MXPLAD30KP22A [MICROSEMI]
Trans Voltage Suppressor Diode, 30000W, 22V V(RWM), Unidirectional, 1 Element, Silicon, PLASTIC PACKAGE-1;型号: | MXPLAD30KP22A |
厂家: | Microsemi |
描述: | Trans Voltage Suppressor Diode, 30000W, 22V V(RWM), Unidirectional, 1 Element, Silicon, PLASTIC PACKAGE-1 局域网 二极管 |
文件: | 总6页 (文件大小:392K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
MPLAD30KP14A –
MPLAD30KP400CA
High-Reliability
screening available in
reference to
Surface Mount 30,000 Watt Transient
Voltage Suppressor
DESCRIPTION
Available
MIL-PRF-19500
These high power 30 kW rated transient voltage suppressors in a surface mount package are
provided with design features to minimize thermal resistance and cumulative heating. Typical
applications include lightning and automotive load dump protection. They are particularly effective at
meeting the multi-stroke lightning standard RTCA DO-160, section 22 for aircraft design. This
efficient low profile package design is offered in standoff voltage selections (VWM) of 14 volts to
400 volts in either unidirectional or bidirectional construction.
Important: For the latest information, visit our website http://www.microsemi.com.
FEATURES
•
•
•
•
•
Available in both unidirectional and bidirectional construction (bidirectional with CA suffix)
High reliability with wafer fabrication and assembly lot traceability
All parts surge tested
PLAD
(The cathode is the metal base
under the body of this device.)
Low profile surface mount package
Optional upscreening is available with various screening and conformance inspection options based
on MIL-PRF-19500. Refer to Hirel Non-Hermetic Product Portfolio brochure on our web site for more
details on the screening options.
Also available:
•
•
•
•
Suppresses transients up to 30,000 W @ 10/1000 μs (see Figure 1)
Moisture classification is Level 1 with no dry pack required per IPC/JEDEC J-STD-020B
RoHS compliant versions are available
PLAD15KP
(15,000 watts)
MPLAD15KP7.0A thru
MPLAD15KP200CA
3σ lot norm screening performed on standby current (ID)
APPLICATIONS / BENEFITS
•
•
•
Protection from switching transients and induced RFI
Protection from ESD, and EFT per IEC 61000-4-2 and IEC 61000-4-4
Secondary lightning protection per IEC 61000-4-5 with 42 ohms source impedance:
Class 1,2,3,4,5: MPLAD30KP14A to 400CA
Class 5: MPLAD30KP14A to 400CA (short distance)
Class 5: MPLAD30KP14A to 220CA (long distance)
Secondary lightning protection per IEC 61000-4-5 with 12 ohms source impedance:
Class 1,2,3: MPLAD30KP14A to 400CA
•
•
Class 4: MPLAD30KP14A to 220CA
MSC – Lawrence
6 Lake Street,
Secondary lightning protection per IEC 61000-4-5 with 2 ohms source impedance:
Class 2: MPLAD30KP10A to 400CA
Lawrence, MA 01841
Tel: 1-800-446-1158 or
(978) 620-2600
Class 3: MPLAD30KP14A to 220CA
Class 4: MPLAD30KP14A to 110CA
Fax: (978) 689-0803
•
•
Pin injection protection per RTCA/DO-160F for Waveform 4 (6.4/69 μs @ 25°C)*:
Level 4: MPLAD30KP14A to 400CA
MSC – Ireland
Level 5: MPLAD30KP14A to 260CA
Gort Road Business Park,
Ennis, Co. Clare, Ireland
Tel: +353 (0) 65 6840044
Fax: +353 (0) 65 6822298
Pin injection protection per RTCA/DO-160F for Waveform 5A (40/120 μs @25°C)*:
Level 4: MPLAD30KP14A to 64CA
Level 5: MPLAD30KP14A to 26CA
Website:
www.microsemi.com
*See MicroNote 132 for further temperature derating selection.
RF01005, Rev G (5/16/14)
©2013 Microsemi Corporation
Page 1 of 6
MPLAD30KP14A –
MPLAD30KP400CA
MAXIMUM RATINGS @ 25 oC unless otherwise specified
Parameters/Test Conditions
Symbol
TJ and TSTG
RӨJA
Value
-55 to +150
50
Unit
Junction and Storage Temperature
Thermal Resistance Junction-to-Ambient (1)
Thermal Resistance Junction-to-Case
Peak Pulse Power @ 10/1000 µs (2)
ºC/W
ºC/W
ºC/W
W
RӨJC
1.0
PPP
30,000
Unidirectional
Bidirectional
<100
<5
ps
ns
V
tclamping (0 volts to V(
min)
BR)
Forward Clamping Voltage @ 500 Amps (3)
Forward Surge Current (3)
VFS
IFSM
TSP
PD
4.0
1500
260
A
Solder Temperature @ 10 s
Steady-State Power dissipation (5)
ºC
TA = 25 °C
TC = 100 °C
2.5 (1)
W
W
(4)
50
Notes: 1. When mounted on FR4 PC board with recommended mounting pad (see pad layout).
2. Also see figures 1 and 2. With impulse repetition rate (duty factor) of 0.05% or less.
3. At 8.3 ms half-sine wave (unidirectional devices only).
4. Case temperature controlled on heat sink as specified.
5. See MicroNote 134 for derating PPP when also applying steady-state power.
MECHANICAL and PACKAGING
•
•
•
•
•
•
•
•
CASE: Void-free transfer molded thermosetting epoxy body meeting UL94V-0
TERMINALS: Tin-lead or RoHS compliant annealed matte-tin plating readily solderable per MIL-STD-750, method 2026
MARKING: Body marked with part number
POLARITY: For unidirectional devices, the cathode is on the metal backside (package bottom)
Available in bulk or custom tape-and-reel packaging
TAPE-AND-REEL: Standard per EIA-481-B (add “TR” suffix to part number). Consult factory for quantities.
WEIGHT: Approximately 1.7 – 2.0 grams
See Package Dimensions on last page.
PART NOMENCLATURE
M PLAD 30K P 14
CA (e3)
Reliability Level*
RoHS Compliance
M
MA
MX
e3 = RoHS compliant
Blank = non-RoHS compliant
Polarity
MXL
*(see Hirel Non-Hermetic
Product Portfolio)
A = Unidirectional
CA = Bidirectional
Package Designation
PPP Rating (W)
Reverse Standoff Voltage
Plastic
SYMBOLS & DEFINITIONS
RF01005, Rev G (5/16/14)
©2013 Microsemi Corporation
Page 2 of 6
MPLAD30KP14A –
MPLAD30KP400CA
Symbol
I(BR)
Definition
Breakdown Current: The current used for measuring breakdown voltage V(BR)
.
ID
IPP
Standby Current: The current at the rated standoff voltage VWM
Peak Impulse Current: The peak current during the impulse.
.
V(BR)
Breakdown Voltage: The minimum voltage the device will exhibit at a specified current.
Clamping Voltage: Clamping voltage at IPP (peak pulse current) at the specified pulse conditions (typically shown as
maximum value).
VC
Rated Working Standoff Voltage: The maximum peak voltage that can be applied over the operating temperature
range.
VWM
αV(BR)
Temperature Coefficient of Breakdown Voltage: The change in breakdown voltage divided by change in temperature.
ELECTRICAL CHARACTERISTICS @ 25 ºC unless otherwise stated
REVERSE
STANDOFF
VOLTAGE
VWM
BREAKDOWN
VOLTAGE
MAXIMUM
CLAMPING
VOLTAGE
VC @ IPP
MAXIMUM MAXIMUM
MAXIMUM
TEMPERATURE
COEFFICIENT
αV(BR)
STANDBY
CURRENT
ID @ VWM
PEAK
PULSE
CURRENT
IPP
MICROSEMI PART NUMBER
(Note 1)
V(BR) @ I(BR)
(FIG. 3)
Unidirectional
Bidirectional
Volts
Volts
mA
Volts
A
mV/ ºC
µA
MPLAD30KP14A
MPLAD30KP15A
MPLAD30KP14CA
MPLAD30KP15CA
14
15
15.6 – 17.2
16.7 – 18.5
150
5
24.0
25.8
3000
750
1251*
1164*
10
12
MPLAD30KP16A
MPLAD30KP17A
MPLAD30KP16CA
MPLAD30KP17CA
16
17
17.8 – 19.7
18.9 – 20.9
5
5
27.2
28.8
450
150
1101*
1041*
12
14
MPLAD30KP18A
MPLAD30KP20A
MPLAD30KP18CA
MPLAD30KP20CA
18
20
20.0 – 22.1
22.2 – 24.5
5
5
30.8
34.0
60
45
975
882
16
18
MPLAD30KP22A
MPLAD30KP24A
MPLAD30KP22CA
MPLAD30KP24CA
22
24
24.4 – 26.9
26.7 – 29.5
5
5
36.4
39.8
10
10
822
753
20
22
MPLAD30KP26A
MPLAD30KP28A
MPLAD30KP26CA
MPLAD30KP28CA
26
28
28.9 – 31.9
31.1 – 34.4
5
5
43.0
46.4
10
10
696
645
24
26
MPLAD30KP30A
MPLAD30KP33A
MPLAD30KP30CA
MPLAD30KP33CA
30
33
33.3 – 36.8
36.7 – 40.6
5
5
48.8
53.3
10
10
618
564
30
35
MPLAD30KP36A
MPLAD30KP40A
MPLAD30KP36CA
MPLAD30KP40CA
36
40
40.0 – 44.2
44.4 – 49.1
5
5
58.1
64.5
10
10
516
468
38
44
MPLAD30KP43A
MPLAD30KP45A
MPLAD30KP43CA
MPLAD30KP45CA
43
45
47.8 – 52.8
50.0 – 55.3
5
5
69.4
72.7
10
10
432
414
50
51
MPLAD30KP48A
MPLAD30KP51A
MPLAD30KP48CA
MPLAD30KP51CA
48
51
53.3 – 58.9
56.7 – 62.7
5
5
77.4
82.4
10
10
390
366
54
58
MPLAD30KP54A
MPLAD30KP58A
MPLAD30KP54CA
MPLAD30KP58CA
54
58
60.0 – 66.3
64.4 – 71.2
5
5
87.1
93.6
10
10
342
318
64
70
MPLAD30KP60A
MPLAD30KP64A
MPLAD30KP60CA
MPLAD30KP64CA
60
64
66.7 – 73.7
71.1 – 78.6
5
5
96.8
103.0
10
10
312
294
72
75
MPLAD30KP70A
MPLAD30KP75A
MPLAD30KP70CA
MPLAD30KP75CA
70
75
77.8 – 86.0
83.3 – 92.1
5
5
113
121
10
10
264
246
84
90
MPLAD30KP78A
MPLAD30KP85A
MPLAD30KP78CA
MPLAD30KP85CA
78
85
86.7 – 95.8
94.4 - 104.0
5
5
126
137
10
10
240
216
95
104
MPLAD30KP90A
MPLAD30KP100A
MPLAD30KP90CA
MPLAD30KP100CA
90
100
100 – 111
111 – 123
5
5
146
162
10
10
204
186
109
122
MPLAD30KP110A
MPLAD30KP120A
MPLAD30KP110CA
MPLAD30KP120CA
110
120
122 – 135
133 – 147
5
5
177
193
10
10
168
156
132
145
MPLAD30KP130A
MPLAD30KP150A
MPLAD30KP130CA
MPLAD30KP150CA
130
150
144 – 159
167 – 185
5
5
209
243
10
10
142
124
157
183
MPLAD30KP160A
MPLAD30KP170A
MPLAD30KP160CA
MPLAD30KP170CA
160
170
178 – 197
189 – 209
5
5
259
275
10
10
116
110
195
207
MPLAD30KP180A
MPLAD30KP200A
MPLAD30KP180CA
MPLAD30KP200CA
180
200
200 – 221
222 – 245
5
5
291
322
10
10
104
94
219
243
MPLAD30KP220A
MPLAD30KP260A
MPLAD30KP220CA
MPLAD30KP260CA
220
260
245 – 271
289 – 320
5
5
356
419
10
10
84
71
269
318
280
300
311 – 345
333 – 369
5
5
451
483
10
10
66
62
344
368
MPLAD30KP280A
MPLAD30KP300A
MPLAD30KP280CA
MPLAD30KP300CA
MPLAD30KP350A
MPLAD30KP400A
MPLAD30KP350CA
MPLAD30KP400CA
350
400
389 – 431
444 – 492
5
5
564
644
10
10
53
46
430
490
NOTE 1: Transient Voltage Suppressors are normally selected with reverse standoff voltage VWM, which should be equal to or greater than peak
operating voltage.
NOTE 2: Items listed in bold above are available ex-stock or with a short lead-time.
*
Surge Testing is performed to 1000Amps due to Equipment limitations
RF01005, Rev G (5/16/14)
©2013 Microsemi Corporation
Page 3 of 6
MPLAD30KP14A –
MPLAD30KP400CA
GRAPHS
tp – Pulse Time – sec
FIGURE 1
Peak Pulse Power vs. Pulse Time
Test waveform parameters: tr = 10 µs, tp = 1000 µs
Figure 2
Pulse Waveform
RF01005, Rev G (5/16/14)
©2013 Microsemi Corporation
Page 4 of 6
MPLAD30KP14A –
MPLAD30KP400CA
GRAPHS (continued)
T Lead Temperature ºC
L
FIGURE 3
Derating Curve
RF01005, Rev G (5/16/14)
©2013 Microsemi Corporation
Page 5 of 6
MPLAD30KP14A –
MPLAD30KP400CA
PACKAGE DIMENSIONS
Dimensions
Millimeters
Ref.
Inch
Max
Min
Min
12.32
11.30
3.68
Max
A1
A2
B
C
D
F
G
H
0.485
0.445
0.145
0.585
0.200
0.008
0.055
0.015
0.495
0.455
0.155
0.595
0.210
0.013
0.065
0.025
12.57
11.56
3.94
14.86
5.08
15.11
5.33
0.20
0.33
1.40
1.65
0.38
0.64
J
0.062 TYP.
1.57 TYP.
r1
r2
0.030 TYP.
0.045 TYP.
0.76 TYP.
1.14 TYP.
PAD LAYOUT
Dimensions
Ref.
Inch
Millimeters
Min
Max
0.475
0.235
0.105
0.05
Min
11.81
5.72
2.41
1.02
Max
12.07
5.97
2.67
1.27
A
B
C
D
0.465
0.225
0.095
0.04
RF01005, Rev G (5/16/14)
©2013 Microsemi Corporation
Page 6 of 6
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