FU-318AP-VM6 [MITSUBISHI]
APD MODULE FOR LONG WAVELENGTH BAND; APD模块对于长波长带
| 型号： | FU-318AP-VM6 |
| 厂家： | 
Mitsubishi Group |
| 描述： | APD MODULE FOR LONG WAVELENGTH BAND |
| 文件： | 总3页 (文件大小：96K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
WZ700066B (1/3)
MITSUBISHI (OPTICAL DEVICES)
FU-318AP/SAP-VM6
APD MODULE FOR LONG WAVELENGTH BAND
DESCRIPTION
The FU-318AP-VM6/318SAP-VM6 series avalanche
photodiode(APD) modules are designed for use in fiber
testing equipment and high-speed, long haul optical
communication systems. The coaxial pakage contains
an InGaAs APD coupled into either singlemode or
multimode fiber pigtail.
FEATURES
z High-responsivity (0.85A/W at 1300nm)
z High-speed response (fc=3GHz)
z Wide Operating Temperature Range : - 40 to + 85°C
z Easy handling
APPLICATION
Fiber testing equipment(OTDRs)
Long haul optical communication systems
ABSOLUTE MAXIMUM RATINGS (Tc=25°C)
Parameter
Reverse current (CW)
Forward current (CW)
Operating case temperature
Storage temperature
Symbol
Conditions
Rating
500
Unit
Ir
If
-
-
-
-
µA
2
mA
Tc
Tstg
-40~+85
-40~+85
°C
°C
ELECTRICAL/OPTICAL CHARACTERISTICS (Tc=25°C, 1.3µm unless otherwise noted)
Parameter
Symbol
Test Conditions
Limits
Unit
Min.
1000
0.75
0.85
50
0.1
-
Typ.
Max.
Detection range
-
-
-
1620
-
nm
A/W
Responsivity(Note 1)
R
M=1(Note 2)
0.85
0.95
-
λ=1.5µm M=1(Note 2)
Id=100µA
Id=100µA,Tc=-40~85°C
Vr=0.9Vbr,Tc=25°C
Vr=0.9Vbr,Tc=70°C
Vr=0.9Vbr,Tc=85°C
M=10(Note 2)
Breakdown voltage
Temp.coefficient of Vbr(note 4)
Dark current
Vbr
β
-
100
0.25
60
V
%°C
nA
0.17
Id
-
-
-
700
1000
-
-
-
-
Excess noise factor
F
5
-
-
Minmum multiplication
Mmin
30
-
-
Ipo=µA,Vr=V(@Id=µA)
(Note 3)
Cut-off frequency (-3dB)
Capacitance
fc
Ct
1
-
3
0.6
-
1
GHz
pF
M=10,Rl=50Ω (Note 2)
M=10,f=1MHz
Note 1. Measured by single-mode fiber : SM9.5/125
Note 2. M : Multiplication ratio
Note 3. Ipo : Photo current with an incident opical power
Note 4.β=Vbr(25°C+∆T)-Vbr(25°C)/Vbr(25°C) *∆T×100[%/°C]
OPTICAL FIBER SPECIFICATION
Parameter
Limits
FU-318AP-VM6
Unit
FU-318SAP-VM6
Type
GI
50±1
-
SM
-
-
Core dia.
Mode filed dia.
N.A.
µm
µm
-
9.5±1
-
0.2
Cladding dia.
Jacket dia.
125±3
0.9 typ.
125±2
0.9 typ.
µm
mm
Mitsubishi Electric Corporation reserves the right to make changes to the products or information contained herein
without notice. No liability is assumed as a result of their use or application.
WZ700066B (2/3)
MITSUBISHI (OPTICAL DEVICES)
FU-318AP/SAP-VM6
APD MODULE FOR LONG WAVELENGTH BAND
ORDERING INFORMATION
FU-318xAP-VM6
Fiber Code
Connector Code
Fiber type
SMF
S
Standard
Standard
blanc
MMF
OUTLINE DIAGRAM (Unit: mm)
NOTE: Tolerances unless noted ±0.5
Fig 1 FU-318AP/SAP-VM6
Mitsubishi Electric Corporation reserves the right to make changes to the products or information contained herein
without notice. No liability is assumed as a result of their use or application.
WZ700066B (3/3)
MITSUBISHI (OPTICAL DEVICES)
FU-318AP/SAP-VM6
APD MODULE FOR LONG WAVELENGTH BAND
Safety Cautions for Use of Optoelectronic Devices
General:
Although the manufacturer is always striving to improve the reliability of its product, problems and errors may occur with
semiconductor products. Therefore, the user's products are required to be designed with full safety regard to prevent any accidents
that results in injury, death, fire or environmental damage even when semiconductor products happen to error. Especially it is
recommended to take in consideration about redundancy, fire prevention, error prevention safeguards. And the following requirements
must be strictly observed.
Warning!
1. Eye safety : Seminductor laser radiates laser light during operation. Laser light is very dangerous when shot directly into human
eyes. Don't look at laser light directly, or through optics such as a lens. The laser light should be observed using the ITV camera, IR-
viewer, or other appropriate instruments.
2. Product handling : The product contains GaAs (gallium arsenide). It is safe for regular use, but harmful to the human body if
made into powder or steam. Be sure to avoid dangerous process like smashing, burning, chemical etching. Never put this product in
one's mouth or swallow it.
3. Product disposal : This product must be disposed of as special industrial waste. It is necessary to separate it from general
industrial waste and general garbage.
Handling Cautions for Optoelectronic Devices
1. General:
(1) The products described in this specification are designed and manufactured for use in general communication systems or
electronic devices, unless their applications or reliability are otherwise specified. Therefore, they are not designed or manufactured for
installation in devices or systems that may affect human life or that are used in social infrastructure requiring high reliability.
(2) When the customer is considering to use the products in special applications, such as transportation systems (automobiles, trains,
vessels), medical equipments, aerospace, nuclear power control, and submarine repeaters or systems, please contact Mitsubishi
Electric or an authorized distributor.
2. Shipping Conditions:
(1) During shipment, place the packing boxes in the correct direction, and fix them firmly to keep them immovable. Placing the boxes
upside down, tilting, or applying abnormal pressure onto them may cause deformation in the electrode terminals, breaking of optical
fiber, or other problems.
(2) Never throw or drop the packing boxes. Hard impact on the boxes may cause break of the devices.
(3) Take strict precautions to keep the devices dry when shipping under rain or snow.
3. Storage Conditions:
When storing the products, it is recommended to store them following the conditions described below without opening the packing.
Not taking enough care in storing may result in defects in electrical characteristics, soldering quality, visual appearance, and so on.
The main points are described below (if special storage conditions are given to the product in the specification sheet, they have priority
over the following general cautions):
(1) Appropriate temperature and humidity conditions, i.e., temperature range between 5~30 C, and humidity between 40~60 percent
RH, should be maintained in storage locations. Controlling the temperature and humidity within this range is particularly important in
case of long-term storage for six months or more.
(2) The atmosphere should be particularly free from toxic gases and dust.
(3) Do not apply any load on the product.
(4) Do not cut or bend the leads of the devices which are to be stored. This is to prevent corrosion in the cut or bent part of the lead
causing soldering problems in the customer’s assembling process.
(5) Sudden change in temperature may cause condensation in the product or packing, therefore, such locations should be avoided
for storing. Temperature in storage locations should be stable.
(6) When storing ceramic package products for extended periods of time, the leads may turn reddish due to reaction with sulfur in the
atmosphere.
(7) Storage conditions for bare chip and unsealed products shall be stated separately because bare chip and unsealed products
require stricter controls than package sealed products.
4. Design Conditions and Environment under Use:
(1) Avoid use in locations where water or organic solvents adhere directly to the product, or where there is any possibility of the
generation of corrosive gas, explosive gas, dust, salinity, or other troublesome conditions. Such environments will not only significantly
lower the reliability, but also may lead to serious accidents.
(2) Operation in excess of the absolute maximum ratings can cause permanent damage to the device. The customers are requested
to design not to exceed those ratings even for a short time.
5. ESD Safety Cautions:
The optoelectronic devices are sensitive to static electricity (ESD, electro-static discharge). The product can be broken by ESD. When
handling this product, please observe the following countermeasures:
<Countermeasures against Static Electricity and Surge>
To prevent break of devices by static electricity or surge, please adopt the following countermeasures in the assembly line:
(1) Ground all equipments, machinery jigs, and tools in the process line with earth wires installed in them. Take particular care with
hot plates, solder irons and other items for which the commercial power supplies are prone to leakage.
(2) Workers should always use earth bands. Use of antistatic clothing, electric conductive shoes, and other safety equipment while at
work is highly recommended.
(3) Use conductive materials for this product’s container, etc.
(4) It is recommended that grounding mats be placed on the surfaces of assembly line workbench and the surrounding floor in work
area, etc.
(5) When mounting this product in parts or materials which can be electrically charged (printed wiring boards, plastic products, etc.),
pay close attention to the static electricity in those parts. ESD may damage the product.
(6) Humidity in working environment should be controlled to be 40 percent RH or higher.
These countermeasures are most general, and there is a need to carefully confirm the line before starting mass production using this
product (in the trial production, etc.). It is extremely important to prevent surge, eliminate it rapidly, and prevent it from spreading.
Mitsubishi Electric Corporation reserves the right to make changes to the products or information contained herein
without notice. No liability is assumed as a result of their use or application.
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