性电镀,锡(Sn ) PC尾电镀
15-47-7750
型号: 15-47-7750
厂家: Molex    Molex
描述:

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 50 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
2.54毫米( .100 )间距C- Grid®头,通孔,双排,垂直,高温,罩,用PEG , 50电路, 0.76μm ( 30μ ),金(Au )选择性电镀,锡(Sn ) PC尾电镀

PC
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