M30620FCMFP [MITSUBISHI]
SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER; 单芯片16位CMOS微机
| 型号： | M30620FCMFP |
| 厂家： | 
Mitsubishi Group |
| 描述： | SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER |
| 文件： | 总33页 (文件大小：412K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Mitsubishi microcomputers
M16C / 62M Group
(Low voltage version)
SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER
Description
Description
The M16C/62M group of single-chip microcomputers are built using the high-performance silicon gate
CMOS process using a M16C/60 Series CPU core and are packaged in a 100-pin plastic molded QFP.
These single-chip microcomputers operate using sophisticated instructions featuring a high level of instruc-
tion efficiency. With 1M bytes of address space, low voltage (2.2V to 3.6V), they are capable of executing
instructions at high speed. They also feature a built-in multiplier and DMAC, making them ideal for control-
ling office, communications, industrial equipment, and other high-speed processing applications.
The M16C/62M group includes a wide range of products with different internal memory types and sizes and
various package types.
Features
• Memory capacity..................................ROM (See Figure 1.1.4. ROM Expansion)
RAM 10K to 20K bytes
• Shortest instruction execution time ......100ns (f(XIN)=10MHZ, VCC=2.7V to 3.6V)
142.9ns (f(XIN)=7MHZ, VCC=2.2V to 3.6V with software one-wait)
• Supply voltage .....................................2.7V to 3.6V (f(XIN)=10MHZ, without software wait)
2.4V to 2.7V (f(XIN)=7MHZ, without software wait)
2.2V to 2.4V (f(XIN)=7MHZ with software one-wait)
• Low power consumption ......................28.5mW (VCC = 3V, f(XIN)=10MHZ, without software wait)
• Interrupts..............................................25 internal and 8 external interrupt sources, 4 software
interrupt sources; 7 levels (including key input interrupt)
• Multifunction 16-bit timer......................5 output timers + 6 input timers
• Serial I/O ..............................................5 channels
(3 for UART or clock synchronous, 2 for clock synchronous)
• DMAC ..................................................2 channels (trigger: 24 sources)
• A-D converter.......................................10 bits X 8 channels (Expandable up to 10 channels)
• D-A converter.......................................8 bits X 2 channels
• CRC calculation circuit.........................1 circuit
• Watchdog timer....................................1 line
• Programmable I/O ...............................87 lines
_______
• Input port..............................................1 line (P85 shared with NMI pin)
• Memory expansion ..............................Available (to a maximum of 1M bytes)
• Chip select output ................................4 lines
• Clock generating circuit .......................2 built-in clock generation circuits
(built-in feedback resistor, and external ceramic or quartz oscillator)
Applications
Audio, cameras, office equipment, communications equipment, portable equipment
1
Mitsubishi microcomputers
M16C / 62M Group
(Low voltage version)
SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER
Description
Pin Configuration
Figures 1.1.1 and 1.1.2 show the pin configurations (top view).
PIN CONFIGURATION (top view)
80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51
P4
4
/CS0
/CS1
/CS2
/CS3
/WRL/WR
/WRH/BHE
/RD
P0
7
/D
7
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
P4
5
P06
/D
/D
/D
6
5
4
P4
P4
6
7
P0
P0
P0
5
4
3
P5
P5
P5
0
/D
/D
/D
/D
3
1
2
P0
P0
P0
/AN
/AN
/AN
/AN4/KI
/AN
2
2
1
1
0
0
3
P5
P5
P5
P5
3
/BCLK
/HLDA
/HOLD
/ALE
P10
P10
7
7
/KI
/KI
/KI
4
5
6
6
6
2
P10
5
5
1
0
3
M16C/62 Group
P57/RDY/CLKOUT
P10
4
P60
/CTS
/CLK
/RxD
3
0
/RTS
0
P10
3
P6
1
0
P10
P10
2
/AN
/AN
2
1
P62
0
1
P6
P6
P6
/T
XD0
AVSS
4
/CTS
5
1
1
1
/RTS
1
/CLKS1
P10
0/AN
0
/CLK
/RxD
V
REF
P6
P6
6
AVcc
/ADTRG/SIN
7
/TXD1
P9
7
4
1
2
3
4
5
6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30
Package: 100P6S-A
Figure 1.1.1. Pin configuration (top view)
2
Mitsubishi microcomputers
M16C / 62M Group
(Low voltage version)
SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER
Description
PIN CONFIGURATION (top view)
75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51
P12/D10
P11/D9
P10/D8
P07/D7
P06/D6
P05/D5
P04/D4
P03/D3
P02/D2
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
P42/A18
P43/A19
P44/CS0
P45/CS1
P46/CS2
P47/CS3
P50/WRL/WR
P51/WRH/BHE
P52/RD
P53/BCLK
P01/D1
P00/D0
P107/AN7/KI3
P106/AN6/KI2
P105/AN5/KI1
P104/AN4/KI0
P103/AN3
P54/HLDA
P55/HOLD
P56/ALE
M16C/62 Group
P57/RDY/CLKOUT
P60/CTS0/RTS0
P61/CLK0
P62/RxD0
P63/TXD0
P64/CTS1/RTS1/CLKS1
P65/CLK1
P66/RxD1
P67/TXD1
P70/TXD2/SDA/TA0OUT
P71/RxD2/SCL/TA0IN/TB5IN
P72/CLK2/TA1OUT/V
P102/AN2
P101/AN1
AVSS
P100/AN0
VREF
AVcc
P97/ADTRG/SIN4
P96/ANEX1/SOUT4
P95/ANEX0/CLK4
1
2
3
4
5
6
7
8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25
Package: 100P6Q-A
Figure 1.1.2. Pin configuration (top view)
3
Mitsubishi microcomputers
M16C / 62M Group
(Low voltage version)
SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER
Description
Block Diagram
Figure 1.1.3 is a block diagram of the M16C/62M group.
Block diagram of the M16C/62M group
8
8
Port P2
8
8
8
8
8
I/O ports
Port P0
Port P1
Port P3
Port P4
Port P5
Port P6
Internal peripheral functions
Timer
System clock generator
IN-XOUT
CIN-XCOUT
A-D converter
(10 bits
X 8 channels
X
X
Expandable up to 10 channels)
Timer TA0 (16 bits)
Timer TA1 (16 bits)
Timer TA2 (16 bits)
Timer TA3 (16 bits)
Timer TA4 (16 bits)
Timer TB0 (16 bits)
Timer TB1 (16 bits)
Timer TB2 (16 bits)
Timer TB3 (16 bits)
Timer TB4 (16 bits)
Timer TB5 (16 bits)
UART/clock synchronous SI/O
Clock synchronous SI/O
(8 bits
X
3 channels)
(8 bits
X
2 channels)
CRC arithmetic circuit (CCITT )
(Polynomial : X16+X12+X5+1)
M16C/60 series16-bit CPU core
Memory
ROM
(Note 1)
Registers
Program counter
R0H
R0H
R1H
R2
R3
A0
A1
FB
R0L
R0L
R1L
PC
Watchdog timer
(15 bits)
RAM
(Note 2)
Vector table
INTB
DMAC
(2 channels)
Stack pointer
ISP
USP
D-A converter
(8 bits X 2 channels)
Multiplier
Flag register
FLG
SB
Note 1: ROM size depends on MCU type.
Note 2: RAM size depends on MCU type.
Figure 1.1.3. Block diagram of M16C/62M group
4
Mitsubishi microcomputers
M16C / 62M Group
(Low voltage version)
SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER
Description
Performance Outline
Table 1.1.1 is a performance outline of M16C/62M group.
Table 1.1.1. Performance outline of M16C/62M group
Item
Performance
Number of basic instructions
91 instructions
100ns(f(XIN)=10MHZ, VCC=2.7V to 3.6V)
Shortest instruction execution time
142.9ns (f(XIN)=7MHZ, VCC=2.2V to 3.6V with software one-wait)
(See the figure 1.1.4. ROM Expansion)
10K to 20K bytes
Memory
capacity
I/O port
ROM
RAM
P0 to P10 (except P85)
P85
8 bits x 10, 7 bits x 1
Input port
1 bit x 1
Multifunction TA0, TA1, TA2, TA3, TA4
16 bits x 5
timer
TB0, TB1, TB2, TB3, TB4, TB5 16 bits x 6
Serial I/O
UART0, UART1, UART2
SI/O3, SI/O4
(UART or clock synchronous) x 3
(Clock synchronous) x 2
A-D converter
D-A converter
DMAC
10 bits x (8 + 2) channels
8 bits x 2
2 channels (trigger: 24 sources)
CRC-CCITT
CRC calculation circuit
Watchdog timer
15 bits x 1 (with prescaler)
Interrupt
25 internal and 8 external sources, 4 software sources, 7 levels
2 built-in clock generation circuits
(built-in feedback resistor, and external ceramic or quartz oscillator)
2.7V to 3.6V (f(XIN)=10MHZ, without software wait)
2.4V to 2.7V (f(XIN)=7MHZ, without software wait)
2.2V to 2.4V (f(XIN)=7MHZ with software one-wait)
28.5mW (f(XIN) =10MHZ, VCC=3V without software wait)
3V
Clock generating circuit
Supply voltage
Power consumption
I/O
I/O withstand voltage
characteristics Output current
Memory expansion
Device configuration
Package
1mA
Available (to a maximum of 1M bytes)
CMOS high performance silicon gate
100-pin plastic mold QFP
5
Mitsubishi microcomputers
M16C / 62M Group
(Low voltage version)
SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER
Description
Mitsubishi plans to release the following products in the M16C/62M group:
(1) Support for mask ROM version and Flash memory version
(2) ROM capacity
(3) Package
100P6S-A : Plastic molded QFP (mask ROM and flash memory versions)
100P6Q-A : Plastic molded QFP (mask ROM and flash memory versions)
ROM Size
(Byte)
External
ROM
256K
128K
96K
M30624MGM-XXXFP/GP M30624FGMFP/GP
M30620MCM-XXXFP/GP M30620FCMFP/GP
64K
32K
Mask ROM version
Flash memory version
Figure 1.1.4. ROM expansion
The M16C/62M group products currently supported are listed in Table 1.1.2.
Table 1.1.2. M16C/62M group
June, 2000
Remarks
Type No
ROM capacity
RAM capacity
10K byte
Package type
M30620MCM-XXXFP
M30620MCM-XXXGP
M30624MGM-XXXFP
M30624MGM-XXXGP
M30620FCMFP
100P6S-A
100P6Q-A
100P6S-A
100P6Q-A
100P6S-A
100P6Q-A
100P6S-A
128K byte
mask ROM version
256K byte
128K byte
256K byte
20K byte
10K byte
20K byte
M30620FCMGP
Flash memory
3V version
M30624FGMFP
M30624FGMGP
100P6Q-A
6
Mitsubishi microcomputers
M16C / 62M Group
(Low voltage version)
SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER
Description
Type No. M 3 0 6 2 0 M C M – X X X F P
Package type:
FP : Package
GP
100P6S-A
100P6Q-A
:
ROM No.
Omitted for blank flash memory version
ROM capacity:
C : 128K bytes
G : 256K bytes
Memory type:
M : Mask ROM version
F : Flash memory version
Shows RAM capacity, pin count, etc
(The value itself has no specific meaning)
M16C/62 Group
M16C Family
Figure 1.1.5. Type No., memory size, and package
7
Mitsubishi microcomputers
M16C / 62M Group
(Low voltage version)
SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER
Electrical characteristics
Table 1.26.1. Absolute maximum ratings
Symbol
Parameter
Condition
Rated value
- 0.3 to 4.6
Unit
V
Supply voltage
Analog supply voltage
Vcc
AVcc
V
CC=AVCC
CC=AVCC
V
- 0.3 to 4.6
V
CNVSS, BYTE,
RESET,
P0 to P0
P3 to P3
P6
P9
Input
voltage
0
7
, P1
0
to P1
7
, P2
, P5
, P8
0 to P27,
0
7
,P4
0
to P4
7
0
to P5
7,
VI
- 0.3 to Vcc + 0.3
V
0
to P6
7
, P7
2
to P7
7
0
to P87,
0
to P9
7
, P10
0
to P10
7,
V
REF, XIN
V
V
P7
0
, P7
to P0
to P3
to P6
, P8 , P9
1
- 0.3 to 4.6
Output
voltage
P00
7
, P1
0
to P1
to P4
to P7
to P9 , P10
7
, P2
0
to P2
to P57
7
,
P30
7
, P4
0
7, P5
0
,
- 0.3 to Vcc + 0.3
V
O
d
P6
0
6
7
, P7
2
7, P8
0
to P84,
to P107,
P8
7
0
7
0
XOUT
P7
0
, P7
1
- 0.3 to 4.6
300
V
mW
C
P
Power dissipation
C
Ta=25
Operating ambient temperature
Storage temperature
- 20 to 85 / -40 to 85 (Note)
- 65 to 150
T
opr
stg
T
C
Note : Specify a product of -40°C to 85°C to use it.
8
Mitsubishi microcomputers
M16C / 62M Group
(Low voltage version)
SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER
Electrical characteristics
Table 1.26.2. Recommended operating conditions (referenced to VCC = 2.2V to 3.6V at Ta = – 20°C
o
o
to 85 C / – 40°C to 85 C(Note3) unless otherwise specified)
Standard
Typ.
Parameter
Unit
Symbol
Max.
Min.
Supply voltage
Vcc
V
2.2
3.0
Vcc
0
3.6
AVcc
Vss
Analog supply voltage
Supply voltage
V
V
AVss
Analog supply voltage
0
V
P3
P7
IN, RESET, CNVSS, BYTE
P7 , P7
1
to P3
to P7
7
, P4
, P8
0
to P4
to P8
7
, P5
, P9
0
to P57, P6
0
to P6
7,
HIGH input
voltage
2
7
0
7
0
to P9 , P10
7
0
to P10
7
,
0.8Vcc
Vcc
V
X
V
IH
0.8Vcc
0.8Vcc
V
V
0
1
4.6
P0 to P0
P0 to P0
(data input function during memory expansion and microprocessor modes)
P3 to P3 , P4 to P4 , P5 to P57, P6 to P6
P7 to P7 , P8 to P8 , P9 to P9 , P10 to P10
IN, RESET, CNVSS, BYTE
0
7, P1
0
to P1
7, P2
0
to P2
7
, P3
0 (during single-chip mode)
Vcc
0
7, P1
0
to P1
7, P2
0
to P2
7
, P3
0
0.5Vcc
Vcc
V
1
7
0
7
0
0
7,
LOW input
voltage
0
7
0
7
0
7
0
7,
0
0.2Vcc
V
X
VIL
P0
0
to P0
7
, P1
0
to P1
7
, P2
0
to P2
7
, P3
0
(during single-chip mode)
0
0
0.2Vcc
V
V
P0
0
to P0
7, P1
0
to P1
7, P2
0
to P2
7, P3
0
0.16Vcc
(data input function during memory expansion and microprocessor modes)
P0
P4
P8
0
0
to P0
to P4
to P8
7
, P1
0
0
6
to P1
to P5
7
, P2
, P6
0
0
to P2
to P6
7
, P3
, P7
0
2
to P3
to P7
7
7
,
,
HIGH peak output
current
IOH (peak)
- 10.0
- 5.0
10.0
7, P5
7
7
mA
mA
0
4
, P8
, P8
7
, P9
0
to P9
7, P10
0
to P10
7
P0
P4
P8
0
to P0
to P4
to P8
7
, P1
, P5
, P8
0
0
6
to P1
to P5
7
, P2
, P6
0
0
to P2
to P6
7
, P3
, P7
0
to P3
7
,
,
HIGH average output
current
IOH (avg)
0
0
7
4
7
7
2
to P77
, P8
to P1
to P5
, P8 , P9
to P1 , P2
to P5
, P8 , P9
7
, P9
, P2
, P6
to P9
0
to P9
7
, P10
0
to P10
to P3
to P7
to P10
to P3
to P7
to P10
7
P0
P4
P8
P0
P4
P8
0
to P0
to P4
to P8
to P0
to P4
to P8
7
, P1
0
7
0
to P2
7
, P3
, P7
0
0
7,
7,
7
LOW peak output
current
mA
mA
IOL (peak)
0
0
7
4
, P5
0
7
0
to P6
7
0
, P8
6
7
0
7, P10
0
7
, P1
0
7
0
0
to P2
to P6
7
, P3
, P7
0
0
7
,
,
LOW average
output current
IOL (avg)
5.0
10
0
7
, P5
, P8
0
7
, P6
7
0
7
0
4
6
7
0
to P9
7, P10
7
0
0
0
0
0
MHz
MHz
MHz
MHz
MHz
Vcc=2.7V to 3.6V
No wait
10 X Vcc
- 17
Vcc=2.4V to 2.7V
Vcc=2.2V to 2.4V
Vcc=2.7V to 3.6V
Vcc=2.2V to 2.7V
f (XIN
)
Main clock input
oscillation
frequency
17.5 X Vcc
- 35
10
with wait
6 X Vcc
- 6.2
Subclock oscillation frequency
Note 1: The mean output current is the mean value within 100ms.
f (XcIN
)
32.768
50
kHz
Note 2: The total IOL (peak) for ports P0, P1, P2, P86, P87, P9, and P10 must be 80mA max. The total IOH (peak) for ports P0, P1,
P2, P86, P87, P9, and P10 must be 80mA max. The total IOL (peak) for ports P3, P4, P5, P6, P7, and P80 to P84 must be
80mA max. The total IOH (peak) for ports P3, P4, P5, P6, P72 to P77, and P80 to P84 must be 80mA max.
Note 3: Specify a product of -40°C to 85°C to use it.
Note 4: Relationship between main clock oscillation frequency and supply voltage.
Main clock input oscillation frequency
(No wait)
Main clock input oscillation frequency
(With wait)
Flash memory version program voltage and read
operation voltage characteristics
10.0
7.0
10.0
7.0
10 X VCC –17MHZ
6 X VCC –6.2MHZ
Flash program voltage
Flash read operation voltage
VCC=2.7V to 3.6V
VCC=2.7V to 3.4V
VCC=2.4V to 3.6V
VCC=2.2V to 2.4V
17.5 X VCC
–35MHZ
3.5
0.0
0.0
2.2
2.4
2.7
3.6
2.2
2.4
2.7
3.6
Supply voltage[V]
Supply voltage[V]
(BCLK: no division)
(BCLK: no division)
Note 5: Execute case without wait, program / erase of flash memory by VCC=2.7V to 3.6V and f(BCLK) ≤ 6.25 MHz. Execute case
with wait, program / erase of flash memory by VCC=2.7V to 3.6V and f(BCLK) ≤ 10.0 MHz.
9
Mitsubishi microcomputers
M16C / 62M Group
(Low voltage version)
SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER
Electrical characteristics
o
Table 1.26.3. Electrical characteristics (referenced to VCC = 2.7V to 3.6V, VSS = 0V at Ta = – 20 C to
o
o
o
85 C / – 40 C to 85 C (Note1), f(XIN) = 10MH
Z
without wait unless otherwise specified)
Standard
Min Typ. Max.
Measuring condition
Unit
Symbol
Parameter
P0
P4
P8
0
0
0
to P0
to P4
to P8
7
7
4
, P1
, P5
, P8
0
0
6
to P1
7
, P2
, P6
0
0
to P2
to P6
7
, P3
, P7
0
2
to P3
to P7
7
7
7
,
HIGH output
voltage
to P5
7
7
,
I
OH=–1mA
2.5
V
V
OH
,P8
7, P9
0
to P9
7, P10
0
to P10
I
I
OH=–0.1mA
2.5
2.5
3.0
1.6
HIGHPOWER
LOWPOWER
HIGH output
voltage
X
OUT
V
V
OH=–50µA
V
OH
With no load applied
With no load applied
HIGHPOWER
LOWPOWER
HIGH output
voltage
X
COUT
P0
P4
P8
0
0
0
to P0
to P4
to P8
7
7
4
, P1
, P5
, P8
0
0
6
to P1
7
, P2
, P6
0
0
to P2
to P6
7
, P3
, P7
0
0
to P3
to P7
7
7
7
,
LOW output
voltage
to P5
7
7
,
I
OL=1mA
0.5
V
V
V
OL
OL
,P87, P90 to P97, P100 to P10
I
I
OL=0.1mA
HIGHPOWER
LOWPOWER
0.5
LOW output
voltage
XOUT
V
V
OL=50µA
0.5
With no load applied
With no load applied
0
0
HIGHPOWER
LOWPOWER
LOW output
voltage
XCOUT
HOLD, RDY, TA0IN to TA4IN, TB0IN to TB5IN
INT to INT , NMI, ADTRG, CTS to CTS , SCL,
SDA, CLK to CLK , TA2OUT to TA4OUT
KI to KI , RxD to RxD , SIN3, SIN4
,
Hysteresis
0
5
0
2
0.2
0.2
0.8
V
V
V
T
T
+–V
T
–
–
0
4
,
0
3
0
2
Hysteresis
RESET
1.8
4.0
V
+–VT
P0
P4
P8
0
0
0
to P0
to P4
to P8
7
7
7
, P1
, P5
, P9
0
to P1
to P5
to P9
7
7
7
, P2
, P6
, P100 to P107,
0
0
to P2
to P6
7
, P3
, P7
0
0
to P3
to P7
7
,
,
HIGH input
current
0
0
7
7
I
IH
V
I=3V
µA
X
IN, RESET, CNVss, BYTE
P0
P4
P8
0
0
0
to P0
to P4
to P8
7
7
7
, P1
, P5
, P9
0
0
0
to P1
to P5
to P9
7
7
7
, P2
, P6
, P100 to P107,
0
0
to P2
to P6
7
, P3
, P7
0
0
to P3
to P7
7
,
,
LOW input
current
7
7
I
IL
V
V
I
=0V
=0V
–4.0
330
µA
XIN, RESET, CNVss, BYTE
P0
P4
P8
0
0
0
to P0
to P4
to P8
7, P1
7, P5
4, P8
0
0
6
to P1
7
, P2
, P6
0
0
to P2
to P6
7
, P3
, P7
0
2
to P3
to P7
7
7
7
,
,
Pull-up
resistance
R
PULLUP
to P5
7
7
I
20
75
k
Ω
,P87, P90 to P97, P100 to P10
Feedback resistance
Feedback resistance
X
X
IN
CIN
RfXIN
3.0
M
M
Ω
Ω
RfXCIN
10.0
RAM retention voltage
When clock is stopped
2.0
V
V
RAM
f(XIN)=10MHz
Square wave,
no division
Mask ROM version
9.5
21.25
21.25
mA
mA
In single-chip mode, the output pins
are open and other pins are VSS
f(XIN)=10MHz
Square wave,
no division
Flash memory
3V version
12.0
Mask ROM version,
flash memory
3V version
f(XCIN)=32kHz
Square wave
µA
45.0
f(XIN)=10MHz
Square wave,
division by 2
Flash memory
3V version
program
mA
14.0
17.0
f(XIN)=10MHz
Flash memory
3V version
erase
Square wave,
division by 2
mA
Power supply current
I
CC
f(XCIN)=32kHz
When a WAIT instruction
is executed.
Oscillation capacity High
(Note2)
Mask ROM version,
flash memory
3V version
2.8
0.9
µA
f(XCIN)=32kHz
When a WAIT instruction
is executed.
Oscillation capacity Low
(Note2)
µA
µA
When clock is stopped
1.0
Ta=25°C
When clock is stopped
20.0
Ta=85°C
Note 1: Specify a product of -40°C to 85°C to use it.
Note 2: With one timer operated using fC32.
10
Mitsubishi microcomputers
M16C / 62M Group
(Low voltage version)
SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER
Electrical characteristics
Table 1.26.4. A-D conversion characteristics (referenced to VCC = AVCC = VREF = 2.4V to 3.6V, VSS = AVSS
= 0V, at Ta = – 20oC to 85oC / – 40oC to 85oC (Note2), f(XIN)=10MHZ unless otherwise specified)
Standard
Symbol
Parameter
Measuring condition
Unit
Min. Typ. Max
10
Bits
LSB
kΩ
Resolution
V
V
V
REF =VCC
–
–
Absolute accuracy Sample & hold function not available (8 bit)
±2
REF =VCC=3V, fAD=fAD/2
REF =VCC
R
LADDER
10
40
Ladder resistance
t
CONV
Conversion
time(8bit)
9.8
µs
2.4
0
V
CC
V
V
V
V
REF
IA
Reference voltage
V
REF
Analog input voltage
Note 1: Connect AVCC pin to VCC pin and apply the same electric potential.
Note 2: Specify a product of –40°C to 85°C to use it.
Table 1.26.5. D-A conversion characteristics (referenced to VCC = 2.4V to 3.6V, VSS = AVSS = 0V, VREF=3V,
at Ta = – 20oC to 85oC / – 40oC to 85oC (Note2), f(XIN)=10MHZ unless otherwise specified)
Standard
Symbol
Parameter
Measuring condition
Unit
Min. Typ. Max
8
1.0
3
Resolution
–
–
Bits
%
Absolute accuracy
t
su
µs
Setup time
RO
4
10
20
kΩ
Output resistance
I
VREF
1.0
mA
Reference power supply input current
(Note1)
Note 1: This applies when using one D-A converter, with the D-A register for the unused D-A converter set to “0016”.
The A-D converter's ladder resistance is not included.
Also, when DA register contents are not “00”, the current IVREF always flows even though Vref may have been
set to be “unconnected” by the A-D control register.
Note 2: Specify a product of –40°C to 85°C to use it.
Table 1.26.6. Flash memory version electrical characteristics
(referenced to VCC = 2.7V to 3.6V, at Ta =0oC to 60oC unless otherwise specified)
Standard
Parameter
Unit
Min.
Typ.
Max
120
Page program time
Block erase time
6
ms
ms
ms
ms
50
600
Erase all unlocked blocks time
Lock bit program time
50 X n (Note)
6
600 X n (Note)
120
Note : n denotes the number of block erases.
Table 1.26.7. Flash memory version program voltage and read operation voltage characteristics
(Ta =0oC to 60oC)
Flash program voltage
Flash read operation voltage
V
CC=2.7V to 3.6V
CC=2.7V to 3.4V
V
V
CC=2.4V to 3.6V
CC=2.2V to 2.4V
V
11
Mitsubishi microcomputers
M16C / 62M Group
(Low voltage version)
SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER
Timing
Timing requirements
o
o
o
o
(referenced to VCC = 3V, VSS = 0V, at Ta = – 20 C to 85 C / – 40 C to 85 C (*) unless otherwise specified)
* : Specify a product of -40°C to 85°C to use it.
Table 1.26.8. External clock input
Standard
Parameter
Symbol
Unit
Min.
100
40
Max.
t
c
External clock input cycle time
ns
ns
ns
ns
t
w(H)
External clock input HIGH pulse width
External clock input LOW pulse width
t
w(L)
40
t
r
External clock rise time
External clock fall time
18
18
t
f
ns
Table 1.26.9. Memory expansion and microprocessor modes
Standard
Symbol
Parameter
Unit
Min.
Max.
(Note)
(Note)
t
ac1(RD-DB)
Data input access time (no wait)
ns
ns
t
ac2(RD-DB)
ac3(RD-DB)
Data input access time (with wait)
t
ns
ns
Data input access time (when accessing multiplex bus area)
Data input setup time
(Note)
t
t
su(DB-RD)
80
60
80
0
su(RDY-BCLK )
ns
ns
ns
ns
ns
RDY input setup time
HOLD input setup time
Data input hold time
RDY input hold time
HOLD input hold time
t
t
su(HOLD-BCLK )
h(RD-DB)
t
h(BCLK -RDY)
0
0
t
h(BCLK-HOLD )
ns
t
d(BCLK-HLDA)
HLDA output delay time
100
Note: Calculated according to the BCLK frequency as follows:
109
f(BCLK) X 2
– 90
tac1(RD – DB) =
tac2(RD – DB) =
t
ac3(RD – DB) =
[ns]
3 X 10 9
f(BCLK) X 2
– 90
– 90
[ns]
[ns]
3 X 10 9
f(BCLK) X 2
12
Mitsubishi microcomputers
M16C / 62M Group
(Low voltage version)
SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER
Timing
Timing requirements
o
o
o
o
(referenced to VCC = 3V, VSS = 0V, at Ta = – 20 C to 85 C / – 40 C to 85 C (*) unless otherwise specified)
* : Specify a product of –40°C to 85°C to use it.
Table 1.26.10. Timer A input (counter input in event counter mode)
Standard
Symbol
Parameter
Unit
Min.
150
60
Max.
t
c(TA)
TAiIN input cycle time
ns
ns
ns
t
w(TAH)
TAiIN input HIGH pulse width
TAiIN input LOW pulse width
t
w(TAL)
60
Table 1.26.11. Timer A input (gating input in timer mode)
Standard
Min. Max.
600
Symbol
Parameter
Unit
ns
t
c(TA)
TAiIN input cycle time
t
w(TAH)
TAiIN input HIGH pulse width
TAiIN input LOW pulse width
300
300
ns
ns
t
w(TAL)
Table 1.26.12. Timer A input (external trigger input in one-shot timer mode)
Standard
Symbol
Parameter
Unit
ns
Min.
300
Max.
t
c(TA)
TAiIN input cycle time
t
w(TAH)
TAiIN input HIGH pulse width
TAiIN input LOW pulse width
150
150
ns
ns
t
w(TAL)
Table 1.26.13. Timer A input (external trigger input in pulse width modulation mode)
Standard
Symbol
Parameter
Unit
Min.
150
Max.
t
w(TAH)
TAiIN input HIGH pulse width
TAiIN input LOW pulse width
ns
ns
t
w(TAL)
150
Table 1.26.14. Timer A input (up/down input in event counter mode)
Standard
Symbol
Parameter
Unit
Min.
Max.
t
c(UP)
TAiOUT input cycle time
3000
ns
ns
ns
ns
ns
t
w(UPH)
w(UPL)
TAiOUT input HIGH pulse width
TAiOUT input LOW pulse width
TAiOUT input setup time
1500
1500
600
t
t
su(UP-TIN
)
t
h(TIN-UP)
TAiOUT input hold time
600
13
Mitsubishi microcomputers
M16C / 62M Group
(Low voltage version)
SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER
Timing
Timing requirements
o
o
o
o
(referenced to VCC = 3V, VSS = 0V, at Ta = – 20 C to 85 C / – 40 C to 85 C (*) unless otherwise specified)
* : Specify a product of –40°C to 85°C to use it.
Table 1.26.15. Timer B input (counter input in event counter mode)
Standard
Parameter
Unit
Symbol
Max.
Min.
150
60
TBiIN input cycle time (counted on one edge)
t
c(TB)
ns
ns
ns
t
w(TBH)
TBiIN input HIGH pulse width (counted on one edge)
TBiIN input LOW pulse width (counted on one edge)
TBiIN input cycle time (counted on both edges)
TBiIN input HIGH pulse width (counted on both edges)
TBiIN input LOW pulse width (counted on both edges)
t
w(TBL)
60
t
c(TB)
w(TBH)
w(TBL)
300
160
160
ns
ns
ns
t
t
Table 1.26.16. Timer B input (pulse period measurement mode)
Standard
Parameter
Symbol
Unit
Min.
600
300
300
Max.
t
c(TB)
TBiIN input cycle time
ns
ns
ns
t
w(TBH)
TBiIN input HIGH pulse width
TBiIN input LOW pulse width
t
w(TBL)
Table 1.26.17. Timer B input (pulse width measurement mode)
Standard
Parameter
Symbol
Unit
Min.
Max.
TBiIN input cycle time
t
t
c(TB)
600
300
300
ns
ns
ns
w(TBH)
TBiIN input HIGH pulse width
TBiIN input LOW pulse width
t
w(TBL)
Table 1.26.18. A-D trigger input
Standard
Symbol
Parameter
Unit
Min.
Max.
t
c(AD)
w(ADL)
ADTRG input cycle time (trigger able minimum)
ADTRG input LOW pulse width
1500
200
ns
ns
t
Table 1.26.19. Serial I/O
Standard
Symbol
Parameter
Unit
Max.
Min.
300
150
t
c(CK)
CLKi input cycle time
ns
ns
t
w(CKH)
CLKi input HIGH pulse width
t
w(CKL)
CLKi input LOW pulse width
TxDi output delay time
150
ns
ns
t
t
d(C-Q)
h(C-Q)
160
TxDi hold time
0
50
90
ns
ns
ns
t
su(D-C)
RxDi input setup time
RxDi input hold time
t
h(C-D)
_______
Table 1.26.20. External interrupt INTi inputs
Standard
Symbol
Parameter
Unit
Min.
380
Max.
t
w(INH)
w(INL)
ns
ns
INTi input HIGH pulse width
INTi input LOW pulse width
t
380
14
Mitsubishi microcomputers
M16C / 62M Group
(Low voltage version)
SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER
Timing
o
o
o
o
Switching characteristics (referenced to VCC = 3V, VSS = 0V at Ta = – 20 C to 85 C / – 40 C to 85 C
(Note 3), CM15 = “1” unless otherwise specified)
Table 1.26.21. Memory expansion and microprocessor modes (with no wait)
Standard
Measuring condition
Symbol
Parameter
Address output delay time
Unit
Min.
Max.
60
t
t
d(BCLK-AD)
h(BCLK-AD)
ns
ns
Address output hold time (BCLK standard)
4
0
0
t
t
t
t
h(RD-AD)
Address output hold time (RD standard)
Address output hold time (WR standard)
Chip select output delay time
ns
ns
ns
ns
h(WR-AD)
d(BCLK-CS)
60
60
60
h(BCLK-CS)
Chip select output hold time (BCLK standard)
4
t
t
d(BCLK-ALE)
h(BCLK-ALE)
ALE signal output delay time
ALE signal output hold time
RD signal output delay time
RD signal output hold time
ns
ns
ns
ns
—4
Figure 1.26.1
t
t
d(BCLK-RD)
h(BCLK-RD)
0
t
t
t
t
d(BCLK-WR)
WR signal output delay time
WR signal output hold time
Data output delay time (BCLK standard)
Data output hold time (BCLK standard)
60
80
ns
ns
ns
ns
h(BCLK-WR)
d(BCLK-DB)
0
h(BCLK-DB)
4
(Note1)
0
t
t
d(DB-WR)
h(WR-DB)
Data output delay time (WR standard)
Data output hold time (WR standard)(Note2)
ns
ns
Note 1: Calculated according to the BCLK frequency as follows:
10 9
td(DB – WR) =
– 80
[ns]
f(BCLK) X 2
Note 2: This is standard value shows the timing when the output is off,
and doesn't show hold time of data bus.
Hold time of data bus is different by capacitor volume and pull-up
(pull-down) resistance value.
Hold time of data bus is expressed in
R
C
DBi
t = –CR X ln (1 – VOL / VCC
)
by a circuit of the right figure.
For example, when VOL = 0.2VCC, C = 30pF, R = 1kΩ, hold time
of output “L” level is
t = – 30pF X 1kΩ X ln (1 – 0.2VCC / VCC
)
= 6.7ns.
Note 3: Specify a product of –40°C to 85°C to use it.
P0
P1
P2
P3
30pF
P4
P5
P6
P7
P8
P9
P10
Figure 1.26.1. Port P0 to P10 measurement circuit
15
Mitsubishi microcomputers
M16C / 62M Group
(Low voltage version)
SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER
Timing
o
o
o
o
Switching characteristics (referenced to VCC = 3V, VSS = 0V at Ta = – 20 C to 85 C / – 40 C to 85 C
(Note 3), CM15 = “1” unless otherwise specified)
Table 1.26.22. Memory expansion and microprocessor modes
(when accessing external memory area with wait)
Standard
Measuring condition
Symbol
Parameter
Unit
ns
Min.
Max.
60
t
d(BCLK-AD)
h(BCLK-AD)
Address output delay time
t
t
Address output hold time (BCLK standard)
Address output hold time (RD standard)
4
0
0
ns
ns
h(RD-AD)
t
t
t
t
h(WR-AD)
Address output hold time (WR standard)
Chip select output delay time
Chip select output hold time (BCLK standard)
ALE signal output delay time
ns
ns
ns
ns
d(BCLK-CS)
60
60
h(BCLK-CS)
4
Figure 1.26.1
d(BCLK-ALE)
ALE signal output hold time
t
h(BCLK-ALE)
ns
ns
ns
ns
– 4
0
td(BCLK-RD)
RD signal output delay time
RD signal output hold time
WR signal output delay time
60
60
th(BCLK-RD)
td(BCLK-WR)
t
t
t
h(BCLK-WR)
WR signal output hold time
0
ns
ns
ns
ns
d(BCLK-DB)
h(BCLK-DB)
Data output delay time (BCLK standard)
Data output hold time (BCLK standard)
Data output delay time (WR standard)
80
4
(Note1)
0
t
d(DB-WR)
h(WR-DB)
Data output hold time (WR standard)(Note2)
t
ns
Note 1: Calculated according to the BCLK frequency as follows:
10 9
td(DB – WR) =
– 80
[ns]
f(BCLK)
Note 2: This is standard value shows the timing when the output is off,
and doesn't show hold time of data bus.
Hold time of data bus is different by capacitor volume and pull-up
(pull-down) resistance value.
Hold time of data bus is expressed in
R
C
DBi
t = –CR X ln (1 – VOL / VCC
)
by a circuit of the right figure.
For example, when VOL = 0.2VCC, C = 30pF, R = 1kΩ, hold time
of output “L” level is
t = – 30pF X 1kΩ X ln (1 – 0.2VCC / VCC
)
= 6.7ns.
Note 3: Specify a product of –40°C to 85°C to use it.
16
Mitsubishi microcomputers
M16C / 62M Group
(Low voltage version)
SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER
Timing
o
o
o
o
Switching characteristics (referenced to VCC = 3V, VSS = 0V at Ta = – 20 C to 85 C / – 40 C to 85 C
(Note 2), CM15 = “1” unless otherwise specified)
Table 1.26.23. Memory expansion and microprocessor modes
(when accessing external memory area with wait, and select multiplexed bus)
Standard
Measuring condition
Symbol
Parameter
Address output delay time
Unit
Min.
Max.
60
t
d(BCLK-AD)
h(BCLK-AD)
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
t
4
Address output hold time (BCLK standard)
Address output hold time (RD standard)
t
h(RD-AD)
(Note 1)
(Note 1)
t
t
t
h(WR-AD)
Address output hold time (WR standard)
Chip select output delay time
d(BCLK-CS)
h(BCLK-CS)
60
4
Chip select output hold time (BCLK standard)
Chip select output hold time (RD standard)
Chip select output hold time (WR standard)
RD signal output delay time
t
h(RD-CS)
(Note 1)
(Note 1)
t
h(WR-CS)
t
d(BCLK-RD)
h(BCLK-RD)
60
60
80
t
RD signal output hold time
0
0
t
t
t
t
t
t
d(BCLK-WR)
h(BCLK-WR)
d(BCLK-DB)
h(BCLK-DB)
d(DB-WR)
WR signal output delay time
Figure 1.26.1
WR signal output hold time
Data output delay time (BCLK standard)
Data output hold time (BCLK standard)
Data output delay time (WR standard)
Data output hold time (WR standard)
ALE signal output delay time (BCLK standard)
ALE signal output hold time (BCLK standard)
ALE signal output delay time (Address standard)
ALE signal output hold time(Address standard)
Post-address RD signal output delay time
Post-address WR signal output delay time
Address output floating start time
4
(Note 1)
(Note 1)
h(WR-DB)
t
d(BCLK-ALE)
h(BCLK-ALE)
60
t
– 4
t
d(AD-ALE)
h(ALE-AD)
(Note 1)
t
40
0
t
d(AD-RD)
t
d(AD-WR)
0
t
dZ(RD-AD)
8
Note 1: Calculated according to the BCLK frequency as follows:
10 9
th(RD – AD) =
[ns]
f(BCLK) X 2
10 9
th(WR – AD) =
[ns]
[ns]
[ns]
[ns]
[ns]
[ns]
f(BCLK) X 2
10 9
th(RD – CS) =
f(BCLK) X 2
10 9
th(WR – CS) =
td(DB – WR) =
f(BCLK) X 2
10 9 X 3
– 80
– 45
f(BCLK) X 2
10 9
th(WR – DB) =
td(AD – ALE) =
f(BCLK) X 2
10 9
f(BCLK) X 2
Note 2: Specify a product of –40°C to 85°C to use it.
17
Mitsubishi microcomputers
M16C / 62M Group
(Low voltage version)
SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER
Timing
VCC = 3V
tc(TA)
t
w(TAH)
TAiIN input
t
w(TAL)
t
c(UP)
t
w(UPH)
TAiOUT input
t
w(UPL)
TAiOUT input
(Up/down input)
During event counter mode
TAiIN input
tsu(UP–TIN)
t
h(TIN–UP)
(When count on falling
edge is selected)
TAiIN input
(When count on rising
edge is selected)
t
c(TB)
tw(TBH)
TBiIN input
t
w(TBL)
t
c(AD)
t
w(ADL)
ADTRG input
t
c(CK)
tw(CKH)
CLKi
TxDi
t
w(CKL)
th(C–Q)
t
su(D–C)
t
d(C–Q)
t
h(C–D)
RxDi
t
w(INL)
INTi input
t
w(INH)
Figure 1.26.2. VCC=3V timing diagram (1)
18
Mitsubishi microcomputers
M16C / 62M Group
(Low voltage version)
SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER
Timing
VCC = 3V
Memory Expansion Mode and Microprocessor Mode
(Valid only with wait)
BCLK
RD
(Separate bus)
WR, WRL, WRH
(Separate bus)
RD
(Multiplexed bus)
WR, WRL, WRH
(Multiplexed bus)
RDY input
th(BCLK–RDY)
tsu(RDY–BCLK)
(Valid with or without wait)
BCLK
tsu(HOLD–BCLK)
th(BCLK–HOLD)
HOLD input
HLDA output
td(BCLK–HLDA)
td(BCLK–HLDA)
P0, P1, P2,
P3, P4,
Hi–Z
P50 to P52
Note: The above pins are set to high-impedance regardless of the input level of the
BYTE pin and bit (PM06) of processor mode register 0 selects the function of
ports P40 to P43.
Measuring conditions :
• VCC=3V
• Input timing voltage : Determined with VIL=0.6V, VIH=2.4V
• Output timing voltage : Determined with VOL=1.5V, VOH=1.5V
Figure 1.26.3. VCC=3V timing diagram (2)
19
Mitsubishi microcomputers
M16C / 62M Group
(Low voltage version)
SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER
Timing
VCC = 3V
Memory Expansion Mode and Microprocessor Mode
(With no wait)
Read timing
BCLK
CSi
th(BCLK–CS)
4ns.min
td(BCLK–CS)
60ns.max
tcyc
th(RD–CS)
0ns.min
td(BCLK–AD)
60ns.max
th(BCLK–AD)
4ns.min
ADi
BHE
0ns.min
th(RD–AD)
td(BCLK–ALE)
th(BCLK–ALE)
–4ns.min
60ns.max
ALE
RD
DB
th(BCLK–RD)
0ns.min
td(BCLK–RD)
60ns.max
tac1(RD–DB)
Hi–Z
th(RD–DB)
0ns.min
tSU(DB–RD)
80ns.min
Write timing
BCLK
td(BCLK–CS)
th(BCLK–CS)
4ns.min
60ns.max
CSi
th(WR–CS)
0ns.min
tcyc
td(BCLK–AD)
60ns.max
th(BCLK–AD)
4ns.min
ADi
BHE
th(WR–AD)
0ns.min
th(BCLK–ALE)
td(BCLK–ALE)
60ns.max
–4ns.min
ALE
th(BCLK–WR)
0ns.min
td(BCLK–WR)
60ns.max
WR,WRL,
WRH
td(BCLK–DB)
80ns.max
Hi–Z
th(BCLK–DB)
4ns.min
DB
th(WR–DB)
0ns.min
td(DB–WR)
(tcyc/2–80)ns.min
Figure 1.26.4. VCC=3V timing diagram (3)
20
Mitsubishi microcomputers
M16C / 62M Group
(Low voltage version)
SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER
Timing
VCC = 3V
Memory Expansion Mode and Microprocessor Mode
(When accessing external memory area with wait)
Read timing
BCLK
t
h(BCLK–CS)
4ns.min
t
d(BCLK–CS)
60ns.max
CSi
t
h(RD–CS)
0ns.min
tcyc
t
h(BCLK–AD)
4ns.min
t
d(BCLK–AD)
60ns.max
ADi
BHE
t
d(BCLK–ALE)
60ns.max
t
h(RD–AD)
0ns.min
t
h(BCLK–ALE)
–4ns.min
ALE
RD
DB
t
d(BCLK–RD)
60ns.max
0ns.min
h(BCLK–RD)
t
t
ac2(RD–DB)
Hi–Z
t
h(RD–DB)
0ns.min
t
SU(DB–RD)
80ns.min
Write timing
BCLK
t
h(BCLK–CS)
t
d(BCLK–CS)
60ns.max
4ns.min
CSi
t
h(WR–CS)
0ns.min
tcyc
t
d(BCLK–AD)
60ns.max
t
h(BCLK–AD)
4ns.min
ADi
BHE
t
h(WR–AD)
0ns.min
t
d(BCLK–ALE)
60ns.max
t
h(BCLK–ALE)
–4ns.min
ALE
t
h(BCLK–WR)
t
d(BCLK–WR)
60ns.max
0ns.min
WR,WRL,
WRH
t
h(BCLK–DB)
4ns.min
t
d(BCLK–DB)
80ns.max
DBi
t
h(WR–DB)
0ns.min
t
d(DB–WR)
(tcyc–80)ns.min
Measuring conditions :
• VCC=3V
• Input timing voltage : Determined with VIL=0.48V, VIH=1.5V
• Output timing voltage : Determined with VOL=1.5V, VOH=1.5V
Figure 1.26.5. VCC=3V timing diagram (4)
21
Mitsubishi microcomputers
M16C / 62M Group
(Low voltage version)
SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER
Timing
VCC = 3V
Memory Expansion Mode and Microprocessor Mode
(When accessing external memory area with wait, and select multiplexed bus)
Read timing
BCLK
tcyc
t
h(BCLK–CS)
4ns.min
t
d(BCLK–CS)
60ns.max
t
h(RD–CS)
(tcyc/2)ns.min
CSi
(tcyc/2–45)ns.min
Address
t
d(AD–ALE)
t
dz(RD–AD)
8ns.max
ADi
Data input
Address
/DBi
t
h(RD–DB)
0ns.min
tac3(RD–DB)
t
h(ALE–AD)
40ns.min
t
SU(DB–RD)
80ns.min
t
d(AD–RD)
0ns.min
t
d(BCLK–AD)
60ns.max
t
h(BCLK–AD)
4ns.min
ADi
BHE
t
d(BCLK–ALE)
t
h(BCLK–ALE)
–4ns.min
t
h(RD–AD)
(tcyc/2)ns.min
60ns.max
ALE
RD
t
h(BCLK–RD)
0ns.min
t
d(BCLK–RD)
60ns.max
Write timing
BCLK
tcyc
t
h(BCLK–CS)
4ns.min
t
d(BCLK–CS)
60ns.max
t
h(WR–CS)
(tcyc/2)ns.min
CSi
t
h(BCLK–DB)
4ns.min
t
d(BCLK–DB)
80ns.max
ADi
Address
Address
Data output
/DBi
t
d(DB–WR)
t
h(WR–DB)
t
d(AD–ALE)
(tcyc*3/2–80)ns.min
(tcyc/2)ns.min
(tcyc/2–60)ns.min
t
h(BCLK–AD)
4ns.min
td(BCLK–AD)
60ns.max
ADi
BHE
td(BCLK–ALE)
th(BCLK–ALE)
t
h(WR–AD)
(tcyc/2)ns.min
t
d(AD–WR)
0ns.min
60ns.max
–4ns.min
ALE
t
d(BCLK–WR)
60ns.max
t
h(BCLK–WR)
0ns.min
WR,WRL,
WRH
Measuring conditions :
• VCC=3V
• Input timing voltage : Determined with VIL=0.48V,VIH=1.5V
• Output timing voltage : Determined with VOL=1.5V,VOH=1.5V
Figure 1.26.6. VCC=3V timing diagram (5)
22
Mitsubishi microcomputers
M16C / 62M Group
(Low voltage version)
SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER
Usage precaution
Usage Precaution
Timer A (timer mode)
(1) Reading the timer Ai register while a count is in progress allows reading, with arbitrary timing, the
value of the counter. Reading the timer Ai register with the reload timing gets “FFFF16”. Reading the
timer Ai register after setting a value in the timer Ai register with a count halted but before the counter
starts counting gets a proper value.
Timer A (event counter mode)
(1) Reading the timer Ai register while a count is in progress allows reading, with arbitrary timing, the
value of the counter. Reading the timer Ai register with the reload timing gets “FFFF16” by underflow
or “000016” by overflow. Reading the timer Ai register after setting a value in the timer Ai register with
a count halted but before the counter starts counting gets a proper value.
(2) When stop counting in free run type, set timer again.
Timer A (one-shot timer mode)
(1) Setting the count start flag to “0” while a count is in progress causes as follows:
• The counter stops counting and a content of reload register is reloaded.
• The TAiOUT pin outputs “L” level.
• The interrupt request generated and the timer Ai interrupt request bit goes to “1”.
(2) The timer Ai interrupt request bit goes to “1” if the timer's operation mode is set using any of the
following procedures:
• Selecting one-shot timer mode after reset.
• Changing operation mode from timer mode to one-shot timer mode.
• Changing operation mode from event counter mode to one-shot timer mode.
Therefore, to use timer Ai interrupt (interrupt request bit), set timer Ai interrupt request bit to “0”
after the above listed changes have been made.
Timer A (pulse width modulation mode)
(1) The timer Ai interrupt request bit becomes “1” if setting operation mode of the timer in compliance with
any of the following procedures:
• Selecting PWM mode after reset.
• Changing operation mode from timer mode to PWM mode.
• Changing operation mode from event counter mode to PWM mode.
Therefore, to use timer Ai interrupt (interrupt request bit), set timer Ai interrupt request bit to “0”
after the above listed changes have been made.
(2) Setting the count start flag to “0” while PWM pulses are being output causes the counter to stop
counting. If the TAiOUT pin is outputting an “H” level in this instance, the output level goes to “L”, and
the timer Ai interrupt request bit goes to “1”. If the TAiOUT pin is outputting an “L” level in this instance,
the level does not change, and the timer Ai interrupt request bit does not becomes “1”.
Timer B (timer mode, event counter mode)
(1) Reading the timer Bi register while a count is in progress allows reading , with arbitrary timing, the
value of the counter. Reading the timer Bi register with the reload timing gets “FFFF16”. Reading the
timer Bi register after setting a value in the timer Bi register with a count halted but before the counter
starts counting gets a proper value.
23
Mitsubishi microcomputers
M16C / 62M Group
(Low voltage version)
SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER
Usage precaution
Timer B (pulse period/pulse width measurement mode)
(1) If changing the measurement mode select bit is set after a count is started, the timer Bi interrupt
request bit goes to “1”.
(2) When the first effective edge is input after a count is started, an indeterminate value is transferred to
the reload register. At this time, timer Bi interrupt request is not generated.
A-D Converter
(1) Write to each bit (except bit 6) of A-D control register 0, to each bit of A-D control register 1, and to bit
0 of A-D control register 2 when A-D conversion is stopped (before a trigger occurs).
In particular, when the Vref connection bit is changed from “0” to “1”, start A-D conversion after an
elapse of 1 µs or longer.
(2) When changing A-D operation mode, select analog input pin again.
(3) Using one-shot mode or single sweep mode
Read the correspondence A-D register after confirming A-D conversion is finished. (It is known by A-
D conversion interrupt request bit.)
(4) Using repeat mode, repeat sweep mode 0 or repeat sweep mode 1
Use the undivided main clock as the internal CPU clock.
Stop Mode and Wait Mode
____________
(1) When returning from stop mode by hardware reset, RESET pin must be set to “L” level until main clock
oscillation is stabilized.
(2) When switching to either wait mode or stop mode, instructions occupying four bytes either from the
WAIT instruction or from the instruction that sets the every-clock stop bit to “1” within the instruction
queue are prefetched and then the program stops. So put at least four NOPs in succession either to
the WAIT instruction or to the instruction that sets the every-clock stop bit to “1”.
Interrupts
(1) Reading address 0000016
• When maskable interrupt is occurred, CPU read the interrupt information (the interrupt number
and interrupt request level) in the interrupt sequence.
The interrupt request bit of the certain interrupt written in address 0000016 will then be set to “0”.
Reading address 0000016 by software sets enabled highest priority interrupt source request bit to “0”.
Though the interrupt is generated, the interrupt routine may not be executed.
Do not read address 0000016 by software.
(2) Setting the stack pointer
• The value of the stack pointer immediately after reset is initialized to 000016. Accepting an
interrupt before setting a value in the stack pointer may become a factor of runaway. Be sure to
set a value in the stack pointer before accepting an interrupt.
_______
When using the NMI interrupt, initialize the stack point at the beginning of a program. Concerning
_______
the first instruction immediately after reset, generating any interrupts including the NMI interrupt is
prohibited.
_______
(3) The NMI interrupt
_______
_______
• The NMI interrupt can not be disabled. Be sure to connect NMI pin to Vcc via a pull-up resistor if
unused.
_______
• Do not get either into stop mode with the NMI pin set to “L”.
24
Mitsubishi microcomputers
M16C / 62M Group
(Low voltage version)
SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER
Usage precaution
(4) External interrupt
_______
_______
• When the polarity of the INT0 to INT5 pins is changed, the interrupt request bit is sometimes set
to "1". After changing the polarity, set the interrupt request bit to "0".
(5) Rewrite the interrupt control register
• To rewrite the interrupt control register, do so at a point that does not generate the interrupt
request for that register. If there is possibility of the interrupt request occur, rewrite the interrupt
control register after the interrupt is disabled. The program examples are described as follow:
Example 1:
INT_SWITCH1:
FCLR
I
; Disable interrupts.
AND.B #00h, 0055h ; Clear TA0IC int. priority level and int. request bit.
NOP
NOP
FSET
; Four NOP instructions are required when using HOLD function.
; Enable interrupts.
I
Example 2:
INT_SWITCH2:
FCLR
I
; Disable interrupts.
AND.B #00h, 0055h ; Clear TA0IC int. priority level and int. request bit.
MOV.W MEM, R0
; Dummy read.
; Enable interrupts.
FSET
I
Example 3:
INT_SWITCH3:
PUSHC FLG
; Push Flag register onto stack
; Disable interrupts.
FCLR
I
AND.B #00h, 0055h ; Clear TA0IC int. priority level and int. request bit.
POPC FLG ; Enable interrupts.
The reason why two NOP instructions (four when using the HOLD function) or dummy read are inserted
before FSET I in Examples 1 and 2 is to prevent the interrupt enable flag I from being set before the
interrupt control register is rewritten due to effects of the instruction queue.
• When a instruction to rewrite the interrupt control register is executed but the interrupt is disabled,
the interrupt request bit is not set sometimes even if the interrupt request for that register has
been generated. This will depend on the instruction. If this creates problems, use the below in-
structions to change the register.
Instructions : AND, OR, BCLR, BSET
Noise
(1) Insert bypass capacitor between VCC and VSS pin for noise and latch up countermeasure.
• Insert bypass capacitor (about 0.1 µF) and connect short and wide line between VCC and VSS
lines.
25
Mitsubishi microcomputers
M16C / 62M Group
(Low voltage version)
SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER
Usage precaution
Notes on the microprocessor mode and transition after shifting from the micropro-
cessor mode to the memory expansion mode
• Microprocessor mode
In microprocessor mode, the SFR, internal RAM, and external memory space can be accessed.
For that reason, the internal ROM area cannot be accessed.
• Memory expansion mode
In memory expansion mode, external memory can be accessed in addition to the internal memory
space (SFR, internal RAM, and internal ROM).
However, after the reset has been released and the operation of shifting from the microprocessor
mode has started (“H” applied to the CNVSS pin), the internal ROM area cannot be accessed even if
the CPU shifts to the memory expansion mode.
26
Mitsubishi microcomputers
M16C / 62M Group
(Low voltage version)
SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER
GZZ-SH13-95B<02A0>
Mask ROM number
Date :
Section head Supervisor
MITSUBISHI ELECTRIC-CHIP 16-BIT
signature
signature
MICROCOMPUTER M30620MCM-XXXFP/GP
MASK ROM CONFIRMATION FORM
Note : Please complete all items marked ❈ .
Submitted by Supervisor
Company
name
TEL
(
)
❈
Customer
Date
Date :
issued
❈1. Check sheet
Mitsubishi processes the mask files generated by the mask file generation utilities out of those held on
the floppy disks you give in to us, and forms them into masks. Hence, we assume liability provided that
there is any discrepancy between the contents of these mask files and the ROM data to be burned into
products we produce. Check thoroughly the contents of the mask files you give in.
Prepare 3.5 inches 2HD (IBM format) floppy disks. And store only one mask file in a floppy disk.
Microcomputer type No. :
File code :
M30620MCM-XXXFP
M30620MCM-XXXGP
(hex)
Mask file name :
.MSK (alpha-numeric 8-digit)
❈2. Mark specification
The mark specification differs according to the type of package. After entering the mark specification on
the separate mark specification sheet (for each package), attach that sheet to this masking check sheet
for submission to Mitsubishi.
For the M30620MCM-XXXFP, submit the 100P6S mark specification sheet. For the M30620MCM-XXXGP,
submit the 100P6Q mark specification sheet.
❈3. Usage Conditions
For our reference when of testing our products, please reply to the following questions about the usage
of the products you ordered.
(1) Which kind of XIN-XOUT oscillation circuit is used?
Ceramic resonator
External clock input
What frequency do not use?
f(XIN) =
Quartz-crystal oscillator
Other (
)
MHZ
27
Mitsubishi microcomputers
M16C / 62M Group
(Low voltage version)
SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER
GZZ-SH13-95B<02A0>
Mask ROM number
MITSUBISHI ELECTRIC-CHIP 16-BIT
MICROCOMPUTER M30620MCM-XXXFP/GP
MASK ROM CONFIRMATION FORM
(2) Which kind of XCIN-XCOUT oscillation circuit is used?
Ceramic resonator
External clock input
What frequency do not use?
f(XCIN) =
Quartz-crystal oscillator
Other (
)
kHZ
(3) Which operation mode do you use?
Single-chip mode
Memory expansion mode
Microprocessor mode
(4) Which operating supply voltage do you use?
(Circle the operating voltage range of use)
2.2 2.4 2.6
2.7
2.8
2.9 3.0 3.1
3.2 3.3
3.4 3.5
3.6
3.7 3.8
(V)
(5) Which operating ambient temperature do you use?
(Circle the operating temperature range of use)
-50 -40 -30 -20
-10
0
10
20
30
40
50
60
70
80
90
(°C)
2
(6) Do you use I C (Inter IC) bus function?
Not use
Use
(7) Do you use IE (Inter Equipment) bus function?
Not use
Use
Thank you cooperation.
❈4. Special item (Indicate none if there is not specified item)
28
Mitsubishi microcomputers
M16C / 62M Group
(Low voltage version)
SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER
GZZ-SH13-48B<98A1>
Mask ROM number
Date :
Section head Supervisor
MITSUBISHI ELECTRIC-CHIP 16-BIT
signature
signature
MICROCOMPUTER M30624MGM-XXXFP/GP
MASK ROM CONFIRMATION FORM
Note : Please complete all items marked ❈ .
Submitted by Supervisor
Company
name
TEL
(
)
❈
Customer
Date
Date :
issued
❈1. Check sheet
Mitsubishi processes the mask files generated by the mask file generation utilities out of those held on
the floppy disks you give in to us, and forms them into masks. Hence, we assume liability provided that
there is any discrepancy between the contents of these mask files and the ROM data to be burned into
products we produce. Check thoroughly the contents of the mask files you give in.
Prepare 3.5 inches 2HD (IBM format) floppy disks. And store only one mask file in a floppy disk.
Microcomputer type No. :
File code :
M30624MGM-XXXFP
M30624MGM-XXXGP
(hex)
Mask file name :
.MSK (alpha-numeric 8-digit)
❈2. Mark specification
The mark specification differs according to the type of package. After entering the mark specification on
the separate mark specification sheet (for each package), attach that sheet to this masking check sheet
for submission to Mitsubishi.
For the M30624MGM-XXXFP, submit the 100P6S mark specification sheet. For the M30624MGM-
XXXGP, submit the 100P6Q mark specification sheet.
❈3. Usage Conditions
For our reference when of testing our products, please reply to the following questions about the usage
of the products you ordered.
(1) Which kind of XIN-XOUT oscillation circuit is used?
Ceramic resonator
External clock input
What frequency do not use?
f(XIN) =
Quartz-crystal oscillator
Other (
)
MHZ
29
Mitsubishi microcomputers
M16C / 62M Group
(Low voltage version)
SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER
GZZ-SH13-48B<98A1>
Mask ROM number
MITSUBISHI ELECTRIC-CHIP 16-BIT
MICROCOMPUTER M30624MGM-XXXFP/GP
MASK ROM CONFIRMATION FORM
(2) Which kind of XCIN-XCOUT oscillation circuit is used?
Ceramic resonator
External clock input
What frequency do not use?
f(XCIN) =
Quartz-crystal oscillator
Other (
)
kHZ
(3) Which operation mode do you use?
Single-chip mode
Memory expansion mode
Microprocessor mode
(4) Which operating supply voltage do you use?
(Circle the operating voltage range of use)
2.2 2.4 2.6
2.7
2.8
2.9 3.0 3.1
3.2 3.3
3.4 3.5
3.6
3.7 3.8
(V)
(5) Which operating ambient temperature do you use?
(Circle the operating temperature range of use)
-50 -40 -30 -20
-10
0
10
20
30
40
50
60
70
80
90
(°C)
2
(6) Do you use I C (Inter IC) bus function?
Not use
Use
(7) Do you use IE (Inter Equipment) bus function?
Not use
Use
Thank you cooperation.
❈4. Special item (Indicate none if there is not specified item)
30
Mitsubishi microcomputers
M16C / 62M Group
(Low voltage version)
SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER
Differences between M16C/62M (Low voltage version) and M30624FGLFP/GP
Item
M16C/62M (Low voltage version)
1 Mbyte fixed
M30624FGLFP/GP
Memory expansion
Memory area
1.2 Mbytes mode
4 Mbytes mode
No CTS/RTS separate function
CTS/RTS separate function
Serial I/O
Only analog delay is selected as
SDA delay
Analog or digital delay is selected as
SDA delay
IIC bus mode
Memory version
Mask ROM version
Flash memory version
Flash memory version only
Clock synchronized only
Standard serial I/O
mode
Clock synchronized
Clock asynchronized
(Flash memory version)
31
Keep safety first in your circuit designs!
●
Mitsubishi Electric Corporation puts the maximum effort into making semiconductor
products better and more reliable, but there is always the possibility that trouble may
occur with them. Trouble with semiconductors may lead to personal injury, fire or
property damage. Remember to give due consideration to safety when making your
circuit designs, with appropriate measures such as (i) placement of substitutive,
auxiliary circuits, (ii) use of non-flammable material or (iii) prevention against any
malfunction or mishap.
Notes regarding these materials
●
●
●
These materials are intended as a reference to assist our customers in the selection
of the Mitsubishi semiconductor product best suited to the customer's application;
they do not convey any license under any intellectual property rights, or any other
rights, belonging to Mitsubishi Electric Corporation or a third party.
Mitsubishi Electric Corporation assumes no responsibility for any damage, or
infringement of any third-party's rights, originating in the use of any product data,
diagrams, charts, programs, algorithms, or circuit application examples contained in
these materials.
All information contained in these materials, including product data, diagrams, charts,
programs and algorithms represents information on products at the time of publication
of these materials, and are subject to change by Mitsubishi Electric Corporation
without notice due to product improvements or other reasons. It is therefore
recommended that customers contact Mitsubishi Electric Corporation or an authorized
Mitsubishi Semiconductor product distributor for the latest product information before
purchasing a product listed herein.
The information described here may contain technical inaccuracies or typographical
errors. Mitsubishi Electric Corporation assumes no responsibility for any damage,
liability, or other loss rising from these inaccuracies or errors.
Please also pay attention to information published by Mitsubishi Electric Corporation
by various means, including the Mitsubishi Semiconductor home page (http://
www.mitsubishichips.com).
●
●
When using any or all of the information contained in these materials, including
product data, diagrams, charts, programs, and algorithms, please be sure to evaluate
all information as a total system before making a final decision on the applicability of
the information and products. Mitsubishi Electric Corporation assumes no
responsibility for any damage, liability or other loss resulting from the information
contained herein.
Mitsubishi Electric Corporation semiconductors are not designed or manufactured
for use in a device or system that is used under circumstances in which human life is
potentially at stake. Please contact Mitsubishi Electric Corporation or an authorized
Mitsubishi Semiconductor product distributor when considering the use of a product
contained herein for any specific purposes, such as apparatus or systems for
transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use.
The prior written approval of Mitsubishi Electric Corporation is necessary to reprint
or reproduce in whole or in part these materials.
●
●
If these products or technologies are subject to the Japanese export control
restrictions, they must be exported under a license from the Japanese government
and cannot be imported into a country other than the approved destination.
Any diversion or reexport contrary to the export control laws and regulations of Japan
and/or the country of destination is prohibited.
●
Please contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semicon
ductor product distributor for further details on these materials or the products con
tained therein.
MITSUBISHI SEMICONDUCTORS
M16C/62M Group (Low voltage version)
Specifications REV.B
Jun. First Edition 2000
Edition by
Committee of editing of Mitsubishi Semiconductor
Published by
Mitsubishi Electric Corp., Kitaitami Works
This book, or parts thereof, may not be reproduced in any form without
permission of Mitsubishi Electric Corporation.
©2000 MITSUBISHI ELECTRIC CORPORATION
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