LS830 [MICROSS]
Linear Systems Ultra Low Leakage Low Drift Monolithic Dual JFET; 线性系统的超低漏电低漂移单片双路JFET型号: | LS830 |
厂家: | MICROSS COMPONENTS |
描述: | Linear Systems Ultra Low Leakage Low Drift Monolithic Dual JFET |
文件: | 总1页 (文件大小:278K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
LS830
MONOLITHIC DUAL
N-CHANNEL JFET
Linear Systems Ultra Low Leakage Low Drift Monolithic Dual JFET
FEATURES
The LS830 is a high-performance monolithic dual
ULTRA LOW DRIFT
ULTRA LOW LEAKGE
LOW NOISE
LOW CAPACITANCE
ABSOLUTE MAXIMUM RATINGS @ 25°C (unless otherwise noted)
| V GS1‐2 / T| ≤ 5µV/°C TYP.
IG = 80fA TYP.
en = 70nV/√Hz TYP.
CISS = 3pF MAX.
JFET featuring extremely low noise, tight offset voltage
and low drift over temperature specifications, and is
targeted for use in a wide range of precision
instrumentation applications. The LS830 features a 5-
mV offset and 10-µV/°C drift.
Maximum Temperatures
Storage Temperature
Operating Junction Temperature
Maximum Voltage and Current for Each Transistor – Note 1
The 8 Pin P-DIP and 8 Pin SOIC provide ease of
manufacturing, and the symmetrical pinout prevents
improper orientation.
‐65°C to +150°C
+150°C
‐VGSS
‐VDSO
‐IG(f)
‐IG
Gate Voltage to Drain or Source
Drain to Source Voltage
Gate Forward Current
40V
40V
10mA
10µA
(See Packaging Information).
LS830 Applications:
Gate Reverse Current
Maximum Power Dissipation
Device Dissipation @ Free Air – Total
Wideband Differential Amps
High-Speed,Temp-Compensated Single-
Ended Input Amps
High-Speed Comparators
Impedance Converters and vibrations
detectors.
40mW @ +125°C
MATCHING CHARACTERISTICS @ 25°C UNLESS OTHERWISE NOTED
SYMBOL
CHARACTERISTICS VALUE UNITS CONDITIONS
| V GS1‐2 / T| max.
DRIFT VS.
TEMPERATURE
5
µV/°C
VDG=10V, ID=30µA
TA=‐55°C to +125°C
VDG=10V, ID=30µA
| V GS1‐2 | max.
OFFSET VOLTAGE
25
mV
ELECTRICAL CHARACTERISTICS @ 25°C (unless otherwise noted)
SYMBOL
BVGSS
BVGGO
CHARACTERISTICS
Breakdown Voltage
Gate‐To‐Gate Breakdown
TRANSCONDUCTANCE
Full Conduction
MIN.
40
40
TYP.
60
‐‐
MAX.
‐‐
‐‐
UNITS
V
V
CONDITIONS
VDS = 0
I G= 1nA
ID=1nA
ID= 0
IS= 0
YfSS
YfS
|YFS1‐2 / Y FS|
70
50
‐‐
300
100
0.6
500
200
3
µmho
µmho
%
VDG= 10V
VDG= 10V
VGS= 0V f = 1kHz
ID= 30µA f = 1kHz
Typical Operation
Mismatch
DRAIN CURRENT
Click To Buy
IDSS
|IDSS1‐2 / IDSS
Full Conduction
Mismatch at Full Conduction
GATE VOLTAGE
0.5
‐‐
‐‐
1
10
5
mA
%
VDG= 10V
VGS= 0V
|
VGS(off) or Vp
VGS(on)
Pinchoff voltage
Operating Range
GATE CURRENT
0.6
‐‐
2
‐‐
4.5
4
V
V
VDS= 10V
VDS=10V
ID= 1nA
ID=30µA
‐IGmax.
‐IGmax.
‐IGSSmax.
‐IGSSmax.
IGGO
Operating
‐‐
‐‐
‐‐
5
‐‐
‐‐
‐‐
5
0.1
0.1
0.2
0.5
‐‐
pA
nA
pA
nA
pA
VDG= 10V ID= 30µA
TA= +125°C
High Temperature
At Full Conduction
High Temperature
Gate‐to‐Gate Leakage
OUTPUT CONDUCTANCE
Full Conduction
VDS =0
VGS= 0V, VGS= ‐20V, TA= +125°C
VGG = 20V
‐‐
1
YOSS
YOS
‐‐
‐‐
‐‐
‐‐
5
0.5
µmho
µmho
VDG= 10V
VDG= 10V
VGS= 0V
ID= 30µA
Operating
COMMON MODE REJECTION
CMR
‐20 log | V GS1‐2/ V DS
‐20 log | V GS1‐2/ V DS
NOISE
|
|
‐‐
‐‐
90
90
‐‐
‐‐
dB
∆VDS = 10 to 20V
∆VDS = 5 to 10V
VDS= 10V VGS= 0V
f= 100Hz
ID=30µA
ID=30µA
RG= 10MΩ
NBW= 6Hz
NF
en
Figure
Voltage
‐‐
‐‐
‐‐
20
1
70
dB
nV/√Hz
VDS=10V ID=30µA f=10Hz NBW=1Hz
CAPACITANCE
Input
Reverse Transfer
Drain‐to‐Drain
CISS
CRSS
CDD
‐‐
‐‐
‐‐
‐‐
‐‐
‐‐
3
1.5
0.1
pF
pF
pF
VDS= 10V, VGS= 0V, f= 1MHz
VDS= 10V, VGS= 0V, f= 1MHz
VDS= 10V, ID=30µA
Note 1 – These ratings are limiting values above which the serviceability of any semiconductor may be impaired
PDIP & SOIC (Top View)
Available Packages:
LS830 / LS830 in PDIP & SOIC
LS830 / LS830 available as bare die
Please contact Micross for full package and die dimensions
Tel: +44 1603 788967
Email: chipcomponents@micross.com
Web: http://www.micross.com/distribution
Information furnished by Linear Integrated Systems and Micross Components is believed to be accurate and reliable. However, no responsibility is assumed for its use; nor for any infringement of patents or
other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Linear Integrated Systems.
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