0780610061 [MOLEX]
1.00mm (.039) Pitch Fully Buffered DIMM Socket, Vertical, Through Hole, 0.76μm (30μ) Gold(Au) Selective Plating, 240 Circuits, with Beveled Metal Pins; 1.00毫米（ .039 ）间距全缓冲DIMM插槽，垂直，通孔， 0.76μm （ 30μ ），金（Au ）选择性电镀， 240电路，与斜面金属针
| 型号： | 0780610061 |
| 厂家： | 
Molex |
| 描述： | 1.00mm (.039) Pitch Fully Buffered DIMM Socket, Vertical, Through Hole, 0.76μm (30μ) Gold(Au) Selective Plating, 240 Circuits, with Beveled Metal Pins |
| 文件： | 总7页 (文件大小：365K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
This document was generated on 04/13/2010
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
Part Number:
Status:
0780610061
Active
Description:
1.00mm (.039") Pitch Fully Buffered DIMM Socket, Vertical, Through Hole, 0.76µm
(30µ") Gold(Au) Selective Plating, 240 Circuits, with Beveled Metal Pins, with Black
Latches, 2.67mm (.105") Solder Tail Length, Lead-free
Documents:
3D Model
Drawing (PDF)
Product Specification PS-78061-001 (PDF)
RoHS Certificate of Compliance (PDF)
Series
image - Reference only
China RoHS
Agency Certification
CSA
UL
LR 19980
E29179
EU RoHS
ELV and RoHS
Compliant
REACH SVHC
Contains SVHC: No
Halogen-Free
Status
Not Halogen-Free
Need more information on product
environmental compliance?
General
Product Family
Series
Memory Module Sockets
78061
<LI>Latches in Black Color <LI>Solder Tail Length at
2.67mm (.105")
Memory Module
MO-256
Comments
Component Type
JEDEC Outline
Product Name
FB DIMM
Email productcompliance@molex.com
For a multiple part number RoHS Certificate of
Compliance, click here
Physical
Circuits (Loaded)
240
Black
Color - Resin
Durability (mating cycles max)
Entry Angle
Flammability
25
Please visit the Contact Us section for any
non-product compliance questions.
Vertical (Top Entry)
94V-0
Keying to Mating Part
Material - Metal
Yes
Brass, Phosphor Bronze
Material - Plating Mating
Material - Plating Termination
Material - Resin
Gold
Tin
Search Parts in this Series
78061Series
High Temperature Thermoplastic
PC Tail Length (in)
PC Tail Length (mm)
PCB Locator
0.105 In
2.67 mm
Yes
Mates With
JEDEC MO-256 modules
PCB Retention
Yes
PCB Thickness Recommended (in)
PCB Thickness Recommended (mm)
Packaging Type
0.062 In
1.60 mm
Tray
Pitch - Mating Interface (in)
Pitch - Mating Interface (mm)
Temperature Range - Operating
Termination Interface: Style
0.039 In
1.00 mm
-55°C to +85°C
Through Hole
Electrical
Current - Maximum per Contact
Voltage - Maximum
Voltage Key
1A
30V
1.8V, Center
Solder Process Data
Duration at Max. Process Temperature (seconds)
Lead-free Process Capability
5
SMC & Wave Capable (TH only)
Max. Cycles at Max. Process Temperature
Process Temperature max. C
1
265
Material Info
Reference - Drawing Numbers
Product Specification
Sales Drawing
PS-78061-001, RPS-78061-001
SD-78061-001
This document was generated on 04/13/2010
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
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