JM38510/10103BGA [MICROSS]
Operational Amplifier, 1 Func, 3000uV Offset-Max, BIPolar, MBCY8,;
| 型号： | JM38510/10103BGA |
| 厂家： | 
MICROSS COMPONENTS |
| 描述： | Operational Amplifier, 1 Func, 3000uV Offset-Max, BIPolar, MBCY8, 放大器 |
| 文件： | 总42页 (文件大小：265K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INCH-POUND
MIL-M-38510/101K
14 December 2005
SUPERSEDING
MIL-M-38510/101J
07 February 2003
MILITARY SPECIFICATION
MICROCIRCUITS, LINEAR, OPERATIONAL AMPLIFIER, MONOLITHIC SILICON
This specification is approved for use by all Departments and Agencies of the Department of Defense.
Inactive for new design after 13 July 1995.
The requirements for acquiring the product herein shall consist of this specification sheet and MIL-PRF-38535.
1. SCOPE
1.1 Scope. This specification covers the detail requirements for monolithic silicon, operational amplifiers. Two product
assurance classes and a choice of case outlines and lead finish are provided for each type and are reflected in the complete
part number. For this product, the requirements of MIL-M-38510 have been superseded by MIL-PRF-38535, (see 6.4).
1.1.2 Part or identifying number (PIN). The PIN is in accordance with MIL-PRF-38535, and as specified herein.
1.2.1 Device types. The device types are as follows:
Device type
Circuit
01
02
03
04
05
06
07
08
Single operational amplifier - internally compensated
Dual operational amplifier - internally compensated
Single operational amplifier - externally compensated
Single operational amplifier - externally compensated
Dual operational amplifier - externally compensated 1/
Dual operational amplifier - externally compensated 1/
Single operational amplifier, high speed
Dual operational amplifier - internally compensated
1.2.2 Device class. The device class is the product assurance level as defined in MIL-PRF-38535.
______
1/ Device types 05 and 06 may be monolithic, or they may consist of two separate, independent die.
Comments, suggestions, or questions on this document should be addressed to: Commander, Defense
Supply Center Columbus, ATTN: DSCC-VAS, 3990 East Broad St., Columbus, OH 43218-3990, or
emailed to linear@dscc.dla.mil. Since contact information can change, you may want to verify the
currency of this address information using the ASSIST Online database at http://assist.daps.dla.mil.
AMSC N/A
FSC 5962
MIL-M-38510/101K
1.2.3 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows:
Outline letter
Descriptive designator
Terminals
Package style
A 2/
GDFP5-F14 or CDFP6-F14
GDFP4-14
14
14
14
14
16
16
8
10
10
8
Flat pack
Flat pack
Dual-in-line
Flat pack
Dual-in-line
Flat pack
Can
Flat pack
Can
B 2/
C
D
E
GDIP1-T14 or CDIP2-T14
GDFP1-F14 or CDFP2-F14
GDIP1-T16 or CDIP2-T16
GDFP2-F16 or CDFP3-F16
MACY1-X8
GDFP1-F10 or CDFP2-F10
MACY1-X10
GDIP1-T8 or CDIP2-T8
GDFP1-G10
F
G
H
I
P
Z
Dual-in-line
Flat pack with gullwing leads
Square leadless chip carrier
10
20
2
CQCC1-N20
1.3 Absolute maximum ratings.
Supply voltage range (V ) ............................................................................±22 V dc 3/
CC
Input voltage range .........................................................................................±20 V dc 4/
Differential input voltage range ....................................................................... ±30 V dc 5/
Input current range ......................................................................................... -0.1 mA to +10 mA
Storage temperature range ............................................................................-65°C to +150°C
Output short-circuit duration ........................................................................... Unlimited 6/
Lead temperature (soldering, 60 seconds) ..................................................... +300°C
Junction temperature (T ) ............................................................................... +175°C 7/
J
1.4 Recommended operating conditions.
Supply voltage (V ) ......................................................................................±5 V dc to ±20 V dc
CC
Ambient temperature range (T ) .................................................................... -55°C to +125°C
A
______
2/ Inactive package case outline.
3/ Voltages in excess of these may be applied for short-term tests if voltage difference does not exceed 44 volts.
4/ For supply voltages less than ±20 V dc, the absolute maximum input voltage is equal to the supply voltage.
5/ For device types 04, 06, and 07 only, this rating is ±1.0 V unless resistances of 2 kΩ or greater are inserted in
series with the inputs to limit current in the input shunt diodes to the maximum allowable value.
6/ Short circuit may be to ground or either supply. Rating applies to +125°C case temperature or +75°C
ambient temperature.
7/ For short term test (in the specific burn-in and life test configuration when required and up to 168 hours
maximum) T = +275°C.
J
2
MIL-M-38510/101K
1.5 Power and thermal characteristics.
Maximum
Maximum
θJA
Maximum allowable power
dissipation
Case outlines
θJC
A,B,D
60°C/W
35°C/W
40°C/W
40°C/W
60°C/W
35°C/W
21°C/W
140°C/W
350 mW at T = +125°C
A
C,E,P
120°C/W
150°C/W
400 mW at T = +125°C
A
G
I
330 mW at T = +125°C
A
140°C/W
350 mW at T = +125°C
A
H
F
Z
150°C/W
330 mW at T = +125°C
A
120°C/W
400 mW at T = +125°C
A
225°C/W still air
142°C/W 500 LFPM
330 mW at T = +125°C
A
2
60°C/W
120°C/W
8/ at T = +125°C
A
2. APPLICABLE DOCUMENTS
2.1 General. The documents listed in this section are specified in sections 3, 4, or 5 of this specification. This section
does not include documents cited in other sections of this specification or recommended for additional information or as
examples. While every effort has been made to ensure the completeness of this list, document users are cautioned that
they must meet all specified requirements of documents cited in sections 3, 4, or 5 of this specification, whether or not they
are listed.
2.2 Government documents.
2.2.1 Specifications, standards, and handbooks. The following specifications and standards form a part of this
specification to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits (Microcircuits) Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 - Test Method Standard for Microelectronics.
MIL-STD-1835 - Interface Standard Electronic Component Case Outlines
(Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or
http://assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D,
Philadelphia, PA 19111-5094.)
2.3 Order of precedence. In the event of a conflict between the text of this specification and the references cited herein,
the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws and
regulations unless a specific exemption has been obtained.
______
8/ P = 102 mW for device type 01. P = 75 mW for device type 03. P = 149 mW for device type 04.
D
D
D
3
MIL-M-38510/101K
3. REQUIREMENTS
3.1 Qualification. Microcircuits furnished under this specification shall be products that are manufactured by a
manufacturer authorized by the qualifying activity for listing on the applicable qualified manufacturers list before contract
award (see 4.3 and 6.3).
3.2 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535 and as specified
herein or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall
not affect the form, fit, or function as described herein.
3.3 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as
specified in MIL-PRF-38535 and herein.
3.3.1 Terminal connections. The terminal connections shall be as specified on figure 1.
3.3.2 Schematic circuits. The schematic circuits shall be maintained by the manufacturer and made available to the
qualifying activity and the preparing activity (DSCC-VAS) upon request.
3.3.3 Case outlines. The case outlines shall be as specified in 1.2.3.
3.4 Lead material and finish. Lead material and finish shall be in accordance with MIL-PRF-38535 (see 6.6).
3.5 Electrical performance characteristics. The following electrical performance characteristics apply over the full
operating ambient temperature range of -55°C to +125°C and for supply voltages ±5 V dc to ±20 V dc, unless otherwise
specified (see table I).
3.5.1 Offset null circuits. Each amplifier having nulling inputs (device types 01, 02, 03, 05, and 07) shall be capable of
being nulled 1 mV beyond the specified offset voltage limits for -55°C ≤ T ≤ +125°C using the circuits of figure 2.
A
3.5.2 Frequency compensation. Device types 01, 02, 07, and 08 shall be free of oscillation when operated in a unity gain
non-inverting mode with no external compensation and a source resistance of ≤ 10 kΩ, and when operated in any test
condition specified herein. Device types 03, 04, 05, and 06 shall be free from oscillation when compensated with a 30 pF
capacitor for all gain configurations or a 3 pF capacitor when used with a gain of 10.
3.6 Rebonding. Rebonding shall be in accordance with MIL-PRF-38535.
3.7 Electrical test requirements. Electrical test requirements for each device class shall be the subgroups specified in
table II. The electrical tests for each subgroup are described in table III.
3.8 Marking. Marking shall be in accordance with MIL-PRF-38535.
3.9 Microcircuit group assignment. The devices covered by this specification shall be in microcircuit group number 49
(see MIL-PRF-38535, appendix A).
4
MIL-M-38510/101K
TABLE I. Electrical performance characteristics. 1/
Conditions
-55°C ≤ T ≤ +125°C
Group A
subgroups
Device
type
Limits
Max
Unit
A
Test
Symbol
see figure 3
unless otherwise specified
Min
-3
Input offset voltage
1
2,3
2
01,02,
08
+3
mV
V
IO
R = 50 Ω 2/
S
03,05
04,06
07
-2
-0.5
-4
+2
+0.5
+4
01,02,
08
-4
+4
03,05
04,06
07
-3
+3
-1
+1
-6
+6
Input offset voltage
01,02,
08
-15
+15
µV/°C
∆V
/
IO
temperature sensitivity
∆T
03,05
04,06
07
-18
-5
+18
+5
-50
-15
-5
+50
+15
+5
3
01,02,
03,05
04,06
07
-50
-20
+50
20
08
See footnotes at end of table.
5
MIL-M-38510/101K
TABLE I. Electrical performance characteristics – Continued. 1/
Conditions
-55°C ≤ T ≤ +125°C
Group A
subgroups
Device
type
Limits
Unit
A
Test
Symbol
IO
see figure 3
unless otherwise specified
Min
-30
Max
+30
Input offset current
2/
1
01,02,08
03,05
04,06
07
nA
I
-10
-0.2
-40
+10
+0.2
+40
2
01
-30
-70
+30
+70
*
2,3
02,08
03,05
04,06
07
-20
-0.4
-80
+20
+0.4
+80
+70
3
2
01
-70
*
Input offset current
01,02,08
-500
+500
pA/°C
∆I
/
IO
temperature sensitivity
∆T
03,05
04,06
07
-200
-2.5
+200
+2.5
-1000
-200
-100
-2.5
+1000
+200
+100
+2.5
3
01,02,08
03,05
04,06
07
-1000
+1000
See footnotes at end of table.
6
MIL-M-38510/101K
TABLE I. Electrical performance characteristics – Continued. 1/
Conditions
-55°C ≤ T ≤ +125°C
Group A
subgroups
Device
type
Limits
Max
Unit
A
Test
Symbol
see figure 3
unless otherwise specified
Min
-0.1
Input bias current
2/
1,2
01,02,
08
+110
nA
+I
IB
03,05
-0.1
-0.1
-0.1
-1.0
-0.1
-0.1
-0.1
-0.1
-0.1
-0.1
-0.1
-0.1
-1.0
-0.1
-0.1
-0.1
-0.1
+75
07
+250
+2.0
+2.0
+265
+100
+3.0
+400
+110
+75
1
2
3
04,06
01,02,
08
03,05
04,06
07
1,2
01,02,
08
-I
IB
03,05
07
+250
+2.0
+2.0
+265
+100
+3.0
+400
1
2
3
04,06
01,02,
08
03,05
04,06
07
See footnotes at end of table.
7
MIL-M-38510/101K
TABLE I. Electrical performance characteristics – Continued. 1/
Conditions
-55°C ≤ T ≤ +125°C
Group A
subgroups
Device
type
Limits
Max
Unit
A
Test
Symbol
+PSRR
see figure 3
unless otherwise specified
Min
-50
Power supply rejection
ratio
1
2,3
1
01,02,
03,05,
08
+50
µV/V
+V
= 10 V, R = 50 Ω,
CC
S
04,06
-16
+16
+100
+100
-V
= -20 V
CC
07
-100
-100
01,02,
03,05,
08
04,06
-16
-150
-50
+16
+150
+50
07
-PSRR
01,02,
03,05,
08
+V
= 20 V, R = 50 Ω,
CC
S
04,06
-16
+16
+100
+100
-V
CC
= -10 V
07
-100
-100
2,3
01,02,
03,05,
08
04,06
-16
-150
80
+16
07
+150
Input voltage common
mode rejection
CMR
1,2,3
01,02,
03,05,
07,08
dB
±V
= 20 V, V = ±15 V,
IN
CC
R = 50 Ω
S
04,06
96
See footnotes at end of table.
8
MIL-M-38510/101K
TABLE I. Electrical performance characteristics – Continued. 1/
Conditions
-55°C ≤ T ≤ +125°C
Group A
subgroups
Device
type
Limits
Unit
A
Test
Symbol
see figure 3
unless otherwise specified
Min
+5
Max
Adjustment for input 3/
offset voltage
1,2,3
01,02,
08
mV
V
±V
= 20 V
IO
CC
ADJ(+)
03,05
04,06
+4
No
external
ADJ
07
+7
Adjustment for input 3/
offset voltage
1,2,3
01,02,
08
-5
-4
mV
V
±V
= 20 V
IO
CC
ADJ(-)
03,05
04,06
No
extern
al ADJ
07
-7
Output short-circuit
current (for positive
1,2,3
01,02,
03,05,
08
-60
mA
I
(+)
±V
= 15 V, t ≤ 25 ms 4/
OS
CC
output)
04
06
07
-20
-20
-65
*
*
Output short-circuit
current (for negative
1,2,3
01,02,
03,05,
08
+60
mA
I
(-)
±V
= 15 V, t ≤ 25 ms 4/
OS
CC
output)
04
06
07
+20
+20
+65
*
*
1,2
3
+80
See footnotes at end of table.
9
MIL-M-38510/101K
TABLE I. Electrical performance characteristics – Continued. 1/
Conditions
-55°C ≤ T ≤ +125°C
Group A
subgroups
Device
type
Limits
Max
Unit
A
Test
Symbol
see figure 3
unless otherwise specified
Min
Supply current
1
01,02,
08
+3.8
mA
I
±V
= ±15 V 5/
CC
CC
03,05
04,06
07
+3
+0.6
+8
2
01,02,
08
+3.4
+2.5
+0.6
+7
03,05
04,06
07
3
01,02,
08
+4.2
+3.5
+0.8
+9
03,05
04,06
07
Output voltage swing
(maximum)
4,5,6
01-06,
08
V
±16
±17
±15
V
OP
±V
±V
= 20 V, R = 10 kΩ
L
CC
07
01,02,
03,05,
08
= 20 V, R = 2 kΩ
CC
L
04,06
Not
speci-
fied
07
±16
See footnotes at end of table.
10
MIL-M-38510/101K
TABLE I. Electrical performance characteristics – Continued. 1/
Conditions
-55°C ≤ T ≤ +125°C
Group A
subgroups
Device
type
Limits
Max
Unit
A
Test
Symbol
see figure 3
unless otherwise specified
Min
50
Open loop voltage gain 6/
(single ended)
4
01,02,
03,05,
07,08
V/mV
A
VS
(±)
±V
= 20 V, 7/
CC
R = 2 kΩ, 10 kΩ
L
04,06
80
25
V
OUT
= ±15 V
5,6
01,02,
03,05,
08
04,06
40
32
10
07
Open loop voltage gain 6/
(single ended)
4,5,6
01,02,
03,05,
07,08
V/mV
A
VS
±V
= 5 V, 7/
CC
R = 2 kΩ, 10 kΩ
L
04,06
20
V
OUT
= ±2 V
Transient response rise
time
See figure 4 8/
7,8A,8B
01,02,
03,05,
08
+800
ns
TR
(tr)
04,06
+1000
+40
07
Transient response
overshoot
See figure 4 8/
7,8A,8B
7,8B
01,02,
03,05,
08
+25
%
TR
(OS)
04,06,
07
+50
Slew rate 9/
SR(+)
01,02,
08
+0.3
10/
V/µs
V
IN
= ±5 V, A = 1,
V
see figure 4
03,05
04,06
07
+0.05
+40
See footnotes at end of table.
11
MIL-M-38510/101K
TABLE I. Electrical performance characteristics – Continued. 1/
Conditions
-55°C ≤ T ≤ +125°C
Group A
subgroups
Device
type
Limits
Unit
A
Test
Symbol
SR(+)
see figure 3
unless otherwise specified
Min
Max
Slew rate 9/
8A
01,02,
03,05,
08
+0.3
V/µs
V
= ±5 V, A = 1,
V
IN
see figure 4
04,06
+0.05
+30
07
Slew rate 9/
SR(-)
7,8B
01,02,
08
+0.3
10/
V/µs
V
= ±5 V, A = 1,
V
IN
see figure 4
03,05
04,06
07
+0.05
+40
8A
01,02,
03,05,
08
+0.3
04,06
+0.05
+30
07
Settling time 11/
See figure 4
12
13A,13B
12
07
800
1200
800
ns
t (+)
S
t (-)
S
13A,13B
7
1200
Channel separation
CS
02,05,
06,08
80
dB
±V
= ±20 V,
CC
see figure 5,
= +25°C
T
A
See footnotes at end of table.
12
MIL-M-38510/101K
TABLE I. Electrical performance characteristics – Continued. 1/
Conditions
-55°C ≤ T ≤ +125°C
Group A
subgroups
Device
type
Limits
Min Max
Unit
A
Test
Symbol
NI(BB)
see figure 3
unless otherwise specified
Noise (referred to input)
broadband
7
7
01-06,
08
15
µVrms
±V
= 20 V, T = +25°C,
A
CC
bandwidth = 5 kHz
07
25
40
Noise (referred to input)
popcorn
NI(PC)
01,02,
04,06,
08
µVpk
±V
= 20 V, T = +25°C,
A
CC
bandwidth = 5 kHz
03,05,
07
80
1/
For devices marked with the “Q” certification mark, the parameters listed herein maybe guaranteed if not tested
to the limits specified herein in accordance with the manufacturer’s QM plan.
2/
3/
4/
Tests at common mode V
= 0 V, V
= -15 V, and V
= +15 V.
CM
CM
CM
V
is not performed on device type 02, case I only, or on device type 08 for either case G or P.
IO(ADJ)
Continuous short circuit limits will be considerably less than the indicated test limits. Continuous I
at T ≤ +75°C
A
OS
will cause T to exceed the maximum of +175°C. For dual devices, I
is measured one channel at a time.
J
OS
5/
6/
Value shown is for single devices (01, 03, 04) only. For dual devices (02, 05, 06, and 08) this limit is for single
devices.
Note that gain is not specified at V
extremes. Some gain reduction is usually seen at V
extremes.
IO(ADJ)
IO(ADJ)
For closed loop applications (closed loop gain less than 1,000), the open loop tests (AVS) prescribed herein should
guarantee a positive, reasonably linear, transfer characteristic. They do not, however, guarantee that the open
loop gain is linear, or even positive, over the operating range. If either of these requirements exist (positive open
loop gain or open loop gain linearity), they should be specified in the individual procurement document as
additional requirements.
7/
8/
R = 10 kΩ only for device types 04 and 06.
L
For transient response tests, C = 10 pF for device types 01, 02, 03, 04, 05, 06, and 08. Device type 07,
F
C = 47 pF. C includes the effects of stray capacitance.
F
F
9/
Minimum limit for device 08 is 0.4 V/µs at all temperatures.
10/ Minimum limits for device types 03 and 05 are 0.2 V/µs at -55°C and 0.3 V/µs at both +25°C and +125°C.
11/ Settling time is waived for method 5004, MIL-STD-883 except for device type 07.
13
MIL-M-38510/101K
TABLE II. Electrical test requirements.
MIL-PRF-38535
Subgroups (see table III)
test requirements
Class S
devices
Class B
devices
Interim electrical parameters
1
1
Final electrical test parameters 1/
1,2,3,4
1,2,3,4
1,2,3,4,5,6,
7,8A,8B,12,
13A,13B
Group A test requirements
1,2,3,4,5,6,7
1,2,3, and
table IV delta
limits
Group C end point electrical
parameters
1 and table IV
delta limits
Additional electrical subgroups
For group C periodic inspections
8A,8B,12,
13A,13B
Not applicable
1,2,3
Group D end point electrical
parameters
1
1/ PDA applies to subgroup 1.
4. VERIFICATION.
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as
modified in the device manufacturer’s Quality Management (QM) plan. The modification in the QM plan shall not affect the
form, fit, or function as function as described herein.
4.2 Screening. Screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to
qualification and quality conformance inspection. The following additional criteria shall apply:
a. The burn-in test duration, test condition, and test temperature, or approved alternatives shall be as specified in the
device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained
under document control by the device manufacturer's Technology Review Board (TRB) in accordance with
MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit
shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent
specified in test method 1015 of MIL-STD-883.
b. Interim and final electrical test parameters shall be as specified in table II, except interim electrical parameters test
prior to burn-in is optional at the discretion of the manufacturer.
c. Additional screening for space level product shall be as specified in MIL-PRF-38535.
14
MIL-M-38510/101K
Device type
01
Case outlines
A,B,C,D
G and P
H
2
Terminal
number
1
Terminal symbol
NC
NC
OFFSET NULL
-INPUT
NC
OFFSET NULL
-INPUT
NC
2
3
OFFSET
NULL (-)
NC
OFFSET NULL
-INPUT
+INPUT
4
+INPUT
NC
-INPUT
NC
-V
CC
5
+INPUT
OFFSET NULL
OUTPUT
-V
CC
6
OFFSET NULL
OUTPUT
-V
CC
7
NC
+INPUT
NC
+V
CC
8
NC
NC
+V
CC
9
OFFSET NULL
OUTPUT
---
---
---
---
---
---
---
---
---
---
---
---
NC
NC
10
11
12
13
14
15
16
17
18
19
20
NC
---
---
---
---
---
---
---
---
---
---
-V
CC
NC
+V
CC
NC
OFFSET
NULL (+)
NC
NC
NC
---
NC
OUTPUT
NC
---
---
+V
CC
---
NC
---
NC
NC
---
NC = No connection
FIGURE 1. Terminal connections.
15
MIL-M-38510/101K
Device type
02
03
Case outlines
A,B,C,D
I
C
G and P
H
Terminal
number
1
Terminal symbol
-INPUT A
+INPUT A
OUTPUT A
+V (A)
SEE NOTE 2
-INPUT A
NC
NC
OFFSET NULL /
COMP
NC
2
-INPUT
OFFSET NULL /
COMP
CC
3
4
5
6
7
8
OFFSET NULL A
-V
OFFSET NULL /
COMP
+INPUT
-INPUT
+INPUT A
-INPUT
+INPUT
-V
CC
CC
OFFSET NULL B
+INPUT B
+INPUT
OFFSET NULL
OUTPUT
-V
CC
-V
CC
+INPUT B
-INPUT B
OFFSET NULL
OUTPUT
-V
CC
-INPUT B
NC
+V
CC
OFFSET NULL B
NC
COMP
---
+V
(B)
+V
CC
CC
SEE NOTE 2
OUTPUT B
9
OFFSET NULL
OUTPUT
COMP
+V
(B)
CC
SEE NOTE 2
OUTPUT B
10
11
12
13
NC
---
---
---
---
---
NC
---
NC
+V
CC
OUTPUT A
---
COMP
NC
---
---
---
+V
(A)
CC
SEE NOTE 2
14
15
16
17
18
19
20
OFFSET NULL A
---
---
---
---
---
---
---
NC
---
---
---
---
---
---
---
---
---
---
---
---
---
---
---
---
---
---
---
---
---
---
---
---
---
---
NC = No connection
FIGURE 1. Terminal connections – Continued.
16
MIL-M-38510/101K
Device type
03
2
04
Case outlines
C
G and P
H
2
Terminal
number
1
Terminal symbol
INPUT COMP
-INPUT
NC
NC
INPUT COMP
GUARD
NC
NC
INPUT COMP
NC
2
3
OFFSET
NULL (-)
NC
GUARD
-INPUT
+INPUT
GUARD
+INPUT
4
NC
-INPUT
NC
-INPUT
NC
-V
CC
5
+INPUT
NC
OUTPUT
+V
-INPUT
NC
6
GUARD
-V
CC
7
+INPUT
NC
OUTPUT
+V
+INPUT
NC
-V
CC
CC
8
NC
OUTPUT
COMP
---
CC
9
NC
NC
OUTPUT
COMP
NC
10
11
12
13
14
15
16
17
18
19
20
OUTPUT
---
---
---
---
---
---
---
---
---
---
---
INPUT COMP
-V
-V
CC
CC
NC
---
---
---
---
---
---
---
---
---
---
NC
+V
CC
OFFSET
NULL (+)
NC
OUTPUT
COMP
NC
NC
NC
NC
OUTPUT
NC
NC
---
---
---
---
---
---
NC
OUTPUT
NC
+V
+V
CC
CC
NC
NC
NC
NC
FREQ COMP
OUTPUT
COMP
NC = No connection
FIGURE 1. Terminal connections – Continued.
17
MIL-M-38510/101K
Device type
05
06
07
Case outlines
E and F
E and F
C
G and P
Terminal
number
1
Terminal symbol
+V (A)
CC
NC
NC
COMP A /
OFFSET
NULL
+V
(A)
CC
SEE NOTE 5
SEE NOTE 5
2
3
4
5
COMP A
OUTPUT
COMP A
INPUT
COMP A
-INPUT A
-INPUT
OFFSET NULL /
COMP
COMP A /
OFFSET NULL
-INPUT
+INPUT
-INPUT A
-V
CC
+INPUT A
+INPUT A
+INPUT
COMP B /
OFFSET
NULL
6
7
8
9
OUTPUT
-V
-V
-V
CC
CC
CC
OFFSET
NULL B
OUTPUT B
NC
OUTPUT B
+V (B)
NC
+V
CC
NC
COMP C
---
COMP B /
OFFSET NULL
+V
(B)
CC
CC
SEE NOTE 5
COMP B
SEE NOTE 5
OUTPUT
COMP B
INPUT
COMP B
-INPUT B
10
11
12
13
14
15
16
OUTPUT
---
---
---
---
---
---
---
OFFSET NULL /
COMP B
+V
CC
-INPUT B
COMP C
NC
+INPUT B
+INPUT B
NC
OFFSET
NULL A
NC
NC
NC
---
OUTPUT A
OUTPUT A
---
NC = No connection
FIGURE 1. Terminal connections – Continued.
18
MIL-M-38510/101K
Device types
07
H
08
Case outlines
G and P
Terminal
number
1
Terminal symbol
NC
OUTPUT A
-INPUT A
+INPUT A
2
3
COMP A /
OFFSET NULL
-INPUT
4
+INPUT
-V
CC
5
+INPUT B
-INPUT B
-V
CC
6
COMP B /
OFFSET NULL
OUTPUT
7
OUTPUT B
8
+V
+V
CC
CC
9
COMP C
NC
---
---
10
NC = No connection
NOTES:
1. -V
shall be connected to case of metal packages.
CC
2. For device type 02 only, +V
(A) and +V
(B) shall be internally connected.
CC
CC
3. +Input is non-inverting input.
4. -Input is inverting input.
5. For device types 05 and 06 only, +V
(A) and +V
(B) shall not be internally connected.
CC
CC
(External connection to the same supply voltage recommended).
FIGURE 1. Terminal connections – Continued.
19
MIL-M-38510/101K
FIGURE 2. Offset null circuits.
20
MIL-M-38510/101K
Device type 07
FIGURE 2. Offset null circuits - Continued.
21
MIL-M-38510/101K
FIGURE 3. Test circuit for static and dynamic tests.
22
MIL-M-38510/101K
FIGURE 3. Test circuit for static and dynamic tests- Continued.
23
MIL-M-38510/101K
FIGURE 3. Test circuit for static and dynamic tests- Continued.
24
MIL-M-38510/101K
NOTES:
1/ These voltages in mV shall be measured to four place accuracy to provide required resolution in PSRR and CMR.
2/ Precautions shall be taken to prevent damage to the device under test during insertion into socket and change
of switch positions (example, disable voltage supplies, current limit ±V , etc.).
CC
3/ If this alternate CMR test is used, these resistors shall be of .01 percent tolerances matched to .001 percent.
4/ Device types 02, 05, and 06 only, test both halves for all tests. The idle half of the dual amplifiers shall be
maintained in this configuration where V1 is midway between +V
and -V , or the manufacturer has the
CC
CC
option to connect the idle half in a V configuration such that the inputs are maintained at the same common
IO
mode voltage as the device under test.
5/ Compensation: for device types 03, 04, 05, and 06 only, equals 30 pF; for device type 07 only, equals
330 pF (optional).
6/ Device types 01, all case types, and device type 02, case outlines A, B, C, and D only.
7/ Device types 03 and 05 only.
8/ See figure 6. Noise test circuit.
9/ As required, if needed to prevent oscillation. Also, proper wiring procedures shall be followed to prevent oscillation.
Loop response and settling time shall be consistent with the test rate such that any value has settled for at least
five loop time constants before the value is measured.
10/ Adequate settling time shall be allowed such that each parameter has settled to within five percent of its final value.
11/ The nulling amplifier is an M38510/10101XXX. Saturation of the nulling amplifier is not allowed on test where
the "E" value is measured.
12/ All resistors 0.1 percent tolerance except as noted (note 3).
13/ For device types 01, 02, 07, and 08: R = 20 kΩ. For device types 03 and 05: R = 100 kΩ.
S
S
For device types 04 and 06: R = 5.0 MΩ.
S
14/ Device type 07 only, this capacitor = 1,000 pF maximum to prevent oscillations.
15/ Device type 07 only.
16/ To minimize thermal drift, the reference voltages for gain measurements (E3 and E4) shall be taken immediately
prior to or after the reading corresponding to device gain (E24, E25, E26, E27, E30, E31, E32, and E33).
The gain at R = 10 kΩ is essentially the gain at R = 2 kΩ is influenced by thermal gradients on the die resulting
L
L
from power dissipation in the output stage. Hence, it is not linear and may not even be a true approximation of the
gain between other than the specified operation points.
17/ Any oscillation greater that 300 mV in amplitude (pk - pk) shall be cause for device failure.
18/ Although switches are depicted as toggle switches, any switching mechanism may be used provided the switching
action is achieved without adversely affecting the measurement.
19/ The load resistors (2,050 Ω and 11.1 kΩ) yield effective load resistances of 2 kΩ and 10 kΩ, respectively.
20/ The equations take into account both the loop gain of 1,000 and the scale factor multiplier, so that the calculated value
is in table III units. Therefore, use measured value / units in the equations, example E1 (volts).
FIGURE 3. Test circuit for static and dynamic tests- Continued.
25
MIL-M-38510/101K
See notes on page 29
Parameter
Pulse generator
Measure
Equation
Units
Rise time (tr)
+50 mV amplitude
t (µs),
see waveform 1
µs
t = t
r
A = 1
V
Overshoot (OS)
+50 mV amplitude
+50 mV amplitude
-5 V to +5 V step
%
∆V (mV),
OS = (∆V / 50) x 100
BW = 0.35 / tr (µs)
see waveform 1
A = 1
V
Bandwidth (BW)
Calculate
MHz
V/µs
A = 1
V
Slew rate (+SR)
∆V (volts),
+SR = |∆V (+) / ∆t(+)|
O
O
A = 1
V
∆t (µs)
see waveform 2
Slew rate (-SR)
+5 V to -5 V step
V/µs
∆V (volts),
∆t (µs)
see waveform 3
-SR = |∆V (-) / ∆t(-)|
O
O
A = 1
V
FIGURE 4. Transient response test circuit.
26
MIL-M-38510/101K
See notes on page 30
Parameter
Pulse generator
+50 mV amplitude
+50 mV amplitude
+50 mV amplitude
-5 V to +5 V step
Measure
Equation
Units
ns
Rise time (tr)
t (ns),
see waveform 1
∆V (mV),
see waveform 1
Calculate
t = t
r
Overshoot (OS)
Bandwidth (BW)
Slew rate (+SR)
%
OS = (∆V / 50) x 100
3
MHz
V/µs
BW = (0.35 x 10 ) / tr (ns)
-3
∆V (+) (volts),
+SR = |∆V (+) / ∆t(+) x 10 |
O
O
∆t (+) (ns)
see waveform 2
-3
Slew rate (-SR)
+5 V to -5 V step
V/µs
∆V (-) (volts),
-SR = |∆V (-) / ∆t(-) x 10 |
O
O
∆t (-) (ns)
see waveform 3
-5 V to +5 V step
+5 V to -5 V step
ns
ns
Settling time t (+) 5/
t (+),
S
see waveform 2
t (+) = t (+)
S S
S
Settling time t (-) 5/
t (-),
S
t (-) = t (-)
S S
S
see waveform 3
FIGURE 4. Transient response test circuit - Continued.
27
MIL-M-38510/101K
(Alternate) device type 07
NOTES:
1. K1 is closed for small tests (Tr and P.O.) and is open for large signal tests ( ±slew rate, ±Ts).
2. Input signal is a -50 mV to 0 mV pulse train for small signal tests and -5 V to +5 V pulse train for large
signal tests.
3. Tr of the input signal is < 10 ns for the small signal tests.
FIGURE 4. Transient response test circuit - Continued.
28
MIL-M-38510/101K
NOTES:
1. Idle half of dual amplifier shall be connected during test of other half.
2. All resistor tolerances are 1 percent, capacitor tolerances are 10 percent and ±V
= ±20 V.
CC
3. This compensation capacitor is used for device types 03, 04, 05, and 06.
4. For device types 01, 02, 03, 05, and 08, R = 2 kΩ; for device types 04 and 06, R = 10 kΩ.
L
L
5. Settling time is the interval from the beginning of the output response to the point where the output remains
within the error band, in this case ±2 percent.
6. CF = 10 pF ±10 percent includes stray capacitance.
7. R1 may be added to the circuit. When R1 is added, its value shall be 10 kΩ. When using R1, the unity gain
will increase to 2. To accommodate this change in gain, the pulse generator input shall be halved.
8. C1 may be added to the circuit. When added, it shall be within the range of 0 pF to 2 pF.
9. C capacitance specified includes stray, jig, and probe capacitance.
L
FIGURE 4. Transient response test circuit - Continued.
29
MIL-M-38510/101K
Device types 02, 05, 06, and 08 only.
NOTES:
1. ±V
= 20 V.
CC
2. Measure: V (volts, p-p) at 1 kHz to accuracy of 0.1 mV or better.
02
3. Channel separation (dB) referred to input of second channel = 20 log [V / (0.1 x V ) ].
01
02
4. All resistor tolerances ≤ 1 percent.
5. A 30 pF compensation capacitor is required for device types 05 and 06.
FIGURE 5. Test circuit for channel separation.
30
MIL-M-38510/101K
Noise
Symbol
S1
Measure
Value
Measured
equation
Parameter
units
(Referred to
input)
Broadband
Units
mV rms
mV pk
Closed
Open
µV rms
µV pk
N (BB)
1
E
E
E / 1000
0
0
Popcorn
N (PC)
1
E / 1000
0
0
NOTES:
1. R = 20 kΩ for device types 01, 02, 07, and 08; R = 100 kΩ for device types 03, 04, 05, and 06.
S
S
2. E is measured using an RMS voltmeter with a bandwidth of 10 Hz to 5 kHz and a peak detector
0
simultaneously. Monitor the peak test for a minimum of 15 seconds. The loop bandwidth shall be
at least 5 kHz.
FIGURE 6. Noise test circuit.
31
MIL-M-38510/101K
TABLE III. Group A inspection.
32
MIL-M-38510/101K
TABLE III. Group A inspection - Continued.
See footnotes at end of table III.
33
MIL-M-38510/101K
TABLE III. Group A inspection - Continued.
See footnotes at end of table III.
34
MIL-M-38510/101K
TABLE III. Group A inspection - Continued.
See footnotes at end of table III.
35
MIL-M-38510/101K
TABLE III. Group A inspection - Continued.
See footnotes at end of table III.
36
MIL-M-38510/101K
TABLE III. Group A inspection - Continued.
See footnotes at end of table III.
37
MIL-M-38510/101K
TABLE III. Group A inspection - Continued.
38
MIL-M-38510/101K
TABLE IV. Group C end point electrical parameters.
(T = +25°C, V
= ±20 V, V
= 0 V)
A
CC
CM
Table III
test no.
Test
01, 02, 08
03, 05
Unit
Limit
Delta
Max
Limit
Delta
Max
Min
-3.0
+1.0
+1.0
Max
+3.0
Min
-0.5
-12
-12
Min
-2.0
Max
Min
-0.5
-7.5
-7.5
3
+0.5
+12
+12
+2.0
+75
+75
+0.5
+7.5
+7.5
mV
nA
nA
V
IO
11
15
+110
+110
+1.0
+1.0
+I
IB
-I
IB
Table III
test no.
Test
04, 06
07
Unit
Limit
Delta
Limit
Delta
Min
Max
Min
Max
Min
Max
Min
Max
V
3
-0.5
-0.1
-0.1
+0.5
+2.0
+2.0
-0.25
-0.5
+0.25
+0.5
+0.5
-4.0
+1.0
+1.0
+4.0
250
250
-1.0
-25
-25
+1.0
+25
+25
mV
nA
nA
IO
+I
IB
11
15
-I
-0.5
IB
39
MIL-M-38510/101K
4.3 Qualification inspection. Qualification inspection shall be in accordance with MIL-PRF-38535.
4.4 Technology Conformance inspection (TCI). Technology conformance inspection shall be in accordance with MIL-
PRF-38535 and herein for groups A, B, C, and inspections (see 4.4.1 through 4.4.4).
4.4.1 Group A inspection. Group A inspection shall be in accordance with table III of MIL-PRF-38535 and as follows:
a. Subgroups 9, 10, and 11 shall be omitted.
b. Tests shall be as specified in table II herein.
c. Subgroups 12 and 13 (for device type 07 only) shall be added to table III of MIL-PRF-38535 for class S only.
The class S sample size series for subgroup 12 shall be 5 and for subgroup 13 the class S sample size
series shall be 7.
4.4.2 Group B inspection. Group B inspection shall be in accordance with table II of MIL-PRF-38535.
4.4.3 Group C inspection. Group C inspection shall be in accordance with table IV of MIL-PRF-38535 and as follows:
a. End point electrical parameters shall be as specified in table II herein.
b. Subgroups shall be added to group C inspection and shall consist of subgroups 8, 12, and 13
respectively as specified in table III herein. The sample size series for subgroup 12 shall be 5, and
subgroup 13 shall be 7 for class B devices (see MIL-PRF-38535, Appendix D).
c. The steady-state life test duration, test condition, and test temperature, or approved alternatives shall be as
specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall
be maintained under document control by the device manufacturer's Technology Review Board (TRB) in
accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request.
The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with
the intent specified in test method 1005 of MIL-STD-883.
4.4.4 Group D inspection. Group D inspection shall be in accordance with table V of MIL-PRF-38535. End point electrical
parameters shall be as specified in table II herein.
4.5 Methods of inspection. Methods of inspection shall be specified and as follows.
4.5.1 Voltage and current. All voltage values given, except the input offset voltage (or differential voltage) are referenced
to the external zero reference level of the supply voltage. Currents given are conventional current and positive when flowing
into the referenced terminal.
4.5.2 Burn-in and life test cooldown procedure. When devices are measured at +25°C following application of the steady
state life or burn-in condition, they shall be cooled to within 10°C of their power stable condition at room temperature prior to
removal of the bias.
40
MIL-M-38510/101K
5. PACKAGING
5.1 Packaging requirements. For acquisition purposes, the packaging requirements shall be as specified in the contract
or order (see 6.2). When packaging of materiel is to be performed by DoD personnel, these personnel need to contact the
responsible packaging activity to ascertain requisite packaging requirements. Packaging requirements are maintained by
the Inventory Control Point's packaging activity within the Military Department of Defense Agency, or within the Military
Department's System Command. Packaging data retrieval is available from the managing Military Department's or Defense
Agency's automated packaging files, CD-ROM products, or by contacting the responsible packaging activity.
6. NOTES
(This section contains information of a general or explanatory nature which may be helpful, but is not mandatory.)
6.1 Intended use. Microcircuits conforming to this specification are intended for logistic support of existing equipment.
6.2 Acquisition requirements. Acquisition documents should specify the following:
a. Title, number, and date of the specification.
b. PIN and compliance identifier, if applicable (see 1.2).
c. Requirements for delivery of one copy of the conformance inspection data pertinent to the device
inspection lot to be supplied with each shipment by the device manufacturer, if applicable.
d. Requirements for certificate of compliance, if applicable.
e. Requirements for notification of change of product or process to acquiring activity in addition to
notification of the qualifying activity, if applicable.
f. Requirements for failure analysis (including required test condition of MIL-STD-883, method 5003),
corrective action and reporting of results, if applicable.
g. Requirements for product assurance options.
h. Requirements for special carriers, lead lengths, or lead forming, if applicable. These requirements shall not
affect the part number. Unless otherwise specified, these requirements will not apply to direct purchase by
or direct shipment to the Government.
i.
j.
Requirements for “JAN” marking.
Packaging requirements (see 5.1).
6.3 Qualification. With respect to products requiring qualification, awards will be made only for products which are, at the
time of award of contract, qualified for inclusion in Qualified Manufacturers List QML-38535 whether or not such products
have actually been so listed by that date. The attention of the contractors is called to these requirements, and
manufacturers are urged to arrange to have the products that they propose to offer to the Federal Government tested for
qualification in order that they may be eligible to be awarded contracts or purchase orders for the products covered by this
specification. Information pertaining to qualification of products may be obtained from DSCC-VQ, 3990 E. Broad Street,
Columbus, Ohio 43218-1199.
41
MIL-M-38510/101K
6.4 Superseding information. The requirements of MIL-M-38510 have been superseded to take advantage of the
available Qualified Manufacturer Listing (QML) system provided by MIL-PRF-38535. Previous references to MIL-M-38510
in this document have been replaced by appropriate references to MIL-PRF-38535. All technical requirements now consist
of this specification and MIL-PRF-38535. The MIL-M-38510 specification sheet number and PIN have been retained to
avoid adversely impacting existing government logistics systems and contractor's parts lists.
6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in
MIL-PRF-38535 and MIL-HDBK-1331.
6.6 Logistic support. Lead materials and finishes (see 3.4) are interchangeable. Unless otherwise specified,
microcircuits acquired to Government logistic support will be acquired to device class B (see 1.2.2), lead material and finish
A (see 3.4). Longer length leads and lead forming should not affect the part number.
6.7 Substitutability. The cross-reference information below is presented for the convenience of users. Microcircuits
covered by this specification will functionally replace the listed generic-industry type. Generic-industry microcircuit types
may not have equivalent operational performance characteristics across military temperature ranges or reliability factors
equivalent to MIL-M-38510 device types and may have slight physical variations in relation to case size. The presence of
this information should not be deemed as permitting substitution of generic-industry types for MIL-M-38510 types or as a
waiver of any of the provisions of MIL-PRF-38535.
Military device type
Generic-industry type
741A
01
02
747A (with common +V
LM101A
)
CC
03
04
05
06
07
08
LM108A
LH2101A
LH2108A
LM118
1558
6.8 Changes from previous issue. Marginal notations are not used in this revision to identify changes with respect to the
previous issue due to the extensiveness of the changes.
Custodians:
Army - CR
Navy - EC
Air Force - 11
NASA - NA
DLA - CC
Preparing activity:
DLA - CC
Project 5962-2005-046
Review activities:
Army – MI, SM
Navy - AS, CG, MC, SH, TD
Air Force – 03, 19, 99
NOTE: The activities listed above were interested in this document as of the date of this document.
Since organizations and responsibilities can change, you should verify the currency of the information above
using the ASSIST Online database at http://assist.daps.dla.mil.
42
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