CM150TL-24NF_09

更新时间:2024-09-18 10:19:56
品牌:MITSUBISHI
描述:IGBT MODULES HIGH POWER SWITCHING USE

CM150TL-24NF_09 概述

IGBT MODULES HIGH POWER SWITCHING USE IGBT模块大功率开关使用

CM150TL-24NF_09 数据手册

通过下载CM150TL-24NF_09数据手册来全面了解它。这个PDF文档包含了所有必要的细节,如产品概述、功能特性、引脚定义、引脚排列图等信息。

PDF下载
MITSUBISHI IGBT MODULES  
CM150TL-24NF  
HIGH POWER SWITCHING USE  
CM150TL-24NF  
¡IC ...................................................................150A  
¡VCES ......................................................... 1200V  
¡Insulated Type  
¡6-elements in a pack  
APPLICATION  
AC drive inverters & Servo controls, etc  
OUTLINE DRAWING & CIRCUIT DIAGRAM  
Dimensions in mm  
135  
(6.05)  
11.7  
(6.05)  
110 0.5  
17.5  
10.5  
26  
26  
10.5  
10.5  
V
W U  
A
1
8
CN  
B
1
1
1
WP  
VP  
UP  
4-φ5.5  
MOUNTING HOLES  
(13)  
11  
30.5  
25  
25  
46.3  
6-M5 NUTS  
Housing Type of A and B  
(J.S.T.Mfg.Co.Ltd)  
A = B8P-VH-FB-B, B = B2P-VH-FB-B  
LABEL  
P
UP-1  
UP-2  
VP-1  
VP-2  
WP-1  
WP-2  
NC  
NC  
W
B
U
V
CN-7  
CN-8  
CN-5  
CN-6  
CN-3  
CN-4  
CN-1  
CN-2  
NC  
N
CIRCUIT DIAGRAM  
Feb. 2009  
MITSUBISHI IGBT MODULES  
CM150TL-24NF  
HIGH POWER SWITCHING USE  
ABSOLUTE MAXIMUM RATINGS (Tj = 25°C, unless otherwise specified)  
Symbol  
Parameter  
Collector-emitter voltage  
Gate-emitter voltage  
Conditions  
Ratings  
1200  
Unit  
V
V
VCES  
VGES  
IC  
G-E Short  
C-E Short  
DC, TC = 76°C*1  
Pulse  
20  
150  
A
A
Collector current  
Emitter current  
300  
150  
ICM  
(Note 2)  
(Note 2)  
A
A
IE  
(
Note 1  
)
)
)
300  
890  
IEM (Note 1  
PC (Note 3  
Tj  
Pulse  
W
Maximum collector dissipation TC = 25°C  
Junction temperature  
–40 ~ +150  
–40 ~ +125  
2500  
2.5 ~ 3.5  
2.5 ~ 3.5  
750  
°C  
°C  
Vrms  
N • m  
Tstg  
Storage temperature  
Viso  
Isolation voltage  
Torque strength  
Weight  
Terminals to base plate, f = 60Hz, AC 1 minute  
Main terminals M5 screw  
Mounting M5 screw  
N • m  
g
Typical value  
ELECTRICAL CHARACTERISTICS (Tj = 25°C, unless otherwise specified)  
Limits  
Typ.  
Symbol  
Parameter  
Test conditions  
VCE = VCES, VGE = 0V  
Unit  
mA  
Min.  
Max.  
1
Collector cutoff current  
ICES  
VGE(th)  
IGES  
Gate-emitter threshold voltage IC = 15mA, VCE = 10V  
6
7
8
V
Gate leakage current  
VGE = VGES, VCE = 0V  
IC = 150A, VGE = 15V  
2.1  
2.1  
2.4  
0.5  
3.0  
µA  
Tj = 25°C  
Tj = 125°C  
Collector-emitter saturation voltage  
V
VCE(sat)  
Input capacitance  
Cies  
Coes  
Cres  
QG  
23  
nF  
nF  
nF  
nC  
ns  
ns  
ns  
ns  
ns  
VCE = 10V  
VGE = 0V  
Output capacitance  
Reverse transfer capacitance  
Total gate charge  
2
0.45  
675  
VCC = 600V, IC = 150A, VGE = 15V  
Turn-on delay time  
td(on)  
tr  
130  
70  
Turn-on rise time  
VCC = 600V, IC = 150A  
VGE = 15V  
Turn-off delay time  
td(off)  
tf  
400  
350  
150  
Turn-off fall time  
RG = 2.1, Inductive load  
IE = 150A  
Reverse recovery time  
Reverse recovery charge  
Emitter-collector voltage  
trr  
(Note 1)  
Qrr (Note 1  
)
5.8  
µC  
V
VEC(Note 1  
Rth(j-c)Q  
Rth(j-c)R  
Rth(c-f)  
RG  
)
3.8  
0.14  
0.23  
IE = 150A, VGE = 0V  
IGBT part (1/6 module)*1  
FWDi part (1/6 module)*1  
K/W  
K/W  
K/W  
Thermal resistance  
Case to heat sink, Thermal compound Applied (1/6 module)*2  
Contact thermal resistance  
External gate resistance  
0.051  
31  
1 : Case temperature (Tc) measured point is just under the chips.  
If you use this value, Rth(f-a) should be measured just under the chips.  
2 : Typical value is measured by using thermally conductive grease of λ = 0.9[W/(m • K)].  
*
*
Note 1. IE, VEC, trr & Qrr represent characteristics of the anti-parallel, emitter-collector free-wheel diode (FWDi).  
2. Pulse width and repetition rate should be such that the device junction temperature (Tj) does not exceed Tjmax rating.  
3. Junction temperature (Tj) should not increase beyond 150°C.  
4. Pulse width and repetition rate should be such as to cause negligible temperature rise.  
Feb. 2009  
2
MITSUBISHI IGBT MODULES  
CM150TL-24NF  
HIGH POWER SWITCHING USE  
PERFORMANCE CURVES  
OUTPUT CHARACTERISTICS  
COLLECTOR-EMITTER SATURATION  
VOLTAGE CHARACTERISTICS  
(TYPICAL)  
(TYPICAL)  
300  
250  
200  
150  
100  
50  
4
3
2
1
0
VGE =  
20V  
VGE = 15V  
Tj = 25°C  
15  
13  
12  
11  
10  
9
Tj = 25°C  
Tj = 125°C  
0
0
2
4
6
8
10  
0
50  
100 150 200 250 300  
COLLECTOR-EMITTER VOLTAGE VCE (V)  
COLLECTOR CURRENT IC (A)  
COLLECTOR-EMITTER SATURATION  
VOLTAGE CHARACTERISTICS  
(TYPICAL)  
FREE-WHEEL DIODE  
FORWARD CHARACTERISTICS  
(TYPICAL)  
10  
103  
7
Tj = 25°C  
5
8
6
4
2
0
3
2
102  
7
5
IC = 300A  
IC = 150A  
3
2
Tj = 25°C  
Tj = 125°C  
IC = 60A  
101  
6
8
10 12 14 16 18 20  
0
1
2
3
4
5
GATE-EMITTER VOLTAGE VGE (V)  
EMITTER-COLLECTOR VOLTAGE VEC (V)  
CAPACITANCE–VCE  
CHARACTERISTICS  
(TYPICAL)  
HALF-BRIDGE  
SWITCHING CHARACTERISTICS  
(TYPICAL)  
102  
7
5
103  
td(off)  
7
5
tf  
3
2
3
2
Cies  
101  
7
5
102  
7
5
td(on)  
3
2
3
2
Conditions:  
VCC = 600V  
VGE = 15V  
RG = 2.1Ω  
Tj = 125°C  
Inductive load  
100  
7
5
Coes  
101  
7
5
tr  
3
2
3
2
Cres  
VGE = 0V  
10–1  
100  
10–1  
2
3
5 7100  
2
3
5 7101 2 3 5 7102  
101  
2
3
5
7
102  
2
3
5
7
103  
COLLECTOR-EMITTER VOLTAGE VCE (V)  
COLLECTOR CURRENT I  
C
(A)  
Feb. 2009  
3
MITSUBISHI IGBT MODULES  
CM150TL-24NF  
HIGH POWER SWITCHING USE  
TRANSIENT THERMAL  
IMPEDANCE CHARACTERISTICS  
(IGBT part & FWDi part)  
REVERSE RECOVERY CHARACTERISTICS  
OF FREE-WHEEL DIODE  
(TYPICAL)  
1032 3 571022 3 571012 3 57100 2 3 57101  
103  
100  
Single Pulse,  
= 25°C  
Under the chip  
7
5
7
5
TC  
3
2
3
2
10–1  
10–1  
7
5
7
5
I
rr  
rr  
102  
7
3
2
3
2
t
Conditions:  
IGBT part:  
Per unit base =  
th(j–c) = 0.14K/W  
FWDi part:  
5
10–2  
10–2  
V
V
CC = 600V  
15V  
= 2.1Ω  
= 25°C  
Inductive load  
7
5
7
5
R
GE  
=
3
2
R
T
G
3
2
3
2
Per unit base =  
j
Rth(j–c) = 0.23K/W  
10–3  
10–3  
101  
101  
2
3
5
7
102  
2
3
5
7
103  
1052 3 5710–42 3 5710–3  
TIME (s)  
EMITTER CURRENT I  
E
(A)  
SWITCHING LOSS vs.  
COLLECTOR CURRENT  
(TYPICAL)  
SWITCHING LOSS vs.  
GATE RESISTANCE  
(TYPICAL)  
102  
7
102  
7
Conditions:  
Esw(on)  
V
V
R
CC = 600V  
15V  
= 2.1Ω  
5
5
GE  
=
G
3
2
3
2
Tj = 125°C  
Inductive load  
Esw(off)  
Esw(off)  
Esw(on)  
C snubber at bus  
101  
7
101  
7
Conditions:  
CC = 600V  
15V  
V
5
5
VGE  
=
I
T
C
= 150A  
= 125°C  
3
2
3
2
j
Inductive load  
C snubber at bus  
100  
100  
101  
2
3
5
7
102  
2
3
5
7
103  
100  
2
3
5
7
101  
2
3
5
7
102  
COLLECTOR CURRENT I  
C
(A)  
GATE RESISTANCE R  
G
()  
RECOVERY LOSS vs.  
GATE RESISTANCE  
(TYPICAL)  
RECOVERY LOSS vs. I  
E
(TYPICAL)  
102  
7
102  
7
Conditions:  
V
CC = 600V  
15V  
5
5
VGE  
=
I
T
E
= 150A  
= 125°C  
3
2
3
2
j
Inductive load  
Err  
C snubber at bus  
Err  
101  
7
101  
7
Conditions:  
V
V
R
CC = 600V  
15V  
= 2.1Ω  
= 125°C  
Inductive load  
C snubber at bus  
5
5
GE  
=
G
3
2
3
2
Tj  
100  
100  
100  
2
3
5
7
101  
2
3
5
7
102  
101  
2
3
5
7
102 103  
2
3
5 7  
GATE RESISTANCE R  
G
()  
EMITTER CURRENT IE (A)  
Feb. 2009  
4
MITSUBISHI IGBT MODULES  
CM150TL-24NF  
HIGH POWER SWITCHING USE  
GATE CHARGE  
CHARACTERISTICS  
(TYPICAL)  
20  
16  
12  
8
IC = 150A  
V
CC = 400V  
V
CC = 600V  
4
0
0
200  
400  
600  
800  
1000  
GATE CHARGE QG (nC)  
Feb. 2009  
5

CM150TL-24NF_09 相关器件

型号 制造商 描述 价格 文档
CM150TL-24NF_12 MITSUBISHI HIGH POWER SWITCHING USE 获取价格
CM150TU-12F MITSUBISHI HIGH POWER SWITCHING USE 获取价格
CM150TU-12F POWEREX Trench Gate Design Six IGBTMOD⑩ 150 Amperes/600 Volts 获取价格
CM150TU-12F_09 MITSUBISHI IGBT MODULES HIGH POWER SWITCHING USE 获取价格
CM150TU-12F_12 MITSUBISHI HIGH POWER SWITCHING USE 获取价格
CM150TU-12H MITSUBISHI HIGH POWER SWITCHING USE INSULATED TYPE 获取价格
CM150TU-12H POWEREX Six IGBTMOD 150 Amperes/600 Volts 获取价格
CM150TU-12H_09 MITSUBISHI IGBT MODULES HIGH POWER SWITCHING USE INSULATED TYPE 获取价格
CM150TU-12H_12 MITSUBISHI HIGH POWER SWITCHING USE INSULATED TYPE 获取价格
CM150TX-13T MITSUBISHI IGBT模块 T系列 CM150TX-13T 获取价格

CM150TL-24NF_09 相关文章

  • Bourns 密封通孔金属陶瓷微调电位计产品选型手册(英文版)
    2024-09-20
    6
  • Bourns 精密环境传感器产品选型手册(英文版)
    2024-09-20
    9
  • Bourns POWrTher 负温度系数(NTC)热敏电阻手册 (英文版)
    2024-09-20
    8
  • Bourns GMOV 混合过压保护组件产品选型手册(英文版)
    2024-09-20
    6