0879330815 [MOLEX]
Board Connector;
| 型号： | 0879330815 |
| 厂家： | 
Molex |
| 描述： | Board Connector 连接器 |
| 文件： | 总14页 (文件大小：698K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PRODUCT SPECIFICATION
SLIMGRID
Board to Board
CONNECTOR SYSTEM
Vertical Header, Surface Mount
Series: 87933
TABLE OF CONTENTS
Slim-Grid B-t-B Connector System Web Page
REVISION: ECM INFORMATION:
TITLE:
SHEET No.
EC No:
PROD. SPEC. SLIM-GRID UNSHROUDED
635370
1 of 14
B
HEADERS
DATE:
2020/04/06
DOC
TYPE:
DOC
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MRAMAKRISHNA
PART:
PS
000
ABABUPS
MRAMAKRISHNA
879330001
TEMPLATE FILENAME: 1703070003 REV A
PRODUCT SPECIFICATION
Table of Contents
ITEM
PAGE
1.0 SCOPE ....................................................................................................................... 3
2.0 PRODUCT DESCRIPTION ........................................................................................ 3
2.1 DESCRIPTION, SERIES NUMBER, AND LINKS ................................... 3
2.2 DIMENSIONS, MATERIALS, PLATINGS................................................ 3
2.3 ENVIRONMENTAL CONFORMANCE .................................................... 3
2.4 SAFETY AGENCY LISTINGS ................................................................. 3
3.0 APPLICABLE DOCUMENTS AND SPECIFICATION................................................ 4
3.1 MOLEX DOCUMENTS............................................................................ 4
3.2 INDUSTRY DOCUMENTS ...................................................................... 4
4.0 ELECTRICAL PERFORMANCE RATINGS ............................................................... 5
4.1 VOLTAGE................................................................................................ 5
4.2 MAXIMUM CURRENT............................................................................. 5
4.3 TEMPERATURE...................................................................................... 6
4.4 DURABILITY............................................................................................ 6
5.0 QUALIFICATION ........................................................................................................ 6
6.0 PERFORMANCE........................................................................................................ 7
6.1 ELECTRICAL PERFORMANCE.............................................................. 7
6.2 MECHANICAL PERFORMANCE ............................................................ 8
6.3 ENVIRONMENTAL PERFORMANCE..................................................... 9
7.0 TEST SEQUENCE GROUPS................................................................................... 11
8.0 SOLDER INFORMATION......................................................................................... 12
8.1 SOLDER PROCESS TEMPERATURE ................................................. 12
8.2 REFLOW SOLDERING PROFILE......................................................... 12
9.0 PACKAGING ............................................................................................................ 13
10.0 OTHERS................................................................................................................... 13
11.0 POLARIZATION AND KEYING OPTIONS............................................................... 14
TABLE OF CONTENTS
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PROD. SPEC. SLIM-GRID UNSHROUDED
635370
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879330001
TEMPLATE FILENAME: 1703070003 REV A
PRODUCT SPECIFICATION
1.0
2.0
SCOPE
This Product Specification covers the 1.27 mm centerline (pitch) printed circuit board (PCB) connector
series.
PRODUCT DESCRIPTION
2.1
DESCRIPTION, SERIES NUMBER, AND LINKS
DESCRIPTION
SERIES NUMBER
1.27 mm Pitch SLIM-GRID® Unshrouded Headers
87933
2.2
2.3
DIMENSIONS, MATERIALS, PLATINGS
See sales drawings for details on dimensions, materials and platings.
ENVIRONMENTAL CONFORMANCE
To fine product compliance information:
a. Go to molex.com
b. Enter the part number in the search field.
c. At the bottom of the page go to “Environmental” to see compliance status.
2.4
SAFETY AGENCY LISTINGS
UL File Number: File E29179, Vol 10
CSA File Number: 152514 (LR19980)
CSA approval meets following standards/test procedures:
a) CSA std. C22.2 No. 182.3-M1987
b) UL-1977
* “C” and “US” mark adjacent to CSA signifies that the product has been evaluated to the
applicable CSA and ANSI/UL standards, for use in Canada and US respectively.
Series 78120, 87933, 200989, 201021, 201022, 201173, rated 4.3 A, 125 Vac
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635370
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ABABUPS
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879330001
TEMPLATE FILENAME: 1703070003 REV A
PRODUCT SPECIFICATION
3.0
APPLICABLE DOCUMENTS AND SPECIFICATION
3.1
MOLEX DOCUMENTS
Molex Solderability Specification SMES-152
Molex Heat Resistance Specification AS-40000-5013
Molex Moisture Technical Advisory AS-45499-001
Molex Package Handling Specification 454990100-PK
3.2
INDUSTRY DOCUMENTS
EIA-364-1000
UL-60950-1
UL-1977
CSA STD. C22.2 NO. 182.3-M1987
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635370
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TEMPLATE FILENAME: 1703070003 REV A
PRODUCT SPECIFICATION
4.0
ELECTRICAL PERFORMANCE RATINGS
4.1
VOLTAGE
125 Vac
4.2
MAXIMUM CURRENT
4.3 Amps per Pole (only 1 contact powered up)
Current rating is application dependent and each application should be evaluated by the end user
for compliance to specific safety agency requirements. The ratings listed in the chart below are per
Molex test method based on a 30 °C maximum temperature rise over ambient temperature and
are provided as a guideline. Appropriate de-rating is required based on circuit size, ambient
temperature, copper trace size on the PCB, AWG WIRE, gross heating from adjacent modules /
components and other factors that influence connector performance.
CIRCUIT SIZE
2*
4
6*
8*
10*
12*
14
16*
18*
20*
22*
24
Current
Rating
(Amps,
Max)
1.9
0
3.60 3.00 2.70 2.50 2.40 2.30 2.20 2.10 2.10 2.00 2.00
*Extrapolated from test data. Refer below for more information.
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TEMPLATE FILENAME: 1703070003 REV A
PRODUCT SPECIFICATION
4.3
TEMPERATURE
Operating Temperature
Non-Operating Temperature
: - 55 °C to + 105 °C
: - 55 °C to + 105 °C
Field Temperature and Field Life: 65°C for 3 years (based EIA-364-1000, table 8)
Note: Temperature life test duration (section 6.3. item 2) is based on the assumption that the
contact spends its entire life at the rated field maximum temperature
(based on EIA-364-1000, table 8).
4.4
DURABILITY
Plating Type
Gold Plated
Number of Cycles
50
As tested in accordance with EIA-364-1000 test method (see Sec. 6.2 item 2 of this specification).
Durability per EIA-364-09.
5.0
QUALIFICATION
Laboratory condition, sample selection and test sequences are in accordance with EIA-364-1000.
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635370
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TEMPLATE FILENAME: 1703070003 REV A
PRODUCT SPECIFICATION
6.0
PERFORMANCE
6.1
ITEM
ELECTRICAL PERFORMANCE
DESCRIPTION
TEST CONDITION
REQUIREMENT
Mate connectors: apply a maximum
voltage of 20 mV and
Contact
Resistance
(LLCR)
30 milliohms
[Initial]
[Maximum]
a current of 100 mA
6.1.1
6.1.2
(EIA-364-23)
Note: Wire resistance and traces shall
be removed from the measured value.
Mate & unmount connectors; apply a
voltage of 500 VDC between adjacent
terminals and between terminals to
ground. (EIA-364-21)
Insulation
Resistance
1000 Megohms
[Minimum]
Mate & unmount connectors; apply a
voltage of 1000 VAC between
adjacent terminals and between
terminals to ground.
Mate & unmount connectors; apply a
voltage of 1250 VAC between
adjacent terminals and between
terminals to ground.
Dielectric
Withstanding
Voltage
No breakdown;
Current Leakage < 5 mA
6.1.3
6.1.4
(EIA-364-20)
Mate connectors: measure the
temperature rise of contact when the
maximum DC rated current is passed.
(EIA-364-70, Method 1)
Temperature Rise
+30°C
Temperature Rise
[Maximum]
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TEMPLATE FILENAME: 1703070003 REV A
PRODUCT SPECIFICATION
6.2
ITEM
MECHANICAL PERFORMANCE
DESCRIPTION
TEST CONDITION
REQUIREMENT
Mate Force
15 N (24ckt)
10 N (4ckt)
[Maximum]
Unmate Force
3.0 N (24ckt)
0.5 N (4ckt)
[Minimum]
Mate and unmate connectors at a rate
of 25.4 mm/min..
Connector Mate &
Unmate Force
6.2.1
(EIA-364-13D, Method A)
Appearance: No Damage
Contact Resistance: 15 milliΩ
[Maximum]
Mate connectors up to 50 cycles at a
maximum rate of 500 ±50 cycles/hr.
(EIA-364-09)
6.2.2
6.2.3
6.2.4
Durability
Reseating
[Change from Initial]
Manually mate and unmate the
Appearance: No Damage
connector with mating half for 3 cycles Contact Resistance: 15 milliΩ
with rate of 5 cycles/min maximum.
[Maximum]
[Change from Initial]
(EIA-364-09)
Axial pullout force on the terminal in the
housing at a rate of 25 ± 6 mm
(1 ± ¼ inch) per minute.
Terminal
Retention Force
(in Housing)
4.0 N
[Minimum]
(EIA-364-29, Method C)
Mate connectors and subject to the
following vibration conditions, for a
period of 2 hours in each 3 mutually
perpendicular axis.
Appearance: No Damage
15 milliohms
[Maximum]
Amplitude: 1.52mm (.060 inch)
peak to peak
6.2.5
Vibration
(change from initial)
Discontinuity: 1.0 μs
[Maximum]
Test pulse: half sine
Sweep: 10->55->10 Hz in 1 minute
Duration: 2 hours in each x-y-z axis.
(EIA-364-28, Test Condition I)
Mate connectors and subject to the
following shock conditions, 3 shocks
shall be applied along 3 mutually
perpendicular axis. (total of 18 shocks)
Peak value: 490 m/s sq. (50G)
Test pulse : half sine
Appearance: No Damage
Contact Resistance: 15 milliΩ
[Maximum]
6.2.6
Mechanical shock
[Change from Initial]
Discontinuity: 1.0 μs
[Maximum]
Duration : 11 ms in each x-y-z axis
(EIA-364-27B Condition A)
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635370
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TEMPLATE FILENAME: 1703070003 REV A
PRODUCT SPECIFICATION
6.3
ITEM
ENVIRONMENTAL PERFORMANCE
DESCRIPTION
TEST CONDITION
REQUIREMENT
Mate connectors, expose to
5 cycles of:-
Temp °C
Duration
(Minutes)
30
Appearance: No Damage
Contact Resistance:
15 milliΩ
-55 + 0/-5
Transfer time
from cold to hot
+105 + 3/-0
6.3.1
Thermal Shock
5 Maximum
30
[Maximum]
[Change from Initial]
Transfer time
from hot to cold
5 Maximum
(EIA-364-32G Method A,
Condition VII)
Appearance: No Damage
Contact Resistance:
15 milliΩ
Mate Connectors, expose to:-
Temperature: 105 ± 2 °C
Duration: 96 hours.
(EIA-364-17, Method A, condition 4)
6.3.2
Temperature Life
[Maximum]
[Change from Initial]
Mate connector and expose to:-
Temperature: 25 ± 3 °C @
Humidity: 80% ± 3%
Appearance: No Damage
Contact Resistance:
15 milliΩ
and
[Maximum]
Temperature: 65 ± 3 °C @
Humidity: 50% ± 3%
Cyclic Temperature
and Humidity
[Change from Initial]
Dielectric Withstanding
Voltage:
No Breakdown
Insulation Resistance:
1000 MegaΩ Minimum
6.3.3
Ramp times should be 0.5 hour
and dwell times should be 1.0 hour.
Dwell times start when the
temperature and humidity have
stabilized within the specified levels.
Duration: 24 cycles (72 hours)
Appearance: No Damage
Contact Resistance:
15 milliΩ
Mate connectors and expose to:
Temperature: -40 °C ± 3 °C
Duration: 96 + 5/-0 Hours
(EIA-364-59A)
6.3.4 Low Temperature Test
[Maximum]
[Change from Initial]
Mate connectors and expose to:
SO2 gas density: 50 ± 5 ppm
Temperature: 40 ± 2 °C
Duration: 24 hours
Appearance: No Damage
Contact Resistance:
15 milliΩ
SO2 Gas
6.3.5
(Gold Plated only)
[Maximum]
Humidity: 60-75%
[Change from Initial]
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TEMPLATE FILENAME: 1703070003 REV A
PRODUCT SPECIFICATION
6.3
ITEM
ENVIRONMENTAL PERFORMANCE
DESCRIPTION
TEST CONDITION
REQUIREMENT
Unmate connector.
Steam age for 8 hour ± 15 min.
(precondition: Condition C)
SMT
Surface mount process simulation test
Solder paste is deposited onto screen
(e.g. ceramic plate) via stencil.
The connectors are placed onto the
solder paste print.
95% of the immersed area
must show no voids, pin
holes
6.3.6
Solderability
Subject the substrate and component
to the reflow process through a
convection oven.
Refer to section 8.0 for temperature
profile.
Flux type: ROL0
SMT
Convection reflow
Resistance to solder
Heats
Sample to be passed through reflow
over according to temperature profiles
(shown in section 8.0)
6.3.7
Appearance: no damage
(EIA-364-56C, Procedure 6)
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PRODUCT SPECIFICATION
7.0
TEST SEQUENCE GROUPS
Sequential Tests Group
Test or Examination
Sample size
1
2
3
4
5
6
7
8
9
5
10 11
5
1
5
1
5
1
5
1
5
1
5
1
5
1
5
1
5
5
Resistance to Soldering
Conditions
Low Level Contact Resistance 2, 5, 2, 5, 2, 5,
2, 4 2, 4 2, 4 3, 7
(LLCR)
Insulation Resistance
Dielectric Withstanding Voltage
Connector Mate
7
7, 9 7, 9
2, 6
3, 7
2, 6
4, 8
5
Connector Unmate
Durability
3(a) 3(a) 3(a)
Reseating
6
8
Vibration
6
8
Mechanical Shock
Thermal Shock
4
6
4
5
Temperature Life
Cyclic Temperature & Humidity
Low Temperature Test
SO2 gas (Gold plated)
Salt Spray
4
4(a)
3
3
3
Pin Retention (in housing)
Solderability
1
1
Temperature Rise
1
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635370
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TEMPLATE FILENAME: 1703070003 REV A
PRODUCT SPECIFICATION
8.0
SOLDER INFORMATION
Per SMES-152 and AS-40000-5013
*These specifications establish standard solderability test methods used to evaluate a products ability to
accept molten solder. Solder Process Temperatures and Reflow Solder Profiles will vary based on
application, equipment, solder paste, PCB thickness, etc.
8.1
8.2
SOLDER PROCESS TEMPERATURE
Wave Solder: 245 °C
Reflow Solder: 260 °C
Molex Solderability Specification SMES-152
(Click Here)
REFLOW SOLDERING PROFILE
(This profile is per AS-40000-5013 and is provided as a guideline only. Please see notes for
additional information)
Molex Connector Heat Resistance Specification
AS-40000-5013
(Click Here)
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635370
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PRODUCT SPECIFICATION
Description
Average Ramp Rate
Preheat Temperature
Preheat Time
Requirement
3 °C/sec Max
150 °C Min to 200 °C Max
60 to 180 sec
3 °C/sec Max
Ramp to Peak
Time over Liquidus (217°C)
Peak Temperature
Time within 5°C of Peak
Ramp - Cool Down
Time 25°C to Peak
60 to 150 sec
260 +0/-5 °C
20 to 40 sec
6 °C/sec Max
8 min Max
9.0
PACKAGING
Parts shall be packaging to protect the parts from damage during standard shipping, storage, and handling.
Parts are packaged in bulk, tape and reel or tube. Refer to Packaging Specification, PK-87933-565 and
PK-87933-300.
10.0 OTHERS
Although some discoloration could be seen on the solder tail after reflow, it does not impact on the
product’s performance.
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PRODUCT SPECIFICATION
11.0 POLARIZATION AND KEYING OPTIONS
11.1
UNSHROUDED HEADER (Series: 87933)
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