WF128K32N-60G2LQ5A [MICROSEMI]
Flash Module, CQFP68, 22.4 MM, CERAMIC, QFP-68;型号: | WF128K32N-60G2LQ5A |
厂家: | Microsemi |
描述: | Flash Module, CQFP68, 22.4 MM, CERAMIC, QFP-68 |
文件: | 总11页 (文件大小:814K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
WF128K32-XXX5
128KX32 5V NOR FLASH MODULE (SMD 5962-94716**)
FEATURES
Access times of 50*, 60, 70, 90, 120, 150ns
Low power CMOS
Packaging:
Embedded erase and program algorithms
TTL compatible inputs and CMOS outputs
• 66 pin, PGA type, 1.075 inch square, Hermetic Ceramic
HIP (Package 400)
Built-in decoupling caps and multiple ground pins for low
• 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880 inch)
square, 3.56mm (0.140 inch) high (Package 510)
noise operation
Page program operation and internal program control time
Weight
• 68 lead, Hermetic CQFP (G2L), 22.4mm (0.880 inch)
square, 4.06mm (0.160 inch) high (Package 528)
WF128K32-XG2LX5 - 8 grams typical
WF128K32-XG2UX5 - 8 grams typical
WF128K32-XH1X5 - 13 grams typical
Sector architecture
• 8 equal size sectors of 16KBytes each
• Any combination of sectors can be concurrently erased.
Also supports full chip erase
This product is subject to change without notice.
Note: For programming information and waveforms refer to Flash Programming 1M5 Application
Note AN0036.
100,000 erase/program cycles minimum
Organized as 128Kx32
* The access time of 50ns is available in Industrial and Commercial temperature ranges only.
** For reference only. See SMD table on page 10.
Commercial, industrial and military temperature ranges
5 volt programming
FIGURE 1 – PIN CONFIGURATION FOR WF128K32N-XH1X5
Pin Description
Top View
I/O0-31
Data Inputs/Outputs
Address Inputs
Write Enables
Chip Selects
A0-16
I/O24
I/O25
I/O26
A7
VCC
CS4#
WE4#
I/O27
A4
I/O31
I/O30
I/O29
I/O28
A1
I/O8
I/O9
I/O10
A14
WE2#
CS2#
GND
I/O11
A10
I/O15
I/O14
I/O13
I/O12
OE#
NC
WE1-4
#
CS1-4
OE#
VCC
#
Output Enable
Power Supply
Ground
GND
NC
Not Connected
A12
A16
Block Diagram
NC
A5
A2
A11
A9
WE1# CS1#
WE2# CS2#
WE3# CS3#
WE4# CS4#
128K x 8
OE#
A0-16
A13
A6
A3
A0
A15
WE1#
I/O7
A8
WE3#
CS3#
GND
I/O19
I/O23
I/O22
I/O21
I/O20
NC
I/O0
I/O1
I/O2
VCC
128K x 8
128K x 8
128K x 8
I/O16
I/O17
I/O18
CS1#
NC
I/O6
8
8
8
8
I/O5
I/O0-7
I/O8-15
I/O16-23
I/O24-31
I/O3
I/O4
Microsemi Corporation reserves the right to change products or specifications without notice.
June 2012 © 2012 Microsemi Corporation. All rights reserved.
Rev. 12
1
Microsemi Corporation • (602) 437-1520 • www.microsemi.com
WF128K32-XXX5
FIGURE 3 – PIN CONFIGURATION FOR WF128K32-XG2UX5 AND WF128K32-XG2LX5
TOP VIEW
PIN DESCRIPTION
I/O0-31
A0-16
Data Inputs/Outputs
Address Inputs
Write Enables
Chip Selects
9
8
7
6
5
4
3
2
1
68 67 66 65 64 63 62 61
60 I/O16
WE1-4
#
I/O0 10
I/O1 11
I/O2 12
I/O3 13
I/O4 14
I/O5 15
I/O6 16
I/O7 17
GND 18
I/O8 19
I/O9 20
I/O10 21
I/O11 22
I/O12 23
I/O13 24
I/O14 25
I/O15 26
CS1-4
OE#
VCC
#
59 I/O17
58 I/O18
57 I/O19
56 I/O20
55 I/O21
54 I/O22
53 I/O23
52 GND
51 I/O24
50 I/O25
49 I/O26
48 I/O27
47 I/O28
46 I/O29
45 I/O30
44 I/O31
Output Enable
Power Supply
Ground
GND
NC
Not Connected
BLOCK DIAGRAM
WE1# CS1#
WE2# CS2#
WE3# CS3#
WE4# CS4#
128K x 8
OE#
A0-16
2728 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43
128K x 8
128K x 8
128K x 8
8
8
8
8
I/O0-7
I/O8-15
I/O16-23
I/O24-31
Microsemi Corporation reserves the right to change products or specifications without notice.
June 2012 © 2012 Microsemi Corporation. All rights reserved.
Rev. 12
2
Microsemi Corporation • (602) 437-1520 • www.microsemi.com
WF128K32-XXX5
ABSOLUTE MAXIMUM RATINGS (1)
RECOMMENDED OPERATING CONDITIONS
Parameter
Unit
°C
Parameter
Symbol
VCC
TA
Min
4.5
-55
-40
0
Max
5.5
Unit
V
Operating Temperature
-55 to +125
-2.0 to +7.0
-2.0 to +7.0
-65 to +150
+300
Supply Voltage
Supply Voltage Range (VCC
)
V
Operating Temp. (Mil, Q)
Operating Temp. (Ind)
Operating Temp. (Com)
+125
+85
+70
°C
°C
°C
Signal voltage range (any pin except A9) (2)
Storage Temperature Range
V
TA
°C
TA
Lead Temperature (soldering, 10 seconds)
Data Retention Mil Temp
°C
10
years
cycles
V
Endurance (write/erase cycles) Mil Temp
A9 Voltage for sector protect (VID) (3)
NOTES:
100,000 min
-2.0 to +12.5
CAPACITANCE
Ta = +25°C
1. Stresses above the absolute maximum rating may cause permanent damage to the device.
Extended operation at the maximum levels may degrade performance and affect reliability.
2. Minimum DC voltage on input or I/O pins is -0.5V. During voltage transitions, inputs may
overshoot VSS to -2.0 V for periods of up to 20ns. Maximum DC voltage on output and I/O pins
is Vcc + 0.5V. During voltage transitions, outputs may overshoot to VCC + 2.0 V for periods of up
to 20ns.
3. Minimum DC input voltage on A9 pin is -0.5V. During voltage transitions, A9 may overshoot
Vss to -2V for periods of up to 20ns. Maximum DC input voltage on A9 is +12.5V which may
overshoot to 13.5 V for periods up to 20ns.
Parameter
Symbol
COE
CWE
Conditions
VIN = 0V, f = 1.0 MHz
VIN = 0V, f = 1.0 MHz
Max Unit
OE# capacitance
WE1-4# capacitance
HIP (PGA) H1
50
pF
pF
20
15
20
20
50
CQFP G2U/G2L
CS1-4# capacitance
Data# I/O capacitance
Address input capacitance
CCS
CI/O
CAD
VIN = 0V, f = 1.0 MHz
VI/O = 0V, f = 1.0 MHz
VIN = 0V, f = 1.0 MHz
pF
pF
pF
This parameter is guaranteed by design but not tested.
DC CHARACTERISTICS – CMOS COMPATIBLE
Parameter
Symbol
ILI
Conditions
VCC = VCC MAX, VIN = GND to VCC
Min
Max
10
Unit
Input Leakage Current
Output Leakage Current
μA
μA
mA
mA
mA
mA
V
ILOx32
ICC1
ICC2
ICC3
ICC4
VIH
VCC = VCC MAX, VOUT = GND to VCC
CS# = VIL, OE# = VIH, VCC = VCC MAX
CS# = VIL, OE# = VIH, VCC = VCC MAX
VCC = VCC MAX, CS# = VCC ±0.5V, OE# = VIH, f = 5MHz
VCC = 5.5, CS# = VIH
10
VCC Active Current for Read(1)
VCC Active Current for Program or Erase(2)
VCC Standby Current
140
200
6.5
VCC Static Current
Input High Voltage
0.6
2.0
-0.5
11.5
VCC + 0.3
+0.8
12.5
0.45
Input Low Voltage
VIL
V
Voltage for Auto Select and Sector Protect
Output Low Voltage
Output High Voltage
Output High Voltage
Low VCC Lock Out Voltage
NOTES:
VID
V
VOL
VOH1
VOH2
VLKO
IOL = 8.0 mA, VCC = VCC MIN
IOH = -2.5 mA, VCC = VCC MIN
IOH = -100 μA, VCC = VCC MIN
V
0.85 x VCC
VCC -0.4
3.2
V
V
V
1.
2.
I
I
CC current is typically less than 8mA/MHz, with OE# at VIH.
CC active while Embedded Algorithm (program or erase) is in progress.
Microsemi Corporation reserves the right to change products or specifications without notice.
June 2012 © 2012 Microsemi Corporation. All rights reserved.
Rev. 12
3
Microsemi Corporation • (602) 437-1520 • www.microsemi.com
WF128K32-XXX5
AC CHARACTERISTICS – WRITE/ERASE/PROGRAM OPERATIONS, CS# CONTROLLED
Parameter
Symbol
-50
-60
-70
-90
-120
-150
Unit
Min
50
0
Max
Min
60
0
Max
Min
70
0
Max
Min
90
0
Max
Min
120
0
Max
Min
150
0
Max
Write Cycle Time
tAVAV
tWLEL
tELEH
tWC
tWS
tCP
ns
ns
WE# Setup Time
CS# Pulse Width
25
0
30
0
35
0
45
0
50
0
50
0
ns
Address Setup Time
Data Setup Time
tAVEL
tAS
ns
tDVEH
tEHDX
tELAX
tDS
25
0
30
0
30
0
45
0
50
0
50
0
ns
Data Hold Time
tDH
tAH
tWH
tCPH
ns
Address Hold Time
40
0
45
0
45
0
45
0
50
0
50
0
ns
WE# Hold from WE# High
CS# Pulse Width High
Duration of Programming Operation
Duration of Erase Operation
Read Recovery before Write
Chip Programming Time
tEHWH
tEHEL
ns
20
14
2.2
0
20
14
2.2
0
20
14
2.2
0
20
14
2.2
0
20
14
2.2
0
20
14
2.2
0
ns
tWHWH1
tWHWH2
tGHEL
μs
sec
ns
60
60
60
60
60
60
12.5
12.5
12.5
12.5
12.5
12.5
sec
FIGURE 4 – AC TEST CIRCUIT
AC TEST CONDITIONS
Parameter
Typ
Unit
Input Pulse Levels
Input Rise and Fall
Input and Output Reference Level
Output Timing Reference Level
VIL = 0, VIH = 3.0
V
ns
V
IOL
5
1.5
1.5
Current Source
V
Notes:
D.U.T.
Ceff = 50 pf
V
Z 1.5V
VZ is programmable from -2V to +7V.
(Bipolar Supply)
I
OL & IOH programmable from 0 to 16mA.
Tester Impedance Z0 = 75 Ω.
VZ is typically the midpoint of VOH and VOL
.
I
OL & IOH are adjusted to simulate a typical resistive load circuit.
ATE tester includes jig capacitance.
IOH
Current Source
Microsemi Corporation reserves the right to change products or specifications without notice.
June 2012 © 2012 Microsemi Corporation. All rights reserved.
Rev. 12
4
Microsemi Corporation • (602) 437-1520 • www.microsemi.com
WF128K32-XXX5
AC CHARACTERISTICS – WRITE/ERASE/PROGRAM OPERATIONS, WE# CONTROLLED
Parameter
Symbol
-50
-60
-70
-90
-120
Max
-150
Max
Unit
Min
50
0
Max
Min
60
0
Max
Min
70
0
Max
Min
90
0
Max
Min
120
0
Min
150
0
Write Cycle Time
tAVAV
tELWL
tWLWH tWP
tAVWL tAS
tDVWH tDS
tWHDX tDH
tWLAX tAH
tWC
ns
ns
ns
ns
ns
ns
ns
ns
ns
μs
sec
ns
μs
sec
ns
ns
Chip Select Setup Time
Write Enable Pulse Width
Address Setup Time
tCS
25
0
30
0
35
0
45
0
50
0
50
0
Data Setup Time
25
0
30
0
30
0
45
0
50
0
50
0
Data Hold Time
Address Hold Time
40
0
45
0
45
0
45
0
50
0
50
0
Chip Select Hold Time
Write Enable Pulse Width High
Duration of Byte Programming Operation (min)
Sector Erase Time
tWHEH tCH
tWHWL tWPH
tWHWH1
20
14
2.2
0
20
14
2.2
0
20
14
2.2
0
20
14
2.2
0
20
14
2.2
0
20
14
2.2
0
tWHWH2
60
60
60
60
60
60
Read Recovery Time Before Write
tGHWL
VCC Setup Time
tVCS
50
50
50
50
50
50
Chip Programming Time
Output Enable Setup Time
12.5
12.5
12.5
12.5
12.5
12.5
tOES
tOEH
0
0
0
0
0
0
Output Enable Hold Time (1)
1. For Toggle and Data Polling.
10
10
10
10
10
10
AC CHARACTERISTICS – READ ONLY OPERATIONS
Parameter
Symbol
-50
-60
-70
-90
-120
-150
Unit
Min
50
Max
Min
60
Max
Min
70
Max
Min
90
Max
Min
Max
Min
Max
Read Cycle Time
tAVAV
tRC
120
150
ns
ns
ns
ns
ns
ns
ns
Address Access Time
tAVQV tACC
50
50
25
20
20
60
60
30
20
20
70
70
35
20
20
90
90
40
25
25
120
120
50
150
150
55
Chip Select Access Time
OE# to Output Valid
tELQV
tGLQV
tEHQZ
tGHQZ
tAXQX
tCE
tOE
tDF
tDF
tOH
Chip Select to Output High Z (1)
OE# High to Output High Z (1)
30
35
30
35
Output Hold from Address, CS# or OE# Change,
0
0
0
0
0
0
whichever is first
1. Guaranteed by design, not tested.
Microsemi Corporation reserves the right to change products or specifications without notice.
June 2012 © 2012 Microsemi Corporation. All rights reserved.
Rev. 12
5
Microsemi Corporation • (602) 437-1520 • www.microsemi.com
WF128K32-XXX5
PACKAGE 400 – 66 PIN, PGA TYPE, CERAMIC HEX-IN-LINE PACKAGE, HIP (H1)
27.3 (1.075) 0.25 (0.010) Sꢀ
PIN 1 IDENTIFIER
SꢀUARE PAD
ON BOTTOM
25.4 (1.0) TYP
4.60 (0.181)
MAX
3.81 (0.150)
0.13 (0.005)
0.76 (0.030) 0.13 (0.005)
15.24 (0.600) TYP
25.4 (1.0) TYP
2.54 (0.100)
TYP
1.27 (0.050) TYP DIA
0.46 (0.018) 0.05 (0.002) DIA
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
Microsemi Corporation reserves the right to change products or specifications without notice.
June 2012 © 2012 Microsemi Corporation. All rights reserved.
Rev. 12
6
Microsemi Corporation • (602) 437-1520 • www.microsemi.com
WF128K32-XXX5
PACKAGE 510 – 68 LEAD, CERAMIC QUAD FLAT PACK, CQFP (G2U)
25.15 (0.990) 0.25 (0.010) Sꢀ
3.56 (0.140) MAX
22.36 (0.880) 0.25 (0.010) Sꢀ
0.254 (0.010)
+ 0.051 (0.002)
- 0.025 (0.001)
0.254 (0.010) TYP
R 0.127
24.0 (0.946)
(0.005)
0.53 (0.021)
0.18 (0.007)
0.25 (0.010)
MIN
1°/ 7°
1.01 (0.040)
0.13 (0.005)
DETAIL A
1.27 (0.050) TYP
0.38 (0.015)
0.05 (0.002)
SEE DETAIL “A”
20.32 (0.800) TYP
The Microsemi 68 lead G2U CQFP fills the same
fit and function as the JEDEC 68 lead CQFJ or
68 PLCC. But the G2U has the TCE and lead
inspection advantage of the CQFP form.
24.0 (0.946) TYP
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
Microsemi Corporation reserves the right to change products or specifications without notice.
June 2012 © 2012 Microsemi Corporation. All rights reserved.
Rev. 12
7
Microsemi Corporation • (602) 437-1520 • www.microsemi.com
WF128K32-XXX5
PACKAGE 528 – 68 LEAD, CERAMIC QUAD FLAT PACK, CQFP (G2L)
25.15 (0.990) 0.25 (0.010) Sꢀ
5.10 (0.200) MAX
22.36 (0.880) 0.25 (0.010) Sꢀ
0.254 (0.010)
+ 0.051 (0.002)
- 0.025 (0.001)
0.254 (0.010) TYP
R 0.127
24.0 (0.946)
(0.005)
0.25 (0.010)
1.37 (0.054) MIN
0.004
MIN
1°/ 7°
1.01 (0.040)
0.13 (0.005)
DETAIL A
1.27 (0.050) TYP
0.38 (0.015)
0.05 (0.002)
SEE DETAIL “A”
20.32 (0.800) TYP
The Microsemi 68 lead G2L CQFP fills the same
fit and function as the JEDEC 68 lead CQFJ or
68 PLCC. But the G2L has the TCE and lead
inspection advantage of the CQFP form.
24.0 (0.946) TYP
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
Microsemi Corporation reserves the right to change products or specifications without notice.
June 2012 © 2012 Microsemi Corporation. All rights reserved.
Rev. 12
8
Microsemi Corporation • (602) 437-1520 • www.microsemi.com
WF128K32-XXX5
ORDERING INFORMATION
W F 128K32 X - XXX X X 5 X
MICROSEMI CORPORATION
NOR FLASH
Organization, 128K x 32
User configurable as 256K x 16 or 512K x 8
IMPROVEMENT MARK
N = No Connect at pin 8, 21, 28 and 39 in HIP for Upgrade
ACCESS TIME (ns)
PACKAGE TYPE:
H1 = 1.075" sq. Ceramic Hex In-line Package, HIP (Package 400)
G2U = 22.4mm Ceramic Quad Flat Pack, Low Profile CQFP (Package 510)
G2L = 22.4mm Ceramic Quad Flat Pack, Low Profile CQFP (Package 528)
DEVICE GRADE:
Q
= MIL - STD 833 Compliant
M = Military Screened -55°C to +125°C
I
= Industrial
-40°C to +85°C
0°C to + 70°C
C
= Commercial
V
PP Programming Voltage
5 = 5V
LEAD FINISH:
Blank = Gold plated leads
A
= Solder dip leads
Microsemi Corporation reserves the right to change products or specifications without notice.
June 2012 © 2012 Microsemi Corporation. All rights reserved.
Rev. 12
9
Microsemi Corporation • (602) 437-1520 • www.microsemi.com
WF128K32-XXX5
DEVICE TYPE
128K x 32 Flash
128K x 32 Flash
128K x 32 Flash
128K x 32 Flash
128K x 32 Flash
SPEED
150ns
120ns
90ns
PACKAGE
66 pin HIP (H1)
66 pin HIP (H1)
66 pin HIP (H1)
66 pin HIP (H1)
66 pin HIP (H1)
SMD NO.
5962-94716 01H8X
5962-94716 02H8X
5962-94716 03H8X
5962-94716 04H8X
5962-94716 05H8X
70ns
60ns
128K x 32 Flash
128K x 32 Flash
128K x 32 Flash
128K x 32 Flash
128K x 32 Flash
150ns
120ns
90ns
68 lead CQFP (G2U)
68 lead CQFP (G2U)
68 lead CQFP (G2U)
68 lead CQFP (G2U)
68 lead CQFP (G2U)
5962-94716 01HNX
5962-94716 02HNX
5962-94716 03HNX
5962-94716 04HNX
5962-94716 05HNX
70ns
60ns
128K x 32 Flash
128K x 32 Flash
128K x 32 Flash
128K x 32 Flash
128K x 32 Flash
150ns
120ns
90ns
68 lead CQFP (G2L)
68 lead CQFP (G2L)
68 lead CQFP (G2L)
68 lead CQFP (G2L)
68 lead CQFP (G2L)
5962-94716 01HAX
5962-94716 02HAX
5962-94716 03HAX
5962-94716 04HAX
5962-94716 05HAX
70ns
60ns
NOTE: This table is for reference only. For 5962-94716 ordering information and specifications refer to latest SMD document.
Microsemi Corporation reserves the right to change products or specifications without notice.
June 2012 © 2012 Microsemi Corporation. All rights reserved.
Rev. 12
10
Microsemi Corporation • (602) 437-1520 • www.microsemi.com
WF128K32-XXX5
Document Title
128KX32 5V NOR FLASH MODULE, SMD 5962-94716
Revision History
Rev # History
Release Date Status
Rev 10
Changes (Pg. 1-16)
June 2011
Final
10.1 Change document layout from White Electronic Designs to Microsemi
10.2 Add document Revision History page
Rev 11
Rev 12
Changes (Pg. 1, 16)
August 2011
June 2012
Final
Final
11.1 Add "NOR" to headline
Changes (Pg. 1, 3, 4, 5-15)
12.1 Update features
12.2 Update Absolute Maximum Ratings, Recommended Operating Conditions
and DC Characteristics – CMOS Compatible charts
12.3 Delete subhead from all AC Characteristics charts
12.4 Delete AC Waveforms diagram
12.5 Update package 510 – 68 Lead, Ceramic Quad Flat Pack, CQFP (G2U)
diagram
12.6 Update package 528 – 68 Lead, Ceramic Quad Flat Pack, CQFP (G2L)
diagram
12.7 Add NOR to Flash option in Ordering Information chart
12.8 Update notes to QML chart
Microsemi Corporation reserves the right to change products or specifications without notice.
June 2012 © 2012 Microsemi Corporation. All rights reserved.
Rev. 12
11
Microsemi Corporation • (602) 437-1520 • www.microsemi.com
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