0737700100 [MOLEX]
2.00mm (.079") Pitch HDM® Board-to-Board Stacking Header, High Rise Vertical, SMC, Closed End Option, 72 Circuits; 2.00毫米（ .079 “ ）间距HDM®板对板堆垛头，高层垂直， SMC ，闭端选项， 72电路
| 型号： | 0737700100 |
| 厂家： | 
Molex |
| 描述： | 2.00mm (.079") Pitch HDM® Board-to-Board Stacking Header, High Rise Vertical, SMC, Closed End Option, 72 Circuits |
| 文件： | 总3页 (文件大小：123K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
This document was generated on 06/07/2010
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
Part Number:
Status:
0737700100
Active
hdm
Overview:
Description:
2.00mm (.079") Pitch HDM® Board-to-Board Stacking Header, High Rise Vertical,
SMC, Closed End Option, 72 Circuits
Documents:
3D Model
Drawing (PDF)
Product Specification PS-73780-999 (PDF)
RoHS Certificate of Compliance (PDF)
Series
image - Reference only
China RoHS
Agency Certification
CSA
UL
LR19980
E29179
EU RoHS
RoHS Compliant by
Exemption
REACH SVHC
Contains SVHC: No
Halogen-Free
Status
General
Product Family
Series
Application
Component Type
MolexKits
Backplane Connectors
73770
Backplane, Mezzanine
PCB Header
Yes
Not Reviewed
Overview
Product Name
Style
hdm
HDM®
N/A
Need more information on product
environmental compliance?
Email productcompliance@molex.com
For a multiple part number RoHS Certificate of
Compliance, click here
Physical
Circuits (Loaded)
72
Circuits (maximum)
Color - Resin
Durability (mating cycles max)
First Mate / Last Break
Flammability
72
Black
200
No
Please visit the Contact Us section for any
non-product compliance questions.
94V-0
Guide to Mating Part
Keying to Mating Part
Material - Metal
No
None
Phosphor Bronze
Search Parts in this Series
73770Series
Material - Plating Mating
Material - Plating Termination
Material - Resin
Number of Columns
Number of Pairs
Gold
Tin-Lead
High Temperature Thermoplastic
12
Open Pin Field
6
Mates With
73632 HDM PLUS® Board-to-Board
Daughtercard Receptacle. 73780 HDM®
Board-to-Board Daughtercard Receptacle
Number of Rows
Orientation
PC Tail Length (in)
PC Tail Length (mm)
PCB Locator
PCB Retention
PCB Thickness Recommended (in)
PCB Thickness Recommended (mm)
Packaging Type
Pitch - Mating Interface (in)
Pitch - Mating Interface (mm)
Plating min: Mating (µin)
Plating min: Mating (µm)
Plating min: Termination (µin)
Plating min: Termination (µm)
Polarized to PCB
Vertical
0.138 In
3.50 mm
No
None
0.055 In
1.40 mm
Tube
0.079 In
2.00 mm
30
0.75
15
Application Tooling | FAQ
Tooling specifications and manuals are
found by selecting the products below.
Crimp Height Specifications are then
contained in the Application Tooling
Specification document.
Global
Description
Product #
Flat Rock Tooling for 0622013700
Pneumatic Press
HDM® Backplane
Insertion Signal
Contact Tool
0621001400
0.375
No
Extraction Tool
0621001000
Stackable
Yes
Surface Mount Compatible (SMC)
Temperature Range - Operating
Termination Interface: Style
Yes
-55°C to +105°C
Through Hole - Compliant Pin
Electrical
Current - Maximum per Contact
Data Rate
Real Signals (per 25mm)
Voltage - Maximum
1A
1.0 Gbps
72
250V AC
Material Info
Reference - Drawing Numbers
Packaging Specification
Product Specification
PK-70873-0870
PS-73780-999
SD-73770-001
Sales Drawing
HDM and High Density Metric are trademarks of Amphenol Corporation
This document was generated on 06/07/2010
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
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