MGFC39V7785A_04 [MITSUBISHI]

7.7 ~ 8.5GHz BAND 8W INTERNALLY MATCHED GaAs FET; 7.7 〜 8.5GHz波段8W内部匹配的GaAs FET
MGFC39V7785A_04
型号: MGFC39V7785A_04
厂家: Mitsubishi Group    Mitsubishi Group
描述:

7.7 ~ 8.5GHz BAND 8W INTERNALLY MATCHED GaAs FET
7.7 〜 8.5GHz波段8W内部匹配的GaAs FET

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MITSUBISHI SEMICONDUCTOR <GaAs FET>  
MGFC39V3436  
3.4 ~ 3.6GHz BAND 8W INTERNALLY MATCHED GaAs FET  
DESCRIPTION  
The MGFC39V3436 is an internally impedance-matched  
GaAs power FET especially designed for use in 3.4 ~ 3.6 GHz  
band amplifiers.The hermetically sealed metal-ceramic  
package guarantees high reliability.  
OUTLINE DRAWING Unit : millimeters  
FEATURES  
Class A operation  
0.6 +/-0.15  
Internally matched to 50(ohm) system  
High output power  
(2)  
(2)  
P1dB = 8W (TYP.) @ f=3.4~3.6GHz  
High power gain  
R-1.6  
GLP = 12.5 dB (TYP.) @ f=3.4~3.6GHz  
High power added efficiency  
P.A.E. = 32 % (TYP.) @ f=3.4~3.6GHz  
Low distortion [ item -51 ]  
(3)  
IM3= -45 dBc(TYP.) @Po=28dBm S.C.L.  
APPLICATION  
item 01 : 3.4~3.6 GHz band power amplifier  
item 51 : 3.4~3.6 GHz band digital radio communication  
QUALITY GRADE  
IG  
RECOMMENDED BIAS CONDITIONS  
VDS= 10 (V)  
ID= 2.4 (A)  
(1) GATE  
(2) SOURCE (FLANGE)  
(3) DRAIN  
GF-8  
RG= 50 (ohm)  
(Ta=25 deg.C)  
ABSOLUTE MAXIMUM RATINGS  
< Keep safety first in your circuit designs! >  
Symbol  
VGDO  
VGSO  
ID  
Parameter  
Gate to drain voltage  
Gate to source voltage  
Drain current  
Ratings  
-15  
Unit  
V
Mitsubishi Electric Corporation puts the maximum effort into  
making semiconductor products better and more reliable, but  
there is always the possibility that trouble may occur with them.  
Trouble with semiconductors may lead to personal injury, fire or  
property damage. Remember to give due consideration to safety  
when making your circuit designs, with appropriate measures  
such as (1)placement of substitutive, auxiliary circuits, (2)use of  
non-flammable material or (3)prevention against any malfunction  
or mishap.  
-15  
V
7.5  
A
IGR  
Reverse gate current  
Forward gate current  
Total power dissipation *1  
Channel temperature  
Storage temperature  
-20  
mA  
mA  
W
IGF  
42  
PT  
42.8  
175  
Tch  
deg.C  
deg.C  
Tstg  
-65/+175  
*1 : Tc=25 deg.C  
(Ta=25 deg.C)  
ELECTRICAL CHARACTERISTICS  
Limits  
Symbol  
Parameter  
Test conditions  
Unit  
Min.  
Typ.  
-
Max.  
IDSS  
gm  
Saturated drain current  
Transconductance  
VDS=3V, VGS=0V  
VDS=3V, ID=2.2A  
VDS=3V, ID=20mA  
-
-
7.5  
A
S
2
-
Gate to source cut-off voltage  
Output power at 1dB gain compression  
Linear power gain  
VGS(off)  
P1dB  
GLP  
ID  
-
-
-4.5  
V
38  
10  
-
39.5  
12.5  
-
-
-
dBm  
dB  
A
VDS=10V, ID(RF off)=2.4A, f=3.4~3.6GHz  
Drain current  
3
-
P.A.E.  
IM3  
Power added efficiency  
-
32  
-45  
3
%
3rd order IM distortion  
*1  
*2  
-42  
-
-
dBc  
Rth(ch-c) Thermal resistance  
Delta Vf method  
3.5 deg.C/W  
*1 : item -51, 2 tone test, Po=28dBm Single Carrier Level, f=3.6GHz, Delta f=5MHz  
*2 : Channel to case  
June/2004  
MITSUBISHI  
ELECTRIC  
MITSUBISHI SEMICONDUCTOR <GaAs FET>  
MGFC39V3436  
3.4 ~ 3.6GHz BAND 8W INTERNALLY MATCHED GaAs FET  
June/2004  
MITSUBISHI  
ELECTRIC  

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