CM1200DC-34S [MITSUBISHI]

HIGH POWER SWITCHING USE NSULATED TYPE; 大功率开关使用NSULATED TYPE
CM1200DC-34S
型号: CM1200DC-34S
厂家: Mitsubishi Group    Mitsubishi Group
描述:

HIGH POWER SWITCHING USE NSULATED TYPE
大功率开关使用NSULATED TYPE

开关 高功率电源
文件: 总11页 (文件大小:518K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
< HVIGBT MODULES >  
CM1200DC-34S  
HIGH POWER SWITCHING USE  
INSULATED TYPE  
5th-Version HVIGBT (High Voltage Insulated Gate Bipolar Transistor) Modules  
CM1200DC-34S  
IC ································································ 1200A  
VCES ·························································· 1700V  
2-element in a Pack  
Insulated Type  
CSTBT™(III) / Soft Recovery Diode  
AlSiC Baseplate  
APPLICATION  
Traction drives, High Reliability Converters / Inverters, DC choppers  
OUTLINE DRAWING & CIRCUIT DIAGRAM  
Dimensions in mm  
Feb 2013 (HVM-1068)  
1
< HVIGBT MODULES >  
CM1200DC-34S  
HIGH POWER SWITCHING USE  
INSULATED TYPE  
5th-Version HVIGBT (High Voltage Insulated Gate Bipolar Transistor) Modules  
MAXIMUM RATINGS  
Symbol  
VCES  
Item  
Collector-emitter voltage  
Gate-emitter voltage  
Conditions  
Ratings  
1700  
Unit  
V
VGE = 0V  
VGES  
IC  
VCE = 0V, Tj = 25 °C  
DC, Tc = 110 °C  
Pulse (Note 1)  
DC  
± 20  
1200  
V
A
Collector current  
Emitter current  
ICRM  
IE  
2400  
A
1200  
A
(Note 2)  
IERM  
Ptot  
Viso  
Ve  
Pulse (Note 1)  
2400  
A
Maximum power dissipation (Note 3) Tc = 25°C, IGBT part  
6750  
W
V
Isolation voltage  
RMS, sinusoidal, f = 60Hz, t = 1 min.  
4000  
Partial discharge extinction voltage  
Operating junction temperature  
Storage temperature  
RMS, sinusoidal, f = 60Hz, QPD 10 pC  
1320  
V
Tjop  
Tstg  
tpsc  
50 ~ +150  
50 ~ +150  
10  
°C  
°C  
s  
Short circuit pulse width  
VCC = 1200V, VCE VCES, VGE =15V, Tj =150°C  
ELECTRICAL CHARACTERISTICS  
Limits  
Symbol  
Item  
Conditions  
Unit  
mA  
Min  
5.4  
0.5  
Typ  
Max  
Tj = 25°C  
4.0  
6.6  
0.5  
2.70  
ICES  
Collector cutoff current  
VCE = VCES, VGE = 0V  
Tj = 125°C  
Tj = 150°C  
1.5  
7.0  
VGE(th)  
IGES  
Cies  
Gate-emitter threshold voltage  
Gate leakage current  
Input capacitance  
VCE = 10 V, IC = 120 mA, Tj = 25°C  
VGE = VGES, VCE = 0V, Tj = 25°C  
6.0  
V
µA  
nF  
nF  
nF  
µC  
216  
8.0  
VCE = 10 V, VGE = 0 V, f = 100 kHz  
Tj = 25°C  
Coes  
Cres  
QG  
Output capacitance  
Reverse transfer capacitance  
Total gate charge  
1.6  
VCC = 850V, IC = 1200A, VGE  
IC = 1200 A (Note 4)  
=
±
15V  
12.0  
1.95  
2.25  
2.30  
0.60  
0.60  
0.60  
0.16  
0.17  
0.18  
260  
340  
370  
300  
390  
420  
Tj = 25°C  
Tj = 125°C  
Tj = 150°C  
Tj = 25°C  
Tj = 125°C  
Tj = 150°C  
Tj = 25°C  
Tj = 125°C  
Tj = 150°C  
Tj = 25°C  
Tj = 125°C  
Tj = 150°C  
Tj = 25°C  
Tj = 125°C  
Tj = 150°C  
VCEsat  
td(on)  
tr  
Collector-emitter saturation voltage  
Turn-on delay time  
V
V
GE = 15 V  
µs  
µs  
mJ  
mJ  
V
CC = 850 V  
Turn-on rise time  
IC = 1200 A  
GE = ±15 V  
G(on) = 1.3 Ω  
V
R
(Note 5)  
Ls = 70 nH  
Eon(10%)  
Turn-on switching energy  
Inductive load  
(Note 6)  
Eon  
Turn-on switching energy  
Feb 2013 (HVM-1068)  
2
< HVIGBT MODULES >  
CM1200DC-34S  
HIGH POWER SWITCHING USE  
INSULATED TYPE  
5th-Version HVIGBT (High Voltage Insulated Gate Bipolar Transistor) Modules  
ELECTRICAL CHARACTERISTICS (continuation)  
Symbol Item  
Limits  
Typ  
Conditions  
Unit  
µs  
Min  
Max  
3.00  
Tj = 25°C  
Tj = 125°C  
Tj = 150°C  
Tj = 25°C  
Tj = 125°C  
Tj = 150°C  
Tj = 25°C  
Tj = 125°C  
Tj = 150°C  
Tj = 25°C  
Tj = 125°C  
Tj = 150°C  
Tj = 25°C  
Tj = 125°C  
Tj = 150°C  
Tj = 25°C  
Tj = 125°C  
Tj = 150°C  
Tj = 25°C  
Tj = 125°C  
Tj = 150°C  
Tj = 25°C  
Tj = 125°C  
Tj = 150°C  
Tj = 25°C  
Tj = 125°C  
Tj = 150°C  
Tj = 25°C  
Tj = 125°C  
Tj = 150°C  
1.20  
1.30  
1.32  
0.12  
0.15  
0.17  
200  
280  
310  
260  
360  
400  
2.60  
2.30  
2.20  
0.22  
0.32  
0.38  
750  
850  
840  
150  
340  
400  
70  
td(off)  
Turn-off delay time  
V
CC = 850 V  
IC = 1200 A  
GE = ±15 V  
G(off) = 3.3 Ω  
tf  
Turn-off fall time  
µs  
mJ  
mJ  
V
V
R
(Note 5)  
(Note 6)  
(Note 2)  
(Note 2)  
(Note 2)  
(Note 2)  
Ls = 70 nH  
Eoff(10%)  
Turn-off switching energy  
Turn-off switching energy  
Emitter-collector voltage  
Reverse recovery time  
Reverse recovery current  
Inductive load  
Eoff  
IE = 1200 A (Note 4)  
VGE = 0 V  
VEC  
trr  
µs  
A
Irr  
VCC = 850 V  
IC = 1200 A  
V
GE = ±15 V  
G(on) = 1.3 Ω  
Qrr  
Reverse recovery charge  
Reverse recovery energy  
µC  
mJ  
mJ  
R
Ls = 70 nH  
Inductive load  
(Note 2)  
(Note 5)  
Erec(10%)  
170  
210  
80  
(Note 2)  
(Note 6)  
Reverse recovery energy  
Erec  
180  
230  
THERMAL CHARACTERISTICS  
Limits  
Typ  
Symbol  
Item  
Conditions  
Unit  
Min  
Max  
18.5  
42.0  
Rth(j-c)Q  
Rth(j-c)D  
Junction to Case, IGBT part (per 1/2 module)  
Junction to Case, FWDi part (per 1/2 module)  
Case to heat sink, 1/2 module  
grease = 1W/m·k, D(c-s) = 100m  
K/kW  
K/kW  
Thermal resistance  
Rth(c-s)  
Contact thermal resistance  
16.0  
K/kW  
Feb 2013 (HVM-1068)  
3
< HVIGBT MODULES >  
CM1200DC-34S  
HIGH POWER SWITCHING USE  
INSULATED TYPE  
5th-Version HVIGBT (High Voltage Insulated Gate Bipolar Transistor) Modules  
MECHANICAL CHARACTERISTICS  
Limits  
Typ  
Symbol  
Item  
Conditions  
M8 : Main terminals screw  
Unit  
Min  
7.0  
3.0  
1.0  
Max  
22.0  
6.0  
3.0  
Mt  
N·m  
N·m  
N·m  
kg  
Mounting torque  
Ms  
M6 : Mounting screw  
Mt  
M4 : Auxiliary terminals screw  
m
Mass  
0.8  
CTI  
da  
Comparative tracking index  
Clearance  
600  
9.5  
15.0  
mm  
mm  
nH  
ds  
Creepage distance  
Parasitic stray inductance  
Internal lead resistance  
Internal gate resistance  
LP CE  
RCC’+EE’  
rg  
22  
TC = 25°C, 1/2 module  
TC = 25°C, 1/2 module  
0.16  
0.28  
mꢀ  
  
Note1. Pulse width and repetition rate should be such that junction temperature (Tj) does not exceed Tjopmax rating.  
2. The symbols represent characteristics of the anti-parallel, emitter to collector free-wheel diode (FWDi).  
3. Junction temperature (Tj) should not exceed Tjopmax rating .  
4. Pulse width and repetition rate should be such as to cause negligible temperature rise.  
5. Eon(10%) / Eoff(10%) / Erec(10%) are the integral of 0.1VCE x 0.1IC x dt.  
6. Definition of all items is according to IEC 60747, unless otherwise specified.  
Feb 2013 (HVM-1068)  
4
< HVIGBT MODULES >  
CM1200DC-34S  
HIGH POWER SWITCHING USE  
INSULATED TYPE  
5th-Version HVIGBT (High Voltage Insulated Gate Bipolar Transistor) Modules  
PERFORMANCE CURVES  
OUTPUT CHARACTERISTICS  
TRANSFER CHARACTERISTICS  
(TYPICAL)  
(TYPICAL)  
2500  
2500  
Tj = 125°C  
VCE = 10V  
VGE = 17V  
2000  
2000  
1500  
1000  
500  
0
VGE = 11V  
VGE = 15V  
VGE = 13V  
1500  
Tj = 125°C / 150°C  
VGE = 9V  
1000  
500  
0
Tj = 25°C  
0
1
2
3
4
5
6
0
5
10  
15  
Collector - Emitter Voltage [V]  
Gate - Emitter Voltage [V]  
COLLECTOR-EMITTER SATURATION VOLTAGE  
CHARACTERISTICS (TYPICAL)  
FREE-WHEEL DIODE FORWARD  
CHARACTERISTICS (TYPICAL)  
2500  
2500  
2000  
1500  
1000  
500  
VGE = 15V  
Tj = 125°C  
Tj = 125°C  
2000  
Tj = 25°C  
Tj = 150°C  
1500  
1000  
500  
0
Tj = 25°C  
Tj = 150°C  
0
0
1
2
3
4
0
1
2
3
4
Emitter-Collector Voltage [V]  
Collector-Emitter Saturation Voltage [V]  
Feb 2013 (HVM-1068)  
5
< HVIGBT MODULES >  
CM1200DC-34S  
HIGH POWER SWITCHING USE  
INSULATED TYPE  
5th-Version HVIGBT (High Voltage Insulated Gate Bipolar Transistor) Modules  
PERFORMANCE CURVES  
CAPACITANCE CHARACTERISTICS  
(TYPICAL)  
GATE CHARGE CHARACTERISTICS  
(TYPICAL)  
20  
1000  
VCE = 850V, I  
C
= 1200A  
Tj = 25°C  
15  
10  
5
Cies  
100  
10  
0
Coes  
-5  
1
Cres  
-10  
-15  
VGE = 0V, Tj = 25°C  
f = 100kHz  
0.1  
0
5
10  
15  
0.1  
1
10  
100  
Gate Charge [µC]  
Collector-Emitter Voltage [V]  
HALF-BRIDGE SWITCHING ENERGY  
CHARACTERISTICS (TYPICAL)  
HALF-BRIDGE SWITCHING ENERGY  
CHARACTERISTICS (TYPICAL)  
1200  
1200  
V
R
CC = 850V, VGE = ±15V  
G(on) = 1.3, RG(off) = 3.3ꢀ  
Tj = 125°C, Inductive load  
V
R
CC = 850V, VGE = ±15V  
G(on) = 1.3, RG(off) = 3.3ꢀ  
Tj = 150°C, Inductive load  
1000  
800  
600  
400  
200  
0
1000  
800  
600  
400  
200  
0
Eon  
Eon  
Eoff  
Eoff  
Erec  
Erec  
0
500  
1000  
1500  
2000  
2500  
0
500  
1000  
1500  
2000  
2500  
Collector Current [A]  
Collector Current [A]  
Feb 2013 (HVM-1068)  
6
< HVIGBT MODULES >  
CM1200DC-34S  
HIGH POWER SWITCHING USE  
INSULATED TYPE  
5th-Version HVIGBT (High Voltage Insulated Gate Bipolar Transistor) Modules  
PERFORMANCE CURVES  
HALF-BRIDGE SWITCHING ENERGY  
CHARACTERISTICS (TYPICAL)  
HALF-BRIDGE SWITCHING ENERGY  
CHARACTERISTICS (TYPICAL)  
2000  
1500  
1000  
500  
0
1000  
V
CC = 850V, I  
C
= 1200A  
V
CC = 850V, I  
C = 1200A  
VGE = ±15V, Tj = 125°C  
VGE = ±15V, Tj = 125°C  
Inductive load  
Inductive load  
800  
600  
400  
200  
0
Eon  
Eoff  
Erec  
0
2
4
6
8
0
5
10  
15  
20  
Gate Resistance []  
Gate Resistance []  
HALF-BRIDGE SWITCHING ENERGY  
CHARACTERISTICS (TYPICAL)  
HALF-BRIDGE SWITCHING ENERGY  
CHARACTERISTICS (TYPICAL)  
2000  
1000  
VCC = 850V, I  
C
= 1200A  
VCC = 850V, I  
C = 1200A  
VGE = ±15V, Tj = 150°C  
VGE = ±15V, Tj = 150°C  
Inductive load  
Inductive load  
800  
600  
400  
200  
0
1500  
1000  
500  
0
Eon  
Eoff  
Erec  
0
2
4
6
8
0
5
10  
15  
20  
Gate Resistance []  
Gate Resistance []  
Feb 2013 (HVM-1068)  
7
< HVIGBT MODULES >  
CM1200DC-34S  
HIGH POWER SWITCHING USE  
INSULATED TYPE  
5th-Version HVIGBT (High Voltage Insulated Gate Bipolar Transistor) Modules  
HALF-BRIDGE SWITCHING TIME  
CHARACTERISTICS (TYPICAL)  
HALF-BRIDGE SWITCHING TIME  
CHARACTERISTICS (TYPICAL)  
10  
10  
VCC = 850V, VGE = ±15V  
VCC = 850V, VGE = ±15V  
RG(on) = 1.3, RG(off) = 3.3ꢀ  
RG(on) = 1.3, RG(off) = 3.3ꢀ  
Tj = 125°C, Inductive load  
Tj = 150°C, Inductive load  
td(off)  
td(off)  
1
1
td(on)  
td(on)  
tf  
tf  
0.1  
0.1  
tr  
tr  
0.01  
0.01  
100  
1000  
10000  
100  
1000  
10000  
Collector Current [A]  
Collector Current [A]  
FREE-WHEEL DIODE REVERSE RECOVERY  
CHARACTERISTICS (TYPICAL)  
FREE-WHEEL DIODE REVERSE RECOVERY  
CHARACTERISTICS (TYPICAL)  
100  
10  
1
10000  
1000  
100  
100  
10  
1
10000  
1000  
100  
VCC = 850V, VGE = ±15V  
RG(on) = 1.3, LS = 70nH  
Tj = 125°C, Inductive load  
VCC = 850V, VGE = ±15V  
RG(on) = 1.3, LS = 70nH  
Tj = 150°C, Inductive load  
Irr  
Irr  
trr  
trr  
0.1  
10  
0.1  
10  
100  
1000  
Emitter Current [A]  
10000  
100  
1000  
Emitter Current [A]  
10000  
Feb 2013 (HVM-1068)  
8
< HVIGBT MODULES >  
CM1200DC-34S  
HIGH POWER SWITCHING USE  
INSULATED TYPE  
5th-Version HVIGBT (High Voltage Insulated Gate Bipolar Transistor) Modules  
PERFORMANCE CURVES  
TRANSIENT THERMAL IMPEDANCE  
CHARACTERISTICS  
1.2  
t
n
  
  
Rth(j-c)Q = 18.5K/kW  
Rth(j-c)D = 42.0K/kW  
i   
(t)   
1exp  
Zth( jc)  
R
i  
i1  
1
0.8  
0.6  
0.4  
0.2  
0
1
2
3
4
Ri [K/kW] :  
0.0096  
0.0001  
0.1893  
0.0058  
0.4044  
0.0602  
0.3967  
0.3512  
i [sec.] :  
0.001  
0.01  
0.1  
1
10  
Time [s]  
REVERSE BIAS SAFE OPERATING AREA  
(RBSOA)  
SHORT CIRCUIT  
SAFE OPERATING AREA (SCSOA)  
3000  
10000  
VCC 1200V, VGE = ±15V  
RG(on)1.3, RG(off)3.3ꢀ  
Tj = 150°C, tpsc 10µs  
V
CC 1200V, VGE = ±15V  
Tj = 150°C, RG(off) 3.3ꢀ  
2500  
2000  
1500  
1000  
500  
8000  
6000  
4000  
2000  
0
0
0
500  
1000  
1500  
2000  
0
500  
1000  
1500  
2000  
Collector-Emitter Voltage [V]  
Collector-Emitter Voltage [V]  
Feb 2013 (HVM-1068)  
9
< HVIGBT MODULES >  
CM1200DC-34S  
HIGH POWER SWITCHING USE  
INSULATED TYPE  
5th-Version HVIGBT (High Voltage Insulated Gate Bipolar Transistor) Modules  
PERFORMANCE CURVES  
FREE-WHEEL DIODE REVERSE RECOVERY  
SAFE OPERATING AREA (RRSOA)  
3000  
VCC 1200 V, di/dt 7200A/µs  
T = 150°C  
j
2500  
2000  
1500  
1000  
500  
0
0
500  
1000  
1500  
2000  
Collector-Emitter Voltage [V]  
Feb 2013 (HVM-1068)  
10  
< HVIGBT MODULES >  
CM1200DC-34S  
HIGH POWER SWITCHING USE  
INSULATED TYPE  
5th-Version HVIGBT (High Voltage Insulated Gate Bipolar Transistor) Modules  
Keep safety first in your circuit designs!  
Mitsubishi Electric Corporation puts the maximum effort into making semiconductor products better and more  
reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors  
may lead to personal injury, fire or property damage. Remember to give due consideration to safety when  
making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary  
circuits, (ii) use of non-flammable material or (iii) prevention against any malfunction or mishap.  
Notes regarding these materials  
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semiconductor product best suited to the customer’s application; they do not convey any license under any  
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Feb 2013 (HVM-1068)  
11  

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