0702462004 [MOLEX]

2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 20Circuits, 0.127μm (5μ") Gold (Au) Plating, Tin(Sn) PC Tail Plating; 2.54毫米( .100“ )间距C- Grid®头,低调,双排,垂直,带罩, 20Circuits , 0.127μm ( 5μ ”),金(Au )镀层,锡( Sn)的PC端脚镀层
0702462004
型号: 0702462004
厂家: Molex Electronics Ltd.    Molex Electronics Ltd.
描述:

2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 20Circuits, 0.127μm (5μ") Gold (Au) Plating, Tin(Sn) PC Tail Plating
2.54毫米( .100“ )间距C- Grid®头,低调,双排,垂直,带罩, 20Circuits , 0.127μm ( 5μ ”),金(Au )镀层,锡( Sn)的PC端脚镀层

PC
文件: 总4页 (文件大小:180K)
下载:  下载PDF数据表文档文件

0702462401

2.54mm (.100") Pitch C-Grid Header, Low Profile, Dual Row, Vertical, Shrouded, 24 Circuits, 0.38um (15u") Gold (Au)

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8 MOLEX

0702462402

2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 24Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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6 MOLEX

0702462501

2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded,26 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, Void

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18 MOLEX

0702462601

2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 26Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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8 MOLEX

0702462602

2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 26 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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8 MOLEX

0702462604

2.54mm (.100) Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 26 Circuits, 0.127μm (5μ) Gold (Au) Plating, Tin(Sn) PC Tail Plating

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11 MOLEX

0702463001

2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 30Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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4 MOLEX

0702463002

2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 30Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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8 MOLEX

0702463004

2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 30Circuits, 0.127μm (5μ") Gold (Au) Plating, Tin(Sn) PC Tail Plating

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9 MOLEX

0702463401

2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 34Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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9 MOLEX

0702463402

2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 34Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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8 MOLEX

0702463404

2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 34Circuits, 0.127μm (5μ") Gold (Au) Plating, Tin(Sn) PC Tail Plating

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7 MOLEX

0702464001

2.54mm (.100") Pitch C-Grid Header, Low Profile, Dual Row, Vertical, Shrouded, 40 Circuits

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7 MOLEX

0702464002

2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 40 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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7 MOLEX

0702464004

2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 40Circuits, 0.127μm (5μ") Gold (Au) Plating, Tin(Sn) PC Tail Plating

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7 MOLEX