CM600DU-12NFH [MITSUBISHI]

HIGH POWER SWITCHING USE INSULATED TYPE; 大功率开关使用绝缘型
CM600DU-12NFH
型号: CM600DU-12NFH
厂家: Mitsubishi Group    Mitsubishi Group
描述:

HIGH POWER SWITCHING USE INSULATED TYPE
大功率开关使用绝缘型

开关 高功率电源
文件: 总8页 (文件大小:312K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
MITSUBISHI IGBT MODULES  
CM600DU-12NFH  
HIGH POWER SWITCHING USE  
INSULATED TYPE  
- 5th generation Fast switching IGBT module -  
CM600DU-12NFH  
Collector current IC .............…............…  
Collector-emitter voltage VCES ...........…  
Maximum junction temperature Tjmax ...  
Flat base Type  
A
6 0 0  
6 0 0  
1 5 0  
V
°C  
Copper base plate  
RoHS Directive compliant  
UL Recognized under UL1557, File E323585  
Dual (Half-Bridge)  
APPLICATION  
High freqency (30 kHz ~ 60 kHz) switching use:  
Gradient anplifier, Induction heating, Power supply, etc.  
OUTLINE DRAWING & INTERNAL CONNECTION  
Dimension in mm  
INTERNAL CONNECTION  
Tolerance otherwise specified  
Division of Dimension Tolerance  
Di1  
0.5 to  
3
6
±0.2  
±0.3  
±0.5  
±0.8  
±1.2  
Tr2  
over  
over  
3
6
to  
Tr1  
to 30  
E2  
C2E1  
C1  
over 30 to 120  
over 120 to 400  
Di2  
February-2011  
1
MITSUBISHI IGBT MODULES  
CM600DU-12NFH  
HIGH POWER SWITCHING USE  
INSULATED TYPE  
ABSOLUTE MAXIMUM RATINGS (Tj=25 °C, unless otherwise specified)  
Symbol  
Item  
Collector-emitter voltage  
Gate-emitter voltage  
Conditions  
Rating  
600  
Unit  
V
VCES  
G-E short-circuited  
C-E short-circuited  
VGES  
IC  
±20  
V
600  
(Note.5)  
Operation  
Collector current  
A
W
A
IC(rms)  
ICRM  
Ptot  
400  
(Note.4)  
Pulse, Repetitive  
1200  
(Note.2, 5)  
TC=25 °C  
1130  
Total power dissipation  
(Note.3, 5)  
Ptot  
IE  
'
TC'=25 °C  
2350  
(Note.1)  
(Note.1)  
(Note.1)  
600  
(Note.5)  
Operation  
Emitter current  
(Free wheeling diode forward current)  
IE(rms)  
IERM  
Tj  
400  
(Note.4)  
Pulse, Repetitive  
1200  
Junction temperature  
Storage temperature  
Isolation voltage  
-
-
-40 ~ +150  
-40 ~ +125  
2500  
°C  
V
Ts t g  
Vi s o l  
Terminals to base plate, RMS, f=60 Hz, AC 1 min  
ELECTRICAL CHARACTERISTICS (Tj=25 °C, unless otherwise specified)  
Limits  
Symbol  
Item  
Conditions  
Unit  
Min.  
Typ.  
Max.  
1
ICES  
Collector-emitter cut-off current  
Gate-emitter leakage current  
Gate-emitter threshold voltage  
VCE=VCES, G-E short-circuited  
±VGE=VGES, C-E short-circuited  
-
-
5
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
mA  
μA  
V
IGES  
-
6
0.5  
7
VGE(th)  
IC=60 mA, VCE=10 V  
(Note.6)  
IC=600 A  
GE=15 V  
,
Tj =25 °C  
2.0  
1.95  
-
2.7  
-
VCEsat  
Collector-emitter saturation voltage  
V
V
Tj =125 °C  
Ci e s  
Co e s  
Cr e s  
QG  
Input capacitance  
166  
11  
6.0  
-
VCE=10 V, G-E short-circuited  
nF  
nC  
Output capacitance  
-
Reverse transfer capacitance  
Gate charge  
-
VCC=300 V, IC=600 A, VGE=15 V  
3720  
-
td ( o n )  
tr  
td ( o f f )  
tf  
Turn-on delay time  
650  
250  
800  
150  
2.6  
200  
-
VCC=300 V, IC=600 A, VGE=±15 V,  
Rise time  
-
ns  
Turn-off delay time  
-
RG=2.0 , Inductive load  
Fall time  
-
(Note.1)  
VEC  
trr  
Emitter-collector voltage  
Reverse recovery time  
Reverse recovery charge  
Turn-on switching energy per pulse  
Turn-off switching energy per pulse  
Reverse recovery energy per pulse  
Internal gate resistance  
IE=600 A (Note.6) , G-E short-circuited  
VCC=300 V, IE=600 A, VGE=±15 V,  
RG=2.0 , Inductive load  
VCC=300 V, IC=IE=600 A,  
VGE=±15 V, RG=2.0 , Tj =125 °C,  
Inductive load  
2.0  
-
V
(Note.1)  
(Note.1)  
ns  
μC  
Qrr  
Eon  
Eoff  
Err  
rg  
11  
11  
27  
6.3  
0.8  
-
mJ  
-
(Note.1)  
-
Per switch, TC=25 °C  
-
THERMAL RESISTANCE CHARACTERISTICS  
Limits  
Symbol  
Item  
Conditions  
Unit  
Min.  
Typ.  
Max.  
0.11  
0.12  
Rth(j-c)Q  
Rth(j-c)D  
Junction to case, per IGBT  
-
-
-
-
K/W  
K/W  
(Note.2)  
Thermal resistance  
Junction to case, per FWDi  
Case to heat sink, per 1/2 module,  
Thermal grease applied  
(Note.2)  
Rth(c-s)  
Contact thermal resistance  
-
0.02  
-
K/W  
(Note.7)  
Rth(j-c')Q  
Rth(j-c')D  
Junction to case, per IGBT  
Junction to case, per FWDi  
-
-
-
-
53  
78  
K/kW  
K/kW  
(Note.3)  
Thermal resistance  
MECHANICAL CHARACTERISTICS  
Limits  
Typ.  
4.0  
Symbol  
Item  
Conditions  
Unit  
N·m  
Min.  
3.5  
3.5  
-
Max.  
4.5  
4.5  
-
Mt  
Main terminals  
Mounting to heat sink  
-
M 6 screw  
M 6 screw  
Mounting torque  
Weight  
Ms  
m
4.0  
580  
-
g
(Note.8)  
ec  
Flatness of base plate  
On the centerline X, Y  
-100  
+100  
μm  
February-2011  
2
MITSUBISHI IGBT MODULES  
CM600DU-12NFH  
HIGH POWER SWITCHING USE  
INSULATED TYPE  
RECOMMENDED OPERATING CONDITIONS (Ta=25 °C)  
Limits  
Unit  
Symbol  
Item  
Conditions  
Min.  
-
Typ.  
300  
15.0  
-
Max.  
400  
16.5  
10  
VCC  
(DC) Supply voltage  
Applied across C1-E2  
V
VGEon  
RG  
Gate (-emitter drive) voltage  
External gate resistance  
Applied across G1-Es1/G2-Es2  
Per switch  
13.5  
1.0  
Note.1: Represent ratings and characteristics of the anti-parallel, emitter-collector free wheeling diode (FWDi).  
Note.2: Case temperature (TC) measured point is base plate side. (Refer to the figure of chip location)  
Note.3: Case temperature (TC ') and heat sink temperature (Ts ') are defined on the each surface of base plate and heat sink  
just under the chips. (Refer to the figure of chip location)  
The heat sink thermal resistance {Rth(s-a)} should measure just under the chips.  
Note.4: Pulse width and repetition rate should be such that the device junction temperature (Tj ) dose not exceed Tj m a x rating.  
Note.5: Junction temperature (Tj ) should not increase beyond Tj m a x rating.  
Note.6: Pulse width and repetition rate should be such as to cause negligible temperature rise.  
(Refer to the figure of test circuit)  
Note.7: Typical value is measured by using thermally conductive grease of λ=0.9 W/(m·K).  
Note.8: Base plate flatness measurement points are as in the following figure.  
bottom  
X
3 mm  
Y
bottom  
-:Concave  
+:Convex  
bottom  
Note.9: No short circuit capability is designed.  
CHIP LOCATION (Top view)  
Dimension in mm, tolerance: ±1 mm  
Case Temperature (TC)  
measurement point  
(Base plate side)  
Tr1/Tr2: IGBT, Di1/Di2: FWDi  
February-2011  
3
MITSUBISHI IGBT MODULES  
CM600DU-12NFH  
HIGH POWER SWITCHING USE  
INSULATED TYPE  
TEST CIRCUIT AND WAVEFORMS  
C1  
C1  
C1  
C1  
Short-  
circuited  
Short-  
circuited  
Short-  
circuited  
VGE=15 V  
G1  
G1  
IC  
IE  
G1  
G1  
V
V
Es1  
Es1  
Es1  
Es1  
V
V
C2E1  
E2  
C2E1  
E2  
C2E1  
E2  
C2E1  
E2  
Short-  
circuited  
VGE=15 V  
Short-  
circuited  
Short-  
circuited  
IC  
IE  
G2  
G2  
G2  
G2  
Es2  
Es2  
Es2  
Es2  
Tr1  
Tr2  
Di1  
Di2  
VCEsat test circuit  
VEC test circuit  
vGE  
iE  
90 %  
iE  
Qrr=0.5×Irr×trr  
trr  
0 V  
0
t
Load  
-VGE  
IE  
+
VCC  
iC  
0 A  
t
90 %  
RG  
vGE  
Irr  
+VGE  
-VGE  
0.5×Irr  
vCE  
0 V  
iC  
10%  
tf  
0 A  
td (o n)  
tr  
t
td( o ff)  
Switching characteristics test circuit and waveforms  
trr, Qrr test waveform  
IEM  
iE  
vEC  
iC  
iC  
ICM  
ICM  
VCC  
vCE  
vCE  
VCC  
VCC  
t
t
0 A  
0 V  
0.1×VCC  
0.1×ICM  
0.02×ICM  
0.1×VCC  
0
t
t
0
ti  
ti  
ti  
IGBT Turn-on switching energy  
IGBT Turn-off switching energy  
FWDi Reverse recovery energy  
Turn-on / Turn-off switching energy and Reverse recovery energy test waveforms (Integral time instruction drawing)  
February-2011  
4
MITSUBISHI IGBT MODULES  
CM600DU-12NFH  
HIGH POWER SWITCHING USE  
INSULATED TYPE  
PERFORMANCE CURVES  
INVERTER PART  
COLLECTOR-EMITTER SATURATION  
VOLTAGE CHARACTERISTICS  
(TYPICAL)  
OUTPUT CHARACTERISTICS  
(TYPICAL)  
Tj=25 °C  
VGE=20 V  
15 V  
VGE=15 V  
13 V 11 V 10 V 9.5 V  
1200  
1000  
800  
600  
400  
200  
0
3
2.5  
2
9 V  
8.5  
Tj=125 °C  
8 V  
1.5  
Tj=25 °C  
7.5  
1
0.5  
7 V  
0
0
1
2
3
4
5
0
200  
400  
600  
800  
1000  
1200  
COLLECTOR-EMITTER VOLTAGE VCE (V)  
COLLECTOR CURRENT IC (A)  
COLLECTOR-EMITTER SATURATION  
VOLTAGE CHARACTERISTICS  
(TYPICAL)  
FREE WHEELING DIODE  
FORWARD CHARACTERISTICS  
(TYPICAL)  
Tj=25 °C  
G-E short-circuited , Tj=25 °C  
5
4.5  
4
10000  
1000  
100  
IC=1200 A  
IC=600 A  
3.5  
3
Tj=125 °C  
IC=240 A  
2.5  
2
Tj=25 °C  
1.5  
1
0.5  
0
10  
0
5
10  
15  
20  
0
0.5  
1
1.5  
2
2.5  
3
GATE-EMITTER VOLTAGE VGE (V)  
EMITTER-COLLECTOR VOLTAGE VEC (V)  
February-2011  
5
MITSUBISHI IGBT MODULES  
CM600DU-12NFH  
HIGH POWER SWITCHING USE  
INSULATED TYPE  
HALF-BRIDGE  
SWITCHING CHARACTERISTICS  
(TYPICAL)  
HALF-BRIDGE  
SWITCHING CHARACTERISTICS  
(TYPICAL)  
VCC=300 V, VGE=±15 V, RG=2.0 ,  
V
CC=300 V, IC=600 A, VGE=±15 V,  
Tj=125 °C, INDUCTIVE LOAD  
Tj=125 °C, INDUCTIVE LOAD  
1000  
10000  
td(off)  
td(on)  
td(off)  
100  
1000  
tf  
td(on)  
tr  
tr  
tf  
10  
100  
10  
100  
1000  
0.1  
1
10  
COLLECTOR CURRENT IC (A)  
EXTERNAL GATE RESISTANCE RG ()  
HALF-BRIDGE  
SWITCHING CHARACTERISTICS  
(TYPICAL)  
HALF-BRIDGE  
SWITCHING CHARACTERISTICS  
(TYPICAL)  
VCC=300 V, VGE=±15 V, RG=2.0 , Tj=125 °C,  
VCC=300 V, IC/IE=600 A, VGE=±15 V, Tj=125 °C,  
INDUCTIVE LOAD, PER PULSE  
INDUCTIVE LOAD, PER PULSE  
100  
100  
Eo f f  
Eo f f  
Eo n  
10  
10  
Er r  
Er r  
Eo n  
1
1
10  
100  
1000  
0.1  
1
10  
COLLECTOR CURRENT IC (A)  
EMITTER CURRENT IE (A)  
EXTERNAL GATE RESISTANCE RG ()  
February-2011  
6
MITSUBISHI IGBT MODULES  
CM600DU-12NFH  
HIGH POWER SWITCHING USE  
INSULATED TYPE  
FREE WHEELING DIODE  
REVERSE RECOVERY CHARACTERISTICS  
(TYPICAL)  
CAPACITANCE CHARACTERISTICS  
(TYPICAL)  
VCC=300 V, VGE=±15 V, RG=2.0 ,  
Tj=25 °C, INDUCTIVE LOAD  
G-E short-circuited, Tj=25 °C  
1000  
100  
10  
1000  
100  
10  
Ci e s  
Ir r  
tr r  
Co e s  
Cr e s  
1
10  
100  
1000  
0.1  
1
10  
100  
EMITTER CURRENT IE (A)  
COLLECTOR-EMITTER VOLTAGE VCE (V)  
TRANSIENT THERMAL IMPEDANCE  
CHARACTERISTICS  
GATE CHARGE CHARACTERISTICS  
(TYPICAL)  
(MAXIMUM)  
IC=600 A, Tj=25 °C  
Single pulse, TC'=25°C  
20  
1
18  
16  
14  
12  
10  
8
VC C =200 V  
0.1  
VC C =300 V  
0.01  
6
4
2
0.001  
0.00001  
0
0.0001  
0.001  
0.01  
0.1  
1
10  
0
1000  
2000  
3000  
4000  
5000  
Rth(j-c')Q=53 K/kW, Rth(j-c')D=78 K/kW  
GATE CHARGE QG (nC)  
TIME (S)  
February-2011  
7
MITSUBISHI IGBT MODULES  
CM600DU-12NFH  
HIGH POWER SWITCHING USE  
INSULATED TYPE  
Keep safety first in your circuit designs!  
·Mitsubishi Electric Corporation puts the maximum effort into making semiconductor products better and more reliable, but there is  
always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property  
damage.  
Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of  
substitutive, auxiliary circuits, (ii) use of non-flammable material or (iii) prevention against any malfunction or mishap.  
Notes regarding these materials  
·These materials are intended as a reference to assist our customers in the selection of the Mitsubishi semiconductor product best suited  
to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to  
Mitsubishi Electric Corporation or a third party.  
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use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials.  
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February-2011  
8

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