FU-653SEA-V53F [MITSUBISHI]

1.55 レm EAM/DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL; 与单模光纤尾纤1.55微米EAM / DFB -LD模块


型号：	FU-653SEA-V53F
厂家：	Mitsubishi Group
描述：	1.55 レm EAM/DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL 与单模光纤尾纤1.55微米EAM / DFB -LD模块光纤
文件：	总5页 (文件大小：134K)
中文：	中文翻译
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JAN06 (1/5)

MITSUBISHI (OPTICAL DEVICES)

FU-653SEA-x2MyyF

1.55 μm EAM/DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL

DESCRIPTION

Module type FU-653SEA-x2MyyF is a 1.55μm EA

modulator integrated DFB-LD module with single-

mode optical fiber.

This module is suitable to a light source for use in

10Gb/s digital optical communication systems.

FEATURES

•

Input impedance is 50Ω

Electroabsorption Modulator integrated Multi quantum

wells (MQW) DFB Laser Diode

•

Emission wavelength is in full C band

Single mode optical fiber pig-tail

Built-in optical isolator

Built-in thermal electric cooler

7-pin Butterfly package with GPO connectoｒ

With photodiode for optical output monitor

RoHS (2002/95/EC) complianｔ

APPLICATION

STM-64, OC192 (10Gb/s)

Dense-WDM systems

ABSOLUTE MAXIMUM RATINGS (Tld=Tset)

Parameter

Symbol

Vrl

Vrm

Vfm

Vrd

Ifd

Ipe

Vpe

Conditions

Rating

200

1.5

Unit

°C

Laser diode

Modulator

Optical output power

Forward current

Reverse voltage

Forward voltage

Reverse voltage

Forward current

Current

Photodiode for

monitoring

Thermoelectric

cooler(Note 1)

Voltage

Operating case temperature

Storage temperature

-20 to 70

-40 to 85

Tstg

Note 1. Even if the thermoelectric cooler(TEC) is operated within the rated conditions, uncontrolled current loading or

operation without heat sink may easily damage the module by exceeding the storage temperature range.

Thermistor resistance should be properly monitored by the feedback circuit during TEC operation to avoid the

catastrophic damage.

Mitsubishi Electric Corporation reserves the right to make changes to the products or information contained herein

without notice. No liability is assumed as a result of their use or application.

JAN06 (2/5)

MITSUBISHI (OPTICAL DEVICES)

FU-653SEA-x2MyyF

1.55 μm EAM/DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL

ELECTRICAL/OPTICAL CHARACTERISTICS (Tc=25°C, Tld=Tset, unless otherwise noted)

Item

Symbol

Ith

Iop

Vop

Zin

Condition(Note2)

CW,Vm=0V

CW, If=Iop, Vm=0V

If=Iop

Min.

Typ.

Max.

100

1.7

Unit

dBm

Threshold current

Operating current

Operating voltage

Input impedance

Optical output power Pf

from fiber end

(Note 3,4)

-2

Laser

diode Tset

°C

temperature

Wavelength

Side mode

suppression ratio

Relative intensity

noise

(Note 3,4)

(See teble 1)

λc

RIN

CW, If=Iop, Vm=0V,10GHz

-135

dB/Hz

Power penalty

Extinction ratio

Rise/fall time

Cutoff frequency

RF return loss

tr/tf

(Note 3,4,), 800ps/nm

(Note 3,4)

(Note 3,4),20-80%

If=Iop,Vm=-1V

If=Iop,Vm=-1V, f≤5GHz

If=Iop,Vm=-1V, f≤10GHz

If=Iop,Tc=-20∼70°C, Note 5

If=Iop,Vrd=-5V

Vrd=-5V

Tc=25°C

Tc=-20∼70°C

0.3

2.0

GHz

μA

0.5

1.5

0.1

S11

Tracking error

Imon

Iso

Monitor current

Dark current(PD)

Capacitance(PD)

Optical isolation

0.1

Note 2 : Vm is EAM bias voltage at CW condition, Vpp and Voff are EAM amplitude and EAM high level

offset voltage respectively at modulation condition.

Note 3 : 9.95328Gbps, NRZ, PRBS2^23-1, If=Iop,Vpp=2.5V,Voff=0V to –1V

Note 4 : Optical return loss of the connectors should be greater than 40dB in order to get specified performance.

Note 5 : Er=10×log[Pf(Tc)/Pf(25°C)]

THERMAL CHARACTERISTICS

Limits

Typ.

3950

0.6

1.2

Parameter

Symbol

Conditions

(Note2)

Unit

Min.

9.5

Max.

10.5

Thermistor resistance

B constant of Rth

Cooling capacity

Cooler current

Rth

ΔT

Ipe

Vpe

Tc=Tld=25°C,

°C

1.2

2.5

If=Iop, Tc=70°C,Tld=25°C

Cooler voltage

FIBER PIGTAIL SPECIFICATIONS

Parameter

Specification

Unit

Type

Mode field diameter

Cladding diameter

Secondary coating outer diameter

Connector

9.5±1

125±2

0.9±0.1

See ordering information

μm

Optical return loss of connector

40(min)

Mitsubishi Electric Corporation reserves the right to make changes to the products or information contained herein

without notice. No liability is assumed as a result of their use or application.

JAN06 (3/5)

MITSUBISHI (OPTICAL DEVICES)

FU-653SEA-x2MyyF

1.55 μm EAM/DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL

ORDERING INFORMATION

FU – 653SEA – _2M __ F

λ code

See table 1

Connector

SC/PC

FC/PC

Table 1.

f [THz]

λc [nm] λ code

195.90 1530.33

195.80 1531.12

194.50 1541.35

194.40 1542.14

194.30 1542.94

194.20 1543.73

194.10 1544.53

194.00 1545.32

193.90 1546.12

193.80 1546.92

193.70 1547.72

193.60 1548.51

193.50 1549.32

193.40 1550.12

193.30 1550.92

193.20 1551.72

193.10 1552.52

193.00 1553.33

192.90 1554.13

192.80 1554.94

192.70 1555.75

192.60 1556.55

192.50 1557.36

192.40 1558.17

192.30 1558.98

192.20 1559.79

192.10 1560.61

192.00 1561.42

191.90 1562.23

191.80 1563.05

195.70 1531.90

195.60 1532.68

195.50 1533.47

195.40 1534.25

195.30 1535.04

195.20 1535.82

195.10 1536.61

195.00 1537.40

194.90 1538.19

194.80 1538.98

194.70 1539.77

194.60 1540.56

All wavelengths are referred to vacuum. Tolerance is λc+/-0.05nm.

Mitsubishi Electric Corporation reserves the right to make changes to the products or information contained herein

without notice. No liability is assumed as a result of their use or application.

JAN06 (4/5)

MITSUBISHI (OPTICAL DEVICES)

FU-653SEA-x2MyyF

1.55 μm EAM/DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL

OUTLINE DIAGRAM

unit : mm

Connector

Pin7

Pin1

Pin No.

Function

Thermistor

LD bias (Anode)

Monitor PD (Anode)

Monitor PD (Cathode)

Cooler (Anode)

Cooler (Cathode)

Ground

EAM/LD

GPO connector

Case

FU-653SEA-x2MｙｙF

Mitsubishi Electric Corporation reserves the right to make changes to the products or information contained herein

without notice. No liability is assumed as a result of their use or application.

JAN06 (5/5)

MITSUBISHI (OPTICAL DEVICES)

FU-653SEA-x2MyyF

1.55 μm EAM/DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL

Safety Cautions for Use of Optoelectronic Devices

General:

Although the manufacturer is always striving to improve the reliability of its product, problems and errors may occur with

semiconductor products. Therefore, the user's products are required to be designed with full safety regard to prevent any accidents that

results in injury, death, fire or environmental damage even when semiconductor products happen to error. Especially it is recommended

to take in consideration about redundancy, fire prevention, error prevention safeguards. And the following requirements must be strictly

observed.

Warning!

1. Eye safety : Seminductor laser radiates laser light during operation. Laser light is very dangerous when shot directly into human

eyes. Don't look at laser light directly, or through optics such as a lens. The laser light should be observed using the ITV camera, IR-

viewer, or other appropriate instruments.

2. Product handling : The product contains GaAs (gallium arsenide). It is safe for regular use, but harmful to the human body if

made into powder or steam. Be sure to avoid dangerous process like smashing, burning, chemical etching. Never put this product in

one's mouth or swallow it.

3. Product disposal : This product must be disposed of as special industrial waste. It is necessary to separate it from general

industrial waste and general garbage.

Handling Cautions for Optoelectronic Devices

1. General:

(1) The products described in this specification are designed and manufactured for use in general communication systems or

electronic devices, unless their applications or reliability are otherwise specified. Therefore, they are not designed or manufactured for

installation in devices or systems that may affect human life or that are used in social infrastructure requiring high reliability.

(2) When the customer is considering to use the products in special applications, such as transportation systems (automobiles, trains,

vessels), medical equipments, aerospace, nuclear power control, and submarine repeaters or systems, please contact Mitsubishi

Electric or an authorized distributor.

2. Shipping Conditions:

(1) During shipment, place the packing boxes in the correct direction, and fix them firmly to keep them immovable. Placing the boxes

upside down, tilting, or applying abnormal pressure onto them may cause deformation in the electrode terminals, breaking of optical

fiber, or other problems.

(2) Never throw or drop the packing boxes. Hard impact on the boxes may cause break of the devices.

(3) Take strict precautions to keep the devices dry when shipping under rain or snow.

3. Storage Conditions:

When storing the products, it is recommended to store them following the conditions described below without opening the packing. Not

taking enough care in storing may result in defects in electrical characteristics, soldering quality, visual appearance, and so on. The

main points are described below (if special storage conditions are given to the product in the specification sheet, they have priority over

the following general cautions):

(1) Appropriate temperature and humidity conditions, i.e., temperature range between 5~30°C, and humidity between 40~60 percent

RH, should be maintained in storage locations. Controlling the temperature and humidity within this range is particularly important in

case of long-term storage for six months or more.

(2) The atmosphere should be particularly free from toxic gases and dust.

(3) Do not apply any load on the product.

(4) Do not cut or bend the leads of the devices which are to be stored. This is to prevent corrosion in the cut or bent part of the lead

causing soldering problems in the customer’s assembling process.

(5) Sudden change in temperature may cause condensation in the product or packing, therefore, such locations should be avoided for

storing. Temperature in storage locations should be stable.

(6) When storing ceramic package products for extended periods of time, the leads may turn reddish due to reaction with sulfur in the

atmosphere.

(7) Storage conditions for bare chip and unsealed products shall be stated separately because bare chip and unsealed products

require stricter controls than package sealed products.

4. Design Conditions and Environment under Use:

(1) Avoid use in locations where water or organic solvents adhere directly to the product, or where there is any possibility of the

generation of corrosive gas, explosive gas, dust, salinity, or other troublesome conditions. Such environments will not only significantly

lower the reliability, but also may lead to serious accidents.

(2) Operation in excess of the absolute maximum ratings can cause permanent damage to the device. The customers are requested

to design not to exceed those ratings even for a short time.

5. ESD Safety Cautions:

The optoelectronic devices are sensitive to static electricity (ESD, electro-static discharge). The product can be broken by ESD. When

handling this product, please observe the following countermeasures:

To prevent break of devices by static electricity or surge, please adopt the following countermeasures in the assembly line:

(1) Ground all equipments, machinery jigs, and tools in the process line with earth wires installed in them. Take particular care with hot

plates, solder irons and other items for which the commercial power supplies are prone to leakage.

(2) Workers should always use earth bands. Use of antistatic clothing, electric conductive shoes, and other safety equipment while at

work is highly recommended.

(3) Use conductive materials for this product’s container, etc.

(4) It is recommended that grounding mats be placed on the surfaces of assembly line workbench and the surrounding floor in work

area, etc.

(5) When mounting this product in parts or materials which can be electrically charged (printed wiring boards, plastic products, etc.),

pay close attention to the static electricity in those parts. ESD may damage the product.

(6) Humidity in working environment should be controlled to be 40 percent RH or higher.

These countermeasures are most general, and there is a need to carefully confirm the line before starting mass production using this

product (in the trial production, etc.). It is extremely important to prevent surge, eliminate it rapidly, and prevent it from spreading.

Mitsubishi Electric Corporation reserves the right to make changes to the products or information contained herein

without notice. No liability is assumed as a result of their use or application.

FU-653SEA-V53F [MITSUBISHI]

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