0878321412 [MOLEX]
2.00mm (.079) Pitch Milli-Grid™ Header, Surface Mount, Vertical, Shrouded, Leadfree 14 Circuits, 0.38μm (15μ) Gold (Au) Plating, with Locking Windows; 2.00毫米（ 0.079 ）间距的Milli-电网™接头，表面贴装，立式，带罩， 14无铅电路， 0.38μm （ 15μ ），金（Au ），电镀，带锁定的Windows
| 型号： | 0878321412 |
| 厂家： | 
Molex |
| 描述： | 2.00mm (.079) Pitch Milli-Grid™ Header, Surface Mount, Vertical, Shrouded, Leadfree 14 Circuits, 0.38μm (15μ) Gold (Au) Plating, with Locking Windows |
| 文件： | 总5页 (文件大小：353K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
This document was generated on 05/25/2010
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
Part Number:
Status:
0878321412
Active
milligrid
Overview:
Description:
2.00mm (.079") Pitch Milli-Grid™ Header, Surface Mount, Vertical, Shrouded, Lead-
free, 14 Circuits, 0.38µm (15µ") Gold (Au) Plating, with Locking Windows, Center
Polarization Slot, without Cap or PCB Locator, Tube
Documents:
Drawing (PDF)
RoHS Certificate of Compliance (PDF)
Series
Product Specification PS-87831-027 (PDF)
image - Reference only
China RoHS
ELV and RoHS
Compliant
Agency Certification
CSA
UL
EU RoHS
LR19980
E29179
General
Product Family
Series
Application
Comments
REACH SVHC
Contains SVHC: No
Halogen-Free
Status
PCB Headers
87832
Wire-to-Board
Without Cap; Contact Molex for application in
Not Halogen-Free
automotive industry
milligrid
Need more information on product
environmental compliance?
Overview
Product Name
Milli-Grid™
Email productcompliance@molex.com
For a multiple part number RoHS Certificate of
Compliance, click here
Physical
Breakaway
No
Circuits (Loaded)
Circuits (maximum)
Color - Resin
First Mate / Last Break
Flammability
Glow-Wire Compliant
Guide to Mating Part
Keying to Mating Part
Lock to Mating Part
Material - Metal
Material - Plating Mating
Material - Plating Termination
Material - Resin
14
14
Black
No
94V-0
No
No
Yes
No
Phosphor Bronze
Gold
Tin
Nylon
2
Please visit the Contact Us section for any
non-product compliance questions.
Search Parts in this Series
87832Series
Mates With
50394 Wire-to-Board Terminals. 51110
Wire-to-Board Crimp Housing. 87568 Wire-
to-Board IDT Housings. 79107 Board-to-
Board Top Entry Through Hole Receptacle.
79108 Board-to-Board FFC/FPC Top Entry
Through Hole Receptacle. L
Number of Rows
Orientation
PCB Locator
Vertical
No
PCB Retention
Packaging Type
None
Tube
0.079 In
2.00 mm
0.079 In
2.00 mm
15
0.38
75
1.88
Center Slot
No
Pitch - Mating Interface (in)
Pitch - Mating Interface (mm)
Pitch - Term. Interface (in)
Pitch - Term. Interface (mm)
Plating min: Mating (µin)
Plating min: Mating (µm)
Plating min: Termination (µin)
Plating min: Termination (µm)
Polarized to Mating Part
Polarized to PCB
Shrouded
Stackable
Fully
No
Temperature Range - Operating
Termination Interface: Style
-55°C to +105°C
Surface Mount
Electrical
Current - Maximum per Contact
Voltage - Maximum
2A
125V
Solder Process Data
Duration at Max. Process Temperature (seconds)
Lead-free Process Capability
10
Reflow Capable (SMT only)
Max. Cycles at Max. Process Temperature
Process Temperature max. C
1
260
Material Info
Reference - Drawing Numbers
Product Specification
Sales Drawing
PS-87831-027
SD-87832-008
This document was generated on 05/25/2010
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
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