SG1845L-DESC-TR [MICROSEMI]
Switching Controller, Current-mode, 1A, CQCC20, LCC-20;
| 型号： | SG1845L-DESC-TR |
| 厂家： | 
Microsemi |
| 描述： | Switching Controller, Current-mode, 1A, CQCC20, LCC-20 开关 |
| 文件： | 总19页 (文件大小：752K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SG1844/SG1845/SG3844/SG3845
Current Mode PWM Controller
Features
Description
.
.
.
.
.
.
.
.
Optimized for Off-Line Control
The SG1844/45 family of control ICs provides all the
required features to implement off-line Fixed
Frequency, Current-mode switching power supplies
with a minimum number of external components.
Current-mode architecture demonstrates improved line
regulation, improved load regulation, pulse-by pulse
current limiting and inherent protection of the power
supply output switch.
Low Start-Up Current (<1mA)
Automatic Feed Forward Compensation
Trimmed Oscillator
Discharge Current
Pulse-By-Pulse Current Limiting
Enhanced Load Response Characteristics
Undervoltage Lockout with 6V Hysteresis
(SG1844 only)
The Bandgap reference is trimmed to ±1% over
temperature. Oscillator discharge current is trimmed to
less than ±10%. The SG1844/45 has under-voltage
lockout, current-limiting circuitry and start-up current of
less than 1mA. The totem-pole output is optimized to
drive the gate of a power MOSFET. The output is low
in the off state to provide direct interface to an N-
channel device. Both operate up to a maximum duty
cycle range of zero to <50% due to an internal toggle
flip-flop which blanks the output off every other clock
cycle. The SG1844/45 is specified for operation over
the full military ambient temperature range of -55°C to
125°C. The SG3844/45 is designed for the commercial
range of 0°C to 70°C.
.
.
.
.
.
Double Pulse Suppression
High-Current Totem-Pole Output
Internally Trimmed Bandgap Reference
500kHz Operation
Under-voltage Lockout
SG1844 - 16 Volts
SG1845 - 8.4 Volts
.
Low Shoot-through Current <75mA Over
Temperature
Application
. Available to MIL-STD-883
. Available to DSCC
– Standard Microcircuit Drawing (SMD)
. SGR1844/45 Rad-Tolerant Version Available
Product Highlight
RST
IST
AC
INPUT
Vcc
SG3844
Figure 1 · Product Highlight
November 2014 Rev. 1.7
www.microsemi.com
© 2014 Microsemi Corporation- Analog Mixed Signal Group
1
Current Mode PWM Controller
Connection Diagrams and Ordering Information
Ambient
Temperature
Type
Packaging
Type
Package
Part Number
Connection Diagram
VREF
COM
VFB
VCC
SG3844M
OUTPUT
GND
ISENSE
RT/CT
8-PIN PLASTIC
DUAL INLINE
PACKAGE
M
0°C to 70°C
PDIP
M PACKAGE
(Top View)
SG3845M
M Package: RoHS / Pb-free 100% Matte Tin Lead Finish
SG1844Y
SG1845Y
VREF
COM
VFB
VCC
OUTPUT
GND
ISENSE
RT/CT
8-PIN
SG1844Y-883B
SG1845Y-883B
-55°C to
125°C
CERAMIC
DUAL INLINE
PACKAGE
Y
CERDIP
Y PACKAGE
(Top View)
SG1844Y-DESC
SG1845Y-DESC
PbSn Tin Lead Finish
COM
VFB
VREF
VCC
SG3844DM
SG3845DM
8-PIN SMALL
OUTLINE
INTEGRATED
CIRCUIT
ISENSE
RT/CT
OUTPUT
GND
0°C to 70°C
DM
SOIC
DM PACKAGE
(Top View)
RoHS / Pb-free 100% Matte Tin Lead Finish
VREF
N.C.
COM
N.C.
SG3844D
SG3845D
VCC
VC
VFB
14-PIN SMALL
OUTLINE
INTEGRATED
CIRCUIT
N.C.
ISENSE
N.C.
OUT UT
GND
0°C to 70°C
D
SOIC
WR GND
RT/CT
D PACKAGE
(Top View)
RoHS / Pb-free 100% Matte Tin Lead Finish
2
Connection Diagrams and Ordering Information
Ambient
Temperature
Packaging
Package
Part Number
Connection Diagram
Type
COM
N.C.
VREF
N.C.
SG1844J
SG1845J
VCC
VC
VFB
N.C.
14-PIN
CERAMIC
DUAL INLINE
PACKAGE
SG1844J-883B
ISENSE
N.C.
OUTPUT
GND
-55°C to
125°C
J
CERDIP
SG1845J-883B
SG1844J-DESC
SG1845J-DESC
RT/CT
PGND
J PACKAGE
(Top View)
PbSn Lead Finish
COM
VFB
ISENSE
RT/CT
PGND
VREF
VCC
VC
OUTPUT
GND
SG1844F-DESC
SG1845F-DESC
10-PIN
-55°C to
125°C
CERAMIC
FLAT PACK
PACKAGE
F
FLAT PACK
F PACKAGE
(Top View)
PbSn Lead Finish
SG1844L
3
19
1 20
2
1. N.C.
2. N.C.
11. N.C.
12.
.
3. COM 13. GND
18
17
16
15
14
SG1845L
4
4. N.C.
14. N.C.
15. OUT UT
5
6
7
8
VFB
5.
6. N.C.
7. ISENSE 17. Vc
8. 18. Vcc
16.
N.C.
Ceramic
(LCC)
Leadless
Chip Carrier
SG1844L-883B
SG1845L-883B
SG1844L-DESC
SG1845L-DESC
RT/CT
-55°C to
125°C
20-Pin
CERAMIC
9. N.C.
19.
20.
N.C.
VREF
L
10. N.C.
9
13
10 11 12
L PACKAGE
(Top View)
PbSn Lead Finish
Notes:
1. Contact factory for DESC part availability.
2. All parts are viewed from the top.
3. Available in Tape & Reel. Append the letters “TR” to the part number. (i.e. SG3844D-TR)
4. Hermetic Packages J, F, L, & Y use Pb37/Sn63 hot solder lead finish, contact factory for availability of RoHS versions.
3
Current Mode PWM Controller
Absolute Maximum Ratings1 - 2
Value
Units
Parameter
Supply Voltage (Low Impedance Source)
Output Current (Peak)
30
V
A
±1
Output Current (Continuous)
Output Energy (Capacitive Load)
350
mA
µJ
V
5
-0.3 to +6.3
10
Analog Inputs (VFB, ISENSE
)
Error Amplifier Output Sink Current
Operating Junction Temperature
Hermetic (J, Y, F, L Packages)
Plastic (M, D, DM Packages)
mA
150
150
°C
°C
°C
°C
Storage Temperature Range
-65 to +150
300
Lead Temperature (Soldering, 10 Seconds)
RoHS / Pb-free Peak Package Solder Reflow Temp. (40 second
max. exposure)
260 (+0, -5)
°C
Notes:
1. Exceeding these ratings could cause damage to the device.
2. All voltages are with respect to Pin 5. All currents are positive into the specified terminal.
Thermal Data
Parameter
Value
95
Units
M Package:
Thermal Resistance-Junction to Ambient, θJA
DM Package:
°C/W
°C/W
°C/W
Thermal Resistance-Junction to Ambient, θJA
D Package:
165
120
Thermal Resistance-Junction to Ambient, θJA
Y Package:
°C/W
°C/W
Thermal Resistance-Junction to Case, θJC
Thermal Resistance-Junction to Ambient, θJA
J Package
30
130
°C/W
°C/W
Thermal Resistance-Junction to Case, θJC
Thermal Resistance-Junction to Ambient, θJA
F Package
30
80
°C/W
°C/W
Thermal Resistance-Junction to Case, θJC
Thermal Resistance-Junction to Ambient, θJA
L Package
80
145
°C/W
°C/W
Thermal Resistance-Junction to Case, θJC
Thermal Resistance-Junction to Ambient, θJA
35
120
Notes:
Junction Temperature Calculation: TJ = TA + (PD x θJA).
The θJA numbers are guidelines for the thermal performance of the device/pc-board system. All of the above assume no ambient
airflow.
4
Recommended Operating Conditions3
Recommended Operating Conditions3
Recommended Operating Conditions
Symbol
Parameter
Units
Typ.
30
Min.
Max.
VS
Supply Voltage Range
V
A
IPK
Output Current (Peak)
±1
IOUT
Output Current (Continuous)
Analog Inputs (Pin 2, Pin 3)
Error Amp Output Sink Current
Oscillator Frequency Range
Oscillator Timing Resistor
Oscillator Timing Capacitor
200
mA
V
0
2.6
EAISNK
OSCFR
RT
5
mA
kHz
kΩ
µF
0.1
0.52
0.001
500
150
1.0
CT
Operating Ambient Temperature Range:
SG1844/45
SG3844/45
-55
0
125
70
°C
°C
Note:
3. Range over which the device is functional.
Electrical Characteristics
Unless otherwise specified, these specifications apply over the operating ambient temperatures for
SG1844/SG1845 with -55°C ≤ TA ≤ 125°C, SG3844/SG3845 with 0°C ≤ TA ≤ 70°C, VCC = 15V (Note 7),
RT = 10kΩ, and CT = 3.3nF. Low duty cycle pulse testing techniques are used which maintains
junction and case temperatures equal to the ambient temperature.
SG1844/SG1845
SG3844/SG3845
Symbol
Parameter
Test Conditions
Units
Min. Typ.
Max
Min. Typ. Max
Reference Section
TJ = 25°C, IO = 1mA
12V ≤ VIN ≤ 25V
1 ≤ IO ≤ 20mA
VREF
VREG
IREG
Output Voltage
4.95 5.00
5.05
20
4.90 5.00 5.10
V
mV
Line Regulation
6
6
6
6
20
25
Load Regulation
25
mV
Temperature Stability4
0.2
0.4
0.2
0.4
mV/°C
Line, Load,
Total Output Variation4
Output Noise Voltage4
4.90
5.10
4.82
5.18
V
Temperature
10Hz ≤ f ≤ 10kHz, TJ
= 25°C
50
5
50
5
VN
µV
Long Term Stability4
Output Short Circuit
25
25
mV
mA
TA = 125°C, 1000hrs
VREFISC
-30
47
-100
-180
-30
47
-100 -180
Oscillator Section
TJ = 25°C
f
Initial Accuracy8
52
.02
5
57
1
52
0.2
5
57
1
kHz
%
12V ≤ VCC ≤ 25V
TMIN ≤ TA ≤ TMAX
VRT/CT (Peak to Peak)
TJ = 25°C
fREG
Voltage Stability
Temperature Stability4
Amplitude
%
OSCPP
IDSG
1.7
8.3
1.7
8.4
V
Discharge Current
7.8
6.8
9.1
9.3
7.5
7.2
9.3
9.5
mA
mA
TMIN ≤ T A ≤ TMAX
5
Current Mode PWM Controller
SG1844/SG1845
SG3844/SG3845
Symbol
Parameter
Test Conditions
Units
Min. Typ.
Max
Min. Typ. Max
Error Amplifier Section
EAIH
EAIIB
AVOL
EABW
Input Voltage
VCOMP = 2.5V
2.45 2.50
-0.3
2.55
-1
2.42 2.50 2.58
V
µA
Input Bias Current
Open Loop Gain
Unity Gain Bandwidth4
-0.3
90
1
-2
2V ≤ VO ≤ 4V
65
90
1
65
dB
TJ = 25°C
0.7
0.7
MHz
Power Supply
Rejection Ratio
PSRR
EASNK
EASRC
EAVOH
EAVOL
12V ≤ VCC ≤ 25V
60
2
70
6
60
2
70
6
dB
mA
mA
V
VVFB = 2.7V, VCOMP
1.1V
VVFB = 2.3V, VCOMP
5V
VVFB = 2.3V, RL = 15k
to GND
VVFB = 2.7V, RL = 15k
to VREF
=
Output Sink Current
Output Source Current
VOUT High
=
-0.5
5
-0.8
6
-0.5
5
-0.8
6
VOUT Low
0.7
1.1
0.7
1.1
V
Current Sense Section
Gain5 & 6
CSAVOL
2.85
0.9
3
1
3.15
1.1
2.85
0.9
3
1
3.15
1.1
V/V
V
Maximum Input
Signal5
VCOMP = 5V
Power Supply
PSRR
70
70
dB
12V ≤ VCC ≤ 25V
Rejection Ratio
Input Bias Current
Delay to Output4
-2
-10
-2
-10
µA
ns
CSIIB
150
300
150
300
CSDELAY
Output Section
0.1
1.5
0.4
2.2
0.1
1.5
0.4
2.2
V
V
ISINK = 20mA
VOL
VOH
Output Low Level
ISINK = 200mA
ISOURCE = 200mA
13
12
13.5
13.5
50
13
12
13.5
13.5
50
V
Output High Level
V
ISOURCE = 200mA
Rise Time4
Fall Time4
150
150
150
150
ns
ns
RS
FT
TJ = 25°C, CL = 1nF
TJ = 25°C, CL = 1nF
50
50
Under-Voltage Lockout Section
15
16
17
14.5
16
17.5
V
1844
1845
1844
1845
UVLO
VSMIN
Start Threshold
7.8
9
8.4
10
9.0
11
7.8
8.5
8.4
10
9.0
V
V
11.5
Min. Operation Voltage
After Turn-On
7.0
7.6
8.3
7.0
7.6
8.2
V
PWM Section
46
48
50
0
46
48
50
0
%
%
DCMAX
DCMIN
Maximum Duty Cycle
Minimum Duty Cycle
Power Consumption Section
6
Block Diagram
SG1844/SG1845
SG3844/SG3845
Min. Typ. Max
Symbol
Parameter
Test Conditions
Units
mA
mA
V
Min. Typ.
Max
0.5
1
0.5
11
34
1
IS
I
Start-Up Current
Operating Supply
Current
11
34
17
17
VFB = VISENSE = 0V
ICC = 25mA
Z
VCC Zener Voltage
Note:
4.
5.
6.
7.
8.
These parameters, although guaranteed, are not 100% tested in production.
Parameter measured at trip point of latch with VVFB = 0.
Gain defined as: A = ∆VCOMP / ∆VISENSE ; 0 ≤ VISENSE ≤ 0.8V
Adjust VCC above the start threshold before setting at 15V.
Output frequency equals one half of oscillator frequency.
Block Diagram
VCC
*
34 V
UVLO
VREF
5.0 V
50 mA
5 V
REF
S / R
GROUND**
6V (1844)
16V (1844)
0.8V (1845)
8.4 (1845)
INTERNAL BIAS
2.5 V
VREF
GOOD LOGIC
VC*
OSCILLATOR
ERROR AMP
RT/CT
T
OUTPUT
S
R
2R
R
POWER GROUND**
PWM
LATCH
VFB
COMP
1 V
CURRENT SENSE
COMPARATOR
CURRENT SENSE
* - VCC and VC are internally connected for 8-pin packages.
** - POWER GROUND and GROUND are internally connected for 8-pin packages.
Figure 2 · Block Diagram
7
Current Mode PWM Controller
Characteristic Curves
2
0
VIN = 15V
10.0
Duty Cycle = 50%
SG1844
9.6
-2
-4
-6
9.2
8.8
8.4
-8
8.0
SG1845
-10
-75
-50
25
0
25
50
75
100
125
-75
-50
25
0
25
50
75
100
125
Junction Temperature - (°C)
Junction Temperature - (°C)
Figure 3 · Dropout Voltage vs. Temperature
Figure 4 · Oscillator Temperature Stability
220
0.7
SG1844
200
180
0.6
0.5
0.4
VPIN3
=
1.1V
160
140
120
0.3
SG1845
0.2
-75
-50
25
0
25
50
75
100
125
75
100
125
-75
-25
0
25
50
-50
Junction Temperature - (°C)
Junction Temperature - (°C)
Figure 5 · Current Sense to Output Delay vs.
Temperature
Figure 6 · Start-Up Current vs. Temperature
5.02
8.32
SG1845
5.01
8.30
VCC
= 15V
8.28
8.26
8.24
8.22
8.20
8.18
5.00
4.99
4.98
125
-25
0
25
50
75
100
-50
-75
-75 -50 -25
0
25
50
75 100 125
Junction Temperature - (°C)
Junction Temperature - (°C)
Figure 8 · Start-Up Voltage Threshold vs. Temperature
Figure 7 · Reference Voltage vs. Temperature
8
Characteristic Curves
16.08
16.06
16.04
16.02
8.2
8.0
7.8
7.6
SG1844
16.00
15.98
7.4
7.2
-75
25
50
75
100
-75 -50 -25
0
25
50
75 100 125
-50
-25
0
125
Junction Temperature - (°C)
Junction Temperature - (°C)
Figure 10 · Oscillator Discharge Current vs. Temperature
Figure 9 · Start-Up Voltage Threshold vs. Temperature
2.5
1.0
0.9
2.0
0.8
C
°
5
5
-
C
C
+
°
°
5
2
0.7
+
5
2
1
C
°
5
C
°
2
5
5
-
1.5
1.0
0.6
0.5
0.4
0.3
0.2
C
°
5
2
1
VIN = 15 V
Duty Cycle < 5%
0.5
0
0.1
0
1.0
2.0
3.0
4.0
5.0
100
200
300
400
500
Error Amp Output Voltage - (V)
Output Current - (mA)
Figure 12 · Current Sense Threshold vs. Error Amplifier
Output
Figure 11 · Output Saturation Voltage vs. Output
Current and Temperature (Sink Transistor)
VIN = 15 V
Duty Cycle < 5%
4.0
3.0
2.0
1.0
0
100
200
300
400
500
Output Current - (mA)
Figure 13 · Output Saturation Voltage vs. Output
Current and Temperature (Source Transistor)
9
Current Mode PWM Controller
Application Information
The oscillator of the 1844/45 family of PWM's is programmed by the external timing components (RT, CT) as
shown in Figure 14.
VREF
RT
/CT
RT
CT
GND
1.86
F
Where RT ≥ 5kΩ
≈
RTCT
Figure 14 · Oscillator Timing Circuit
100
10
1
1k
10k
100
100k
1M
Oscillator Frequency - (Hz)
Figure 15 · Oscillator Frequency vs. RT for various CT
10
Typical Application Circuits
Typical Application Circuits
Pin numbers referenced are for 8-pin package and pin numbers in parenthesis are for 14-pin package.
VCC
VIN
7 (12)
7 (11)
Q1
6 (10)
5 (8)
SG1844/45
IPK
R
3 (5)
1.0V
RS
=
IPK(MAX)
RS
C
Figure 16 · Current Sense Spike Suppression
The RC low-pass filter will eliminate the leading edge current spike caused by parasitic of Power MOSFET.
VCC
VIN
7 (12)
7 (11)
6 (10)
Q1
R1
SG1844/45
5 (8)
RS
3 (5)
Figure 17 · MOSFET Parasitic Oscillations
A resistor (R1) in series with the MOSFET gate reduce overshoot and ringing caused by the MOSFET input
capacitance and any inductance in series with the gate drive. (Note: It is very important to have a low
inductance ground path to insure correct operation of the I.C. This can be done by making the ground paths
as short and as wide as possible.)
11
Current Mode PWM Controller
IB
VC
R2
+
VIN
VC1
_
R1 II R2
VC1
VC
7 (11)
6 (10)
C1
R2
Q1
SG1844/45
R1
5 (8)
3 (5)
RS
Figure 18 · Bipolar Transistor Drive
The 1844/45 output stage can provide negative base current to remove base charge of power transistor (Q1)
for faster turn off. This is accomplished by adding a capacitor (C1) in parallel with a resistor (R1). The resistor
(R1) is to limit the base current during turn on.
VCC
VIN
Isolation
Boundary
7 (12)
7 (11)
6 (10)
Q1
VGS Waveforms
50% DC
+
0
SG1844/45
_
5 (8)
3 (5)
+
R
0
_
25% DC
RS
NS
NP
C
V (PIN 1) – 1.4
NP
=
IPK
(
)
NS
3RS
Figure 19 · Isolated MOSFET Drive
Current transformers can be used where isolation is required between PWM and Primary ground. A drive
transformer is then necessary to interface the PWM output with the MOSFET.
12
Typical Application Circuits
VIN
VCC
7 (12)
8 (14)
4 (7)
7 (11)
6 (10)
Q1
SG1844/45
2 (3)
1 (1)
5 (8)
3 (5)
R2
R1
2N2907
C
5 (9)
RS
1
R1 R2
R2+R2
Vc
V1
RS
C
tSOFTSTART = -In1
IPK
=
Where,
0
≤ V1 ≤ 1.0
V
[R ]
2
R1
1.43 - 0.23
R1
0.5
R2
=
Where,V2
and V1
=
R
R21
+
1
1
+
R2
Figure 20 · Adjustable Buffered Reduction of Clamp Level with Softstart
Softstart and adjustable peak current can be done with the external circuitry shown above.
8 (14)
8
RA
4
6
2
SG1844/45
3
4 (7)
555
TIMER
RB
C
1
5 (9)
1.44
To other
SG1844/45
f =
f =
(RA + 2RB) C
RB
R
A + 2RB
Figure 21 · External Duty Cycle Clamp and Multi-Unit Synchronization
Precision duty cycle limiting for a duty cycle of <50%, as well as synchronizing several 1844/45's is possible
with the above circuitry.
13
Current Mode PWM Controller
5 V
7 (11)
6 (10)
2.8 V
1.1 V
RT
_
+
CT
SG1844/45
Discharge
Current
Id = 8.2 mA
Figure 22 · Oscillator Connection
The oscillator is programmed by the values selected for the timing components R
application information for calculation of the component values.
T
and C . Refer to
T
2.5 V
SG1844/45
0.5 mA
2 (3)
Ri
1 (1)
RF
Rf
10K
Figure 23 · Error Amplifier Connection
Error amplifier is capable of sourcing and sinking current up to 0.5mA.
14
PACKAGE OUTLINE DIMENSIONS
PACKAGE OUTLINE DIMENSIONS
Controlling dimensions are in inches, metric equivalents are shown for general information.
MILLIMETERS
INCHES
MIN
Dim
MIN
1.35
0.10
1.25
0.33
0.19
4.83
5.79
MAX
1.75
0.25
1.52
0.51
0.25
5.21
6.20
MAX
0.069
0.010
0.060
0.020
0.010
0.205
0.244
A
A1
A2
b
0.053
0.004
0.049
0.013
0.007
0.189
0.228
D
c
E
H
D
E
e
1.27 BSC
0.050 BSC
H
3.81
0.40
0
4.01
1.27
8
0.150
0.016
0
0.158
0.050
8
e
L
θ
A2
A
*LC
.010
0.004
*Lead Coplanarity
b
L
c
A1
Note:
1.Dimensions do not include mold flash or protrusions;
these shall not exceed 0.155mm (.006”) on any side.
Lead dimension shall not include solder coverage
Figure 24 · DM 8-Pin SOIC Package Dimensions
MILLIMETERS
INCHES
MIN
Dim
MIN
1.35
0.10
1.25
0.33
0.19
8.54
5.79
MAX
1.75
0.25
1.52
0.51
0.25
8.74
6.20
MAX
0.069
0.010
0.060
0.020
0.010
0.344
0.244
A
A1
A2
b
0.053
0.004
0.049
0.013
0.007
0.336
0.228
D
14
1
8
c
H
E
D
7
E
e
1.27 BSC
0.050 BSC
b
L
e
H
3.81
0.40
0
4.01
1.27
8
0.150
0.016
0
0.158
0.050
8
L
θ
A2
A
*LC
.010
0.004
*Lead Coplanarity
c
A1
Note:
1. Dimensions do not include mold flash or protrusions;
these shall not exceed 0.155mm (.006”) on any side.
Lead dimension shall not include solder coverage
Figure 25 · D 14-Pin SOIC Package Dimensions
15
Current Mode PWM Controller
PACKAGE OUTLINE DIMENSIONS
MILLIMETERS
INCHES
D
Dim
MIN
MAX
MIN
MAX
A
A2
b
5.08
0.200
3.30 Typ.
1.30 Typ.
E1
0.38
0.76
0.20
0.51
1.65
0.145
0.030
0.008
0.020
0.065
0.015
0.400
b2
c
0.38
D
E
10.16
b2
7.62 BSC
2.54 BSC
0.300 BSC
0.100 BSC
E
e
E1
L
θ
6.10
6.86
0.240
0.270
A2
A
L
3.05
0
0.120
0
15
15
c
Note:
1. Dimensions do not include mold flash or protrusions; these
shall not exceed 0.155mm (.006”) on any side. Lead
dimension shall not include solder coverage.
H
e
θ
b
Figure 26 · M 8-Pin PDIP Package Dimensions
16
PACKAGE OUTLINE DIMENSIONS
PACKAGE OUTLINE DIMENSIONS
MILLIMETERS
INCHES
MIN
Dim
MIN
4.32
0.38
1.04
0.20
9.52
5.59
MAX
5.08
0.51
1.65
0.38
10.29
7.11
MAX
0.200
0.020
0.065
0.015
0.405
0.280
D
A
b
0.170
0.015
0.045
0.008
0.375
0.220
5
4
8
b2
c
E
D
E
1
e
2.54 BSC
0.100 BSC
eA
b2
eA
H
L
7.37
0.63
3.18
-
7.87
1.78
4.06
15°
0.290
0.025
0.125
-
0.310
0.070
0.160
15°
A
α
Q
0.51
1.02
0.020
0.040
c
Q
L
Note:
SEATING
PLANE
H
e
Dimensions do not include protrusions; these shall not
exceed 0.155mm (.006”) on any side. Lead dimension
shall not include solder coverage.
α
b
Figure 27 · Y 8-Pin CERDIP Package Dimensions
MILLIMETERS
INCHES
MIN
Dim
MIN
4.32
0.38
1.04
0.20
19.30
5.59
MAX
5.08
0.51
1.65
0.38
19.94
7.11
MAX
0.200
0.020
0.065
0.015
0.785
0.280
D
A
b
0.170
0.015
0.045
0.008
0.760
0.220
8
14
b2
c
E
D
E
1
7
e
2.54 BSC
0.100 BSC
eA
eA
H
L
7.37
0.63
3.18
-
7.87
1.78
4.06
15°
0.290
0.025
0.125
-
0.310
0.070
0.160
15°
A
Q
b2
α
c
L
Q
0.51
1.02
0.020
0.040
H
e
b
θ
Note:
Dimensions do not include protrusions; these shall not
exceed 0.155mm (.006”) on any side. Lead dimension
shall not include solder coverage.
Figure 28 · J 14-Pin CERDIP Package Dimensions
17
Current Mode PWM Controller
PACKAGE OUTLINE DIMENSIONS
MILLIMETERS
INCHES
MIN
Dim
MIN
1.45
0.25
0.102
-
MAX
1.70
MAX
0.067
0.019
0.006
0.290
0.252
0.272
0.057
0.010
0.004
-
A
b
0.483
0.152
7.37
b
c
6
7
5
4
3
2
D
E
E1
e
8
D
6.04
-
6.40
0.238
-
9
6.91
10
1
1.27 BSC
0.050 BSC
e
L
6.35
0.51
0.20
9.40
1.02
0.38
0.250
0.020
0.008
0.370
0.040
0.015
E
E1
S1
Q
L
L
S1
Note:
Q
c
A
1. Lead No. 1 is identified by tab on lead or dot on cover.
2. Leads are within 0.13mm (.0005”) radius of the true
position (TP) at maximum material condition.
3. Dimension “e” determines a zone within which all body
and lead irregularities lie.
Figure 29 · F 10-Pin Ceramic Flatpack Package Dimensions
E3
D
MILLIMETERS
INCHES
Dim
MIN
8.64
-
MAX
9.14
MIN
MAX
0.360
0.320
D/E
0.340
-
E3
8.128
E
e
B1
L
1.270 BSC
0.635 TYP
0.050 BSC
0.025 TYP
1.02
1.52
0.040
0.060
0.090
A
1.626
2.286
0.064
h
1.016 TYP
0.040 TYP
A
L2
L
8
A1
A1
A2
L2
B3
1.372
-
1.68
1.168
2.41
0.054
-
0.066
0.046
0.95
3
1
1.91
0.075
0.203R
0.008R
Note:
All exposed metalized area shall be gold plated 60
micro-inch minimum thickness over nickel plated unless
otherwise specified in purchase order.
13
h
18
A2
B3
e
B1
Figure 30 · L 20-Pin Leadless Chip Carrier Package Dimensions
18
Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor
and system solutions for communications, defense & security, aerospace and industrial
markets. Products include high-performance and radiation-hardened analog mixed-signal
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CA 92656 USA
Microsemi makes no warranty, representation, or guarantee regarding the information contained herein or
the suitability of its products and services for any particular purpose, nor does Microsemi assume any
liability whatsoever arising out of the application or use of any product or circuit. The products sold
hereunder and any other products sold by Microsemi have been subject to limited testing and should not
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property of their respective owners.
SG1844/45-1.7/11.14
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