15-47-7730 [MOLEX]

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating; 2.54毫米( .100 )间距C- Grid®头,通孔,双排,垂直,高温,罩,用PEG , 6电路,锡(Sn )镀层
15-47-7730
型号: 15-47-7730
厂家: Molex Electronics Ltd.    Molex Electronics Ltd.
描述:

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating
2.54毫米( .100 )间距C- Grid®头,通孔,双排,垂直,高温,罩,用PEG , 6电路,锡(Sn )镀层

连接器 集管和边缘连接器 PC
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15-47-7732

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 32 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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5 MOLEX

15-47-7732

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating

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0 MOLEX

15-47-7734

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 34 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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6 MOLEX

15-47-7736

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 36 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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3 MOLEX

15-47-7736

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating

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1 MOLEX

15-47-7736

Board Connector, 36 Contact(s), 2 Row(s), Male, Straight, 0.1 inch Pitch, Solder Terminal, Receptacle,

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0 MOLEX

15-47-7738

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating

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-
0 MOLEX

15-47-7738

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 38 Circuits

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2 MOLEX

15-47-7740

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 40 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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6 MOLEX

15-47-7740

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating

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-
0 MOLEX

15-47-7742

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating

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-
1 MOLEX

15-47-7742

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 42 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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5 MOLEX

15-47-7744

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 44 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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2 MOLEX

15-47-7744

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating

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-
0 MOLEX

15-47-7746

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 46 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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3 MOLEX