0702472052 [MOLEX]
2.54mm (.100") Pitch C-Grid® Header, Dual Row, Low Profile, Right Angle, Shrouded20 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating; 2.54毫米（ .100“ ）间距C- Grid®头，双排，超薄，直角， Shrouded20电路， 0.76μm （ 30μ ”），金（Au ）选择性电镀，锡（Sn ） PC端脚镀层
| 型号： | 0702472052 |
| 厂家： | 
Molex |
| 描述： | 2.54mm (.100") Pitch C-Grid® Header, Dual Row, Low Profile, Right Angle, Shrouded20 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating |
| 文件： | 总4页 (文件大小：165K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
This document was generated on 05/24/2010
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
Part Number:
Status:
0702470852
Active
cgrid__sl_products
Overview:
Description:
2.54mm (.100") Pitch C-Grid® Header, Dual Row, Low Profile, Right Angle, Shrouded,
8 Circuits, 0.76µm (30µ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
Documents:
3D Model
Drawing (PDF)
Product Specification PS-70246-100 (PDF)
RoHS Certificate of Compliance (PDF)
Series
Product Specification PS-70246 (PDF)
image - Reference only
Agency Certification
CSA
UL
EU RoHS
ELV and RoHS
Compliant
China RoHS
LR19980
E29179
General
Product Family
Series
Application
Overview
REACH SVHC
Contains SVHC: No
Halogen-Free
Status
Not Reviewed
Need more information on product
environmental compliance?
PCB Headers
70247
Wire-to-Board
cgrid__sl_products
C-Grid®
Product Name
Physical
Breakaway
Circuits (Loaded)
Circuits (maximum)
Color - Resin
Durability (mating cycles max)
First Mate / Last Break
Flammability
Glow-Wire Compliant
Guide to Mating Part
Keying to Mating Part
Lock to Mating Part
Material - Plating Mating
Material - Plating Termination
Material - Resin
Email productcompliance@molex.com
For a multiple part number RoHS Certificate of
Compliance, click here
No
8
8
Black
50
No
94V-0
No
No
None
None
Gold
Tin
Polyester
2
Please visit the Contact Us section for any
non-product compliance questions.
Search Parts in this Series
70247Series
Mates With
70450 SL™ Crimp Housing, 70058 SL™
Crimp Terminal
Number of Rows
Orientation
PC Tail Length (in)
PC Tail Length (mm)
PCB Locator
Right Angle
0.120 In
3.05 mm
No
PCB Retention
None
0.062 In
1.60 mm
Tray
PCB Thickness Recommended (in)
PCB Thickness Recommended (mm)
Packaging Type
Pitch - Mating Interface (in)
Pitch - Mating Interface (mm)
Plating min: Mating (µin)
Plating min: Mating (µm)
Plating min: Termination (µin)
Plating min: Termination (µm)
Polarized to Mating Part
Shrouded
0.100 In
2.54 mm
30
0.75
75.2
1.88
Center Slot
Fully
Stackable
No
Temperature Range - Operating
-55°C to +120°C
Termination Interface: Style
Through Hole
Electrical
Current - Maximum per Contact
Voltage - Maximum
2.5A
250V DC
Solder Process Data
Duration at Max. Process Temperature (seconds)
Lead-free Process Capability
10
Wave Capable (TH only)
Max. Cycles at Max. Process Temperature
Process Temperature max. C
1
265
Material Info
Reference - Drawing Numbers
Packaging Specification
Product Specification
PK-87835-001
PS-70246, PS-70246-100
SDA-70247-**00-04
Sales Drawing
This document was generated on 05/24/2010
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
相关型号：
0702472054
2.54mm (.100") Pitch C-Grid Header, Dual Row, Low Profile, Right Angle, Shrouded, 20 Circuits, 0.127um (5u")
MOLEX
0702472451
2.54mm (.100") Pitch C-Grid® Header, Dual Row, Low Profile, Right Angle, Shrouded24 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
MOLEX
0702472452
2.54mm (.100") Pitch C-Grid Header, Dual Row, Low Profile, Right Angle, Shrouded, 24 Circuits, 0.76um (30u")
MOLEX
0702472651
2.54mm (.100") Pitch C-Grid® Header, Dual Row, Low Profile, Right Angle, Shrouded26 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
MOLEX
0702472652
2.54mm (.100") Pitch C-Grid® Header, Dual Row, Low Profile, Right Angle, Shrouded26 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
MOLEX
0702472654
2.54mm (.100") Pitch C-Grid® Header, Dual Row, Low Profile, Right Angle, Shrouded26 Circuits, 0.127μm (5μ") Gold (Au) Plating, Tin(Sn) PC TailPlating
MOLEX
0702473051
2.54mm (.100") Pitch C-Grid® Header, Dual Row, Low Profile, Right Angle, Shrouded30 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
MOLEX
0702473052
2.54mm (.100") Pitch C-Grid® Header, Dual Row, Low Profile, Right Angle, Shrouded30 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
MOLEX
0702473054
2.54mm (.100") Pitch C-Grid® Header, Dual Row, Low Profile, Right Angle, Shrouded30 Circuits, 0.127μm (5μ") Gold (Au) Plating, Tin(Sn) PC TailPlating
MOLEX
0702473451
2.54mm (.100") Pitch C-Grid® Header, Dual Row, Low Profile, Right Angle, Shrouded34 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
MOLEX
0702473452
2.54mm (.100") Pitch C-Grid Header, Dual Row, Low Profile, Right Angle, Shrouded,34 Circuits, 0.76um
MOLEX
0702473454
2.54mm (.100") Pitch C-Grid Header, Dual Row, Low Profile, Right Angle, Shrouded, 34 Circuits, 0.127um
MOLEX
©2020 ICPDF网 联系我们和版权申明