0736442001 [MOLEX]

2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location A, Polarizing Key Position A, 72 Circuits; 2.00毫米( .079 “ )间距HDM®板对板背板头,垂直, SMC ,压入,导柱位置A,偏光关键位置A , 72电路
0736442001
型号: 0736442001
厂家: Molex    Molex
描述:

2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location A, Polarizing Key Position A, 72 Circuits
2.00毫米( .079 “ )间距HDM®板对板背板头,垂直, SMC ,压入,导柱位置A,偏光关键位置A , 72电路

文件: 总4页 (文件大小:178K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
This document was generated on 05/14/2010  
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION  
Part Number:  
Status:  
0736442001  
Active  
hdm  
Overview:  
Description:  
2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, SMC, Press-  
Fit, Guide Post Location A, Polarizing Key Position A, 72 Circuits  
Documents:  
3D Model  
Drawing (PDF)  
Test Summary (PDF)  
RoHS Certificate of Compliance (PDF)  
Series  
image - Reference only  
China RoHS  
Agency Certification  
CSA  
UL  
LR19980  
E29179  
EU RoHS  
Not RoHS Compliant  
REACH SVHC  
Not Reviewed  
Halogen-Free  
Status  
General  
Product Family  
Series  
Application  
Comments  
Component Type  
Overview  
Backplane Connectors  
73644  
Backplane  
Standard Press-Fit, Tin/Lead (SnPb)  
PCB Header  
hdm  
HDM®  
N/A  
Not Reviewed  
Need more information on product  
environmental compliance?  
Product Name  
Style  
Email productcompliance@molex.com  
For a multiple part number RoHS Certificate of  
Compliance, click here  
Physical  
Circuits (Loaded)  
72  
Please visit the Contact Us section for any  
non-product compliance questions.  
Circuits (maximum)  
Color - Resin  
72  
Black, Natural  
Durability (mating cycles max)  
First Mate / Last Break  
Flammability  
250  
No  
94V-0  
Guide to Mating Part  
Keying to Mating Part  
Material - Metal  
Yes  
Yes  
Search Parts in this Series  
73644Series  
Phosphor Bronze, Stainless Steel  
Material - Plating Mating  
Material - Plating Termination  
Material - Resin  
Number of Columns  
Number of Pairs  
Gold  
Tin  
Mates With  
73632 HDM PLUS® Board-to-Board  
Daughtercard Receptacle. 73780 HDM®  
Board-to-Board Daughtercard Receptacle  
High Temperature Thermoplastic  
12  
Open Pin Field  
6
Number of Rows  
Application Tooling | FAQ  
Tooling specifications and manuals are  
found by selecting the products below.  
Crimp Height Specifications are then  
contained in the Application Tooling  
Specification document.  
Orientation  
PC Tail Length (in)  
PC Tail Length (mm)  
PCB Locator  
PCB Retention  
PCB Thickness Recommended (in)  
PCB Thickness Recommended (mm)  
Packaging Type  
Pitch - Mating Interface (in)  
Pitch - Mating Interface (mm)  
Pitch - Term. Interface (in)  
Pitch - Term. Interface (mm)  
Plating min: Mating (µin)  
Plating min: Mating (µm)  
Plating min: Termination (µin)  
Plating min: Termination (µm)  
Vertical  
0.138 In  
3.50 mm  
No  
Yes  
0.098 In  
2.50 mm  
Tube  
0.079 In  
2.00 mm  
0.079 In  
2.00 mm  
30  
Global  
Description  
Product #  
Flat Rock Tooling for 0622013700  
Pneumatic Press  
HDM® Backplane  
Insertion Signal  
Contact Tool  
0621001400  
Extraction Tool  
0621001000  
0.75  
15  
0.375  
Polarized to PCB  
No  
Stackable  
No  
Surface Mount Compatible (SMC)  
Temperature Range - Operating  
Termination Interface: Style  
Yes  
-55°C to +105°C  
Through Hole - Compliant Pin  
Electrical  
Current - Maximum per Contact  
Data Rate  
Real Signals (per 25mm)  
Shielded  
1A  
1.0 Gbps  
75  
No  
Voltage - Maximum  
250V AC  
Material Info  
Reference - Drawing Numbers  
Packaging Specification  
Sales Drawing  
PK-70873-0818  
SDA-73644-****  
HDM and High Density Metric are trademarks of Amphenol Corporation  
This document was generated on 05/14/2010  
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION  

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