select brandShort,logo,brand from pdf_brand where id=752 limit 1 10-89-7162_技术文档

10-89-7162 [MOLEX]

2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 16 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 2.72mm (.107") PC Tail; 2.54毫米（ .100“ ）间距C- Grid®分离针座，双排，垂直，高温， 16电路， 0.38μm （ 15μ ”），金（Au ）选择性电镀，锡（Sn ） PC端脚镀层， 2.72毫米（ 0.107 “ ）的PC尾

10-89-7162


型号：	10-89-7162
厂家：	Molex
描述：	2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 16 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 2.72mm (.107") PC Tail 2.54毫米（ .100“ ）间距C- Grid®分离针座，双排，垂直，高温， 16电路， 0.38μm （ 15μ ”），金（Au ）选择性电镀，锡（Sn ） PC端脚镀层， 2.72毫米（ 0.107 “ ）的PC尾 PC
文件：	总4页 (文件大小：425K)
中文：	中文翻译
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